JPH07243810A - Electronic component position recognition method and position recognition device - Google Patents

Abstract

(57) [Abstract] [Purpose] To make it possible to recognize the position of an IC that has a bumper section. [Structure] The IC 1 has lead portions 4 on four sides of the package 2 and bumper portions 3 on four corners. The CCD camera 7 photographs the IC 1 from the bottom side. Visual recognition controller 9
Inputs image data, linearly scans the lead portion 4 and the bumper portions 3 at both ends to obtain binarized data, and detects the scanning width of the data in the portion where the object exists. Since the scanning width of the bumper portion 3 and the scanning width between the lead wires of the lead portion 4 are different, the bumper portion 3 can be specified by comparing with the dimensional data of the IC 1. The center position and the tilt angle of the IC 1 are calculated and calculated based on the image data of the lead portion 4, and the position is corrected when the IC 1 is mounted on the printed circuit board 6.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is intended for position recognition of a lead portion formed of a plurality of lead wires outside a package and an electronic component having bumper portions formed at both ends so as to protect the lead portion. The present invention relates to a position recognizing method and a position recognizing device for an electronic component, the position of which is recognized based on imaged data obtained by photographing.

[0002]

2. Description of the Related Art For example, in an apparatus for automatically mounting electronic components such as ICs on a printed circuit board, the electronic components to be mounted are sucked and fixed to a robot head and conveyed onto the printed circuit board, and the electronic components are printed. It is configured to be mounted on a predetermined mounting portion of the board.

In recent years, with the progress of miniaturization of electronic parts such as ICs, the mounting density on a printed circuit board has increased, and high positional accuracy has been required for mounting electronic parts. Therefore, taking into account that the relative position of the robot head and the electronic component attracted to it is shifted, the electronic component being transferred is photographed by a CCD camera or the like, and the adsorption fixing position of the electronic component with respect to the reference position is taken from the photographed data. Is accurately detected, and the mounting position on the printed circuit board is corrected based on the detection result.

In this case, the following method is considered as a method for recognizing the position of the electronic component. That is, generally, the shape of the electronic component that is the position recognition target is formed in a shape in which a large number of lead wires are led out from a resin-made package portion in which a semiconductor chip is sealed. Therefore,
Binary data corresponding to the contour shape of the electronic component is obtained by photographing the planar shape of the electronic component with a CCD camera or the like, inputting image data, and performing binarization processing or the like on the image data. Then, the lead portion and the package portion are identified from the whole based on the binarized data, and the center line and the tilt angle of the electronic component are detected by obtaining the center line and the like from the outer shape of the obtained package portion. Of.

[0005]

By the way, in the position recognition method for an electronic component as described above, the electronic component whose position is to be recognized is composed of a rectangular package portion and a lead wire portion led to the outside thereof. The center position, the tilt angle, and the like are detected on the assumption that the external shape is as follows. In recent years, for example, an electronic component having an external shape that does not meet this prerequisite is, for example, a QFP with bumper.
I with a (Quad Flat Package) type package
Since C has appeared, it cannot be dealt with by the conventional position recognition method as described above, and the actual situation is hindering automatic mounting.

Such a QFP type IC with bumper
Is, for example, a bumper portion projecting in a diagonal direction is formed at four corners of a QFP type rectangular package similar to the conventional one, and the lead wire portions led out from the four sides are externally mounted before mounting. The bumper part is provided so as to prevent the bumper part from being deformed due to contact with the like. Therefore, even if the planar shape is photographed according to the conventional method, when the package portion and the lead portion are distinguished from each other, the lead portion is sandwiched by the bumper portions, so that the position cannot be recognized.

The present invention has been made in view of the above circumstances, and an object thereof is to accurately recognize the position even in an electronic component having a bumper portion on both sides of a lead wire portion such as a bumper-equipped electronic component. An object of the present invention is to provide a position recognition method and a position recognition device for an electronic component, which are capable of performing the above.

[0008]

A method for recognizing a position of an electronic component according to the present invention is an electronic device in which bumps are formed at both ends so as to protect a lead portion composed of a plurality of lead wires outside the package and the lead portion. A binary for creating binary data by linearly scanning a part as a position recognition target so as to cross a plurality of lead wires of the lead part from image data obtained when the electronic part is photographed by the image pickup means. And a step of identifying the lead portion and the bumper portion based on the binarized data obtained by the binarizing process and the dimension data of the lead portion and the bumper portion of the electronic component, And a calculation step for calculating the position of the electronic component based on the image data corresponding to the lead portion identified in the identification step. A.

The identification step includes a scanning width detection step of detecting the scanning width of the bumper portion and the scanning width of each lead wire of the lead portion from the binarized data, and width dimension data of the bumper portion of the electronic component. Based on the stored dimensional data from the storage means, a portion corresponding to the bumper portion is specified from the scanning width detected in the scanning width detecting step to discriminate between the bumper portion and the lead portion. It is better to configure it with steps.

The identifying step includes a scanning width detecting step of detecting a scanning width between the bumper portion and the lead portion and a scanning width between lead wires of the lead portion from the binarized data, Based on the dimension data from the storage means that stores the width dimension data between the bumper portion and the lead portion of the electronic component, the bumper portion and the lead portion are detected from the scanning width detected in the scanning width detecting step. It is also possible to include a determination step of determining the bumper portion and the lead portion by specifying a portion corresponding to the width dimension between the two.

Further, in the identifying step, the portions located at both ends of the data indicating the existence of the object in the binarized data are specified as the bumper portion of the electronic component, and the bumper portion and the bumper portion are identified. You may make it discriminate | determine from a lead part.

Further, the electronic component position recognizing device of the present invention is capable of recognizing the position of an electronic component having bumpers at both ends so as to protect the lead portion composed of a plurality of lead wires outside the package and the lead portion. An image pickup device for taking an image of the electronic component, and a binary data that is linearly scanned across a plurality of lead wires of the lead portion based on image data from the image pickup device. And a discriminating means for discriminating the lead portion and the bumper portion based on the binarized data obtained by the binarizing processing means and the dimension data of the lead portion and the bumper portion of the electronic component. And a calculating means for calculating the position of the electronic component based on the image data corresponding to the lead portion identified by the identifying means.

In the above structure, a storage means for storing width dimension data of the bumper portion of the electronic component is provided, and the identification means is configured to use the binarized data to scan the bumper portion and each lead wire of the lead portion. And a portion corresponding to the bumper portion from the scanning width detected by the scanning width detecting means based on the dimension data from the scanning width detecting means for detecting the scanning width of the bumper portion. And a discriminating means for discriminating the lead portion.

Storage means for storing width dimension data between the bumper portion and the lead portion of the electronic component is provided, and the identifying means is used to identify the bumper portion and the lead portion from the binarized data. A scanning width detecting means for detecting a width dimension between and a scanning width between the lead wires of the lead portion,
Based on the dimension data from the storage means, a portion corresponding to the width dimension between the bumper portion and the lead portion is specified from the scanning width detected by the scanning width detection means to specify the bumper portion and the lead portion. It can also be configured by a determination means for determining

Further, the identifying means identifies the portions located at both ends of the data indicating the presence of the object in the binarized data as the bumper portion of the electronic component, and the bumper portion and the bumper portion. It may be configured to discriminate the lead portion.

[0016]

According to the electronic component position recognizing method of the present invention, in the binarizing step, the image data of the electronic component photographed by the image pickup means is made to traverse a plurality of lead wires of the lead portion. Binary data is created by linearly scanning and comparing the image data on the scan line with a predetermined threshold value. And
In the identification step, the scanning width of the lead wire of the lead portion of the electronic component or the scanning width of the bumper portion obtained from the binarized data is obtained, and the scanning width is compared with the corresponding dimension data of the actual electronic component. The portion corresponding to the lead portion and bumper portion of the electronic component in the image data is identified. In the calculation step, the position of the electronic component is calculated based on the image data of the identified lead portion, and the central position or the tilt angle of the electronic component is calculated. Thus, for example, when an electronic component having a bumper portion is automatically mounted on a printed circuit board or the like, it becomes possible to correctly recognize the position of the electronic component to be mounted and mount it at the correct position.

According to the electronic component position recognizing method of the present invention, in the above-mentioned identification step, in the scanning width detecting step, the scanning width of the bumper portion and the scanning of each lead wire of the lead portion are scanned from the binarized data. The width of the bumper portion of the electronic component is detected by reading the width dimension data of the bumper portion of the electronic component from the storage means and comparing it with the scanning width detected in the scanning width detecting step. The corresponding portion is specified to discriminate between the bumper portion and the lead portion. This makes it possible to correctly recognize the position of the electronic component having the bumper portion and mount the electronic component at the correct position.

According to the electronic component position recognizing method of the third aspect, in the above-mentioned identification step, in the scanning width detecting step, the scanning width between the bumper portion and the lead portion and the lead portion are detected from the binarized data. The scanning width between the lead wires is detected, and then, in the determining step, the width dimension data between the bumper portion and the lead portion of the electronic component is read from the storage unit, and the scanning width detected in the scanning width detecting step is compared with the scanning width. By comparing, the portion corresponding to the width dimension between the bumper portion and the lead portion of the electronic component is specified to discriminate the bumper portion and the lead portion. This makes it possible to correctly recognize the position of the electronic component having the bumper portion and mount the electronic component at the correct position. In the above case, the bumper portion can be specified without setting the positions of the start point and the end point of the scan line to the positions outside the bumper portion, and the degree of freedom in setting the scan line is increased.

According to the position recognizing method of the electronic component of the fourth aspect, in the above-mentioned identifying step, the portions located at both ends of the data indicating the presence of the object in the binarized data are electronic components. The bumper portion and the lead portion can be discriminated by specifying the bumper portion. As a result, the position of the electronic component having the bumper portion can be correctly recognized easily and quickly, and the electronic component can be mounted at the correct position.

According to another aspect of the position recognizing device for electronic parts, when the electronic part is imaged by the imaging means, the binarization processing means converts the image data from the imaging means into a plurality of lead wires of the lead section. Then, the image data on the scanning line is compared with a predetermined threshold value to create binary data. The identification means is
The scan width of the lead wire of the lead part of the electronic component or the scan width of the bumper part obtained from the binarized data is obtained, and the scan width is compared with the corresponding dimension data of the actual electronic component to obtain the electronic data in the image data. Identify the parts that correspond to the lead and bumper parts of the part. Then, the calculation means calculates the position of the electronic component based on the image data of the identified lead portion. This makes it possible to obtain the center position or tilt angle of the electronic component. For example, when an electronic component having a bumper section is automatically mounted on a printed circuit board or the like, the position of the electronic component to be mounted can be correctly recognized and accurately determined. It can be installed at any position.

According to another aspect of the position recognizing device for electronic parts, the scanning width detecting means constituting the identifying means is based on the binarized data, the scanning width of the bumper portion and the scanning width of each lead wire of the lead portion. The discriminating means detects the width dimension data of the bumper portion of the electronic component from the storage means and compares it with the scanning width detected by the scanning width detecting means to determine the portion corresponding to the bumper portion of the electronic component. The bumper section and the lead section are identified and identified. This makes it possible to correctly recognize the position of the electronic component having the bumper portion and mount the electronic component at the correct position.

According to another aspect of the position recognizing device of the electronic component, the scanning width detecting means constituting the identifying means includes the scanning width between the bumper portion and the lead portion and the lead of the lead portion from the binarized data. By detecting the scanning width between the lines, the determining means reads the width dimension data between the bumper portion and the lead portion of the electronic component from the storage means, and compares it with the scanning width detected by the scanning width detecting means. A portion corresponding to the width dimension between the bumper portion and the lead portion of the electronic component is specified to discriminate between the bumper portion and the lead portion. This allows
It becomes possible to correctly recognize the position of the electronic component having the bumper portion and mount the electronic component at the correct position. In the above case, the bumper portion can be specified without setting the positions of the start point and the end point of the scan line to the positions outside the bumper portion, and the degree of freedom in setting the scan line is increased.

According to another aspect of the position recognizing device of the electronic component, the identifying means determines the portions of the binarized data, which are located at both ends of the data indicating the existence of the object, at the bumper portion of the electronic component. It becomes possible to distinguish between the bumper portion and the lead portion by specifying as, so that it becomes possible to easily and quickly recognize the position of the electronic component having the bumper portion correctly and mount it at the correct position. .

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment in which the present invention is applied to an automatic mounting apparatus will be described below with reference to FIGS. FIG. 3 shows a bumper-equipped QPF (BQFP: electronic component) as a position recognition target to be mounted in this embodiment.
4 shows the planar shape of a Quad Flat Package with bumper) type IC1. The IC 1 includes a rectangular resin package portion 2 in which an IC chip is sealed, a bumper portion 3 integrally formed at four corners of the resin package portion 2 so as to project outward, and each side of the resin package portion 2. The lead wire portion 4 has a large number of lead wires 4a led out from the portion toward the outside.

Next, in FIG. 1 schematically showing the main part of the electronic component mounting apparatus, the above-mentioned IC 1 is conveyed onto the printed circuit board 6 by a drive mechanism (not shown) while being fixed by suction by the robot head 5. To be done. Robot head 5
A CCD camera 7 for recognizing ICs is provided as a photographing means in the middle of the conveyance path by, and the plane shape of the IC 1 illuminated from above is photographed below. The installation position of the printed circuit board 6 is photographed by the CCD camera 8 for board recognition. In this case, the CCD camera 8 photographs the portion of the circular board recognition mark A attached to the printed board 6 and detects its position.

The CCD cameras 7 and 8 are connected to the visual recognition controller 9 and process photographed image data as described later. The visual recognition controller 9 provides position control information to the mounting machine controller 10 and outputs a drive signal to the robot head 5 of the drive mechanism to control the drive. The mounting machine controller 10 is provided with a data input unit for mounting the IC 1, receives the data, and drives and controls a drive mechanism (not shown) based on a control signal provided from the visual recognition controller 9.

Now, a block diagram of the control system is shown in FIG.
In the above, the visual controller 9 receives the image data from the IC data receiving unit 11 that receives the data from the mounting machine controller 10, the receiving unit 11 and the CCD cameras 6 and 8 and receives various image data based on the data. It is composed of an arithmetic processing unit 12 that executes arithmetic processing, and a transmission unit 13 that transmits a control signal based on the result calculated by the arithmetic processing unit 12. Further, the arithmetic processing unit 12 is provided with a memory 14 as a storage unit, and stores dimensional data of each unit showing the shape of the IC 1.

Next, the operation of this embodiment will be described with reference to FIGS. 4 and 5. When mounting the electronic component, the data of the external dimensions of the printed circuit board 6 and the electronic component to be mounted, the mounting condition, and the like are input to the mounting machine controller 10 in advance. Therefore, when mounting the IC1, the mounting machine controller 10 sends the external dimension data of the IC1 to the visual recognition controller 9. In this case, the outer dimension data includes the outer dimension of the package 2 of the IC 1, the number of the lead wires 4a of the lead portion 4, the width dimension and the length dimension, and the outer dimension of the bumper portion 3.
As will be described later, it is data corresponding to the width dimension and the like corresponding to the scan width data obtained when the scan line is set.

In the visual recognition controller 9, the IC
The external dimension data of No. 1 is input to the arithmetic processing unit 12 via the data receiving unit 11. The arithmetic processing unit 12 executes various arithmetic processes as follows. In addition, CCD
The position recognition of the printed circuit board 6 by the camera 8 and the position control thereof are performed by the visual recognition controller 9 based on the image data when the position recognition mark A provided on the printed circuit board 6 is photographed to recognize the position. Based on the recognized data, a drive device (not shown) moves to a predetermined position to perform position control.

Now, in the arithmetic processing section 12, the arithmetic processing is executed according to the flow chart of the program shown in FIG. That is, while the IC 1 is adsorbed by the robot head 5, the lower surface side of the IC 1 is photographed by the CCD camera 7 while being moved to the printed circuit board 6 side. In the arithmetic processing section 12, an area for performing image processing corresponding to the lead section 4 of the IC1 is set based on the external dimension data of the IC1.

Then, when the arithmetic processing unit 12 receives the image data from the CCD camera 7 (step S1), as shown in FIG.
Within the area S where the image processing corresponding to
The scanning line m is linearly set so as to cross the lead wire 4a and the bumper portions 3 at both ends thereof (step S
2). Next, the arithmetic processing unit 12 binarizes the image data along the set scanning line m (step S3) and obtains binarized data as shown in FIG. 4B. The arithmetic processing unit 12 detects the data indicating the existence of the object, that is, the scanning width of the guide portion 3 or the lead wire 4a from the binarized data (step S4). In this case, for example, the scanning width of the guide portion 3 is detected as a and the scanning width of each lead wire 4a of the lead portion 4 is detected as two different scanning widths corresponding to b.

Subsequently, the arithmetic processing section 12 reads the width dimension data of the bumper section 3 as the dimension data of the IC 1 stored in the memory 14 (step S5), and the bumper section 3 is read.
Of the scan width and the scan width data a and b detected in step S4 are compared (step S6).
Of b, the one showing a value closer to the width dimension data of the bumper portion 3 is determined to be the bumper portion 3 (step S
7). In this case, for example, when the IC 1 is in a tilted position in the image processing area S, the values of the scanning width data a and b do not match the width dimension data, but the width dimension of the bumper portion 3 and the lead wire 4a. Has a significantly different value, so that one of the scanning width data a and b is the bumper unit 3
Bumper part 3 has a value close to the width dimension data of
Can be determined.

Next, the arithmetic processing unit 12 identifies the lead portion 4 excluding the bumper portion 3 specified in step S7 from the image data (step S8), and based on the image data of this lead portion 4, the IC 1 of the IC 1 is identified. The center position O and the tilt angle are calculated (step S9). In this case, the center position O and the tilt angle are calculated as follows, for example. That is, the arithmetic processing unit 12 calculates the midpoint of the line segment connecting the intersections of the lead lines 4a1 and 4a2 located at both ends of the four lead units 4 and the scanning line m, and the midpoint of the opposing lead unit 4 is calculated. IC at the intersection of the two center lines that connect the two
It is calculated as the center position O of 1. Next, the arithmetic processing unit 12
Calculates the tilt angle of the IC1 by calculating the tilts of the two center lines with respect to the coordinate axes set on the screen.

In this way, when the arithmetic processing unit 12 detects the center position O and the tilt angle from the imaged image data of the IC 1, the arithmetic operation processing unit 12 terminates the position recognition program, and thereafter, the arithmetic operation is performed according to a position control program (not shown). The data of the center position O and the tilt angle are transmitted to the mounting machine controller 10 via the data transmission unit 13. As a result, when the robot head 5 is moved to the printed circuit board 6 side, the mounting machine controller 10 corrects the center position O and the tilt angle of the IC1 with respect to a predetermined mounting position and mounts the IC1.

According to this embodiment, the bumper portion 3
Based on the image data obtained by photographing the IC 1 as an electronic component having a CCD camera 7, the visual recognition controller 9 sets a scanning line to perform binarization processing,
Since the portion corresponding to the guide portion 3 of the IC 1 is specified and the lead portion 4 is identified from the data of the scanning width at that time and the width dimension data of the guide portion 3 stored in the memory 14, When mounting the electronic component having the bumper portion 3, it becomes possible to accurately detect the center position and the inclination angle of the electronic component and perform the mounting.

FIG. 6 shows a second embodiment of the present invention. Hereinafter, parts different from the first embodiment will be described. That is, in this embodiment, the arithmetic processing means 1
2 is a scan line m, as shown in FIGS. 6A to 6D, in step S2 during execution of the position recognition program.
Either n, k, or r is set. That is, the start point and the end point of the scan line m are set outside the bumper section 3 of the IC 1 as in the first embodiment, and the scan line n, k has either the start point or the end point in the bumper section 3. The scanning line r is set in such a manner that both the start point and the end point of the scanning line r are set on the bumper unit 3.

Then, after performing the binarization process through step S3, the arithmetic processing unit 12 in step S4 uses the binarized data obtained as shown in (e) to (h) of FIG. Indicating that there is no such as a gap between the guide portion 3 and the lead wire 4a or the lead wire 4
The scanning width of the portion between a is detected. In this case, for example, the scanning width between the guide portion 3 and the lead portion 4 is c, and the lead portion 4 is
The scanning width between the respective lead wires 4a is detected as two different scanning widths corresponding to d.

Subsequently, the arithmetic processing section 12 reads the width dimension data between the bumper section 3 and the lead section 4 as the dimension data of the IC 1 stored in the memory 14 (step S).
5) The read width dimension data is compared with the scanning width data c and d detected in step S4 (step S6), and the width between the bumper portion 3 and the lead portion 4 of the scanning width data c and d is compared. A portion showing a value close to the dimension data is determined (step S7). As a result, it becomes possible to recognize the lead section 4, and thereafter, the arithmetic processing section 12 similarly executes steps S8 and S9.

According to the second embodiment, the arithmetic processing section 12 scans the binarized data from the scanning width between the guide section 3 and the lead section 4 and the scanning between the lead wires 4a of the lead section 4. Since the guide portion 3 is specified by detecting the width, in addition to the effect of the first embodiment, the scanning lines can be set as four scanning lines m, n, k, r. As a result, the degree of freedom of the detection operation increases.

In the setting of the scanning line in step S2, if the scanning line m shown in FIG. 9A is always set, the scanning width is detected in step S4 as shown in FIG. Based on the binarized data, the scanning width e and the distance between the lead wires 4a corresponding to the pitch, which is the distance between the center position of the guide portion 3 and the center position of the lead wire 4a at the end of the lead portion 4. It is also possible to detect the scanning width f corresponding to the pitch. On the other hand, the memory 14 stores width dimension data corresponding to the pitch dimension between the guide portion 3 and the lead wire 4a at the end of the lead portion 4. In this case, the degree of freedom in setting the scanning line is reduced, but even if the contour portion of the image data is unclear, the center line is determined and determined, so that the detection accuracy can be increased.

FIG. 7 shows a third embodiment of the present invention. Hereinafter, parts different from the second embodiment will be described. That is, in this embodiment, the arithmetic processing unit 12
During execution of the position recognition program, in step S2, one of the scanning lines m, n, k, and r shown in FIGS. 7A to 7D is set in the same manner as described above. When the binarization process is performed in step S3, the arithmetic processing unit 1
2, the process of steps S4 to S6 is omitted, and the process proceeds to step S7, in which the portions located at both ends of the binarized data obtained as shown in (e) to (h) of FIG. Is determined to be the bumper unit 3. That is, the scan line m,
The binarized data at both ends of the portion scanned by n, k, and r is always determined to be the bumper unit 3.

According to the second embodiment as described above, the arithmetic processing unit 12 sets the scanning lines so that both ends of the bumper unit 3 are covered by the arithmetic processing unit 12. Since the portion to be positioned is always specified as the guide portion 3, the detection process can be simplified. Therefore, the lead portion 4 can be quickly identified and the processing for calculating the center position O thereof can be performed. Will be able to.

The present invention is not limited to the above embodiment, but can be modified or expanded as follows. The electronic parts can be photographed even when they are picked up by the robot head 5. The storage means may be a ROM storing dimension data. The position of the electronic component to be recognized can be recognized with reference to the end position of the lead portion 4.

[0044]

As described above, according to the position recognizing method and the position recognizing device for an electronic component of the present invention, the following effects can be obtained. That is, according to the position recognition method of the electronic component of claim 1, the binarization processing step linearly scans the image data of the electronic component from the image pickup means so as to cross a plurality of lead wires of the lead portion. Then, the binarized data is created, and in the identifying step, the lead portion and the bumper portion are identified based on the obtained binarized data and the dimension data of the lead portion and the bumper portion of the electronic component. Since the position of the electronic component is calculated based on the image data corresponding to the lead portion,
The position of an electronic component having a bumper portion can be accurately recognized, and even when the electronic component is automatically mounted on a printed circuit board or the like, the electronic component to be mounted can be mounted at the correct position. It has an excellent effect.

According to the method of recognizing the position of an electronic component of claim 2, the identifying step includes a scanning width detecting step of detecting the scanning width of the bumper portion and the scanning width of each lead wire of the lead portion from the binarized data. , A discrimination step of discriminating the bumper portion from the lead portion by specifying the bumper portion from the detected scanning width based on the dimension data of the storage means, so that the position of the electronic component having the bumper portion can be correctly recognized. It has an excellent effect that it can be mounted at an accurate position.

According to the third aspect of the present invention, the identifying step detects the scanning width between the bumper portion and the lead portion and the scanning width between the lead wires of the lead portion from the binarized data. Based on the scanning width detection step and the dimensional data of the storage means, the portion corresponding to the width dimension between the bumper portion and the lead portion is specified from the detected scanning width to determine the bumper portion and the lead portion. It is possible to correctly recognize the position of the electronic component having the bumper part and mount it at the correct position because it is configured with the determination step to perform, and it is not necessary to set the scanning line to cross the outside of the bumper part. In addition, it has an excellent effect that the bumper portion can be specified with certainty.

According to the position recognition method of the electronic component of the fourth aspect, in the above-mentioned identification step, the portions located at both ends of the data indicating the existence of the object in the binarized data are identified as the electronic component. Since the bumper part and the lead part are distinguished by specifying the bumper part, it is possible to easily and correctly recognize the position of the electronic component having the bumper part and mount it at an accurate position. Has an excellent effect that can be performed in a short time.

According to the position recognizing device of the electronic component of the fifth aspect, the binarization processing means for executing the contents of the above-mentioned binarization processing step, the identification means for executing the contents of the identification step, and the contents of the calculation step. Since the arithmetic means for executing the above is provided, the position of the electronic component having the bumper portion can be accurately recognized, and should be mounted even when the electronic component is automatically mounted on a printed circuit board or the like. It has an excellent effect that the electronic component can be mounted at an accurate position.

According to the position recognizing device of the electronic component of the sixth aspect, the identifying means comprises the dimension detecting means for executing the dimension detecting step and the determining means for executing the determining step. This has an excellent effect of being able to correctly recognize the position of the electronic component having the above and mount it at the correct position.

According to the position recognizing device of the electronic component of the seventh aspect, the identifying means is composed of the dimension detecting means for executing the dimension detecting step and the determining means for executing the determining step. It is possible to correctly recognize the position of the electronic component having the position and mount it at an accurate position, and to reliably identify the bumper portion without setting the scanning line to cross the outside of the bumper portion. It has an excellent effect.

According to the position recognizing device of the electronic component of the present invention, the identifying means causes the bumper portion of the electronic component to locate portions located at both ends of the data indicating the presence of the object in the binarized data. Since the bumper portion and the lead portion can be distinguished by specifying as, it is possible to easily and correctly recognize the position of the electronic component having the bumper portion and mount it at an accurate position, and the judgment of the bumper portion can be shortened. It has an excellent effect that it can be performed in time.

[Brief description of drawings]

FIG. 1 is an overall schematic configuration diagram showing a first embodiment of the present invention.

FIG. 2 is a block diagram of a control system

FIG. 3 is a plan view of an IC

FIG. 4 is an explanatory diagram of an image of an IC and scanning lines in a binarization process.

FIG. 5 is a flowchart of a position recognition program.

FIG. 6 is a view corresponding to FIG. 4 showing a second embodiment of the present invention.

FIG. 7 is a view corresponding to FIG. 4, showing a third embodiment of the present invention.

[Explanation of symbols]

1 is a QPF type IC (electronic component) with bumper, 2 is a package, 3 is a bumper part, 4 is a lead part, 4a is a lead wire, 5 is a robot head, 6 is a printed circuit board, and 7 is a CC.
D camera (imaging means), 8 is a CCD camera, 9 is a visual recognition controller (binarization processing means, identification means, calculation means, dimension detection means, discrimination means), 10 is a mounting machine controller, 11 is a receiving section, 12 Is an arithmetic processing unit, 13 is a transmission unit, and 14 is a memory (storage means).

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Claims (8)

[Claims] 1. A position recognition target is an electronic part having a bumper part formed at both ends so as to protect the lead part composed of a plurality of lead wires and the lead part outside the package, and the electronic part is photographed by an imaging means. A binarization processing step of linearly scanning the image data obtained at the time so as to cross a plurality of lead wires of the lead section to create binarized data, and the binarization processing step. An identifying step of identifying the lead portion and the bumper portion based on the binarized data and the dimension data of the lead portion and the bumper portion of the electronic component; and the identifying step corresponding to the lead portion identified in this identifying step. And a calculation step for calculating the position of the electronic component based on the image data. 2. The identifying step includes a scanning width detecting step of detecting a scanning width of the bumper portion and a scanning width of each lead wire of a lead portion from the binarized data, and a width dimension of the bumper portion of the electronic component. A portion corresponding to the bumper portion is specified from the scanning width detected in the scanning width detecting step, and the bumper portion and the lead portion are distinguished from each other, based on the dimension data from the storage means in which the data is stored. The position recognizing method of the electronic component according to claim 1, further comprising: 3. The scanning width detection step of detecting a scanning width between the bumper portion and the lead portion and a scanning width between lead wires of the lead portion from the binarized data in the identifying step, Based on the dimension data from the storage means in which the width dimension data between the bumper portion and the lead portion of the electronic component is stored,
A determination step of determining a portion corresponding to a width dimension between the bumper portion and the lead portion from the scan width detected in the scanning width detection step to determine the bumper portion and the lead portion. The position recognition method for an electronic component according to claim 1, wherein: 4. In the identifying step, the portions located at both ends of data indicating the presence of an object in the binarized data are identified as bumper portions of the electronic component, and The method for recognizing the position of an electronic component according to claim 1, wherein the lead portion is discriminated. 5. An image pickup means for photographing a position of an electronic part having a bumper part formed at both ends so as to protect the lead part formed of a plurality of lead wires outside the package and the lead part, and photographing the electronic part. And binarization processing means for linearly scanning the lead parts of the lead portion based on the image data from the imaging means to create binarized data, and the binarization processing means Identifying means for identifying the lead portion and the bumper portion based on the binarized data obtained by the above and the dimension data of the lead portion and bumper portion of the electronic component; and the lead portion identified by the identifying means. And a calculation means for calculating the position of the electronic component based on the image data corresponding to the position recognition device of the electronic component. 6. A storage means for storing width dimension data of a bumper portion of the electronic component is provided, and the identifying means scans the scan width of the bumper portion and each lead wire of the lead portion from the binarized data. A scanning width detecting means for detecting a width, and a portion corresponding to the bumper portion is specified from the scanning width detected by the scanning width detecting means on the basis of the dimension data from the storage means to identify the bumper portion and the bumper portion. The position recognizing device for an electronic component according to claim 5, wherein the position recognizing device comprises a discriminating means for discriminating the lead portion. 7. A storage means for storing width dimension data between the bumper portion and the lead portion of the electronic component is provided, and the identifying means is configured to detect the binarized data from the bumper portion and the lead portion. From the scanning width detected by the scanning width detecting means based on the dimension data from the storage means, and the scanning width detecting means for detecting the width between the lead wire and the scanning width between the lead wires of the lead portion. 6. The electronic component according to claim 5, further comprising: a discriminating unit that discriminates between the bumper portion and the lead portion by identifying a portion corresponding to a width dimension between the bumper portion and the lead portion. Position recognition device. 8. The bumper portion and the bumper portion are identified by the identification means identifying portions located at both ends of data indicating the presence of an object in the binarized data as bumper portions of the electronic component. The position recognition device for an electronic component according to claim 5, wherein the position recognition device is configured to discriminate between the lead portion and the lead portion.