JPH07326411A - Chip type jumper wire - Google Patents

Abstract

(57) [Abstract] [Purpose] When mounting an electronic circuit on a single-sided board, provide a jumper wire that is easy to use, and make it possible to use a mounter of the same shape or the same chip part as the chip part to reduce costs. . [Structure] The external appearance of the chip part is almost the same as that of FIG. 1, and has terminal electrodes 6a and 6b on the base electrode, which are plated with solder, on both ends, as in FIG. These terminal electrodes 6a,
In order to electrically connect 6b, the ceramic insulating layers 9 are alternately superposed on the inner good conductor layers 8, and each of the inner good conductor layers 8 is electrically connected to the terminal electrodes 6a, 6b at both ends. From this enlarged view, it can be seen that at least one or more inner good conductor layers 8 are electrically connected to the terminal electrodes 6a and 6b at both ends. With such a configuration, it becomes possible to jump the wiring pattern of the substrate only with the chip type component, and a more complicated circuit can be manufactured.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip type jumper wire, and more particularly to a so-called jumper wire used with an electronic circuit formed on a printed board (particularly a flexible board) using chip parts. For example, it is applied to an electronic circuit device in which miniaturization is important, that is, a compact disc, a portable computer, a video camera, or the like.

[0002]

2. Description of the Related Art Multilayer ceramic chip capacitors have been attracting attention as capacitors that meet the requirements of high-density mounting technology. The monolithic ceramic chip capacitor has a large static capacitance due to the thinning of the ceramic dielectric layer and the multi-layer laminating technique, and is excellent in static mechanical strength because it has a completely monolithic structure. In addition, it has excellent dimensional accuracy and features such as reliable handling during automatic mounting. Moreover, the thin film square chip fixed resistor has high precision and high stability, and has excellent resistance temperature characteristic and life characteristic, and is used in various applications such as VTR (video tape recorder), TV, audio, measuring instrument. is there.

FIG. 5 is a block diagram of a conventional chip resistor, in which 31 is a solder plating electrode, 32 is a protective insulating film,
33 is a resistor thin film, 34 is an alumina substrate, and 35 is a base electrode. It has solder-plated electrodes 31 on both sides of which are plated with solder, and the solder-plated electrodes are electrically connected by a pattern of a resistor thin film 33 on an insulating substrate such as an alumina substrate (ceramic substrate) 34. ing. Further, in order to protect and insulate the pattern of the resistor thin film 33, a protective insulating film 32 is applied on the pattern of the resistor thin film 33.

6 (a) and 6 (b) are configuration diagrams of a conventional chip type capacitor, FIG. 6 (a) is an overall perspective view, and FIG. 6 (b).
FIG. 4 is a partially enlarged view of FIG. In the figure, 36a is a terminal electrode (left), 36b is a terminal electrode (right), 37 is a ceramic dielectric layer (insulating layer), 38a is an internal electrode (left), 38b.
Is the internal electrode (right). The external appearance of the chip part is almost the same as that of FIG. 5, and has terminal electrodes 36a and 36b formed by solder plating on the base electrode at both ends, as in FIG. In order to electrically connect these terminal electrodes 36a and 36b, the ceramic insulating layer 37 is connected to the inner good conductor layers 38a and 38b.
b and the good conductor layers 38a, 38
b is electrically connected to the left and right terminal electrodes 36a and 36b alternately at both ends. FIG. 6B is an enlarged view of this situation. From this enlarged view, it can be seen that all of the good internal conductor layers 38a, 38b are electrically connected in this manner by the terminal electrodes 36a, 36b at the opposite ends alternately in the left and right direction.

[0005]

A jumper is often used to select or change the function of an electronic circuit to be formed on a printed circuit board, or when an intersecting portion of board patterns is realized by a printed circuit board having a small number of layers. Lines are used. For mass production, it is more effective to use parts of the same shape as much as possible in terms of cost and production efficiency, and chip parts that can be used as jumper wires are needed.

Up to now, the jumper wire has been a lead wire, but although the length of the lead wire is flexible,
With the recent miniaturization of electronic parts, chip parts are often used for resistors and capacitors, and it is convenient to have jumper wires conforming to this shape. On the other hand, many flexible boards that are small and suitable for free mounting such as folding are often single-sided patterns at present, and are often used for simple wiring such as buses in devices. You may want to mount some electronic circuitry.

In such a case, since the flexible substrate has one side, it may be desired to cross the wiring pattern on the substrate in the direction perpendicular to the paper under the chip component, for example, by intersecting the wiring. If you try to cross without using two or more layers, such as a double-sided wiring board, you may want a jumper wire with a similar shape in addition to the normal resistance elements and capacitors. In the present situation where most of electronic circuit parts are chip parts, it has been troublesome and costly to mount parts having shapes other than chip parts such as jumper wires.

The present invention has been made in view of the above circumstances, and provides a jumper wire that is easy to use when mounting an electronic circuit on a single-sided board (particularly a flexible board) and has the same shape as a chip part. , Or to provide a chip type jumper wire for cost reduction such as using mounters of the same chip component.

[0009]

In order to achieve the above object, the present invention provides (1) a chip component having a box-shaped rectangular parallelepiped shape and electrodes provided on both lateral sides of the box-shaped rectangular parallelepiped. In (2), a good conductor that is an electrical connection means for electrically connecting the electrodes at both ends is provided, and an electrical insulator is applied or coated around the good conductor, and further, (2) on an insulator substrate or By applying a pattern of a good conductor between the insulating substrates, connection between both electrodes was performed, and further, (3) the insulating substrates and the good conductors were alternately superposed,
Electrically connecting the good conductor to the electrodes on both sides, and (4) forming the good conductor into a chip for connection between the electrodes, and coating an insulating film on the periphery other than the electrode portions on both sides, (5) In any one of (1) to (4) above, the insulating portion between the electrodes is thinner than the electrode portion.

[0010]

The chip-type jumper wire of the present invention having the above-described structure has the shape of (1) box-shaped rectangular parallelepiped, and has electrodes on the short side surfaces on both sides of the box-shaped rectangular parallelepiped. Since a good conductor that is an electrical connection means for electrically connecting the electrodes at both ends is provided and the periphery of the good conductor is coated or covered with an electrical insulator, the wiring pattern jump of the substrate can be made only by the chip type component. Since it is also possible to use the mounter device for mounting the chip components as it is, it becomes possible to manufacture a more complicated circuit at a low cost even with a single-sided board without changing the equipment and process at the time of mounting.

(2) Since the electrodes are connected by applying a pattern of a good conductor on or between the insulating substrate, the manufacturing process of the chip resistor and the chip capacitor can be used as they are. The chip type jumper wire can be easily manufactured. (3) Since the insulating substrate and the good conductor are alternately superposed and the conductors are electrically connected to the electrodes on both sides,
By directly using the manufacturing process of the chip resistor and the chip capacitor, the chip type jumper wire can be easily manufactured.

(4) Since a good conductor is formed in a chip shape for connection between both electrodes, and an insulating film is applied to the periphery except for the electrodes on both sides, a metal wire which is a good conductor makes the chip type easy and low cost. Jumper wires can now be manufactured. Also, by using a metal wire that is compatible with solder from the beginning, it is possible to easily adapt the terminal electrodes on both ends to the solder without solder plating, which facilitates manufacturing and facilitates connection when mounting jumper wires. become.

(5) Since the insulating portion between the electrodes is made thinner than the electrode portion, the electrodes can be connected while avoiding swelling due to the wiring pattern passing between the electrodes of the jumper wire and the thickness of the protective insulating film such as resist. Because,
The stability of the operation when mounted by the chip mounter and the reliability of connection with the board after mounting are improved.

[0014]

Embodiments will be described below with reference to the drawings. FIG. 1 is a configuration diagram for explaining one embodiment of a chip type jumper wire according to the present invention. In the figure, 1 is a solder plating electrode, 2 is a protective insulating film, 3 is a good conductor thin film, 4 is an alumina substrate, 5 Is a base electrode. It has solder-plated electrodes 1 on both sides of which are plated with solder, and the solder-plated electrodes are electrically connected by a pattern of a good conductor thin film 3 on an insulating substrate such as an alumina substrate (ceramic substrate) 4. There is. Further, the good conductor thin film 3 is formed by applying a protective insulating film 2 for protecting and insulating the pattern onto the pattern of the good conductor thin film 3.

2 (a) and 2 (b) are configuration diagrams for explaining another embodiment of the chip type jumper wire according to the present invention. FIG. 2 (a) is an overall perspective view and FIG. 2 (b) is a diagram. It is a partially expanded view of (a). In the figure, 6a is a terminal electrode (left), 6b is a terminal electrode (right), 7 is a ceramic insulating layer, and 8 is an internal electrode layer (good internal conductor layer). The external appearance of the chip part is almost the same as that of FIG. 1, and has terminal electrodes 6a and 6b on both ends of which solder plating is applied on the base electrode, as in FIG. In order to electrically connect these terminal electrodes 6a and 6b, the ceramic insulating layers 9 are alternately stacked on the inner good conductor layers 8, and each of these inner good conductor layers 8 has terminal electrodes 6a, 6b at both ends.
6b is electrically connected. FIG. 6B is an enlarged view of this state. From this enlarged view, at least one or more inner good conductor layers 8 are formed on both ends of the terminal electrodes 6a,
It can be seen that it is electrically connected to 6b.

3 (a) and 3 (b) are manufacturing process diagrams for explaining still another embodiment of the chip type jumper wire according to the present invention, in which 11 is a molded good conductor wire and 12 is an insulating wire. The film 13 is solder plated. A good conductor wire 11 such as a tin-plated wire that is easily compatible with solder is formed in a chip shape, and solder plating 13 is applied to both ends of the good conductor 11 to form terminal electrodes, and an insulating film 12 is provided between the terminal electrodes. This chip type jumper wire is prepared by cutting a good conductor wire 11 and molding it with a press or the like to apply an insulating film 12 excluding both ends to be terminal electrodes, and then using it as it is or solder-plating 13 on the electrodes at both ends. You can make it just by giving it.

FIG. 4 is a constitutional view for explaining still another embodiment of the chip type jumper wire according to the present invention. It is necessary that the bottom surface of the chip-shaped jumper wire is higher than the terminal electrodes at both ends. It is a figure for explaining. 21 in the figure
Is a chip type jumper wire, 22 is solder, 23 is an insulating protective film, 24 is a conductor pattern (electrode), 25 is a substrate, and 26 is a conductor pattern (jumped pattern).

The wiring pattern jumped by the chip type jumper wire 21 is slightly higher than the electrode 24 of the wiring board to which the terminal electrodes of the jumper wire are joined by the amount that the insulating protective film 23 such as resist is applied. . Therefore, it is preferable to increase the distance between the terminal electrodes on both sides of the chip type jumper wire side so that the insulating protection film 23 does not come into contact with each other. By using the chip-type jumper wire having such a structure, it becomes possible to handle it together with other chip-type components, and it is possible to deal with wiring crossing without using a special device for mounting.

[0019]

As is apparent from the above description, the present invention has the following effects. (1) Effect corresponding to claim 1: Since it is possible to jump the wiring pattern of the substrate only with the chip type component, the mounter device for mounting the chip component can be used as it is. Therefore, especially the equipment and process at the time of mounting are changed. Instead, it has become possible to manufacture more complicated circuits at low cost even with a single-sided board. (2) Effects corresponding to claims 2 and 3: The chip type jumper wire can be easily manufactured by directly using the manufacturing process of the chip resistor and the chip capacitor, respectively. (3) Effect corresponding to claim 4: The chip type jumper wire can be manufactured easily and at low cost by using the metal wire which is a good conductor. Also, by using a metal wire that is compatible with solder from the beginning, it is possible to easily adapt the terminal electrodes on both ends to the solder without solder plating, which facilitates manufacturing and facilitates connection when mounting jumper wires. Became. (4) Effect corresponding to claim 5: Since electrodes can be connected while avoiding swelling due to the thickness of a protective insulating film such as a wiring pattern and a resist that passes between electrodes of jumper wires, it is possible to mount the chip mounter at the time of mounting. The stability of the operation and the reliability of the connection with the board after mounting are improved.

[Brief description of drawings]

FIG. 1 is a configuration diagram for explaining an embodiment of a chip type jumper wire according to the present invention.

FIG. 2 is a configuration diagram for explaining another embodiment of the chip type jumper wire according to the present invention.

FIG. 3 is a configuration diagram for explaining still another embodiment of the chip type jumper wire according to the present invention.

FIG. 4 is a configuration diagram for explaining still another embodiment of the chip type jumper wire according to the present invention.

FIG. 5 is a configuration diagram of a conventional chip resistor.

FIG. 6 is a configuration diagram of a conventional chip type capacitor.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Solder plating electrode, 2 ... Protective insulating film, 3 ... Good conductor thin film, 4 ... Alumina substrate, 5 ... Base electrode, 6a ... Terminal electrode (left), 6b ... Terminal electrode (right), 7 ... Ceramic insulating layer, 8 ... internal electrode layer (internal good conductor layer), 11 ... molded good conductor wire, 12 ... insulating film, 13 ... solder plating.

Claims (5)

[Claims] 1. A chip component having the shape of a box-shaped rectangular parallelepiped and provided with electrodes on both short side surfaces of the box-shaped rectangular parallelepiped.
A chip type jumper wire comprising a good conductor which is an electrical connection means for electrically connecting the electrodes at both ends, and an electric insulator is applied or coated around the good conductor. 2. The chip type jumper wire according to claim 1, wherein a connection between the two electrodes is made by applying a pattern of a good conductor on or between the insulating substrates. 3. The chip type jumper wire according to claim 1, wherein the insulating substrates and the good conductors are alternately superposed and the good conductors are electrically connected to the electrodes on both sides. 4. The chip type jumper wire according to claim 1, wherein a good conductor is formed into a chip shape for connection between both electrodes, and an insulating film is applied to the periphery other than the electrode portions on both sides. 5. The chip type jumper wire according to claim 1, wherein the insulating portion between the electrodes is made thinner than the electrode portion.