JPH07336139A - Oscillator - Google Patents
OscillatorInfo
- Publication number
- JPH07336139A JPH07336139A JP12525094A JP12525094A JPH07336139A JP H07336139 A JPH07336139 A JP H07336139A JP 12525094 A JP12525094 A JP 12525094A JP 12525094 A JP12525094 A JP 12525094A JP H07336139 A JPH07336139 A JP H07336139A
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- Prior art keywords
- hole
- resonator
- dielectric
- screw
- cavity resonator
- Prior art date
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Abstract
(57)【要約】
【目的】 本発明は、例えばMMIC基板上に形成され、μ
波帯やｍｍ波帯で使用する発振器に関し、１枚の小さな
MMIC基板と高Ｑの共振器を用い、MMIC基板上部の空間容
積が小さい状態ても実装できる発振器の提供を図ること
を目的とする。
【構成】 表面に能動素子を含む回路パターンが、裏面
にアースパターンが形成されたモノリシックマイクロ波
集積回路用基板11と金属性筐体２を有する発振器におい
て、モノリシックマイクロ波集積回路用基板の表面に回
路パターン14と接続されるマイクロストリップ線路12
を、マイクロストリップ線路の下部近傍の裏面にスロッ
ト線路13をそれぞれ設けてマイクロストリップ線路−ス
ロット線路変換器を形成すると共に、金属性筐体に空洞
共振器となる穴21を設け、スロット線路が空洞共振器と
結合する様に、モノリシックマイクロ波集積回路用基板
を金属性筐体に取り付けるように構成する。
(57) [Abstract] [Objective] The present invention is formed on an MMIC substrate, for example.
Regarding the oscillator used in the wave band and mm wave band, one small
It is an object of the present invention to provide an oscillator that can be mounted using a MMIC substrate and a high Q resonator even when the space volume above the MMIC substrate is small. [Structure] In an oscillator having a monolithic microwave integrated circuit substrate 11 having a circuit pattern including an active element on the front surface and a ground pattern formed on the back surface and a metallic casing 2, the surface of the monolithic microwave integrated circuit substrate is Microstrip line 12 connected to circuit pattern 14
The slot line 13 is provided on the back surface near the lower part of the microstrip line to form a microstrip line-slot line converter, and a hole 21 to be a cavity resonator is provided in the metal housing, so that the slot line is a cavity. The monolithic microwave integrated circuit substrate is attached to the metallic housing so as to be coupled to the resonator.
Description
【０００１】[0001]
【産業上の利用分野】本発明は、例えば、MMIC基板上に
形成され、マイクロ波帯やミリ波帯で使用される発振器
に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an oscillator formed on an MMIC substrate and used in a microwave band or a millimeter wave band.
【０００２】マイクロ波帯やミリ波帯で使用する発振器
の共振回路に誘電体共振器がよく用いられているが、誘
電体共振器を共振回路として用いる為には、 50Ω伝送線路に結合した誘電体共振器が配置された
MIC 基板を、他の機能部分が形成されたMMIC基板に接続
する。 MMIC基板上に直接、誘電体共振器も配置する。 の２つ方法があるが、いずれの方法も後述する様に課題
がある。A dielectric resonator is often used in a resonance circuit of an oscillator used in a microwave band or a millimeter wave band. In order to use the dielectric resonator as a resonance circuit, a dielectric resonator coupled to a 50Ω transmission line is used. Body resonator was placed
Connect the MIC board to the MMIC board on which other functional parts are formed. Dielectric resonators are also placed directly on the MMIC substrate. There are two methods, but each method has a problem as described later.
【０００３】そこで、上記の課題を解決して、１枚の小
さなMMIC基板と高Ｑの共振器を用い、MMIC基板上部の空
間容積が小さい状態でも実装できる発振器の提供を図る
ことが必要である。Therefore, it is necessary to solve the above problems and to provide an oscillator which can be mounted even when the space volume above the MMIC substrate is small by using one small MMIC substrate and a high Q resonator. .
【０００４】[0004]
【従来の技術】図10は従来例の説明図で、(a) は誘電体
共振器装荷型の発振器の要部構成図、(b) は実装説明
図、(c) は(b) の側面図である。図11は従来例の別の実
装説明図である。2. Description of the Related Art FIG. 10 is an explanatory view of a conventional example, (a) is a schematic view of a dielectric resonator loaded oscillator, (b) is an explanatory view of mounting, and (c) is a side view of (b). It is a figure. FIG. 11 is another mounting explanatory diagram of the conventional example.
【０００５】一般に、MMIC発振器の形式として、誘電体
共振器装荷型、電圧制御型、反射型、帰還型が用いられ
ている。電圧制御型、反射型、帰還型は発振回路をGaAs
基板上に全て集積できるので、平面的に構成できると云
う点でMMIC化した発振器の回路形式としては相応しい。Generally, dielectric resonator loaded type, voltage controlled type, reflection type, and feedback type are used as the types of MMIC oscillators. The voltage control type, the reflection type, and the feedback type use GaAs oscillator circuits.
Since it can be integrated on the substrate, it is suitable for the circuit type of the MMIC oscillator because it can be configured in a plane.
【０００６】しかし、共振器のQ がマイクロ波帯で、例
えば、数百〜千程度と低く、ミリ波帯では更に低くなる
と共に能動素子の能力も劣化するので、位相雑音特性、
周波数安定性の良好な発振器が実現できず、これらの型
の発振器は殆ど用いられていない。However, the Q of the resonator is low in the microwave band, for example, about several hundreds to 1,000, and becomes lower in the millimeter wave band, and the performance of the active element deteriorates.
An oscillator with good frequency stability cannot be realized, and these types of oscillators are rarely used.
【０００７】誘電体装荷型は、誘電体共振器のQ がミリ
波帯でも比較的大きく (εr =25 〜30位の時、約数千)
、準ミリ波帯以上の実用レベルの発振器の回路構成と
してよく用いられている。In the dielectric loaded type, the Q of the dielectric resonator is relatively large even in the millimeter wave band (about several thousand when ε r = 25 to 30).
, Is often used as a circuit configuration of a practical level oscillator in the quasi-millimeter wave band or higher.
【０００８】誘電体共振器装荷型の発振器は、図10(a)
に示す様に、一端が抵抗R2( 例えば、50Ω) で終端さ
れ、他端がFET のゲートに接続されたマイクロストリッ
プ線路32の近傍に円形または角柱形の誘電体共振器31が
配置されている。The dielectric resonator loaded oscillator is shown in FIG.
A circular or prismatic dielectric resonator 31 is placed near a microstrip line 32 with one end terminated by a resistor R 2 (for example, 50Ω) and the other end connected to the gate of the FET, as shown in. There is.
【０００９】そして、ゲートと共振器の距離が約半波長
に設定され、ドレインが接地されているので、ドレイン
・ゲート間に並列共振回路が挿入されたことになる。誘
電体共振器は帯域阻止特性を示すので、共振器とFET と
の距離を選べば共振周波数で安定な発振が得られる。Since the distance between the gate and the resonator is set to about a half wavelength and the drain is grounded, the parallel resonant circuit is inserted between the drain and the gate. Since the dielectric resonator has a band stop characteristic, stable oscillation can be obtained at the resonance frequency by selecting the distance between the resonator and the FET.
【００１０】さて、誘電体共振器を共振回路として用い
る為、図10(b) と図11に示す２つ実装方法が一般に採用
されている。前者の方法は、誘電体共振器31、伝送線路
32、抵抗R2の部分を装荷したMIC 基板( アルミナ基板な
ど)33 と、能動素子、整合回路などを含む点線部分14を
形成したMMIC基板( GaAs基板など)34 を、金ワイヤ321
を用いて接続する様にしたものである。なお、誘電体共
振器31はQ の低下を防ぐ為に低誘電率支持台311 に載せ
てある( 図10(b),(c) 参照) 。Since the dielectric resonator is used as a resonance circuit, the two mounting methods shown in FIGS. 10 (b) and 11 are generally adopted. The former method uses the dielectric resonator 31 and the transmission line.
32, a MIC substrate (alumina substrate, etc.) 33 loaded with the resistor R 2 and an MMIC substrate (GaAs substrate, etc.) 34 with a dotted line portion 14 including active elements, matching circuits, etc.
It is designed to be connected using. The dielectric resonator 31 is mounted on the low dielectric constant support base 311 to prevent the Q from decreasing (see FIGS. 10 (b) and 10 (c)).
【００１１】後者の方法は、MMIC基板35の上に誘電体共
振器以外の機能部品は１回のプロセスで集積し、誘電体
共振器は直接、基板上に置く方法である。ここで、２つ
の方法を比較すると、前者では、MMIC基板の外にMIC 基
板が必要となり、回路全部を１つの基板上に集積するこ
とができない。その為、MMIC化によって得られる低コス
ト化の利点が半減する。また、MIC 基板とMMIC基板との
接続は通常、金ワイヤで行われるが、金ワイヤが共振回
路の一部となっている為に接続状態のバラツキに対応し
て発振周波数がバラツク。後者では、MMIC基板上に誘電
体共振器を配置するスペースが必要となる為、誘電体共
振器を配置しない場合に比してMMIC基板の面積が増大し
てコストが増加する。 通常、発振用能動素子、出力整
合回路を合わせた面積と同等またはそれ以上の面積を誘
電体共振器配置の為に必要である。The latter method is a method in which functional components other than the dielectric resonator are integrated on the MMIC substrate 35 in a single process, and the dielectric resonator is directly placed on the substrate. Here, comparing the two methods, the former requires a MIC substrate in addition to the MMIC substrate, and the entire circuit cannot be integrated on one substrate. Therefore, the advantage of cost reduction obtained by using MMIC is halved. In addition, the connection between the MIC board and the MMIC board is usually made with gold wires, but since the gold wires are part of the resonance circuit, the oscillation frequency fluctuates in response to variations in the connection status. In the latter case, a space for arranging the dielectric resonator on the MMIC substrate is required, so that the area of the MMIC substrate is increased and the cost is increased as compared with the case where the dielectric resonator is not arranged. Usually, an area equal to or larger than the area including the active element for oscillation and the output matching circuit is required for the dielectric resonator arrangement.
【００１２】また、前者、後者共、MMIC基板上やMIC 基
板上に誘電体共振器を配置する為の空間が必要の為、筐
体、パッケージなどの中に誘電体共振器装荷型のMMIC発
振器を実装する時、誘電体共振器の高さの為にMMIC基板
表面から、例えば、封止用蓋などの金属面までの高さを
低くできない。そこで、筐体、パッケージ内部で発生し
た高次モードの不要波は遮断周波数の低いパッケージ内
を伝搬して内部回路の動作に悪影響を与える。Further, both the former and the latter require a space for disposing the dielectric resonator on the MMIC substrate or the MIC substrate. Therefore, a dielectric resonator-loaded MMIC oscillator is provided in a housing, a package, or the like. When mounting, the height from the surface of the MMIC substrate to the metal surface such as the sealing lid cannot be lowered because of the height of the dielectric resonator. Therefore, unwanted waves of higher modes generated in the housing and the package propagate in the package having a low cutoff frequency and adversely affect the operation of the internal circuit.
【００１３】[0013]
【発明が解決しようとする課題】上記の様に、誘電体装
荷型の発振器を１枚のMMIC基板に載せるには、基板面積
が大きくなる。また、MMIC基板の上部空間容積が大きく
なって不要波が伝搬する為、内部回路の動作に悪影響を
与えると云う課題がある。As described above, in order to mount the dielectric loaded oscillator on one MMIC substrate, the substrate area becomes large. In addition, since the volume of the upper space of the MMIC substrate increases and unnecessary waves propagate, there is a problem that the operation of the internal circuit is adversely affected.
【００１４】本発明は、１枚の小さなMMIC基板と高Ｑの
共振器を用い、MMIC基板上部の空間容積が小さい状態で
も実装できる発振器の提供を図ることを目的とする。It is an object of the present invention to provide an oscillator which can be mounted even when the space volume above the MMIC substrate is small by using one small MMIC substrate and a high Q resonator.
【００１５】[0015]
【課題を解決するための手段】図１に示す如く、図中、
２は金属性筐体、11は表面に能動素子を含む回路パター
ンが、裏面にアースパターンが形成されたモノリシック
マイクロ波集積回路用基板、12はマイクロストリップ線
路、13はスロット線路、14は回路パターン、21は穴であ
る。[Means for Solving the Problems] As shown in FIG.
2 is a metal case, 11 is a substrate for a monolithic microwave integrated circuit having a circuit pattern including active elements on the front surface, and a ground pattern on the back surface, 12 is a microstrip line, 13 is a slot line, and 14 is a circuit pattern. , 21 are holes.
【００１６】第１の本発明は、モノリシックマイクロ波
集積回路用基板の表面に回路パターンと接続されるマイ
クロストリップ線路を、該マイクロストリップ線路の下
部近傍の裏面にスロット線路をそれぞれ設けてマイクロ
ストリップ線路−スロット線路変換器を形成すると共
に、金属性筐体に空洞共振器となる穴を設ける。According to a first aspect of the present invention, a microstrip line is provided on the surface of a substrate for a monolithic microwave integrated circuit, the microstrip line being connected to a circuit pattern, and the slot line on the back surface near the bottom of the microstrip line. Forming a slot line converter and providing a hole in the metallic housing to be a cavity resonator.
【００１７】そして、スロット線路が該空洞共振器と結
合する様に、モノリシックマイクロ波集積回路用基板を
該金属性筐体に取り付ける構成にした。第２の本発明
は、空洞共振器となる穴から金属性筐体を貫通する螺子
穴を設け、螺子を螺子穴に挿入して、空洞共振器の共振
周波数を調整可能にした。Then, the monolithic microwave integrated circuit substrate is attached to the metallic casing so that the slot line is coupled to the cavity resonator. According to the second aspect of the present invention, a screw hole that penetrates the metallic housing from a hole that becomes a cavity resonator is provided, and the screw is inserted into the screw hole, so that the resonance frequency of the cavity resonator can be adjusted.
【００１８】第３の本発明は、空洞共振器となる穴が凸
型形状で、スロット線路が穴の面積の狭い部分と接する
様にモノリシックマイクロ波集積回路用基板を金属性筐
体に取り付ける構成にした。According to a third aspect of the present invention, a hole for forming a cavity resonator is formed in a convex shape, and a monolithic microwave integrated circuit substrate is attached to a metal case so that the slot line is in contact with a portion having a small hole area. I chose
【００１９】第４の本発明は、凸型形状の穴から金属性
筐体を貫通する螺子穴を設け、螺子を螺子穴に挿入して
空洞共振器の共振周波数を調整可能にした。第５の本発
明は、空洞共振器となる穴に誘電体を充填した。The fourth aspect of the present invention provides a screw hole penetrating the metallic casing through a convex hole, and the screw is inserted into the screw hole to adjust the resonance frequency of the cavity resonator. In the fifth aspect of the present invention, a hole to be a cavity resonator is filled with a dielectric.
【００２０】第６の本発明は、誘電体を充填した空洞共
振器となる穴から金属性筐体を通る螺子穴を設け、螺子
を螺子穴に挿入して空洞共振器の共振周波数を調整可能
にした。In the sixth aspect of the present invention, a screw hole passing through a metallic casing is provided from a hole which becomes a cavity resonator filled with a dielectric, and a screw is inserted into the screw hole to adjust the resonance frequency of the cavity resonator. I chose
【００２１】第７の本発明は、上記金属性筐体に設けた
穴に誘電体共振器を搭載した低誘電率の誘電体部材を配
置し、上記スロット線路が誘電体共振器と磁界結合する
様に取り付ける構成にした。According to a seventh aspect of the present invention, a low dielectric constant dielectric member having a dielectric resonator mounted therein is arranged in a hole provided in the metallic casing, and the slot line is magnetically coupled to the dielectric resonator. It was configured to be attached like this.
【００２２】第８の本発明は、上記低誘電体部材を配置
する穴から、金属性筐体を通る螺子穴を設け、螺子を該
螺子穴に挿入して誘電体共振器の共振周波数を調整可能
にした。According to an eighth aspect of the present invention, a screw hole passing through the metallic casing is provided through the hole for disposing the low dielectric member, and the screw is inserted into the screw hole to adjust the resonance frequency of the dielectric resonator. Made possible
【００２３】[0023]
【作用】第１の本発明は、図１に示す如く、MMIC基板11
の表面のマイクロストリップ線路12の下部近傍の裏面
（アース面）16に、例えば、このマイクロストリップ線
路と基板を介して交差する様にスロット線路13を設け
て、これらの線路を電磁界結合させてマイクロストリッ
プ線路−スロット線路変換器を形成する。The first aspect of the present invention, as shown in FIG.
On the back surface (ground surface) 16 near the lower part of the microstrip line 12 on the surface of, for example, a slot line 13 is provided so as to intersect with the microstrip line via the substrate, and these lines are electromagnetically coupled. Form a microstrip line-slot line converter.
【００２４】なお、マイクロストリップ線路12は能動素
子を含む回路パターン14と接続され、スロット線路の部
分はアース面は除去してある。また、Q が高い空洞共振
器を発振器の共振回路として利用する為、MMIC基板を取
り付ける金属性筐体( 或いは、金属性板、パッケージ底
部など) ２に空洞共振器となる穴21を設ける。The microstrip line 12 is connected to the circuit pattern 14 including active elements, and the ground plane of the slot line is removed. Further, since a cavity resonator having a high Q is used as a resonance circuit of an oscillator, a hole 21 to be a cavity resonator is provided in a metal casing (or a metal plate, a package bottom portion, etc.) 2 to which the MMIC substrate is attached.
【００２５】そして、スロット線路が空洞共振器と電磁
界結合する様に、MMIC基板を金属性筐体に取り付けるの
で、マイクロストリップ線路はスロット線路を介して空
洞共振器と結合し、図10(a) に示す回路構成と同じにな
る。Since the MMIC substrate is attached to the metallic casing so that the slot line is electromagnetically coupled to the cavity resonator, the microstrip line is coupled to the cavity resonator through the slot line, and the microstrip line is connected to the cavity resonator as shown in FIG. ) It becomes the same as the circuit configuration shown in.
【００２６】上記の様に、MMIC基板を取り付ける金属筐
体（或いは、金属性板、パッケージ）の底部を機械加工
することで、その加工された部分を空洞共振器として、
または共振器を配置する空間として利用すると共に、こ
の共振器、または空間をMMIC基板の底部に設けられたス
ロット線路を介してマイクロストリップ線路と電磁界結
合させる様にした。As described above, the bottom portion of the metal casing (or the metal plate or the package) to which the MMIC substrate is attached is machined, and the processed portion is used as a cavity resonator.
Alternatively, the resonator is used as a space for arranging the resonator, and the resonator or the space is electromagnetically coupled to the microstrip line through a slot line provided at the bottom of the MMIC substrate.
【００２７】これにより、MMIC基板上に共振回路を設け
るスペースは不必要となり、１枚の小さなMMIC基板と高
Ｑの共振器を用い、MMIC基板上部の空間容積が小さい状
態ても実装できることが可能となる。また、Q の大きい
共振器を利用できるので、発振器の特性が改善される。As a result, the space for providing the resonance circuit on the MMIC substrate is unnecessary, and it is possible to mount even if the space volume above the MMIC substrate is small by using one small MMIC substrate and a high Q resonator. Becomes In addition, since a resonator having a large Q can be used, the characteristics of the oscillator are improved.
【００２８】第２の本発明は、ネジを用いて空洞共振器
の共振周波数を調整可能にした。第３の本発明は、凸型
形状の穴を設けて空洞共振器とした。第４の本発明は、
ネジを用いて凸型形状の空洞共振器の共振周波数を調整
可能にした。The second aspect of the present invention makes it possible to adjust the resonance frequency of the cavity resonator by using a screw. A third aspect of the present invention is a cavity resonator provided with a convex hole. The fourth invention is
The resonant frequency of the convex cavity can be adjusted by using screws.
【００２９】第５の本発明は、第１の本発明の空洞共振
器となる穴に、この穴と同じ寸法の誘電体を充填して共
振器を形成した後、MMIC基板底部のアース面に設けたス
ロット線路が誘電体が充填された共振器と電磁界結合す
る様にMMIC基板を金属筐体に取り付ける。これにより、
共振器の形状が第１の本発明の場合よりも小となる。A fifth aspect of the present invention is to form a resonator by filling a hole to be the cavity resonator of the first aspect of the present invention with a dielectric material having the same size as the hole, and then forming the resonator on the ground surface of the bottom of the MMIC substrate. The MMIC board is attached to the metal housing so that the slot line provided is electromagnetically coupled with the resonator filled with the dielectric. This allows
The shape of the resonator is smaller than that of the first invention.
【００３０】第６の本発明は、螺子を用いて誘電体を充
填した空洞共振器の共振周波数を調整可能にした。第７
の本発明は、金属性筐体に設けた穴に、誘電体共振器を
搭載した低誘電率の誘電体部材を配置し、上記スロット
線路が該誘電体共振器と磁界結合する様に取り付けるの
で、MMIC基板上部空間容量が小さい状態で実装可能とな
る。The sixth aspect of the present invention makes it possible to adjust the resonance frequency of a cavity resonator filled with a dielectric material using a screw. 7th
According to the present invention, a low dielectric constant dielectric member having a dielectric resonator mounted therein is arranged in a hole provided in a metallic housing, and the slot line is mounted so as to be magnetically coupled to the dielectric resonator. , MMIC board upper space capacity can be mounted in a small state.
【００３１】なお、誘電体共振器を穴の中に配置した時
に所望の共振周波数となる様な誘電体共振器を選択す
る。第８の本発明は、螺子を用いて誘電体共振器の共振
周波数を調整可能にした。It should be noted that a dielectric resonator having a desired resonance frequency when the dielectric resonator is arranged in the hole is selected. In the eighth aspect of the present invention, the resonance frequency of the dielectric resonator can be adjusted by using a screw.
【００３２】即ち、上記で説明した様に、第１〜第８の
本発明により課題が解決できる。That is, as described above, the problems can be solved by the first to eighth inventions.
【００３３】[0033]
【実施例】図１は第１の本発明の実施例の構成図で、
(a) はMMIC基板表面説明図、(b) は(a) のX- X´断面
図、(c) は金属性筐体の側面図、図２は図１の説明図
で、(a)は実装説明図( 斜視図) 、(b) はマイクロスト
リップ線路とスロット線路の結合説明図である。FIG. 1 is a block diagram of the first embodiment of the present invention.
(a) is an explanatory view of the surface of the MMIC board, (b) is a cross-sectional view taken along the line X-X 'of (a), (c) is a side view of the metal housing, and FIG. 2 is an explanatory view of FIG. 1, (a) Is a mounting explanatory diagram (perspective view), and (b) is a coupling explanatory diagram of a microstrip line and a slot line.
【００３４】また、図３は第２の本発明の実施例の構成
図、図４は第３の本発明の実施例の構成図、図５は第４
の本発明の実施例の構成図、図６は第５の本発明の実施
例の構成図、図７は第６の本発明の実施例の構成図、図
８は第７の本発明の実施例の構成図、図９は第８の本発
明の実施例の構成図である。FIG. 3 is a block diagram of the second embodiment of the present invention, FIG. 4 is a block diagram of the third embodiment of the present invention, and FIG.
FIG. 6 is a configuration diagram of an embodiment of the present invention, FIG. 6 is a configuration diagram of an embodiment of the fifth present invention, FIG. 7 is a configuration diagram of an embodiment of the sixth present invention, and FIG. FIG. 9 is a structural diagram of an example, and FIG. 9 is a structural diagram of an eighth embodiment of the present invention.
【００３５】以下、図１〜図９の説明を行う。図１(a),
(b) に示す様に、MMIC基板11の表面に形成されたマイク
ロストリップ線路12の反対側の裏面14のアース面にこの
線路と電磁界結合するスロット線路13を設ける。ここ
で、マイクロストリップ線路12には発振波長の1/4 の終
端開放線路15が接続されており、スロット線路はアース
面を除去して設けられている。1 to 9 will be described below. Figure 1 (a),
As shown in (b), a slot line 13 that is electromagnetically coupled to this line is provided on the ground surface of the rear surface 14 on the opposite side of the microstrip line 12 formed on the surface of the MMIC substrate 11. Here, the microstrip line 12 is connected to an open-ended line 15 having a quarter of the oscillation wavelength, and the slot line is provided with the ground plane removed.
【００３６】更に、MMIC基板11を取り付ける金属性筐体
( 或いは、パッケージ、金属性板）２に円筒形空洞共振
器となる円筒形状穴( 直径φ、深さD) 21 があけられ
る。方形空洞共振器を形成する為にこの穴を直方体形状
とすることも可能である。Further, a metal case to which the MMIC board 11 is attached
(Alternatively, a cylindrical hole (diameter φ, depth D) 21 to be a cylindrical cavity resonator is formed in (or package, metallic plate) 2). It is also possible to make this hole a rectangular parallelepiped shape in order to form a rectangular cavity resonator.
【００３７】そして、図２(a) に示す様に、裏面のアー
ス面に設けたスロット線路が穴21の部分に位置し、且つ
空洞共振器と電磁界結合する様に、MMIC基板を金属性筐
体(或いは、パッケージ、金属性板) ２に取り付ける。Then, as shown in FIG. 2 (a), the MMIC substrate is made of metal so that the slot line provided on the ground plane on the back surface is located at the hole 21 and is electromagnetically coupled to the cavity resonator. Attach it to the case (or package or metal plate) 2.
【００３８】そこで、例えば、図２(b) に示す様に、点
線及び実線で示されるマイクロストリップ線路及びスロ
ット線路の磁界が線路を取り囲む様に発生するが、これ
らの磁界が重なることにより、これらの線路が結合して
マイクロストリップ線路−スロット線路変換器として動
作する。Therefore, for example, as shown in FIG. 2 (b), the magnetic fields of the microstrip line and the slot line indicated by the dotted and solid lines are generated so as to surround the line. The lines are combined to operate as a microstrip line-slot line converter.
【００３９】また、金属性筐体に取り付けたことによ
り、MMIC基板裏面のスロット線路を含むアース面の一部
が内壁の一部となる空洞共振器が形成され、この空洞共
振器を共振器として利用するMMIC化された発振器( 以
下、MMIC発振器と云う) が構成される。なお、共振器の
結合の粗密度は、マイクロストリップ線路とスロット線
路の結合度で大きく決まり、結合度が密な程、空洞共振
器と結合が強くなるが、負荷Q は低下する。Further, by being attached to the metallic casing, a cavity resonator in which a part of the ground surface including the slot line on the back surface of the MMIC substrate becomes a part of the inner wall is formed, and this cavity resonator is used as a resonator. An MMIC-based oscillator to be used (hereinafter referred to as an MMIC oscillator) is configured. The coarse density of the resonator coupling is largely determined by the degree of coupling between the microstrip line and the slot line. The denser the coupling, the stronger the coupling with the cavity resonator, but the load Q decreases.
【００４０】ここで、円筒空洞共振器の形状は下記の式
を参考にして実験及び電磁界解析で決定できる。 λ0 ＝[ φ/ ｛ (χmn/ π)2＋ A2 ｝0.5 ] なお、A ＝ (s φ/ 2 D ) 、λ0 ： TM mns モードの共
振波長、 χmn：ベッセル関数 Jm (x)=0 のn 番目の根、 s ： 円筒の長さ方向に存在する1/2 管内波長の数、 φ：直径、D ：深さ である。Here, the shape of the cylindrical cavity resonator can be determined by experiments and electromagnetic field analysis with reference to the following formula. λ 0 = [φ / {(χ mn / π) 2 + A 2 } 0.5 ] where A = (s φ / 2 D), λ 0 : resonance wavelength of TM mns mode, χ mn : Bessel function J m ( The nth root of x) = 0, s: the number of 1/2 in-tube wavelengths existing in the length direction of the cylinder, φ: diameter, D: depth.
【００４１】図３は空洞共振器となる穴22の底部に、金
属性筐体２を貫通する螺子穴を設ける。そして、金属性
の螺子221 を螺子穴に挿入して空洞共振器の容量を変化
させて共振周波数を調整可能にした。例えば、螺子を螺
子穴に挿入していくと空間容量が減少して、共振周波数
が高くなる。In FIG. 3, a screw hole penetrating the metallic housing 2 is provided at the bottom of the hole 22 which becomes the cavity resonator. Then, the metallic screw 221 was inserted into the screw hole to change the capacitance of the cavity resonator, thereby making it possible to adjust the resonance frequency. For example, as the screw is inserted into the screw hole, the space capacity decreases and the resonance frequency increases.
【００４２】図４は共振周波数が低くなり、MMIC基板の
寸法に対して空洞寸法D が大きくなる場合である。図に
示す様に、金属性筐体２にはMMIC基板11を取り付ける面
の反対側から凸型形状の穴23が開けられ、金属性蓋232
で閉じることにより空洞共振器が形成される。FIG. 4 shows a case where the resonance frequency is low and the cavity size D is large with respect to the size of the MMIC substrate. As shown in the figure, a convex hole 23 is formed in the metallic housing 2 from the side opposite to the surface on which the MMIC board 11 is attached, and a metallic lid 232 is formed.
A cavity is formed by closing at.
【００４３】そして、空洞共振器の直径が小さい円筒部
231 に、MMIC基板11の裏面に設けられたスロット線路が
位置する様に取り付けられる。図５は金属性蓋242 に貫
通螺子穴を設け、螺子241 を回すことで空洞共振器の容
量を変化させて共振周波数を変化させることを可能とし
た。The cylindrical portion having a small diameter of the cavity resonator
The slot line provided on the back surface of the MMIC substrate 11 is attached to the slot 231. In FIG. 5, the metallic lid 242 is provided with a through screw hole, and by rotating the screw 241, the capacitance of the cavity resonator can be changed to change the resonance frequency.
【００４４】図６は図１中の空洞共振器21の寸法を小さ
くする為、空洞共振器となる穴に誘電体25で充填したも
ので、充填した状態で所望の共振周波数となる様な誘電
体共振器を選択する。In FIG. 6, in order to reduce the size of the cavity resonator 21 in FIG. 1, a hole to be a cavity resonator is filled with a dielectric 25, and a dielectric having a desired resonance frequency in the filled state is obtained. Select a body resonator.
【００４５】図７はMMIC基板11を取り付ける金属性筐体
２の面と反対側の面から、共振器25と接する螺子穴を設
ける。そして、螺子251 を螺子穴に挿入して、螺子尖頭
部と誘電体との間の空間容量及び共振器の実効誘電率を
変化させる。これにより、共振器の共振状態が変化し、
共振周波数を変化させることができる。In FIG. 7, a screw hole for contacting the resonator 25 is provided from the surface opposite to the surface of the metallic housing 2 to which the MMIC board 11 is attached. Then, the screw 251 is inserted into the screw hole to change the space capacitance between the screw tip and the dielectric and the effective dielectric constant of the resonator. This changes the resonance state of the resonator,
The resonance frequency can be changed.
【００４６】例えば、螺子を抜くと、誘電体底部と螺子
の尖頭部との間に空間ができるので、誘電率が等価的に
低下すると共に、共振器の形状が大きくなる。これによ
り、共振周波数が低下する。For example, when the screw is removed, a space is formed between the bottom of the dielectric and the tip of the screw, so that the permittivity is equivalently decreased and the shape of the resonator is increased. This lowers the resonance frequency.
【００４７】図８は金属性筐体２に設けられた穴26の底
部に、低誘電率の誘電体の支持台262 を介して円柱また
は角柱形状の誘電体共振器261 を取付け、スロット線路
13と誘電体共振器261 が磁界結合する様にMMIC基板11を
金属性筐体２に取り付けたものである。In FIG. 8, a cylindrical or prismatic dielectric resonator 261 is attached to the bottom of the hole 26 provided in the metallic housing 2 via a low dielectric constant dielectric support 262, and a slot line is installed.
The MMIC substrate 11 is attached to the metallic casing 2 so that the magnetic field coupling between the 13 and the dielectric resonator 261 is achieved.
【００４８】図９は誘電体共振器261 が取り付けられる
穴の底部に螺子穴を設ける。また、螺子穴の直径よりも
大きい寸法の誘電体支持台264 を穴の底部に置き、支持
台の上に誘電体共振器を配置する。In FIG. 9, a screw hole is provided at the bottom of the hole to which the dielectric resonator 261 is attached. Further, a dielectric support base 264 having a size larger than the diameter of the screw hole is placed at the bottom of the hole, and the dielectric resonator is arranged on the support base.
【００４９】そして、螺子263 を螺子穴に挿入して、螺
子尖頭部と誘電体との間の空間容量及び共振器の実効誘
電率を変化させて、共振周波数を変化させる。即ち、MM
IC基板を取り付ける金属筐体の底部を機械加工して、加
工された部分を空洞共振器とし、または共振器を配置す
る空間として利用すると共に、この共振器、または空間
をMMIC基板の底部に設けられたスロット線路を介してマ
イクロストリップ線路と電磁界結合させる様にした。Then, the screw 263 is inserted into the screw hole to change the space capacitance between the screw tip and the dielectric and the effective permittivity of the resonator to change the resonance frequency. That is, MM
The bottom part of the metal housing to which the IC board is attached is machined to use the processed part as a cavity resonator or as a space to place the resonator, and this resonator or space is provided at the bottom of the MMIC board. The microstrip line is electromagnetically coupled through the slot line.
【００５０】これにより、１枚の小さなMMIC基板と高Ｑ
の共振器を用い、MMIC基板上部の空間容積が小さい状態
ても実装できることが可能となる。As a result, one small MMIC board and high Q
It is possible to mount the resonator even if the space volume above the MMIC board is small by using the resonator.
【００５１】[0051]
【発明の効果】上記で詳細に説明した様に本発明によれ
ば、１枚の小さなMMIC基板と高Ｑの共振器を用い、MMIC
基板上部の空間容積が小さい状態ても実装できる発振器
の提供が可能となると云う効果がある。As described in detail above, according to the present invention, an MMIC is used by using one small MMIC substrate and a high Q resonator.
There is an effect that it is possible to provide an oscillator that can be mounted even when the space volume above the substrate is small.
【図１】第１の本発明の実施例の構成図で、(a) はMMIC
基板表面説明図、(b) は(a) のX- X´断面図、(c) は金
属性筐体の側面図である。FIG. 1 is a block diagram of a first embodiment of the present invention, in which (a) is an MMIC.
FIG. 3 is a diagram for explaining the surface of the substrate, (b) is a sectional view taken along line XX ′ in (a), and (c) is a side view of the metallic casing.
【図２】図１の説明図で、(a) は実装説明図( 斜視図)
、(b) はマイクロストリップ線路とスロット線路の結
合説明図である。FIG. 2 is an explanatory view of FIG. 1, in which (a) is a mounting explanatory view (perspective view).
, (B) are explanatory views of the coupling between the microstrip line and the slot line.
【図３】第２の本発明の実施例の構成図である。FIG. 3 is a configuration diagram of a second embodiment of the present invention.
【図４】第３の本発明の実施例の構成図である。FIG. 4 is a configuration diagram of a third embodiment of the present invention.
【図５】第４の本発明の実施例の構成図である。FIG. 5 is a configuration diagram of a fourth embodiment of the present invention.
【図６】第５の本発明の実施例の構成図である。FIG. 6 is a configuration diagram of a fifth embodiment of the present invention.
【図７】第６の本発明の実施例の構成図である。FIG. 7 is a configuration diagram of a sixth embodiment of the present invention.
【図８】第７の本発明の実施例の構成図である。FIG. 8 is a configuration diagram of a seventh embodiment of the present invention.
【図９】第８の本発明の実施例の構成図である。FIG. 9 is a configuration diagram of an eighth embodiment of the present invention.
【図10】図10は従来例の説明図で、(a) は誘電体共振器
装荷型の発振器の要部構成図、(b) は実装説明図、(c)
は(b) の側面図である。FIG. 10 is an explanatory diagram of a conventional example, (a) is a configuration diagram of main parts of a dielectric resonator-loaded oscillator, (b) is an explanatory diagram of mounting, and (c).
[Fig. 3] is a side view of (b).
【図11】従来例の別の実装説明図である。FIG. 11 is another mounting explanatory diagram of the conventional example.
２ 金属性筐体 11 モノリシックマイクロ波集積回路用基板 12 マイクロストリップ線路 13 スロット線路 14 回路パターン 21 穴 2 Metallic housing 11 Substrate for monolithic microwave integrated circuit 12 Microstrip line 13 Slot line 14 Circuit pattern 21 hole
Claims (8)
裏面にアースパターンが形成されたモノリシックマイク
ロ波集積回路用基板(11)と金属性筐体(2) を有する発振
器において、 該モノリシックマイクロ波集積回路用基板の表面に該回
路パターン(14)と接続されるマイクロストリップ線路(1
2)を、該マイクロストリップ線路の下部近傍の裏面にス
ロット線路(13)をそれぞれ設けてマイクロストリップ線
路−スロット線路変換器を形成すると共に、該金属性筐
体に空洞共振器となる穴(21)を設け、該スロット線路が
該空洞共振器と結合する様に、モノリシックマイクロ波
集積回路用基板を該金属性筐体に取り付ける構成にした
ことを特徴とする発振器。1. A circuit pattern including an active element on a surface,
In an oscillator having a monolithic microwave integrated circuit substrate (11) having a ground pattern formed on the back surface and a metal casing (2), the circuit pattern (14) is connected to the surface of the monolithic microwave integrated circuit substrate. Microstrip line (1
2), a slot line (13) is provided on the back surface near the lower part of the microstrip line to form a microstrip line-slot line converter, and a hole (21 ) Is provided, and the substrate for a monolithic microwave integrated circuit is attached to the metallic casing so that the slot line is coupled to the cavity resonator.
筐体を貫通する螺子穴を設け、螺子を該螺子穴に挿入し
て、空洞共振器の共振周波数を調整可能にしたことを特
徴とする請求項１の発振器。2. A resonance hole of the cavity resonator can be adjusted by providing a screw hole penetrating the metallic casing from a hole which becomes the cavity resonator and inserting a screw into the screw hole. An oscillator according to claim 1, characterized in that
上記スロット線路が穴の面積の狭い部分と接する様に該
モノリシックマイクロ波集積回路用基板を該金属性筐体
に取り付ける構成にしたことを特徴とする請求項１の発
振器。3. The hole to be the cavity resonator has a convex shape,
2. The oscillator according to claim 1, wherein the monolithic microwave integrated circuit substrate is attached to the metallic casing so that the slot line is in contact with a portion having a narrow hole area.
金属性筐体を貫通する螺子穴を設け、螺子を螺子穴に挿
入して該空洞共振器の共振周波数を調整可能にしたこと
を特徴とする請求項３の発振器。4. A resonance hole of the cavity resonator can be adjusted by providing a screw hole penetrating the metal casing from a convex hole serving as the cavity resonator and inserting a screw into the screw hole. The oscillator according to claim 3, wherein:
填したことを特徴とする請求項１の発振器。5. The oscillator according to claim 1, wherein a hole to be the cavity resonator is filled with a dielectric material.
穴から該金属性筐体を通る螺子穴を設け、螺子を該螺子
穴に挿入して該誘電体を充填した空洞共振器の共振周波
数を調整可能にしたことを特徴とする請求項５の発振
器。6. A resonance of a cavity resonator filled with the dielectric material by providing a screw hole passing through the metallic housing from a hole to be the cavity resonator filled with the dielectric material, and inserting a screw into the screw hole. 6. The oscillator according to claim 5, wherein the frequency is adjustable.
振器を搭載した低誘電率の誘電体部材を配置し、上記ス
ロット線路が該誘電体共振器と磁界結合する様に取り付
ける構成にしたことを特徴とする発振器。7. A low dielectric constant dielectric member having a dielectric resonator mounted therein is disposed in a hole provided in the metallic housing, and the slot line is attached so as to be magnetically coupled to the dielectric resonator. An oscillator characterized by having a configuration.
属性筐体を通る螺子穴を設け、螺子を該螺子穴に挿入し
て誘電体共振器の共振周波数を調整可能にしたことを特
徴とする請求項７の発振器。8. A screw hole passing through the metallic casing is provided from a hole for disposing the low dielectric member, and a screw is inserted into the screw hole so that the resonance frequency of the dielectric resonator can be adjusted. The oscillator according to claim 7, characterized in that
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12525094A JPH07336139A (en) | 1994-06-07 | 1994-06-07 | Oscillator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12525094A JPH07336139A (en) | 1994-06-07 | 1994-06-07 | Oscillator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07336139A true JPH07336139A (en) | 1995-12-22 |
Family
ID=14905481
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12525094A Withdrawn JPH07336139A (en) | 1994-06-07 | 1994-06-07 | Oscillator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07336139A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100513709B1 (en) * | 1999-03-31 | 2005-09-07 | 삼성전자주식회사 | Cavity resonator for reducing the phase noise of a MMIC VCO |
| KR100552658B1 (en) * | 1999-03-31 | 2006-02-17 | 삼성전자주식회사 | Resonant cavity for phase noise reduction of voltage controlled oscillator |
| JP2010156714A (en) * | 1997-07-31 | 2010-07-15 | Astyx Gmbh | Distance measuring device and method for measuring distance |
| JP2012531122A (en) * | 2009-06-19 | 2012-12-06 | クアルコム，インコーポレイテッド | Adjustable MEMS resonator in cavity |
| US9399089B2 (en) | 2010-03-15 | 2016-07-26 | Fresenius Medical Care Deutschland Gmbh | Cassette with a sensor for determining the difference between a first and a second fluid stream |
-
1994
- 1994-06-07 JP JP12525094A patent/JPH07336139A/en not_active Withdrawn
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010156714A (en) * | 1997-07-31 | 2010-07-15 | Astyx Gmbh | Distance measuring device and method for measuring distance |
| JP2014238411A (en) * | 1997-07-31 | 2014-12-18 | アスティックス ゲーエムベーハー | Distance measuring instrument and method for measuring distance |
| JP2015007644A (en) * | 1997-07-31 | 2015-01-15 | アスティックス ゲーエムベーハー | Distance measurement device and method for measuring distance |
| KR100513709B1 (en) * | 1999-03-31 | 2005-09-07 | 삼성전자주식회사 | Cavity resonator for reducing the phase noise of a MMIC VCO |
| KR100552658B1 (en) * | 1999-03-31 | 2006-02-17 | 삼성전자주식회사 | Resonant cavity for phase noise reduction of voltage controlled oscillator |
| JP2012531122A (en) * | 2009-06-19 | 2012-12-06 | クアルコム，インコーポレイテッド | Adjustable MEMS resonator in cavity |
| US8981875B2 (en) | 2009-06-19 | 2015-03-17 | Qualcomm Incorporated | Tunable MEMS resonators |
| US9399089B2 (en) | 2010-03-15 | 2016-07-26 | Fresenius Medical Care Deutschland Gmbh | Cassette with a sensor for determining the difference between a first and a second fluid stream |
| US10260682B2 (en) | 2010-03-15 | 2019-04-16 | Fresenius Medical Care Deutschland Gmbh | Cassette with a sensor for determining the difference between a first and a second fluid stream |
| US11085588B2 (en) | 2010-03-15 | 2021-08-10 | Fresenius Medical Care Deutschland Gmbh | Cassette with a sensor for determining the difference between a first and a second fluid stream |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20010904 |