JPH0732411Y2 - Chip circuit component supply device - Google Patents

Description

[Detailed description of the device]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for picking up and supplying, in a line, chip-shaped circuit components that are stored in a container in bulk.

[0002]

2. Description of the Related Art A conventional component supply device of this type is
As shown in FIG. 5, the container 1 is formed by the base member 38 and the cylindrical body 41 standing upright from the base member 38, and the inclined surface 2 having a funnel-shaped inclination is formed on the bottom surface of the base member 38. The upper end of the component discharge pipe 49 is vertically slidably inserted through a through hole formed at the lowest central portion of the sloped surface 2. The upper end of this component discharge pipe 49 is
It opens diagonally. The slide member 37 protruding from the bottom of the base member 38 is slidably fitted in the recess of the guide member 36 fixed to the frame 35, whereby the container 1 is guided slidably up and down. Is reciprocated up and down by a drive mechanism (not shown).

As the container 1 is driven up and down in this manner, the upper end of the component discharge pipe 49 relatively reciprocates up and down in the container 1. And the parts discharge pipe 4
When the upper end of 9 rises from the bottom of the base member 38, the chip-shaped circuit parts a, a ... In the container 1 are crushed, and when the upper end of the component discharge pipe 49 goes down, the chip-shaped circuit part a from the opening. One by one enters the parts discharge pipe 49. In this way, the chip-shaped circuit components a that have entered the component discharge pipe 49 are lined up in a line and sequentially fed downward. At the lower end of the component discharge pipe 49, the chip-shaped circuit component a is connected to the pipe-shaped component transport paths 10, 10 ...
Escapement mechanism to release each one is provided.
As a result, the chip-shaped circuit components a lined up in a line in the component discharge pipe 49 are delivered to the component transport path 10 one by one, and transported to a predetermined location through the component transport path 10.

[0004]

However, in such a conventional chip-shaped circuit component supply device,
A power for reciprocating the container 1 up and down with respect to the component discharge pipe 49 and a mechanism for transmitting the power to the container 1 are required, and the configuration of the apparatus becomes complicated as a whole. Further, since the control system of the device is complicated and the operation is troublesome, there is a problem that the device is expensive to manufacture and the operation is complicated. The object of the present invention is to solve the above-mentioned conventional problems and to supply chip-shaped circuit parts by supplying only chip-shaped circuit parts by vibration generated by the operation of a chip mounter without driving the container. It is an object of the present invention to provide a chip-shaped circuit component supply device capable of performing.

[0005]

In order to achieve the above-mentioned object, the present invention provides a hopper portion 5 in which chip-shaped circuit components a, a ... Are stored in bulk, and a chip-shaped circuit component from the hopper portion 5. In the chip-shaped circuit component supply device having the component discharge passage 48 for discharging a and the escapement mechanism for escaping the chip-shaped circuit components a at the lower end of the component discharge passage 48 to the component transport passage 10 one by one, A component discharge chamber 6 having a closed periphery is provided below the component discharge chamber 7, and a component discharge port 7 for supplying the chip-shaped circuit component a from the hopper portion 5 to the component discharge chamber 6 is biased toward one side of the component discharge chamber 6. A nozzle 4 for injecting air into the component discharge chamber 6 is provided on the other side of the component discharge chamber 6, and a chip is provided at the bottom of the component discharge chamber 6 between the nozzle 4 and the component discharge port 7. Circuit part a Providing chip-like CC supplying device component discharge path 48 which may be characterized in that the connected. In this case, the recess 2 having a funnel-shaped slope may be formed in the bottom of the component discharge chamber 6, and the upper end of the component discharge passage 48 may be connected to the bottom of the recess 2.

[0006]

In the chip circuit component feeder according to the present invention, the chip circuit component a is fed from the hopper 5 side through the component discharge port 7 from one side of the component discharge chamber 6.
Since the periphery of the component discharge chamber 6 is closed except for the portion connected to the component discharge port 7 and the component discharge path 48, the inside of the chamber 6 from the nozzle 4 provided on the other side of the component discharge chamber 6. When air is injected into the parts, the pressure of the air causes the pressure of the component discharge port 7 to be higher than that of the inside of the hopper portion 5. Therefore, the chip-shaped circuit component a on the hopper portion 5 side is prevented from being pushed by this atmospheric pressure and being sent from the component discharge port 7 to the component discharge chamber 6 at once. Moreover, since the air jetted from the nozzle 4 circulates in the component discharge port 6,
The chip-shaped circuit component a introduced into the component discharge chamber 6 through the component discharge port 7 is carried to this air and is conveyed to the component discharge chamber 6
And reaches a top end of the component discharge path 48. Since the air jetted from the nozzle 4 is mainly discharged from the component discharge chamber 6 through the component discharge passage 48, the flow of this air causes the chip-shaped circuit component a to move to the component discharge passage 4
No. 8 is entered, and from there, it is sent vertically in one line. The chip-shaped circuit component a is escaped one by one to the pipe-shaped component transport path 10 by the escapement mechanism, and is transported to a predetermined location through the component transport path 10.

[0007]

Embodiments of the present invention will now be described in detail with reference to the drawings. First, the embodiment shown in FIGS. 1 to 3 will be described. In the component supply device, the container 1 is constructed by a cylindrical body 41 standing upright from the base member 38, as in the conventional device described above. From the inner wall surface of the cylinder 41 to L
A partition plate 42 having a character shape is formed, and the tip end thereof is the base member 3
It contacts the bottom surface of the container 8, and thereby the container 1 is partitioned into an upper hopper portion 5 and a lower part discharge chamber 6 therebelow. A portion of the partition plate 42 that vertically divides the hopper portion 5 and the component discharge chamber 6 is inclined, and the lower end side thereof extends vertically and hits the bottom surface of the base member 38. Figure 3
As shown in FIG. 3, one end of the lower end of the partition plate 42 that is in contact with the base member 38 is open, and this is the part discharge port 7, that is, the part discharge chamber 6 from the hopper part 5 side.
It is an outlet for sending the chip-shaped circuit component a to the side. Figure 3
In this embodiment, the component discharge port 7 is provided on one wall surface side of the component discharge chamber 6 and biased toward the end thereof.

A nozzle 4 is provided on the wall surface of the component discharge chamber 6 facing the vertically standing portion of the partition plate 42. This nozzle is on the opposite side of the partition plate 42 from which the component discharge port 7 is provided. Is provided so as to face the end portion of the.
This nozzle 4 is connected to a compressed air source, not shown, from which it injects air into the component discharge chamber 6. As the compressed air source, for example, a high pressure air supply source for driving an air cylinder, an air motor or the like can be used.

A recess 2 having a funnel-shaped slope is formed at the bottom of the component discharge chamber 6, and the upper end of the component discharge passage 48 is connected and fixed to the lowest bottom. The position to which the component discharge path 48 is connected is between the nozzle 4 and the discharge port 7 of the hopper portion 5, and is slightly closer to the wall surface side where the nozzle 4 is provided in FIG. The component discharge passage 48 has a diameter through which the chip-shaped circuit component a can pass vertically, and the chip-shaped circuit components a that have entered the component discharge passage 48 are arranged in a line in a downward direction. To be sent to. The concave portion 2 is preferably not so deep as compared with the size of the chip-shaped circuit component a, and the height of the chip-shaped circuit component a is preferably used as a standard. This is because when the recess 2 is deep,
This is because the chip-shaped circuit component a, which is not discharged from the component discharge path 48, enters the recess and stagnates. If the recesses 2 are not deep, the chip-shaped circuit components a gathering there will not be blown off by the air blown from the nozzles 4 and a large number of chip-shaped circuit components a will not be accumulated, and only a small number of chip-shaped circuit components a Move there and are discharged.

The main air flow direction formed in the component discharge chamber 6 by the air jetted from the nozzle 4 is shown by an arrow in FIG. That is, the air jetted from the nozzle 4 hits the partition plate 4 which is a wall surface facing the nozzle 4 and is bent, passes through the component discharge port 7 and hits the wall surface and is bent. Although it circulates in the component discharge chamber 6 in this manner, the component discharge chamber 6 is gradually sucked toward the opening side of the component discharge passage 48 near the center and discharged from there through the component discharge passage 48. As described above, the chip-shaped circuit component a in the component discharge chamber 6 circulates and is discharged to the component discharge path 48 by this air flow.

An escapement mechanism for escaping the chip-shaped circuit components a one by one to the pipe-shaped component transport paths 10, 10 ... Is provided at the lower end side of the component discharge path 48. That is, the central axes of the lower end of the component discharge path 48 and the upper end of the component transport path 10 are laterally displaced. And
In the meantime, the slider 54 slides to the left and right in FIG. 2, and the through hole 64 formed in this slides the component discharge passage 48.
It reciprocates between the lower end of the component conveyance path and the upper end of the component conveyance path 10. As a result, the chip-shaped circuit components a lined up in a line in the component discharge path 48 are sent to the component transfer path 10 one by one,
Be transported.

Next, the embodiment shown in FIG. 4 will be described. In this embodiment, the component discharge port 7 of the hopper portion 5 is provided at the center of the partition plate 42, and the partition plates on both sides of this discharge port 7 are provided. Nozzles 4 and 4 are provided opposite to 42 on both sides of the other wall surface. This can be applied when the parts discharge chamber 6 is relatively large. The main air flow in the component discharge chamber 6 in this case is shown by arrows in FIG. Further, although not shown, when the component discharge ports 7, 7 of the hopper portion 5 are provided at both ends of the partition plate 42, the nozzle 4 is separated from the partition plate 42.
It can also be provided facing the center of the. In this case, the main air flow in the component discharge chamber 6 is in the opposite direction to that shown by the arrow in FIG.

[0013]

As described above, according to the present invention, when the chip-shaped circuit components in the container 1 are taken out in a row and sent out, the compressed air piping widely used for the operation of the apparatus is connected to the nozzle 4. Since the chip-shaped circuit components can be sequentially supplied to the component discharge path side by injecting air from the nozzle 4, it is not necessary to provide a mechanism for vertically moving the container as in the conventional case, and a simple configuration and simple A chip-shaped circuit component supply device that can be operated can be provided.

[Brief description of drawings]

FIG. 1 is a half cross-sectional perspective view of a chip-shaped circuit component supply device according to a first embodiment of the present invention.

FIG. 2 is a vertical sectional front view of the chip-shaped circuit component supply device according to the first embodiment of the present invention.

FIG. 3 is a cross-sectional plan view of the container portion of the chip-shaped circuit component supply device according to the first embodiment of the present invention.

FIG. 4 is a cross-sectional plan view of a container portion of a chip-shaped circuit component supply device according to a second embodiment of the present invention.

FIG. 5 is a vertical cross-sectional front view of a component supply device as a conventional example.

[Explanation of symbols]

 2 recessed part 4 nozzle 5 hopper part 6 parts discharge chamber 7 parts discharge port of hopper part 10 parts transfer path 48 parts discharge path a chip-shaped circuit parts

Claims (2)

[Scope of utility model registration request] 1. A hopper portion 5 in which chip-shaped circuit components a, a ... Are stored in a bulk shape, a component discharge passage 48 for discharging the chip-shaped circuit component a from the hopper portion 5, and a component discharge passage 48 of the component discharge passage 48. In a chip-shaped circuit component supply device having an escapement mechanism that allows the chip-shaped circuit components a at the lower end to escape to the component transport path 10 one by one, below the hopper portion 5, a component discharge chamber 6 with a closed periphery is provided. , Hopper part 5
The component discharge port 7 for supplying the chip-shaped circuit component a from the component discharge chamber 6 is opened to one side of the component discharge chamber 6, and air is jetted into the component discharge chamber 6 to the other side of the component discharge chamber 6. Nozzles 4 are provided, and these nozzles 4 and the component discharge port 7 are provided.
The chip-shaped circuit component supply device is characterized in that a component-discharging path 48 through which the chip-shaped circuit component a can pass vertically is connected to the bottom of the component-discharging chamber 6 between and. 2. The chip-shaped circuit according to claim 1, wherein the upper end of the component discharge passage 48 is connected to the bottom of the recess 2 having a funnel-shaped slope formed in the bottom of the component discharge chamber 6. Parts supply device.