JPH0733414Y2 - IC socket - Google Patents

Description

[Detailed Description of the Invention] [Industrial field of application] The present invention relates to the structure of an IC socket used for performance tests of ICs.

[Problems to be solved by conventional techniques and devices]

FIGS. 3 and 4 show an example of a conventional IC socket to which the present invention is directed.
A plurality of slits 4 are formed by partition walls 3 arranged in rows on both sides of an IC housing 2 provided in the central part of the contact pin, and each of the slits 4 has a contact piece 5a for contacting a lead terminal L of the IC package. 5 are planted. Further, a presser cover 7 is pivotally supported on one end of the socket body 1 by a support shaft 6 so that the presser cover 7 can be opened and closed. The pad 8 is formed so as to project. When the IC package is set in the accommodating portion 2 of the IC socket thus configured and the pressing cover 7 is closed, the pressing pad 8
Presses the lead terminals L, so that each lead terminal L is surely brought into contact with the contact pin 5. Further, the closed pressing cover 7 is locked by a lock lever 9 pivotally supported on the other end of the socket body 1 and held in a closed state.

However, since the presser cover 7 supported by the support shaft 6 is loosely fitted to the support shaft 6, there is some play between the support shaft 6 and the shaft, especially in the axial direction (arrow A). There is. Therefore, when the presser cover 7 is closed, the presser pad 8 is
There is a problem in that the biasing force of the lead terminal L is biased and the position where the lead pin L is pressed down with respect to the contact piece 5a of the contact pin 5 deviates from the normal position. As a result, there are inconveniences such as bending of the lead terminal L, contact failure with the contact pin 5, and the pressing pad 8 colliding with the partition wall 3 and the pressing cover 7 cannot be closed. . Such a problem is greatly affected when the lead terminals of the IC package are densified and the pitch of the lead terminals L is reduced, or when an automatic machine is applied.

In view of such circumstances, an object of the present invention is to provide an IC socket of this type in which the lead terminal and the contact pin are properly and electrically connected properly.

[Means and Actions for Solving the Problems]

In the IC socket of the present invention, a contact pin having a contact piece that can be vertically moved by elastic deformation is arranged between partition walls arranged in a row in the socket body, and the lead terminal of the IC package is placed on the contact piece. After that, close the presser cover that is pivotally supported on the socket body by the support shaft and is provided with a presser pad, and lock the presser cover with the socket body by a lock lever that is pivotally supported separately from the presser cover. In an IC socket in which the contact pin and lead terminal are electrically connected by pressing down the lead terminal with the presser pad, along the both edges of the mating surface of the presser cover, each should be parallel to the spindle. In addition, a cover side edge slanted portion formed of slanted surfaces that are slanted in opposite directions is provided, and the support shaft is provided along each side edge of the mating surface of the socket body. It is characterized in that a main body-side edge inclined portion which matches with the cover-side edge inclined portion when closing becomes the inclined surface addition pressing cover that and inclined in opposite directions to each other in the row direction.

Therefore, when the presser cover is closed, the cover side edge inclined portion and the main body side edge inclined portion are aligned with each other, so that the presser cover and the pad are correctly and surely positioned with respect to the socket body, and the lead terminal is It can be pushed down stably.

〔Example〕

An embodiment of the IC socket of the present invention will be described below with reference to FIGS. 1 and 2 by using the same reference numerals for the same members as those in the conventional example. In the figure, 10 and 10 'are body side walls formed along both side edges of the mating surface 1a of the socket body 1, and 11 and 11' are outer edges of the cover formed along side edges of the mating surface 7a of the presser cover 7. It is a department. Body sidewall 10, 10 'position regulating fitting recess A ₁ and by the mating surface 1a is formed, also covering the outer edge 11, 11' for position regulated by and mating surface 7a fitting convex portion B ₁
The side walls 10 and 10 ′ of the main body are formed on the side walls 10 and 10 ′ of the main body.
10a and 10'a, and the cover outer edge portions 11 and 11 'coincide with the body side edge inclined portions 10a and 10'a.
11'a are formed respectively. Although not shown, the mating surface 1a is provided with an accommodating portion 2, a partition wall 3, a contact pin 5 and the like having the same configuration as the conventional example (FIG. 3).

Since the IC socket according to the present invention is configured as described above, when the pressing cover 7 is closed, the position regulating fitting convex portion B _{1 of the} cover 7 fits with the position regulating fitting concave portion A _{1 of the} socket body 1. The mating surfaces 1a and 7a overlap each other (see Fig. 2).
As a result, the presser cover 7 is correctly positioned and fixed to the socket body 1. In this case, even if the position regulating fitting convex portion B ₁ is loosened at the pivotal support portion of the presser cover 7 and slightly bent with respect to the main body 1, it is closed.
The cover side edge inclined portions 11a and 11'a of the cover outer edge portions 11 and 11 'of the presser cover 7 are the body side edge inclined portions 10a and 1a of the body side walls 10 and 10'.
Since the main body side edge inclined portions 10a, 10'a and the cover side edge inclined portions 11a, 11'a are guided by 0'a, the pressing cover 7 can be easily and smoothly closed in the correct position. As a result, the pressing pad 8 is kept in the correct position with respect to the lead terminal L without being displaced.
Since it is pressed, it can be pressed down stably. Therefore, there is no risk that the pressing pad 8 will forcefully press down the edge of the lead terminal L to bend it, and the lead terminal L and the contact pin 5 can be reliably connected. As described above, since there is no risk of the pressing cover 7 being displaced, the opening and closing of the IC socket by the automatic machine can be realized without any problem.

[Effect of device]

As described above, the IC socket of the present invention can position the presser cover correctly with respect to the socket body to connect the lead terminal and the contact pin safely and reliably, and is relatively simple in structure, so that it is practical. There are some advantages.

[Brief description of drawings]

1 is a perspective view of the IC socket according to the first embodiment of the present invention with a part omitted, FIG. 2 is a sectional view taken along line II-II of FIG. 1, FIG. 3 and FIG. FIG. 4A is a plan view and a partially cutaway side view of a conventional IC socket. 1 ... Socket body, 3 ... Partition wall, 4 ... Slit,
5 ... Contact pin, 6 ... Support shaft, 7 ... Presser cover, 8 ... Presser pad, 10, 10 '... Main body side wall, 11, 11'
…… Outer edge of cover, A1 …… Mating recess, B1 …… Mating ridge.

Claims (1)

[Scope of utility model registration request] 1. A contact pin having a contact piece that can be moved up and down by elastic deformation is arranged between partition walls arranged in a row in a socket body, and after mounting a lead terminal of an IC package on the contact piece. , The press cover, which is pivotally supported on the socket body by the support shaft and is provided with a press pad, is closed, and the press cover is locked by the socket body separately from the press cover by a lock lever. Then, in the IC socket in which the contact pin and the lead terminal are electrically connected by pressing down the lead terminal with the pressing pad, the above-mentioned is provided along both side edges of the mating surface of the pressing cover. A cover side edge slant portion is provided which is a slant surface slanting in a direction parallel to the support shaft and opposite to each other. Along the both side edges, there are provided main body side edge inclined sections which are inclined planes parallel to the support shaft and inclined in opposite directions and which coincide with the cover side edge inclined sections when the presser cover is closed. Characterized by
IC socket.