JPH0729591Y2 - Chip type connector - Google Patents
Chip type connectorInfo
- Publication number
- JPH0729591Y2 JPH0729591Y2 JP1990102089U JP10208990U JPH0729591Y2 JP H0729591 Y2 JPH0729591 Y2 JP H0729591Y2 JP 1990102089 U JP1990102089 U JP 1990102089U JP 10208990 U JP10208990 U JP 10208990U JP H0729591 Y2 JPH0729591 Y2 JP H0729591Y2
- Authority
- JP
- Japan
- Prior art keywords
- type connector
- chip
- contact
- back surface
- release paper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005476 soldering Methods 0.000 claims description 8
- 239000012790 adhesive layer Substances 0.000 claims description 7
- 230000013011 mating Effects 0.000 claims description 6
- 238000004049 embossing Methods 0.000 claims description 3
- 229920003002 synthetic resin Polymers 0.000 claims description 3
- 239000000057 synthetic resin Substances 0.000 claims description 3
- 239000002390 adhesive tape Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000012790 confirmation Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000003094 microcapsule Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Landscapes
- Packages (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Multi-Conductor Connections (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【考案の詳細な説明】 「産業上の利用分野」 この考案はフレキシブルプリント基板などに面実装する
超小形なチップ形コネクタに関する。DETAILED DESCRIPTION OF THE INVENTION "Industrial application field" The present invention relates to a microminiature chip-type connector surface-mounted on a flexible printed circuit board or the like.
「従来の技術及び考案が解決しようとする課題」 従来のこの種のチップ形コネクタは、フレキシブル基板
などに面実装する際、コネクタが超小形で軽量であるた
め、僅かの振動衝撃や、実装面の傾斜によって、（特に
フレキシブル基板は変形により実装面が傾斜し易い。）
半田付するために配置された所定の位置からずれ易く、
しばしばその位置ずれを修正したり、或いは治具を用い
てフレキシブル基板及びチップ形コネクタを押えて、互
いの位置がずれないようにしなければならず、基板実装
の作業性がきわめて悪い欠点があった。"Problems to be solved by conventional technologies and devices" When this type of conventional chip-type connector is surface-mounted on a flexible substrate, etc., the connector is ultra-compact and lightweight. (In particular, the mounting surface of the flexible board tends to tilt due to deformation.)
Easy to shift from the predetermined position for soldering,
Often, the misalignment had to be corrected, or the jigs had to be used to press the flexible board and the chip-shaped connector so that they would not misalign with each other, and the workability of board mounting was extremely poor. .
この考案は、上記従来の欠点を解決して、基板実装の作
業性のよいチップ形コネクタを提供することを目的とし
ている。An object of the present invention is to solve the above-mentioned conventional drawbacks and to provide a chip-type connector which is easy to mount on a board.
「課題を解決するための手段」 （１）合成樹脂製のボディにコンタクトが植立てられ、
そのコンタクトの一端が上方に突出されて相手コンタク
トとの嵌合部とされ、他端が上記ボディの裏面に形成さ
れたガイド溝に係合して、ボディの側面より外部に突出
されて面実装用の半田付端子部とされて成るチップ形コ
ネクタにおいて、上記半田付端子部の突端が上記ボディ
の裏面とほぼ同じ平面上に位置される。"Means for solving the problem" (1) Contact was planted in a synthetic resin body,
One end of the contact is projected upward to form a mating portion with the mating contact, and the other end is engaged with a guide groove formed on the back surface of the body to project outward from the side surface of the body for surface mounting. In a chip-type connector configured as a soldering terminal portion for use with a soldering terminal portion, the projecting end of the soldering terminal portion is located on substantially the same plane as the back surface of the body.
上記ボディの裏面に接着剤層が形成され、その接着剤層
上に長尺の共通の剥離紙が貼り付けられる。また長尺の
共通のエンボスフィルムが、上記ボディを覆うと共に上
記剥離紙に接合される。即ち、チップ形コネクタは、上
記剥離紙及びエンボスフィルムによってテーピングさ
れ、連鎖状部品とされている。An adhesive layer is formed on the back surface of the body, and a long common release paper is attached to the adhesive layer. A long common embossed film covers the body and is bonded to the release paper. That is, the chip-type connector is made into a chain-like component by taping with the release paper and the embossing film.
「実施例」 この考案のチップ形コネクタは、第１図に示すように、
合成樹脂製のボディ１にコンタクト２が植立てられ、そ
のコンタクト２の一端が上方に突出されて相手コンタク
トとの嵌合部2aとされ、他端が上記ボディ１の側面より
外部に突出されて面実装用の半田付端子部2bとされてい
る。そしてボディ１の裏面に両面接着テープ３が形成さ
れる。[Example] As shown in FIG. 1, the chip type connector of the present invention is
A contact 2 is planted in a synthetic resin body 1, one end of the contact 2 is projected upward to form a fitting portion 2a with a mating contact, and the other end is projected outward from a side surface of the body 1. It is a soldered terminal portion 2b for surface mounting. Then, the double-sided adhesive tape 3 is formed on the back surface of the body 1.
ボディの底板1aには第２図に示すように、その裏面に、
複数の直線状の溝1bが同じピッチで形成され、それらの
各溝1bの底面に一対の貫通孔1cが形成される。ボディ１
の裏面側よりこれらの貫通孔にコンタクト２が圧入され
る。溝1bにコンタクトの半田付端子部2bが案内されてボ
ディ１の側面より外部に突出される。ボディ１の裏面の
２つの角部より、位置決め用の突起1dが必要に応じ一体
に突設される。また、ボディ１の側壁には、相手コネク
タのボディの突部を嵌合させるための凹部1eが２箇所形
成されている。On the bottom plate 1a of the body, as shown in FIG.
A plurality of linear grooves 1b are formed at the same pitch, and a pair of through holes 1c are formed on the bottom surface of each groove 1b. Body 1
The contacts 2 are press-fitted into these through holes from the back surface side of. The soldered terminal portion 2b of the contact is guided in the groove 1b and is projected outside from the side surface of the body 1. Positioning projections 1d are integrally provided as projecting from two corners on the back surface of the body 1 as required. Further, on the side wall of the body 1, there are formed two recesses 1e for fitting the protrusions of the body of the mating connector.
第１図ではコンタクト２がピンコンタクトである場合を
示したが、ソケットコンタクトの場合もある。Although FIG. 1 shows the case where the contact 2 is a pin contact, it may be a socket contact.
両面接着テープ３としては市販のものを用いてもよい
が、接着剤層をボディ１の裏面に印刷し、その上に剥離
紙を貼り付けることもできる。A commercially available one may be used as the double-sided adhesive tape 3, but an adhesive layer may be printed on the back surface of the body 1 and a release paper may be attached thereon.
接着剤としては接着剤入りマイクロカプセルを溶剤中に
分散させたものなど種々のものを用いることができる。As the adhesive, various adhesives such as one in which adhesive-containing microcapsules are dispersed in a solvent can be used.
第３図に示すように、長尺の共通の剥離紙3b上に、接着
剤層3a付の多数のチップ形コネクタ10を所定のピッチで
貼り付け、その剥離紙3bを台テープとし、長尺の共通の
エンボスフィルム４をチップ形コネクタ10に覆せて、台
テープに接合することにより、多数のチップ形コネクタ
10をテーピングすることができる。このテーピングされ
て連鎖状部品とされた多数のチップコネクタ10はリール
に巻き取られて保管される。またこのリールに巻き取ら
れた状態で自動組込装置に装着される。As shown in FIG. 3, a large number of chip-type connectors 10 with an adhesive layer 3a are pasted on a long common release paper 3b at a predetermined pitch, and the release paper 3b is used as a base tape. By covering the chip-type connector 10 with the common embossed film 4 of the above and joining it to the base tape, a large number of chip-type connectors can be obtained.
10 can be taped. A large number of chip connectors 10 that are taped into chain-like parts are wound on reels and stored. Further, the reel is mounted on the automatic assembling device in a state of being wound up.
「考案の効果」 この考案によれば、チップ形コネクタの裏面に両面接着
テープが付けられているので、その剥離紙をはがして、
フレキシブル基板などの所定の実装位置に貼り付けるこ
とができる。従って従来のように、振動、衝撃や実装面
の傾斜によって生ずる位置ずれを修正したり、或いは治
具を用いてフレキシブル基板及びチップ形コネクタを押
えて位置ずれを防ぐといっためんどうな作業は必要でな
くなり、基板実装の作業性のよい、チップ形コネクタが
得られる。"Effect of device" According to this device, since the double-sided adhesive tape is attached to the back surface of the chip type connector, peel off the release paper,
It can be attached to a predetermined mounting position such as a flexible substrate. Therefore, unlike conventional methods, it is no longer necessary to fix the misalignment caused by vibration, impact or mounting surface inclination, or to prevent misalignment by pressing the flexible board and chip type connector with a jig. A chip-type connector with good workability in board mounting can be obtained.
この考案のチップ形コネクタはコネクタの底板の溝1bや
貫通孔1cとコンタクト２との間の隙間が両面接着テープ
３により完全に塞がれるので、半田付の際に生ずるベー
パー、特にそれに含まれるハンダボールその他の異物が
コネクタの上面側のボディやコンタクトに付着する恐れ
はなく、接続の信頼性を向上できる。In the chip type connector of the present invention, the gap between the contact 2 and the groove 1b or the through hole 1c of the bottom plate of the connector is completely closed by the double-sided adhesive tape 3, so that the vapor generated during soldering, especially included in it. There is no risk that solder balls or other foreign matter will adhere to the body or contacts on the upper surface of the connector, and the reliability of the connection can be improved.
半田付端子部2bがボディの側面より突出しているので、
基板実装時の位置決めや半田ののりの確認を容易に行え
る。また半田付端子部の高さ方向の寸法が小さいので、
実装時の部品高を小さくできる。Since the soldered terminal portion 2b projects from the side surface of the body,
Positioning at the time of board mounting and confirmation of solder paste can be performed easily. Also, since the height of the soldered terminals is small,
The height of parts when mounted can be reduced.
半田付時の熱や相手コネクタとの嵌合に対して、コンタ
クト２をガイド溝1bや接着剤層によって強固にボディに
固定できる。The contact 2 can be firmly fixed to the body by the guide groove 1b and the adhesive layer against heat at the time of soldering and fitting with the mating connector.
エンボスフィルム４によって運搬や保管時の振動、衝撃
に対してコネクタを充分保護できる。The embossed film 4 can sufficiently protect the connector against vibration and shock during transportation and storage.
第１図はこの考案の実施例の要部を示す図で、Ａはコネ
クタの半部を断面で示した正面図、Ｂは半部を断面で示
した側面図、Ｃは平面図、Ｄは底面図、第２図は第１図
のボディ１を示す図で、Ａは半部を断面で示した正面
図、Ｂは半部を断面で示した側面図、Ｃは平面図、Ｄは
底面図、第３図はこの考案の実施例を示す縦断面図であ
る。FIG. 1 is a view showing a main part of an embodiment of the present invention, in which A is a front view showing a half of a connector in section, B is a side view showing the half in section, C is a plan view, and D is D. FIG. 2 is a bottom view, FIG. 2 is a view showing the body 1 in FIG. 1, A is a front view showing a half section, B is a side view showing the half section, C is a plan view, and D is a bottom view. 3 and 4 are longitudinal sectional views showing an embodiment of the present invention.
Claims (1)
られ、そのコンタクトの一端が上方に突出されて相手コ
ンタクトとの嵌合部とされ、他端が上記ボディの裏面に
形成されたガイド溝に係合してボディの側面より外部に
突出されて面実装用の半田付端子部とされて成るチップ
形コネクタであって、 上記半田付端子部の突端が、上記ボディの裏面とほぼ同
じ平面上に位置され、 上記ボディの裏面に接着剤層が形成され、 その接着剤層上に長尺の共通の剥離紙が貼り付けられ、 長尺の共通のエンボスフィルムが、上記ボディを覆うと
共に上記剥離紙に接合され、 上記剥離紙及びエンボスフィルムによってテーピングさ
れ、連鎖状部品とされていることを特徴とする、 チップ形コネクタ。1. A guide groove in which a contact is planted in a synthetic resin body, one end of the contact is projected upward to be a fitting portion with a mating contact, and the other end is formed on the back surface of the body. Is a chip-type connector formed by engaging with a body and protruding outward from the side surface of the body to form a soldering terminal portion for surface mounting, wherein the projecting end of the soldering terminal portion is substantially flush with the back surface of the body. Located on the upper side, an adhesive layer is formed on the back surface of the body, and a long common release paper is attached on the adhesive layer, and a long common embossing film covers the body and A chip-type connector, which is joined to a release paper and is taped by the release paper and the embossing film to form a chain-like component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990102089U JPH0729591Y2 (en) | 1990-09-28 | 1990-09-28 | Chip type connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990102089U JPH0729591Y2 (en) | 1990-09-28 | 1990-09-28 | Chip type connector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0459090U JPH0459090U (en) | 1992-05-20 |
| JPH0729591Y2 true JPH0729591Y2 (en) | 1995-07-05 |
Family
ID=31846057
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990102089U Expired - Fee Related JPH0729591Y2 (en) | 1990-09-28 | 1990-09-28 | Chip type connector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0729591Y2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2104438C (en) * | 1992-11-02 | 1996-07-02 | James Stephen Chapman | Method and apparatus for mounting connectors |
| JP5208816B2 (en) * | 2009-03-06 | 2013-06-12 | 日本板硝子株式会社 | Glass with terminal and vehicle with glass with terminal |
| CN114271038B (en) * | 2019-08-23 | 2024-05-03 | 株式会社富士 | Electronic circuit device and method for manufacturing the same |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS624394A (en) * | 1985-06-29 | 1987-01-10 | 株式会社東芝 | Mounting of flat package type electronic component and adhesive sheet used therefor |
| JPS6444571U (en) * | 1987-09-11 | 1989-03-16 | ||
| JPH01184986A (en) * | 1988-01-20 | 1989-07-24 | Sanyo Electric Co Ltd | Printed board composite |
| JPH01276695A (en) * | 1988-04-27 | 1989-11-07 | Pfu Ltd | Surface-mounted electronic components and their taping bodies |
-
1990
- 1990-09-28 JP JP1990102089U patent/JPH0729591Y2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0459090U (en) | 1992-05-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |