JPH0729504Y2 - Support for semiconductor test equipment - Google Patents

Description

[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to an apparatus for inspecting the characteristics of semiconductors such as LSI,
In particular, it relates to improvements in the device that supports this device.

<Prior Art> A semiconductor test device is known, for example, from Japanese Utility Model Laid-Open No. 61-102,881 proposed by the present applicant. FIG. 5 is a diagram for explaining the entire conventional device. In the figure, such an apparatus includes a tester 10 for testing a semiconductor, a sensor head 20 directly connected to a semiconductor under test, a handler 30 for supplying the semiconductor under test, and a handler for the sensor head 20.
A manipulator 40 that moves to an appropriate position with respect to 30,
It comprises a cable 50 for electrically connecting the tester 10 and the sensor head 20.

In the apparatus thus configured, the semiconductor under test is sent to the sensor head 20 by the handler 30. The sensor head 20 checks the characteristics of the semiconductor and sends a measurement signal to the tester 10 via the cable 50.

The manipulator 40 holds the sensor head 20 and
It is aligned with the handler 30 (also known as the prober). The manipulator 40 is provided with casters 42 that move on the floor surface, a holder 44 that projects horizontally in a cantilever shape, and a screw 46 that fixes the holder 44 and the sensor head 20. In addition to this, a joint mechanism is provided to change the posture of the sensor head 20.

<Problems to be solved by the device> However, in the conventional device, the manipulator of the sensor head 20 is used.
Since the attachment to the 40 is performed by using the screw 46, two persons, a person who holds the sensor head 20 and an operator who fixes the screw, are required, which causes a problem that the sensor head replacement work becomes complicated. In the manufacture of semiconductors, a plurality of types of semiconductors may be manufactured on the same day, and the sensor head 20 is frequently replaced accordingly. In addition, the replacement work requires a large space separated from the entire semiconductor test apparatus, which poses a problem that the installation place is limited.

The present invention solves such a problem, and an object of the present invention is to provide a support for a semiconductor test device in which the sensor head and the manipulator can be easily attached and detached.

<Means for Solving the Problems> According to the present invention for achieving such an object, a sensor box having an approximately box shape is attached to a mounting frame of a manipulator, and the posture of the sensor head is determined by this attachment. The support has the following structure.

That is, the sensor head is provided with a bearing provided so as to project to both side surfaces thereof, and a mounting hole provided at a position apart from the bearing on at least one surface of the side surface.

Further, the manipulator is provided on a surface of the mounting frame facing both side surfaces of the sensor head, has a width slightly larger than a diameter of the bearing, and has a depth of at least a radius of the bearing or more. , Centering on a notch portion provided on the opposite side to the floor surface of the mounting frame and a point serving as a rotation axis of a bearing inserted in the notch portion,
Having a distance between the bearing and the mounting hole as a radius,
An arc-shaped guide hole having an angle of at least 90 degrees or more is provided.

Further, a knob fixed to the mounting hole by sandwiching the guide hole is provided.

<Operation> The bearing is a rotating shaft of the sensor head, and absorbs a difference in angle between the contact surface with the notch and the sensor head body. The notch supports the bearing. The guide hole has a shape required to hold the measurement surface of the sensor head horizontally or vertically, and a specific angle is designated for the mounting hole and the knob.

<Example> The present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view showing the construction of an embodiment of the present invention, in which the essential parts are shown. FIG. 2 is an explanatory view of the assembled state,
(A) is a front view and (B) is a side view. In the figure, the bearings 22 are provided so as to project from both side surfaces of the sensor head 20. The mounting hole 24 is provided on at least one surface of this side surface at a position separated from the bearing 22 by a predetermined distance l.

The mounting frame 44 corresponds to the holder 44 described above, and has surfaces facing both side surfaces of the sensor head 20. Notch 45
Is provided on the mounting frame 44, has a width w slightly larger than the diameter d of the bearing 22, and has a depth h at least larger than the radius of the bearing 22.
Perform with 22. The notch 45 is provided on the opposite side of the floor of the mounting frame 44, and here the opening distance at the edge is enlarged like a trumpet to facilitate insertion. The guide hole portion 48 has a distance l between the bearing and the mounting hole as a radius r centering on a point O serving as the rotation axis of the bearing inserted in the cutout portion 45, and an angle θ of at least 90 degrees or more. have. Here, one end H of the guide hole 48 holds the measurement surface of the sensor head 20 horizontally, and the other end V has a positional relationship required to hold the measurement surface vertically. ing.

FIG. 3 is a detailed explanatory view of the bearing 22. The rotating portion 22 having a width w1 at least larger than the thickness t of the mounting frame 44.
1, a bushing 222 provided inside thereof, and a bolt 223 provided on the shaft. The rotating portion 221 contacts the cutout portion 45, and the bolt 223 serves as the reinforcing plate 2 provided on the sensor head 20.
It is screwed to 1.

The operation of the apparatus thus configured will be described below. Fourth
The figure is an illustration of a state in which the sensor head 20 is held horizontally. The bearing 22 is inserted into the cutout portion 45, and the sensor head 20 rotates about the bearing 22 in the arrow A direction. If the mounting position of the bearing 22 is a position where the moment of the sensor head 20 is balanced, the rotation becomes easy. If the knob 60 is attached to the attachment hole 24 via the guide hole portion 48, the angle of the sensor head 20 in the direction of arrow A can be held in a desired posture. If the mounting frame 44 is moved up and down with respect to the manipulator 40, biaxial movement is possible.

<Effect of Device> As described above, the present invention has the following practical effects.

Attach the sensor head 20 to the manipulator 40,
Since the bearing 22 is pivotally supported and fixed by the knob 60, the attachment / detachment is facilitated and the maintenance work is facilitated.

The bearing 22 serves as a rotation axis of the sensor head 20 in the direction of arrow A (up and down with respect to the front surface) and has a fitting relationship with the cutout portion 45, so the number of parts is small and the cost is reduced. Become.

[Brief description of drawings]

FIG. 1 is a perspective view showing the structure of an embodiment of the present invention, FIG. 2 is an explanatory view of an assembled state, FIG. 3 is a detailed explanatory view of a bearing 22, and FIG. 4 is a state in which a sensor head 20 is held horizontally. FIG. FIG. 5 is an explanatory diagram of a conventional device. 10 …… Tester, 20 …… Sensor head, 22 …… Bearing, 24 …… Mounting hole, 30 …… Handler, 40 …… Manipulator, 44 …… Mounting frame, 45 …… Notch part, 48 …… Guide hole part , 60 …… Knob.

Claims (1)

[Scope of utility model registration request] 1. A support for a semiconductor test device, which is attached to a mounting box of a sensor box and a manipulator having a substantially box shape and determines the posture of the sensor head by the mounting, in a state of protruding to both side surfaces of the sensor head. A bearing that is provided, a mounting hole that is provided at a position apart from this bearing on at least one surface of this side surface, and a surface that is provided on a surface of the mounting frame that faces both side surfaces of the sensor head, and that is larger than the diameter of the bearing. A notch having a slightly larger width and at least a radius not less than the radius of the bearing and provided on the opposite side to the floor surface of the mounting frame, and a rotating shaft of the bearing inserted into the notch. A circular arc having a radius between the bearing and the mounting hole and having an angle of at least 90 degrees or more around the point A guide hole and a knob fixed in the mounting hole by sandwiching the guide hole, the bearing is mounted in the notch, and the knob is used to horizontally or horizontally measure the measurement surface of the sensor head. A support for semiconductor test equipment, which is held in a vertical state.