[go: up one dir, main page]

JPH0766510A - Printed-wiring board - Google Patents

Printed-wiring board

Info

Publication number
JPH0766510A
JPH0766510A JP23883793A JP23883793A JPH0766510A JP H0766510 A JPH0766510 A JP H0766510A JP 23883793 A JP23883793 A JP 23883793A JP 23883793 A JP23883793 A JP 23883793A JP H0766510 A JPH0766510 A JP H0766510A
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
connecting piece
circuit boards
connecting portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23883793A
Other languages
Japanese (ja)
Inventor
Kazuhito Yamada
和仁 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP23883793A priority Critical patent/JPH0766510A/en
Publication of JPH0766510A publication Critical patent/JPH0766510A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0097Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards

Landscapes

  • Structure Of Printed Boards (AREA)

Abstract

PURPOSE:To enable the connecting parts of respective connecting pieces to be cut off very easily by a method wherein the first and second connecting parts are composed to be alternately arranged at the end faces of the first and second circuit substrates. CONSTITUTION:Within the printed-wiring board P fundamentally composed of two circuit substrates 1, 2 mutually connected through the intermediary of plural connecting pieces 3, 4, 5, L-type cut off trenches C are provided between respective substrates 1 and 2 by respective connecting pieces 3, 4, 5. At this time, both end parts of respective connecting pieces 3, 4, 5 are provided with wide connecting parts 3A, 4A, 5A and narrow connecting parts 3B, 4B, 5B so as to connect respective circuit substrates 1 and 2 through the intermediary of respective connecting parts 3A, 3B, 4A, 4B, 5A, 5B of respective connecting pieces 3, 4, 5. Accordingly, the stress imposed by the deflection of the circuit substrates 1, 2 may be dispersed extending over the whole part of respective connecting parts while the wide connecting parts are respectively formed of holes 6, 7, 8 so that the connecting strength of respective circuit substrates may be conserved at a level exceeding a specific value simultaneously facilitating the cutting off step thereof.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、例えば、2つの回路基
板を複数個の連結片を介して相互に連結し、各連結片を
削除することにより独立した各回路基板を取得可能なプ
リント配線板に関し、特に、各連結片と各回路基板との
連結強度を向上することによりプリント配線板の取扱時
に連結片が不用意に破断されることなく取扱を容易にし
て不良品の発生を低減可能なプリント配線板に関するも
のである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to, for example, a printed wiring board in which two circuit boards are connected to each other through a plurality of connecting pieces, and the individual connecting boards can be removed by removing the connecting pieces. Regarding the board, especially by improving the connection strength between each connecting piece and each circuit board, the connecting piece can be handled easily and the occurrence of defective products can be reduced when the printed wiring board is handled. Printed wiring board.

【0002】[0002]

【従来の技術】従来より、各種電子機器の小型化、高機
能化等に伴って回路基板製造の効率化を図るため、1つ
のプリント配線板に2以上の回路基板を形成するととも
に、各回路基板を複数の連結片を介して相互に連結して
おき、各回路基板を取得する際には各連結片をプリント
配線板から削除することにより、各回路基板を独立して
得ることが可能な各種のプリント配線板が提案されてい
る。
2. Description of the Related Art Conventionally, two or more circuit boards are formed on one printed wiring board and each circuit is formed in order to increase the efficiency of circuit board manufacturing in accordance with the miniaturization and high functionality of various electronic devices. It is possible to obtain each circuit board independently by connecting the boards to each other through a plurality of connecting pieces and deleting each connecting piece from the printed wiring board when obtaining each circuit board. Various printed wiring boards have been proposed.

【0003】この種のプリント配線板としては、例え
ば、特願平5−154445号の願書に添付された明細
書、図面には、複数個の連結片を介して2つの配線基板
を相互に連結してなるプリント配線板が記載されてお
り、特に、図4には、製品となる2つの配線基板を各連
結片にて連結するについて、各連結片の両端部と各配線
基板の端面との連結部における幅を狭くしたプリント配
線板が記載されている。このように、幅の狭い連結部を
介して2つの配線基板の相互を連結するのは、双方の配
線基板が製品として使用されること、及び、連結部の切
断の容易性を勘案したものである。かかるプリント配線
板では、ニッパ等の切断工具により各連結片と各配線板
との連結部を切断することにより、2つの配線基板を取
得するものである。
As this type of printed wiring board, for example, in the specification and the drawings attached to the application of Japanese Patent Application No. 5-154445, two wiring boards are connected to each other through a plurality of connecting pieces. In particular, in FIG. 4, when connecting two wiring boards to be products with each connecting piece, the two end portions of each connecting piece and the end surface of each wiring board are described. A printed wiring board in which the width of the connecting portion is narrowed is described. In this way, the two wiring boards are connected to each other through the narrow connecting portion in consideration of the fact that both wiring boards are used as products and the easiness of cutting the connecting portion. is there. In such a printed wiring board, two wiring boards are obtained by cutting the connecting portion between each connecting piece and each wiring board with a cutting tool such as a nipper.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、前記の
ように2つの配線基板の相互を、各連結片の両端部にお
ける幅狭の連結部を介して連結した場合には、連結部の
連結強度が弱くなってしまうことから、プリント配線板
の取扱時に幅狭の各連結部において不用意に破断する虞
が多分に存する。このように各連結部において破断して
しまうと、プリント配線板の取扱が困難なものとなり、
また、各配線板が不良品となってしまう虞が存する。
However, when the two wiring boards are connected to each other through the narrow connecting portions at both ends of each connecting piece as described above, the connecting strength of the connecting portions is increased. Since the printed wiring board becomes weak, there is a possibility that the printed wiring board is inadvertently broken at each of the narrow connecting portions. If the connection parts are broken in this way, it becomes difficult to handle the printed wiring board.
Moreover, there is a risk that each wiring board will be defective.

【0005】本発明は前記従来の問題点を解消するため
になされたものであり、各連結片と各回路基板との連結
強度を向上してプリント配線板の取扱時に連結片が不用
意に破断されることなく取扱を容易にして不良品の発生
を低減することができるとともに、各連結片における連
結部の切断を極めて簡単に行なうことができるプリント
配線板を提供することを目的とする。
The present invention has been made in order to solve the above-mentioned conventional problems, and improves the connection strength between each connecting piece and each circuit board to inadvertently break the connecting piece when handling a printed wiring board. It is an object of the present invention to provide a printed wiring board that can be handled easily and can reduce the occurrence of defective products without being damaged, and can cut the connecting portion of each connecting piece extremely easily.

【0006】[0006]

【課題を解決するための手段】前記目的を達成するため
請求項1に係る発明は、少なくとも2つの第1及び第2
回路基板が相互に対向する端面間に複数個の連結片を形
成し、各連結片を介して各回路基板を相互に連結すると
ともに各連結片を削除することにより各回路基板を取得
可能なプリント配線板において、前記各連結片の一端に
所定の幅をもって形成された第1連結部と、前記各連結
片の他端に形成され第1連結部よりも幅狭の第2連結部
とを有し、前記第1及び第2回路基板は前記各連結片の
第1及び第2連結部を介して相互に連結されるととも
に、各第1及び第2連結部は各第1及び第2回路基板の
端面にて交互に配列された構成とされる。また、請求項
2にかかる発明では、前記第1連結部に空孔を形成した
構成とされる。
In order to achieve the above object, the invention according to claim 1 is at least two first and second inventions.
A print that can obtain each circuit board by forming a plurality of connecting pieces between the end faces where the circuit boards face each other, connecting the circuit boards to each other via each connecting piece, and deleting each connecting piece The wiring board has a first connecting portion formed at one end of each connecting piece with a predetermined width, and a second connecting portion formed at the other end of each connecting piece and narrower than the first connecting portion. The first and second circuit boards are connected to each other through the first and second connecting parts of the connecting pieces, and the first and second connecting parts are the first and second circuit boards. Are arranged alternately on the end faces of the. Further, in the invention according to claim 2, a hole is formed in the first connecting portion.

【0007】更に、請求項3に係る発明は、少なくとも
2つの回路基板が相互に対向する端面間に複数個の連結
片を形成し、各連結片を介して各回路基板を相互に連結
するとともに各連結片を削除することにより各回路基板
を取得可能なプリント配線板において、前記各連結片の
両端部に形成され、同一の幅を有する連結部と、前記各
連結部に形成された空孔とを備えた構成とされる。
Further, in the invention according to claim 3, a plurality of connecting pieces are formed between end surfaces of at least two circuit boards facing each other, and the respective circuit boards are connected to each other through the connecting pieces. In a printed wiring board in which each circuit board can be obtained by deleting each connecting piece, connecting portions having the same width are formed at both ends of each connecting piece, and holes formed in each connecting portion. And is configured to include.

【0008】[0008]

【作用】前記構成を有する請求項1に記載の発明に係る
プリント配線板では、各第1及び第2回路基板は複数個
の各連結片の一端に所定の幅をもって形成された各第1
連結部と各連結片の他端に形成され第1連結部よりも幅
狭の第2連結部とにより相互に連結されており、また、
各第1及び第2連結部は第1及び第2回路基板の端面に
て交互に配列されていることから、プリント配線板を取
り扱う際に、各第1回路基板と第2回路基板との間で各
連結片にかかる応力は、各第1連結部及び第2連結部の
全体に渡って分散され、幅の狭い第2連結部のみに集中
することは防止され得る。これより、各連結片と各第
1、第2回路基板との連結強度を向上してプリント配線
板の取扱時に連結片が不用意に破断されることなくプリ
ント配線板を容易に取り扱うことが可能となる。また、
プリント配線板から各第1、第2回路基板を取得する際
には、各連結片における各第1連結部と第2連結部とが
切断されて各連結片が除去されるが、このとき、幅広の
各第1連結部には空孔が形成されており、また、第2連
結部は幅狭に形成されているので、各第1連結部、第2
連結部の切断は極めて簡単に行い得る。
In the printed wiring board according to the present invention having the above structure, each of the first and second circuit boards is formed with a predetermined width at one end of each of the plurality of connecting pieces.
The connecting portion and the second connecting portion, which is formed at the other end of each connecting piece and is narrower than the first connecting portion, are connected to each other, and
Since the first and second connecting portions are alternately arranged on the end surfaces of the first and second circuit boards, when the printed wiring board is handled, the first and second circuit boards are arranged between the first and second circuit boards. Thus, the stress applied to each connecting piece can be dispersed over the entire first connecting portion and the second connecting portion, and can be prevented from being concentrated only on the narrow second connecting portion. As a result, the connection strength between each connecting piece and each first and second circuit board is improved, and the printed wiring board can be easily handled without accidentally breaking the connecting piece when handling the printed wiring board. Becomes Also,
When obtaining the first and second circuit boards from the printed wiring board, the first connecting portion and the second connecting portion of each connecting piece are cut to remove each connecting piece. At this time, Since holes are formed in the wide first connecting portions and the second connecting portions are formed in a narrow width, the first connecting portions, the second connecting portions
The connection can be cut very easily.

【0009】また、請求項3に記載の発明に係るプリン
ト配線板では、2つの回路基板を相互に連結する複数個
の各連結片の両端部に、同一の幅を有する連結部が形成
されるとともに、各連結部には空孔が形成されているこ
とから、プリント配線板を取り扱う際に、各回路基板の
間で各連結片にかかる応力は、各連結部の全体に渡って
均等に分散される。これより、各連結片と各回路基板と
の連結強度は相対的に向上され、プリント配線板の取扱
時に連結片が不用意に破断されることなくプリント配線
板を容易に取り扱うことが可能となる。また、プリント
配線板から2つの各回路基板を取得する際には、各連結
片における各連結部が切断されて各連結片が除去される
が、このとき、各連結部には空孔が形成されているの
で、各連結部の切断は極めて容易に行ない得る。
In the printed wiring board according to the third aspect of the present invention, the connecting portions having the same width are formed at both ends of each of the plurality of connecting pieces for connecting the two circuit boards to each other. At the same time, since holes are formed in each connection part, the stress applied to each connection piece between each circuit board when handling the printed wiring board is evenly distributed over each connection part. To be done. As a result, the connection strength between each connecting piece and each circuit board is relatively improved, and the printed wiring board can be easily handled without accidentally breaking the connecting piece when handling the printed wiring board. . Further, when the two respective circuit boards are obtained from the printed wiring board, the connecting portions of the connecting pieces are cut and the connecting pieces are removed. At this time, holes are formed in the connecting portions. Therefore, the cutting of each connecting portion can be performed very easily.

【0010】[0010]

【実施例】以下、本発明を具体化した実施例に基づいて
図面を参照しつつ詳細に説明する。先ず、本発明の第1
実施例について図1乃至図4に基づき説明する。ここ
に、図1はプリント配線板における2つの回路基板相互
の連結状態を示す平面図、図2は連結片及びその周囲の
寸法関係を示す説明図、図3は2つの回路基板相互の連
結を解除した状態を示す各回路基板の平面図、図4は連
結が解除された一方の回路基板から連結片を削除した状
態を示す回路基板の平面図である。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A detailed description will be given below of an embodiment embodying the present invention with reference to the drawings. First, the first of the present invention
An embodiment will be described with reference to FIGS. Here, FIG. 1 is a plan view showing a connection state of two circuit boards in a printed wiring board, FIG. 2 is an explanatory view showing a dimensional relationship between a connection piece and its periphery, and FIG. 3 is a view showing connection between two circuit boards. FIG. 4 is a plan view of each circuit board in a released state, and FIG. 4 is a plan view of the circuit board in a state in which a connecting piece is removed from one circuit board in which the connection is released.

【0011】図1において、プリント配線板Pは銅張耐
熱ガラスエポキシ基板(板厚1.6mm)からなり、基
本的に2つの回路基板1及び2を複数個(図1には3個
を示す)の連結片3、4、5を介して相互に連結した構
成を有する。各連結片3、4、5により各回路基板1、
2間には、L字状の切断溝Cが設けられている。
In FIG. 1, a printed wiring board P is made of a copper-clad heat-resistant glass epoxy board (board thickness: 1.6 mm), and basically has a plurality of two circuit boards 1 and 2 (three shown in FIG. 1). ) Are connected to each other via connecting pieces 3, 4, and 5. Each connection board 3, 4 and 5 connects each circuit board 1,
An L-shaped cutting groove C is provided between the two.

【0012】かかる切断溝Cは、NCカッタに取り付け
られた直径1mmのダイスを有するルータを使用してプ
リント配線板Pの切削加工を行なうことにより形成さ
れ、このような切断溝Cの形成と同時に、回路基板1、
2、連結片3、4、5がプリント配線板Pにおいて所定
の形状(図1参照)に作成されるものである。尚、ルー
タを使用してプリント配線板Pの切削加工を行なう点に
ついては公知であるので、ここではその説明を省略す
る。
The cutting groove C is formed by cutting the printed wiring board P using a router having a die with a diameter of 1 mm attached to an NC cutter, and at the same time as forming such a cutting groove C. , Circuit board 1,
2. The connecting pieces 3, 4, 5 are formed in the printed wiring board P in a predetermined shape (see FIG. 1). Since it is known that the printed wiring board P is cut using a router, its description is omitted here.

【0013】前記のように形成された各連結片3、4、
5は、それぞれの両端部に幅広の連結部3A、4A、5
Aと連結部3A、4A、5Aよりも幅狭にされた連結部
3B、4B、5Bとが設けられており、これらの各連結
片3、4、5における各連結部3A、3B、4A、4
B、5A、5Bを介して、各回路基板1と回路基板2と
が相互に連結されている。
The connecting pieces 3, 4, formed as described above,
5 is a wide connecting portion 3A, 4A, 5 at each end.
A and connecting portions 3B, 4B, 5B narrower than the connecting portions 3A, 4A, 5A are provided, and the connecting portions 3A, 3B, 4A in the connecting pieces 3, 4, 5 are provided. Four
The respective circuit boards 1 and 2 are connected to each other via B, 5A, and 5B.

【0014】ここに、連結片3の幅広連結部3Aは回路
基板1の端面(図1中左側端面)に連結され、幅狭連結
部3Bは回路基板2の端面(図1中左側端面)に連結さ
れている。また、連結片4の幅広連結部4Aは回路基板
2の端面(図1中下側端面)に連結され、幅狭連結部4
Bは回路基板1の端面(図1中下側端面)に連結されて
いる。更に、連結片5の幅広連結部5Aは回路基板1の
端面(図1中下側端面)に連結され、幅狭連結部5Bは
回路基板2の端面(図1中下側端面)に連結されてい
る。
Here, the wide connecting portion 3A of the connecting piece 3 is connected to the end surface of the circuit board 1 (the left end surface in FIG. 1), and the narrow connecting portion 3B is connected to the end surface of the circuit board 2 (the left end surface in FIG. 1). It is connected. Further, the wide connecting portion 4A of the connecting piece 4 is connected to the end surface (the lower end surface in FIG. 1) of the circuit board 2, and the narrow connecting portion 4 is formed.
B is connected to the end face of the circuit board 1 (lower end face in FIG. 1). Further, the wide connecting portion 5A of the connecting piece 5 is connected to the end surface (lower end surface in FIG. 1) of the circuit board 1, and the narrow connecting portion 5B is connected to the end surface of the circuit board 2 (lower end surface in FIG. 1). ing.

【0015】これらの関係を各回路基板1、2の側で見
てみると、回路基板1の端面側には、連結片3の幅広連
結部3A、連結片4の幅狭連結部4B、及び、連結片5
の幅広連結部5Aが、この順で配列されており、これに
対して、回路基板2の端面側では、前記各連結部3A、
4B、5Aに対応して、連結片3の幅狭連結部3B、連
結片4の幅広連結部4A、連結片5の幅狭連結部5Bが
この順で配列されている。かかる構成によれば、各連結
片3、4、5における幅狭連結部3B、4B、5Bが、
各回路基板1、2に端面に渡って交互に配列されること
となり、従って、プリント配線板Pの取扱時に回路基板
1、2の撓み等から生じる応力は、各連結部3A、3
B、4A、4B、5A、5Bの全体に渡って分散され
る。これにより、前記のような応力が各幅狭連結部3
B、4B、5Bのみに集中することが回避され、不用意
に破断されることはない。
Looking at these relationships on the side of each of the circuit boards 1 and 2, on the end face side of the circuit board 1, the wide connecting portion 3A of the connecting piece 3, the narrow connecting portion 4B of the connecting piece 4, and , Connecting piece 5
The wide connecting portions 5A are arranged in this order. On the other hand, on the end face side of the circuit board 2, the connecting portions 3A,
Corresponding to 4B and 5A, the narrow connecting portion 3B of the connecting piece 3, the wide connecting portion 4A of the connecting piece 4, and the narrow connecting portion 5B of the connecting piece 5 are arranged in this order. According to this structure, the narrow connecting portions 3B, 4B, 5B of the connecting pieces 3, 4, 5 are
Since the circuit boards 1 and 2 are alternately arranged over the end faces, the stress generated due to the bending of the circuit boards 1 and 2 when the printed wiring board P is handled is reduced by the connecting portions 3A and 3A.
B, 4A, 4B, 5A, 5B are dispersed throughout. As a result, the stress as described above is applied to each narrow connecting portion 3
Focusing only on B, 4B, and 5B is avoided, and it is not accidentally broken.

【0016】また、各連結片3、4、5の幅広連結部3
A、4A、5Aには、それぞれ空孔6、7、8が形成さ
れている。これらの各空孔6、7、8を介して、各幅広
連結部3A、4A、5Aは、各回路基板1、2との連結
強度を一定以上に保持しつつ、その切断が容易に行なわ
れ得るものである。
The wide connecting portion 3 of each connecting piece 3, 4, 5
Holes 6, 7, and 8 are formed in A, 4A, and 5A, respectively. The wide connecting portions 3A, 4A, 5A are easily cut through the holes 6, 7, 8 while maintaining the connection strength with the circuit boards 1, 2 at a certain level or more. I will get it.

【0017】更に、連結片3の幅広連結部3Aの両側に
は、回路基板1の端面から内方に入り込むように凹部9
が形成されており、また、幅狭連結部3Bの両側には、
回路基板2の端面から内方に入り込むように凹部10が
形成されている。同様に、連結片4の幅広連結部4Aの
両側には、回路基板2の端面から内方に入り込むように
凹部11が形成され、また、幅狭連結部4Bの両側に
は、回路基板1の端面から内方に入り込むように凹部1
2が形成されている。更に、同様に、連結片5の幅広連
結部5Aの両側には、回路基板1の端面から内方に入り
込むように凹部13が形成され、また、幅狭連結部5B
の両側には、回路基板2の端面から内方に入り込むよう
に凹部14が形成されている。これらの各凹部9乃至1
4は、プリント配線板Pから各連結片3、4、5を削除
して2つの回路基板1、2を取得する際に、各連結片
3、4、5における各連結部3A、3B、4A、4B、
5A、5Bと各回路基板1、2の端面との切断部が各回
路基板1、2の端面から外方に突出しないように作用す
るものである。これにより、切断部にバリが発生した場
合においても、バリの研磨作業を行なうことなく各回路
基板1、2の大きさを確実に規格寸法内に収めることが
可能となる。
Further, recesses 9 are formed on both sides of the wide connecting portion 3A of the connecting piece 3 so as to enter inward from the end surface of the circuit board 1.
Are formed, and on both sides of the narrow connecting portion 3B,
The recess 10 is formed so as to enter the circuit board 2 from the end surface thereof. Similarly, recesses 11 are formed on both sides of the wide connecting portion 4A of the connecting piece 4 so as to enter inward from the end surface of the circuit board 2, and on both sides of the narrow connecting portion 4B of the circuit board 1. Recess 1 so that it goes inward from the end face
2 is formed. Further, similarly, the concave portions 13 are formed on both sides of the wide connecting portion 5A of the connecting piece 5 so as to enter inward from the end surface of the circuit board 1, and the narrow connecting portion 5B is formed.
Recesses 14 are formed on both sides of the recess so as to enter inward from the end surface of the circuit board 2. Each of these recesses 9 to 1
4 removes the connecting pieces 3, 4, 5 from the printed wiring board P and obtains the two circuit boards 1, 2 by connecting the connecting portions 3A, 3B, 4A in the connecting pieces 3, 4, 5 respectively. 4B,
The cut portions between 5A and 5B and the end faces of the circuit boards 1 and 2 act so as not to project outward from the end faces of the circuit boards 1 and 2. As a result, even when burrs are generated in the cut portion, the sizes of the circuit boards 1 and 2 can be surely kept within the standard dimensions without polishing the burrs.

【0018】次に、図2に基づき各連結片3、4、5及
びその周囲の寸法関係について説明する。尚、各連結片
3、4、5等の寸法関係については、それぞれ同一の関
係を有することから、図2では連結片3を例にとって寸
法関係が示されている。
Next, the dimensional relationship between the connecting pieces 3, 4, 5 and their surroundings will be described with reference to FIG. The dimensional relationships among the connecting pieces 3, 4, 5 and the like have the same relationship, and therefore the dimensional relationship is shown in FIG. 2 by taking the connecting piece 3 as an example.

【0019】図2において、切断溝Cの幅aは3mm
(ルータのダイス径の3倍)に設定されており、後述す
るように、各連結部3A、3Bを切断する際にニッパ等
の工具が入り易いように形成されている。また、連結片
3の幅b(幅広連結部3Aの幅も同様)は2.5mmに
設定され、幅狭連結部3Bの幅cは1.5mmに設定さ
れている。更に、空孔6の直径はルータのダイス径と同
一である1mmに、空孔6から連結部3Aの外側縁まで
の幅dは、それぞれ0.75mmに、凹部9の幅eは1
mm(ダイス径と同一)に、凹部10の幅fは1mm
(ダイス径と同一)に、それぞれ設定されている。
In FIG. 2, the width a of the cutting groove C is 3 mm.
It is set to (3 times the diameter of the die of the router), and is formed so that a tool such as a nipper can be easily inserted when cutting the connecting portions 3A and 3B, as described later. Further, the width b of the connecting piece 3 (the same applies to the width of the wide connecting portion 3A) is set to 2.5 mm, and the width c of the narrow connecting portion 3B is set to 1.5 mm. Further, the diameter of the hole 6 is 1 mm, which is the same as the diameter of the router die, the width d from the hole 6 to the outer edge of the connecting portion 3A is 0.75 mm, and the width e of the recess 9 is 1.
mm (the same as the die diameter), the width f of the recess 10 is 1 mm
(Same as the die diameter).

【0020】そして、前記のように構成されたプリント
配線板Pにおける各回路基板1、2には、その両面に接
着された銅箔のエッチング加工を行なうことにより、所
定の回路パターンが形成されている。続いて、前記のよ
うに構成されたプリント配線板Pから各連結片3、4、
5を削除して2つの回路基板1、2を取得する方法につ
いて図3、図4に基づき説明する。先ず、前記のように
所定の回路パターンが形成された各回路基板1、2上に
各種の電子部品を実装した後、各回路基板1、2の切断
作業が行なわれる。かかる切断作業において、先ず、ニ
ッパ等の工具を切断溝C内に挿入し、連結片3における
幅狭連結部3B、連結片4における幅広連結部4A、及
び、連結片5における幅狭連結部5Bを切断する。これ
により、図3に示すように、各回路基板1と2は、相互
に分離される。この状態において、回路基板1では、連
結片3及び連結片5が、それぞれ幅広連結部3A、5A
にて連結されたままであり、また、回路基板2では、連
結片4が幅広連結部4Aにて連結されたままの状態にあ
る。
Then, a predetermined circuit pattern is formed on each of the circuit boards 1 and 2 in the printed wiring board P having the above-described structure by etching the copper foil adhered on both sides thereof. There is. Then, from the printed wiring board P configured as described above, the connecting pieces 3, 4,
A method for deleting the circuit board 5 and obtaining the two circuit boards 1 and 2 will be described with reference to FIGS. 3 and 4. First, after mounting various electronic components on the circuit boards 1 and 2 on which the predetermined circuit patterns are formed as described above, the cutting operation of the circuit boards 1 and 2 is performed. In such a cutting operation, first, a tool such as a nipper is inserted into the cutting groove C, and the narrow connecting portion 3B of the connecting piece 3, the wide connecting portion 4A of the connecting piece 4, and the narrow connecting portion 5B of the connecting piece 5 are inserted. Disconnect. As a result, as shown in FIG. 3, the circuit boards 1 and 2 are separated from each other. In this state, in the circuit board 1, the connecting piece 3 and the connecting piece 5 have the wide connecting portions 3A and 5A, respectively.
In the circuit board 2, the connecting piece 4 is still connected by the wide connecting portion 4A.

【0021】尚、回路基板1において連結片4の幅狭連
結部4Bから切断された切断部は、前記したように凹部
12の存在に基づき、回路基板1の端面よりも内方の位
置に存在し、また、同様に、回路基板2において連結片
3の幅狭連結部3Bから切断された切断部、及び、連結
片5の幅狭連結部5Bから切断された切断部は、それぞ
れ凹部10、14の存在に基づき、回路基板2の端面よ
りも内方の位置に存在する。
The cut portion cut from the narrow connecting portion 4B of the connecting piece 4 in the circuit board 1 exists at a position inside the end surface of the circuit board 1 due to the presence of the recess 12 as described above. Similarly, in the circuit board 2, the cut portion cut from the narrow connecting portion 3B of the connecting piece 3 and the cut portion cut from the narrow connecting portion 5B of the connecting piece 5 are respectively recessed portions 10, Based on the existence of 14, the circuit board 2 exists at a position inward of the end surface of the circuit board 2.

【0022】この後、回路基板1における連結片3の幅
広連結部3A、及び、連結片5の幅広連結部5Aを、そ
れぞれ空孔6、8を通るようにニッパ等の工具により切
断する。これにより、製品として使用可能な回路基板1
が得られる。このとき、連結片3の幅広連結部3Aの切
断面、及び、連結片5の幅広連結部5Aの切断面は、図
4に示すように、それぞれ凹部9、凹部13の存在に基
づき、回路基板1の端面よりも内方の位置に存在し、従
って、前記のように連結片4の幅狭連結部4Bから切断
された切断部が回路基板1の端面よりも内方の位置に存
在こととも相まって、回路基板1はそのまま製品として
使用することが可能となるものである。
After that, the wide connecting portion 3A of the connecting piece 3 and the wide connecting portion 5A of the connecting piece 5 in the circuit board 1 are cut by a tool such as a nipper so as to pass through the holes 6 and 8, respectively. As a result, the circuit board 1 that can be used as a product
Is obtained. At this time, the cut surface of the wide connecting portion 3A of the connecting piece 3 and the cut surface of the wide connecting portion 5A of the connecting piece 5 are based on the existence of the concave portion 9 and the concave portion 13, respectively, as shown in FIG. 1 is located inside the end face of the circuit board 1. Therefore, the cutting portion cut from the narrow connecting portion 4B of the connecting piece 4 as described above may be located inside the end face of the circuit board 1. Together, the circuit board 1 can be used as a product as it is.

【0023】次に、回路基板2における連結片4の幅広
連結部4Aを空孔7を通るようにニッパ等の工具により
切断する。これにより、製品として使用可能な回路基板
2が得られる。このとき、連結片4の幅広連結部4Aの
切断面は、凹部11の存在に基づき、回路基板2の端面
よりも内方の位置に存在し、従って、前記のように連結
片3の幅狭連結部3Bの切断面、及び、連結片5の幅狭
連結部5Bの切断面が回路基板2の端面よりも内方の位
置に存在することとも相まって、回路基板2はそのまま
製品として使用することが可能となるものである。
Next, the wide connecting portion 4A of the connecting piece 4 on the circuit board 2 is cut by a tool such as a nipper so as to pass through the hole 7. As a result, the circuit board 2 that can be used as a product is obtained. At this time, the cut surface of the wide connecting portion 4A of the connecting piece 4 is located inside the end surface of the circuit board 2 due to the presence of the recess 11, and thus the width of the connecting piece 3 is narrow as described above. The fact that the cut surface of the connecting portion 3B and the cut surface of the narrow connecting portion 5B of the connecting piece 5 are located inside the end surface of the circuit board 2 allows the circuit board 2 to be used as it is as a product. Is possible.

【0024】以上説明した通り第1実施例に係るプリン
ト配線板Pでは、各連結片3、4、5における各連結部
3A、3B、4A、4B、5A、5Bを介して回路基板
1及び回路基板2を相互に連結するとともに、回路基板
1の端面側には、連結片3の幅広連結部3A、連結片4
の幅狭連結部4B、及び、連結片5の幅広連結部5A
を、この順で配列し、また、回路基板2の端面側では、
前記各連結部3A、4B、5Aに対応して、連結片3の
幅狭連結部3B、連結片4の幅広連結部4A、連結片5
の幅狭連結部5Bをこの順で配列することにより、各連
結片3、4、5における幅狭連結部3B、4B、5B
が、各回路基板1、2に端面に渡って交互に配列される
ように構成したので、プリント配線板Pの取扱時に回路
基板1、2の撓み等から生じる応力を、各連結部3A、
3B、4A、4B、5A、5Bの全体に渡って分散する
ことができる。これにより、前記のような応力が各幅狭
連結部3B、4B、5Bのみに集中することを回避し
て、不用意に破断されることを確実に防止することがで
きるものである。
As described above, in the printed wiring board P according to the first embodiment, the circuit board 1 and the circuit are connected via the connecting portions 3A, 3B, 4A, 4B, 5A, 5B of the connecting pieces 3, 4, 5. The boards 2 are connected to each other, and on the end face side of the circuit board 1, the wide connecting portion 3A of the connecting piece 3 and the connecting piece 4
Narrow connecting portion 4B and wide connecting portion 5A of the connecting piece 5
Are arranged in this order, and on the end face side of the circuit board 2,
Corresponding to the respective connecting portions 3A, 4B, 5A, the narrow connecting portion 3B of the connecting piece 3, the wide connecting portion 4A of the connecting piece 4, the connecting piece 5
By arranging the narrow connecting portions 5B in this order, the narrow connecting portions 3B, 4B, 5B in each of the connecting pieces 3, 4, 5 are arranged.
However, since the circuit boards 1 and 2 are arranged so as to be alternately arranged over the end faces, the stress caused by the bending of the circuit boards 1 and 2 when the printed wiring board P is handled is reduced by the connecting portions 3A,
It can be dispersed throughout 3B, 4A, 4B, 5A, 5B. As a result, it is possible to prevent the stress as described above from concentrating only on the narrow connecting portions 3B, 4B, 5B, and reliably prevent accidental breakage.

【0025】また、各連結片3、4、5の幅広連結部3
A、4A、5Aには、それぞれ空孔6、7、8を形成し
たので、これらの各空孔6、7、8を介して、各幅広連
結部3A、4A、5Aにより、各回路基板1、2との連
結強度を一定以上に保持しつつ、その切断を容易に行な
うことができる。
The wide connecting portion 3 of each connecting piece 3, 4, 5
Since holes 6, 7, and 8 are formed in A, 4A, and 5A, respectively, each circuit board 1 is formed by the wide connecting portions 3A, 4A, and 5A via these holes 6, 7, and 8. It is possible to easily perform the cutting while maintaining the connection strength with 2 above a certain level.

【0026】更に、連結片3の幅広連結部3Aの両側に
は凹部9、幅狭連結部3Bの両側には凹部10を形成
し、また、連結片4の幅広連結部4Aの両側には凹部1
1、幅狭連結部4Bの両側には凹部12を形成し、更
に、連結片5の幅広連結部5Aの両側には凹部13、幅
狭連結部5Bの両側には凹部14を形成したので、これ
らの各凹部9乃至14を介してプリント配線板Pから各
連結片3、4、5を削除して2つの回路基板1、2を取
得する際に、各連結3、4、5における各連結部3A、
3B、4A、4B、5A、5Bと各回路基板1、2の端
面との切断部を各回路基板1、2の端面よりも内方の位
置に存在せしめることができる。これにより、切断部に
バリが発生した場合においても、バリの研磨作業を行な
うことなく各回路基板1、2の大きさを確実に規格寸法
内に収めることができるものである。
Further, a concave portion 9 is formed on both sides of the wide connecting portion 3A of the connecting piece 3, a concave portion 10 is formed on both sides of the narrow connecting portion 3B, and a concave portion is formed on both sides of the wide connecting portion 4A of the connecting piece 4. 1
1. Since the recesses 12 are formed on both sides of the narrow connecting portion 4B, the recesses 13 are formed on both sides of the wide connecting portion 5A of the connecting piece 5, and the recesses 14 are formed on both sides of the narrow connecting portion 5B. When removing the connecting pieces 3, 4, 5 from the printed wiring board P via the respective recesses 9 to 14 to obtain the two circuit boards 1 and 2, the connecting connections of the connecting connections 3, 4 and 5 are obtained. Part 3A,
The cut portion between 3B, 4A, 4B, 5A, 5B and the end surface of each circuit board 1, 2 can be located at a position more inward than the end surface of each circuit board 1, 2. As a result, even if burrs are generated at the cut portion, the sizes of the circuit boards 1 and 2 can be surely kept within the standard dimensions without polishing the burrs.

【0027】続いて、本発明の第2実施例について図5
乃至図7に基づき説明する。ここに、図5はプリント配
線板における2つの回路基板相互の連結状態を示す平面
図、図6は連結片及びその周囲の寸法関係を示す説明
図、図7は他の連結片及びその周囲の寸法関係を示す説
明図である。
Next, the second embodiment of the present invention will be described with reference to FIG.
It will be described with reference to FIG. Here, FIG. 5 is a plan view showing a connection state between two circuit boards in a printed wiring board, FIG. 6 is an explanatory view showing a dimensional relationship between a connecting piece and its surroundings, and FIG. 7 is another connecting piece and its surroundings. It is explanatory drawing which shows a dimensional relationship.

【0028】図5において、プリント配線板Qは、前記
第1実施例と同様、銅張耐熱ガラスエポキシ基板(板厚
1.6mm)からなり、基本的に2つの回路基板21及
び22を複数個(図1には3個を示す)の連結片23、
24、25を介して相互に連結した構成を有する。各連
結片23、24、25により各回路基板21、22間に
は、L字状の切断溝Dが設けられている。
In FIG. 5, the printed wiring board Q is made of a copper clad heat-resistant glass epoxy board (board thickness 1.6 mm) as in the case of the first embodiment, and basically comprises two circuit boards 21 and 22. Connecting pieces 23 (three shown in FIG. 1),
It has the structure connected mutually via 24 and 25. An L-shaped cutting groove D is provided between the circuit boards 21 and 22 by the connecting pieces 23, 24 and 25.

【0029】かかる切断溝Dは、前記第1実施例におけ
ると同様、NCカッタに取り付けられた直径1mmのダ
イスを有するルータを使用してプリント配線板Pの切削
加工を行なうことにより形成され、このような切断溝D
の形成と同時に、回路基板21、22、連結片23、2
4、25がプリント配線板Qにおいて所定の形状(図1
参照)に作成されるものである。
The cutting groove D is formed by cutting the printed wiring board P by using a router having a die with a diameter of 1 mm attached to the NC cutter, as in the first embodiment. Such a cutting groove D
Simultaneously with the formation of the circuit board, the circuit boards 21, 22, the connecting pieces 23, 2,
4 and 25 have a predetermined shape (see FIG. 1) on the printed wiring board Q.
(See) is created.

【0030】前記のように形成された各連結片23、2
4、25は、それぞれの両端部に同一の幅(後述するよ
うに、前記第1実施例における連結片3、4、5の幅よ
りも若干大きい幅に設定されている)を有する連結部2
3A、24A、25Aとが設けられており、これらの各
連結片23、24、25における各連結部23A、24
A、25Aを介して、各回路基板21と回路基板22と
が相互に連結されている。また、各連結片23、24、
25の各連結部23A、24A、25Aには、それぞれ
楕円形状の空孔26、27、28が形成されている。
Each connecting piece 23, 2 formed as described above
The connecting portions 2 and 4 have the same width at both ends (set to a width slightly larger than the width of the connecting pieces 3, 4, and 5 in the first embodiment, as will be described later).
3A, 24A, 25A are provided, and the respective connecting portions 23A, 24 in the respective connecting pieces 23, 24, 25 are provided.
The circuit boards 21 and 22 are connected to each other via A and 25A. In addition, each connecting piece 23, 24,
Elliptical holes 26, 27, 28 are formed in each of the connecting portions 23A, 24A, 25A of 25.

【0031】かかる構成に基づき、プリント配線板Qの
取扱時に回路基板21、22の撓み等から生じる応力
は、各連結部23A、24A、25Aの全体に渡って分
散されることとなり、これにより、前記のような応力が
各連結部23A、24A、25Aに集中することが回避
され、各連結部23A、24A、25Aにて不用意に破
断されることはない。また、各連結部23A、24A、
25Aには、それぞれ楕円形状の空孔26、27、28
が形成されていることから、これらの各空孔26、2
7、28を介して、各連結部23A、24A、25A
は、各回路基板21、22との連結強度を一定以上に保
持しつつ、その切断が容易に行なわれ得るものである。
Based on this structure, the stress caused by the bending of the circuit boards 21 and 22 when handling the printed wiring board Q is dispersed over the entire connecting portions 23A, 24A and 25A. The stress as described above is prevented from being concentrated on each of the connecting portions 23A, 24A, 25A, and is not inadvertently broken at each of the connecting portions 23A, 24A, 25A. In addition, each connecting portion 23A, 24A,
25A has elliptical holes 26, 27, 28, respectively.
Since these holes are formed, these holes 26, 2
7, 28A through each of the connecting portions 23A, 24A, 25A
Can be easily cut while maintaining the connection strength with each of the circuit boards 21 and 22 above a certain level.

【0032】次に、図6に基づき各連結片23、24、
25及びその周囲の寸法関係について説明する。尚、各
連結片23、24、25等の寸法関係については、それ
ぞれ同一の関係を有することから、図6では連結片23
を例にとって寸法関係が示されている。
Next, based on FIG. 6, each connecting piece 23, 24,
25 and the dimensional relationship of the circumference | surroundings are demonstrated. The dimensional relationships of the connecting pieces 23, 24, 25, etc. have the same relationship. Therefore, in FIG.
As an example, the dimensional relationship is shown.

【0033】図6において、切断溝Dの幅gは3mm
(ルータのダイス径の3倍)に設定されており、各連結
部23Aを切断する際にニッパ等の工具が入り易いよう
に形成されている。また、連結片23の幅hは3.5m
mに設定されている。更に、楕円形状を有する空孔26
の長軸方向の長さiは1.5mmに、短軸方向の長さj
はルータのダイス径と同一である1mmに、それぞれ設
定されており、また、各空孔26間の距離kは1mm
に、各空孔26における長軸方向の端縁から連結片23
の端縁までの距離lは1mmに、それぞれ設定されてい
る。
In FIG. 6, the width g of the cutting groove D is 3 mm.
It is set to (3 times the diameter of the die of the router), and is formed so that a tool such as a nipper can easily enter when cutting each connecting portion 23A. The width h of the connecting piece 23 is 3.5 m.
It is set to m. Further, the holes 26 having an elliptical shape
Has a length i in the major axis direction of 1.5 mm and a length j in the minor axis direction
Is set to 1 mm, which is the same as the diameter of the router die, and the distance k between the holes 26 is 1 mm.
In addition, from the long-axis direction edge of each hole 26 to the connecting piece 23
The distance l to the edge is set to 1 mm.

【0034】そして、前記のように構成されたプリント
配線板Qにおける各回路基板21、22には、その両面
に接着された銅箔のエッチング加工を行なうことによ
り、所定の回路パターンが形成されている。尚、プリン
ト配線板Qから各回路基板21、22を分離する作業に
ついては、前記第1実施例におけると同様であるので、
ここではその説明を省略する。
Then, a predetermined circuit pattern is formed on each of the circuit boards 21 and 22 in the printed wiring board Q having the above-described structure by etching the copper foil adhered to both surfaces thereof. There is. Since the work of separating the circuit boards 21 and 22 from the printed wiring board Q is the same as that in the first embodiment,
The description is omitted here.

【0035】以上説明した通り第2実施例に係るプリン
ト配線板Qでは、各連結片23、24、25における比
較的幅広の各連結部23A、24A、25Aを介して回
路基板21及び回路基板22を相互に連結するととも
に、各連結片23、24、25の連結部23A、24
A、25Aには、それぞれ楕円形状の空孔26、27、
28を形成したので、プリント配線板Qの取扱時に回路
基板21、22の撓み等から生じる応力を、各連結部2
3A、24A、25Aの全体に渡って分散して各連結部
23A、24A、25Aが不用意に破断されることを確
実に防止することができるとともに、各空孔26、2
7、28を介して、各回路基板21、22との連結強度
を一定以上に保持しつつ、その切断を容易に行なうこと
ができる。
As described above, in the printed wiring board Q according to the second embodiment, the circuit board 21 and the circuit board 22 are connected via the relatively wide connecting portions 23A, 24A, 25A of the connecting pieces 23, 24, 25. And the connecting portions 23A, 24 of the connecting pieces 23, 24, 25.
A and 25A have elliptical holes 26, 27, and
Since 28 is formed, stress generated by bending of the circuit boards 21 and 22 when the printed wiring board Q is handled is reduced by each connecting portion 2.
It is possible to reliably prevent the connecting portions 23A, 24A, 25A from being dispersed over the entire 3A, 24A, 25A and being inadvertently broken, and to prevent the holes 26, 2 from being broken.
It is possible to easily disconnect the circuit boards 21 and 22 through the wires 7 and 28 while maintaining the connection strength with the circuit boards 21 and 22 at a certain level or more.

【0036】尚、前記第2実施例における各連結片2
3、24、25の形状、寸法関係については、図7に示
すような形状、寸法関係としても前記と同様の効果を得
ることができる。ここに、各連結片23、24、25は
相互に同一の構成を有しており、図7では連結片23を
例にとって示されている。また、以下では、図6に示し
た寸法と異なる点のみについて説明する。
Incidentally, each connecting piece 2 in the second embodiment.
Regarding the shapes and dimensional relationships of 3, 24 and 25, the same effects as described above can be obtained even if the shapes and dimensional relationships shown in FIG. 7 are used. Here, the connecting pieces 23, 24, 25 have the same configuration as each other, and the connecting piece 23 is shown as an example in FIG. 7. Further, hereinafter, only points different from the dimensions shown in FIG. 6 will be described.

【0037】図7において、連結片23には各空孔26
に対向して4つの円弧状部29が形成されており、かか
る各円弧状部29における半径mは0.5mm(ルータ
のダイス径の半分)に設定されている。また、各空孔2
6における長軸方向の端縁から連結片23の端縁までの
距離nは0.5mmに設定されている。その他の寸法に
ついては、図6に示した寸法と同一の寸法に設定されて
いる。
In FIG. 7, the connecting piece 23 has holes 26.
4 arc-shaped portions 29 are formed facing each other, and the radius m of each of the arc-shaped portions 29 is set to 0.5 mm (half the router die diameter). Also, each hole 2
The distance n from the edge in the long axis direction of 6 to the edge of the connecting piece 23 is set to 0.5 mm. The other dimensions are set to the same dimensions as those shown in FIG.

【0038】以上詳細に説明した通り第1実施例及び第
2実施例に係るプリント配線板P、Qでは、各連結片
3、4、5と各回路板1、2、及び、各連結片23、2
4、25と回路基板21、22との連結強度を向上して
プリント配線板P、Qの取扱時に連結片3、4、5、2
3、24、25が不用意に破断されることなく取扱を容
易にして不良品の発生を低減することができるととも
に、各連結片3、4、5、23、24、25における連
結部の切断を極めて簡単に行なうことができるものであ
る。
As described in detail above, in the printed wiring boards P and Q according to the first and second embodiments, the connecting pieces 3, 4, 5 and the circuit boards 1, 2 and the connecting pieces 23 are provided. Two
4 and 25 and the circuit boards 21 and 22 are improved in connection strength so that the connection pieces 3, 4, 5, 2 can be handled when the printed wiring boards P and Q are handled.
3, 24, 25 can be easily handled without being broken carelessly and the occurrence of defective products can be reduced, and the connecting portion of each connecting piece 3, 4, 5, 23, 24, 25 can be cut. Can be performed very easily.

【0039】[0039]

【発明の効果】以上説明した通り本発明は、各連結片と
各回路基板との連結強度を向上してプリント配線板の取
扱時に連結片が不用意に破断されることなく取扱を容易
にして不良品の発生を低減することができるとともに、
各連結片における連結部の切断を極めて簡単に行なうこ
とができるプリント配線板を提供することがてき、その
産業上奏する効果は大である。
As described above, according to the present invention, the connection strength between each connecting piece and each circuit board is improved to facilitate the handling of the printed wiring board without accidentally breaking the connecting piece. The number of defective products can be reduced and
It has been possible to provide a printed wiring board in which the connecting portion of each connecting piece can be cut very easily, and the industrial effect thereof is great.

【図面の簡単な説明】[Brief description of drawings]

【図1】第1実施例に係るプリント配線板における2つ
の回路基板相互の連結状態を示す平面図である。
FIG. 1 is a plan view showing a connection state of two circuit boards in a printed wiring board according to a first embodiment.

【図2】連結片及びその周囲の寸法関係を示す説明図で
ある。
FIG. 2 is an explanatory diagram showing a dimensional relationship between a connecting piece and its periphery.

【図3】2つの回路基板相互の連結を解除した状態を示
す各回路基板の平面図である。
FIG. 3 is a plan view of each circuit board showing a state where the two circuit boards are disconnected from each other.

【図4】連結が解除された一方の回路基板から連結片を
削除した状態を示す回路基板の平面図である。
FIG. 4 is a plan view of a circuit board showing a state in which a connecting piece is removed from one circuit board whose connection has been released.

【図5】第2実施例に係るプリント配線板における2つ
の回路基板相互の連結状態を示す平面図である。
FIG. 5 is a plan view showing a state where two circuit boards are connected to each other in the printed wiring board according to the second embodiment.

【図6】連結片及びその周囲の寸法関係を示す説明図で
ある。
FIG. 6 is an explanatory view showing a dimensional relationship between a connecting piece and its periphery.

【図7】第2実施例に係る他の連結片及びその周囲の寸
法関係を示す説明図である。
FIG. 7 is an explanatory diagram showing a dimensional relationship of another connecting piece and its periphery according to the second embodiment.

【符号の説明】[Explanation of symbols]

1、2・・・回路基板、3、4、5・・・連結片、3
A、4A、5A・・・幅広連結部、3B、4B、5B・
・・幅狭連結部、6、7、8・・・空孔、21、22・
・・回路基板、23、24、25・・・連結片、23
A、24A、25A・・・連結部、26、27、28・
・・空孔、C、D・・・切断溝、P、Q・・・プリント
配線板
1, 2 ... Circuit board, 3, 4, 5 ... Connecting piece, 3
A, 4A, 5A ... Wide connecting part, 3B, 4B, 5B
..Narrow connection parts, 6, 7, 8 ... Holes, 21, 22 ...
..Circuit boards, 23, 24, 25 ... Connecting pieces, 23
A, 24A, 25A ... connecting portion, 26, 27, 28 ...
..Vacancy, C, D ... Cutting groove, P, Q ... Printed wiring board

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 少なくとも2つの第1及び第2回路基
板が相互に対向する端面間に複数個の連結片を形成し、
各連結片を介して各回路基板を相互に連結するとともに
各連結片を削除することにより各回路基板を取得可能な
プリント配線板において、 前記各連結片の一端に所定の幅をもって形成された第1
連結部と、 前記各連結片の他端に形成され第1連結部よりも幅狭の
第2連結部とを有し、 前記第1及び第2回路基板は前記各連結片の第1及び第
2連結部を介して相互に連結されるとともに、各第1及
び第2連結部は各第1及び第2回路基板の端面にて交互
に配列されたことを特徴とするプリント配線板。
1. A plurality of connecting pieces are formed between end surfaces of at least two first and second circuit boards facing each other,
In a printed wiring board in which each circuit board can be obtained by connecting the circuit boards to each other through the connecting pieces and removing the connecting pieces, a first wiring board having a predetermined width is formed at one end of each of the connecting pieces. 1
A connecting part and a second connecting part formed at the other end of each of the connecting pieces and having a width narrower than that of the first connecting part; and the first and second circuit boards include first and second connecting pieces. A printed wiring board, wherein the first and second connecting portions are connected to each other through two connecting portions, and the first and second connecting portions are alternately arranged on the end faces of the first and second circuit boards.
【請求項2】 前記第1連結部に空孔を形成したこと
を特徴とする請求項1記載のプリント配線板。
2. The printed wiring board according to claim 1, wherein holes are formed in the first connecting portion.
【請求項3】 少なくとも2つの回路基板が相互に対
向する端面間に複数個の連結片を形成し、各連結片を介
して各回路基板を相互に連結するとともに各連結片を削
除することにより各回路基板を取得可能なプリント配線
板において、 前記各連結片の両端部に形成され、同一の幅を有する連
結部と、 前記各連結部に形成された空孔とを備えたことを特徴と
するプリント配線板。
3. A plurality of connecting pieces are formed between end surfaces of at least two circuit boards facing each other, and the circuit boards are connected to each other through the connecting pieces and the connecting pieces are removed. In a printed wiring board capable of obtaining each circuit board, it is provided with a connecting portion formed at both ends of each connecting piece and having the same width, and a hole formed in each connecting portion. Printed wiring board.
JP23883793A 1993-08-30 1993-08-30 Printed-wiring board Pending JPH0766510A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23883793A JPH0766510A (en) 1993-08-30 1993-08-30 Printed-wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23883793A JPH0766510A (en) 1993-08-30 1993-08-30 Printed-wiring board

Publications (1)

Publication Number Publication Date
JPH0766510A true JPH0766510A (en) 1995-03-10

Family

ID=17036017

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23883793A Pending JPH0766510A (en) 1993-08-30 1993-08-30 Printed-wiring board

Country Status (1)

Country Link
JP (1) JPH0766510A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09331121A (en) * 1996-06-11 1997-12-22 Nec Corp Printed circuit board and its dividing method
JP2023164612A (en) * 2018-08-10 2023-11-10 日東電工株式会社 Wired circuit board and its manufacturing method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09331121A (en) * 1996-06-11 1997-12-22 Nec Corp Printed circuit board and its dividing method
JP2023164612A (en) * 2018-08-10 2023-11-10 日東電工株式会社 Wired circuit board and its manufacturing method
US12167544B2 (en) 2018-08-10 2024-12-10 Nitto Denko Corporation Wiring circuit board, producing method thereof, and wiring circuit board assembly sheet

Similar Documents

Publication Publication Date Title
JPH0766510A (en) Printed-wiring board
JPH09162507A (en) Metal base printed circuit board
JPH08181398A (en) Printed board
JP3211609B2 (en) Multilayer electronic component and method of manufacturing the same
JPH10270813A (en) Ceramic substrate with breaking groove and electronic part manufactured from the same
JPH0537271A (en) Electrode forming method for chip parts
JPS59186387A (en) How to join printed circuit boards
JPH07122831A (en) Circuit board and manufacture thereof
JP2000208671A (en) Ceramic substrate, semiconductor device using the same and manufacture thereof
JP2005150134A (en) Electronic circuit unit and its manufacturing method
JP3058999B2 (en) Mejiro wiring board
US6392161B1 (en) Mounting substrate
JPH0498843A (en) Mounting of lsi
JPH06342963A (en) Printed circuit board and dividing method therefor
JP2000151036A (en) Printed circuit board and manufacture thereof
JPS62213291A (en) Multisurface printed wiring board
JPH09293949A (en) Resin circuit board manufacturing method
JPH0778904A (en) Manufacture of printed wiring board
JPH0927659A (en) Flexible printed circuit board
JP2005228969A (en) Electronic component and its manufacturing method
JPH09246099A (en) Electronic component
JP2000225597A (en) Cutting tools for printed wiring boards
JPS6127696A (en) printed circuit board equipment
JPH0964490A (en) Printed wiring board
JP2000012988A (en) Aggregate substrate