JPH07180056A - Production of vapor deposition plating material - Google Patents

Abstract

PURPOSE:To easily obtain a plating layer changed in film thickness in the transverse direction of a long-sized base material. CONSTITUTION:A mask 6 which is arbitrarily changed in the opening length in the traveling direction of an aperture 9 like L9c, L9e is used. This mask 6 is disposed between the traveling long-sized and band-shaped base material 1 and an evaporating source of a raw material for plating. The base material 1 is subjected to vapor deposition plating by the vapor passing the aperture 9.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a vapor-deposited plating material, and more particularly to a vapor-deposited material, in which vapor deposition is performed by partially limiting the vapor deposition material that reaches a running long strip-shaped substrate. The present invention relates to a method for producing a vapor-deposited plated material, which allows a thick plated layer to be easily formed in an arbitrary region.

[0002]

2. Description of the Related Art Electroplating, electroless plating, hot dipping, physical evaporation plating, chemical vapor deposition, etc. have been industrially put into practical use as methods for plating the surface of a material to be treated. Of these, the physical vapor deposition method has recently been actively researched.

In the physical vapor deposition method, the electroplating method and the hot-dip plating method are limited by the plating raw material, but the physical vapor deposition method is not so limited, and a plating layer containing less impurities can be obtained. Have the advantage of.

By carrying out such a physical vapor deposition method, various single metal films, alloy films thereof, or plating layers such as multi-layer plating films and ceramics films can be provided on the surface of the substrate. Therefore, it has been widely put into practical use from electronic materials, magnetic materials, optical materials, and the like to applications such as home appliances, various building materials, tools, and decorative articles, which are provided with design characteristics.
As the physical vapor deposition method, generally, vacuum vapor deposition method,
The ion plating method, the sputtering method, and the like are known, and each of them has its advantages and disadvantages, and is appropriately used depending on the plating raw material and the desired plating performance.

In the physical vapor deposition method, the plating raw material is heated and evaporated in a vacuum, a dilute gas, or an inert gas, or is floated as electrically charged gaseous atoms, which is used as a material to be treated. It is vapor-deposited.

In the physical vapor deposition method, the atoms evaporated or repelled from the plating raw material fly in space with a specific distribution and adhere to the surface of the material to be treated. Therefore, the film thickness distribution of the plating layer adhering to the surface of the material to be treated depends on the distribution of the plating material atoms in the space. For example, in the case of the vacuum evaporation plating method, the distribution of the plating film thickness on the surface of the substrate is cos ⁿ θ (θ is a normal line connecting the evaporation source and an arbitrary position on the substrate when the evaporation area of the plating raw material is sufficiently small. It is said that it depends on the angle formed by. That is, the plating film thickness is
It depends on the positional relationship between the plating raw material and the base material, the evaporation area of the plating raw material, and the like.

FIG. 11 is a partially cutaway perspective view conceptually showing a state in which vacuum evaporation plating is performed on the entire lower surface of a conventional long strip-shaped substrate, in which 1 is a long strip-shaped substrate and 2 is a diagram. The applied plating layers 4 are evaporation sources of the plating raw material, from which the vapor flow 3 of the plating raw material is generated. Reference numeral 14 is a boat in which the plating source evaporation source 4 is inserted. The plating material vapor stream 3 adheres to the lower surface of the long base material 1 facing the plating material evaporation source 4 to form a plating layer 2. Since the distribution of the plating raw material vapor flow 3 is thinner at the edge portion and thicker at the central portion, the plating layer 2 is slightly thicker near the central portion and thinner toward the edge portion, as conceptually shown in FIG. Although the thickness of the plating layer 2 is shown to be thicker than the thickness of the base material 1 in the drawing, this is a characteristic representation of the plating state, and the plating layer is originally thin. . The same applies to the following drawings.

By the way, in each of the above-mentioned fields in which the physical vapor deposition method is used, the required performance of the plating layer on the surface to be treated has become stricter in recent years, and the plating layer is required to be used depending on the intended use and the site of use. Various needs have arisen, such as providing a place with or without a place, making a film thickness of a plating layer different depending on a part, or stacking different types of plating layers.

As a case where partial plating is necessary, for example, there is a case where welding or soldering is partially performed, which causes a problem that weldability or solderability is deteriorated due to the formation of the plating layer. Is.

However, as described above, the plating film thickness in the physical vapor deposition method depends on the positional relationship between the plating raw material and the base material, the evaporation area of the plating raw material, and the like, and a uniform film can be formed only by controlling the plating process. It is very difficult to produce thick plating, to carry out partial plating, or to arbitrarily change the distribution of plating film thickness.

Therefore, conventionally, a plating layer is once formed on the entire surface and then the plating layer at the welded portion (soldered portion) is removed or the above-mentioned weldability is newly improved on the existing plated layer. We are aiming for improvement by partially applying plating.

As a conventional vapor deposition plating method for performing the partial plating, a mask is fixed on a substrate, and a plating raw material is deposited through the mask to form a partial plating layer corresponding to the shape of the mask. There is also a method in which a mask is provided above the moving substrate, and the plating is deposited in stripes by running the substrate. Further, as a method of obtaining a partial plating layer or a plating layer having a partially different plating film thickness, conventionally, a method of chemically or mechanically etching the plating after plating has been adopted.

As a method of chemically etching the plating layer, for example, a photoresist method is generally known. This is because after plating, a photopolymerizable polyfunctional monomer or oligomer called a photopolymer is applied to the surface of the plating, which is exposed and cured through a mask of the desired shape to form a resist film, which is then exposed and cured. This is a method of removing the unexposed portion with a solvent or the like, and then etching with a corrosive solution. Only the exposed / cured portion through the above mask remains on the substrate surface without being etched. By using this method, it is possible to partially form the plating layer or partially change the plating film thickness.

On the other hand, as a method of mechanically etching the plating layer, there is a method of scraping off the plating layer on the surface of the substrate with a grinding brush or the like. By using this method, it is possible to partially completely remove the plating layer or change the plating film thickness within the same base material.

[0015]

However, since the above method is a batch method, it cannot be applied to a large-sized material such as a long base material, and has a problem that it can only have a constant film thickness. . Further, the above method has a problem that only a film having a constant film thickness and a stripe shape can be formed.

The above-mentioned chemical etching method is a batch processing step, so that there is a problem that the processing step becomes complicated. In addition, when it is applied to a long substrate, it is necessary to develop equipment for forming a resist film. Further, this method has a problem in that it is difficult to obtain a film having various plating film thicknesses in the same base material. On the other hand, the mechanical etching method described above has a problem that a large number of flaws are generated on the plated surface or the base material during grinding, resulting in a remarkable poor appearance. Also, in order to change the etching area, the size of the grinding jig must be changed, which is difficult to use easily, and at the same time the mechanical grinding method achieves a change in the plating film thickness in a minute area. The problem is that it is very difficult to do.

The present invention has been made in view of the above problems, and it is possible to form a plating layer having an arbitrarily changed film thickness in an arbitrary region without causing a defect in the plating or the base material. It is an object of the present invention to provide a method for manufacturing a vapor-deposited plated material, which has a simple manufacturing process.

[0018]

A method for manufacturing a vapor-deposited plating material according to the present invention comprises a mask opening as a baffle plate (hereinafter referred to as a mask) provided between a plating source evaporation source and a long strip base material. The opening length of the portion in the traveling direction of the base material is arbitrarily changed along the direction orthogonal to the traveling direction.

Alternatively, as the mask, a mask in which a plurality of openings having different opening lengths in the traveling direction are formed along a direction orthogonal to the traveling direction is used. Further, at least one of the openings may be one in which the opening length in the traveling direction is arbitrarily changed along the direction orthogonal to the traveling direction.

It is also included in the present invention that the mask is repeatedly reciprocated in the direction orthogonal to the traveling direction of the substrate to perform vapor deposition plating. The mask may be one in which the opening length in the running direction of the opening is arbitrarily changed along the direction orthogonal to the running direction, or a plurality of openings having different opening lengths in the running direction may be used. You may use what formed multiple parts along the direction orthogonal to the said running direction. Further, the mask is attached along the running direction 2
It is also possible to provide more than one plate and perform vapor deposition plating.

A plurality of plating source evaporation sources accommodating the same or different plating sources are provided along the running direction of the base material, and the mask is provided for each of the plating source evaporation sources to carry out vapor deposition plating. It is also good to do. In this case, one or two or more openings are provided for each mask, and the openings are at the same position or different positions when viewed in the direction orthogonal to the traveling direction of the base material. Set to. Further, the opening length of the opening in the traveling direction may be arbitrarily changed along the direction orthogonal to the traveling direction.

[0022]

[Action and Example]

<Embodiment 1> FIG. 1 is a view for explaining a method of manufacturing a vapor deposition plating material according to an embodiment of the present invention, and is a cross-sectional view showing a vacuum vapor deposition plating processing chamber in which a mask is arranged. Figure 1
The parts given the same reference numerals as 1 indicate the same or corresponding parts,
Reference numeral 5 is a vacuum vapor deposition plating chamber, and 7 is a support roll, which runs the long strip-shaped substrate 1 in the direction of arrow A. A mask 6 is arranged in an arbitrary space between the long base material 1 and the plating material evaporation source 4. Reference numeral 9a is an opening provided in the mask. Reference numeral 8 denotes an adhesion-preventing plate, which is provided around the mask 6 and prevents vapor (ineffective vapor) that goes around the outside of the mask 6 and reaches the base material 1.

FIG. 2A is a plan view showing an example of the opening shape of the mask 6, and the long base material 1 is running on the back side of the drawing. 2B is BB of FIG. 2A.
A line cross-sectional view shows a cross-sectional view of the plated long base material 1. In the figure, 9a, 9b and 9c are openings provided in the mask 6, and 2a, 2b and 2c are plating layers formed corresponding to them. Reference numeral 13 is a non-plated portion which is not plated.

Plating material vapor stream 3 generated from evaporation source 4
Passes through only the opening portions 9a, 9b, 9c of the mask 6, and the other portions are blocked by the mask 6 and the deposition preventive plate 8 to form the plating layers 2a, 2b, 2c as shown in FIG. 2B. Will be done. The width of the plating layer (W ₂ ) is the width of the opening (W
₉ ), and the film thickness (L ₂ ) of the plating layer is determined by the length of the opening (L ₉ ) and the running speed of the long base material 1 when the evaporation rate of the plating raw material is constant. Therefore, by appropriately setting these, it is possible to obtain a plating layer having an arbitrary width, film thickness and plating interval (region of non-plating portion). Although the number of openings is three in FIG. 2, the number of openings is not limited to this, and any number of openings may be used, such as 2, 4, or 5,
As a result, the plated area and the non-plated area can be variously changed.

As described above, in the first embodiment, the vapor flow 3 is adjusted by the mask 6 according to the shape of the opening. Therefore, the long base material 1 is provided with a plating layer having an arbitrary width. It can be formed thick.

<Examples 2 to 5> FIGS. 3 to 6 are other examples (Examples 2 to 5) of the method for producing a vapor-deposited plated material according to the present invention.
FIG. 9B is a view showing the case where the opening 9 is formed into various other shapes. 3A to 6A are plan views of the mask 6 on which the substrate 1 is running on the back side of the drawings, and cross-sectional views taken along the line BB are shown in FIGS. ).

In FIG. 3A (Example 2), the opening 9
The length L _9c of the central part is long, and the length L _9e becomes shorter _toward the end. Therefore, at the end of the long base material 1 in the width direction, the time of exposure to the steam flow is short and becomes longer as it approaches the central portion. Therefore, as shown in FIG. 3B, the plating layer 2 formed has a mountain shape in which the film thickness is large in the central portion L _2c and the film thickness is continuously reduced toward the end (L _2e ). .

In addition, as shown in FIG. 4 (embodiment 3), FIG. 5 (embodiment 4), and FIG. 6 (embodiment 5), the opening 9 is formed in various shapes to obtain an M-shaped cross section (see FIG. 4), arch type (FIG. 5), step type (FIG. 6) and other various plating layers can be obtained.

As described above, the opening length of the opening 9 in the traveling direction is arbitrarily changed along the direction orthogonal to the traveling direction (L _9c , L _9e, etc. in FIG. 3A). Thus, it is possible to obtain the plating layer 2 having various thicknesses continuously changed in accordance with the length of the opening 9 in the traveling direction.

In the first embodiment, the openings 9a, 9b,
Although the masks each having a rectangular shape of 9c are used, a mask having an opening portion having an arbitrary shape having a different opening length in the traveling direction may be used as in Examples 2 to 5 described above.

<Sixth Embodiment> FIG. 7 is a schematic perspective view showing a sixth embodiment. Although not shown in the drawing, the mask 6d,
In order to prevent the vapor that reaches the base material 1 around the outside of 6e, it is desirable to provide the deposition preventive plate 8 as shown in FIG. Figure 8
8A is a plan view showing the mask portion, and FIG. 8B is FIG.
It is a BB line sectional view in (a), and shows the cross section of the base material 1 by which the plating was given. In this example, as shown in FIG. 7, two different plating source evaporation sources 4d and 4e are provided, and masks 6d and 6e are arranged for each of them. As shown in FIGS. 7 and 8A, the masks 6d and 6e are provided with openings 9d and 9e, respectively.

The long base material 1 travels in the direction of the arrow A, and the plating raw material vapor flows from the evaporation sources 4d and 4e are masks 6d and 6e.
8d reaches the long base material 1 after being shaped into the openings 9d and 9e, and as shown in FIG. 8B, the plating layer 2d corresponding to the opening 9d and the plating layer 2e corresponding to the opening 9e. Are formed respectively.

By providing a plurality of plating source evaporation sources and a plurality of masks as in this example, a plating layer of each plating source can be formed on the substrate 1 correspondingly. Moreover, in the case of this example, it is possible to form the plating made of a plurality of types of plating raw materials in one step. Also, their film thickness can be arbitrarily determined by the length of the opening in the traveling direction, as in the above. In the sixth embodiment, the shape of the opening is rectangular. However, if the opening is formed in any shape such as a diamond shape or a round shape as in the above-described second to fifth embodiments, a plating layer having a continuously changed film thickness is formed. can do.

<Embodiment 7> Similar to Embodiment 6, FIG. 9 is a diagram showing an example in which a plurality of plating source evaporation sources and masks are provided. However, in the case of this example, as shown in FIG. 9A, openings 9f and 9g are provided in the same positional relationship in the width direction of the base material. Therefore, in this example, the plating layer 2f (corresponding to the opening 9f) and the plating layer 2g (corresponding to the opening 9g) to be formed are two-tiered as shown in FIG. 9B.

As described above, a plurality of plating layers of different types can be formed in one step. Moreover, similarly to the above, the plating shape can have an arbitrary width and film thickness, and it is also possible to form a plating layer in which the film thickness is continuously changed.

<Embodiment 8> FIG. 10A is a schematic perspective view showing Embodiment 8, and FIG. 10B is a schematic plan view showing the surface of the plated long substrate 1. Is. In this example, the mask 16 is repeatedly reciprocated in the direction Ha that is orthogonal to the traveling direction A of the substrate 1 by the mask driving unit 11.
In Examples 1 to 7 described above, only a plating layer having the same film thickness, that is, a striped plating layer can be obtained along the traveling direction of the base material 1, but the mask 16 is reciprocally moved as in Example 8. While the base material 1 is moved in the direction of arrow A to deposit the plating raw material, a corrugated plating layer 12 as shown in FIG. 10B can be obtained.

The wave amplitude Hb of the plating layer 12 is determined by the mask 16
Is determined by the movement amplitude Ha of the
Is determined by the vibration period t of the mask 16 and the traveling speed v of the substrate 1. Further, similarly to the above, the width Wb of the plating layer is determined by the width Wa of the opening 9. Therefore, an appropriate plating layer can be obtained by appropriately selecting these. The cycle I is proportional to the traveling speed v of the base material 1 and inversely proportional to the vibration cycle t of the mask. As described above, in Example 8, the plating layer 12 can be formed in a corrugated shape. In the case of Example 8, the plating layer was formed by repeating the plated portion and the non-plated portion as viewed in the longitudinal direction of the base material 1.

Further, by controlling the speed pattern of the mask 16, the plating layer 12 can be formed into a square wave as shown in FIG. 10C, for example. Alternatively, it is also possible to form the plating layer in an arbitrary shape according to the moving stroke by changing the moving cycle instead of the fixed cycle.

Further, if the length of the opening in the running direction is arbitrarily changed along the direction orthogonal to the running direction as described above, the plating layer having various thicknesses continuously changed in the orthogonal direction as well. Can be formed.

The film thickness (L ₂ etc.) of the plating layer shown in Examples 1 to 8 is related not only to the length of the opening (L ₉ etc.) but also to the running speed of the long strip base material. Needless to say.

The shape of the opening of the mask is not limited to that of the above embodiment, and any shape may be used as long as it is a closed figure formed by a straight line or a curved line. Further, it is possible to provide a plurality of openings having different shapes in the same mask, and it is possible to form plating layers having various film thicknesses by arbitrarily combining them. For example, by combining the mask 6 shown in FIG. 2 (a) and the mask 6 shown in FIG. 3 (a), plating which is discontinuous in the width direction of the long base material 1 and whose plating layer thickness continuously changes can be performed. Can be given. Furthermore, by combining the movement of the mask, it is possible to form plating layers of various shapes.

In addition, two masks having different or the same opening portions are superposed, or a mask plate and a shutter plate having no opening portion are superposed, and one or both of these masks (or shutter plates) are attached to the base material 1. The width of the opening can be changed by moving the opening in a direction orthogonal to the traveling direction. Therefore, it is possible to form a plating layer having different widths of the plating region depending on the respective positions of the base material 1 in the longitudinal direction. Further, when the movement of the two masks (or shutter plates) is moved in the traveling direction of the substrate 1, the opening length of the opening in the traveling direction changes, so that the longitudinal direction of the substrate 1 is changed. Plating layers having different film thicknesses can be formed. Needless to say, when the opening is completely closed, a non-plated area is formed.

The material of the mask is not limited as long as the vapor of the plating raw material does not adhere so much and the creeping deformation or the like does not occur due to the radiant heat from the plating raw material. Steel plate, copper plate, stainless steel plate Metal, etc.
It is possible to use graphite, various ceramic materials, etc. as well as alloys.

Discharging the heat of the mask out of the system by circulating a liquid such as water or oil or a gas in the mask is a preferable means from the viewpoint of preventing thermal deformation. The vapor flow passing through the mask spreads over the opening area of the mask when it reaches the surface of the base material, but if the distance between the mask and the long base material is reduced, the edge of the plating layer becomes clearer. It becomes unclear when the distance is increased. Therefore, it is possible to adjust the sharpness of the edge portion of the plating layer by appropriately adjusting the distance between the mask and the long base material. For example, in order to obtain a sharp edge portion of the plating layer, it is desirable that the distance between the base material and the mask be within 10 mm. However, if it is less than 0.5 mm, the mask and the base material may come into contact with each other due to the vibration of the running base material.
More preferably, it is 0.5 mm to 10 mm.

The type of physical vapor deposition plating method to which the present invention is applied is not specified at all, and vacuum vapor deposition plating method, ion plating method, sputtering method and the like can be used. Further, the heating / evaporating means for generating the vapor of the plating raw material is not particularly limited, and the electron beam method, the resistance heating method, the laser beam method,
A hollow cathode method, an ion beam sputtering method, a DC sputtering method, a magnetron sputtering method or the like can be used.

The long base material to which the present invention is applied is not particularly limited, and may be a general ordinary steel plate, various stainless steel plates, metal plates such as alloy steel plates, Al, Cu,
Non-ferrous metal plate such as Ti, or alloy plate of each, Si
It can also be applied to non-metal materials such as, resin plates or films such as plastics, and various ceramic materials.

<Experiment> Hereinafter, an experiment in which the method for producing a vapor-deposited plated material according to the present invention is specifically performed will be described. The continuous vacuum evaporation plating equipment was used for the experiment, and various masks were respectively installed in the evaporation plating chamber as shown in Table 1 below. Graphite was used as the material of the mask, and cold rolled steel plate 150 mm ^w was used as the long base material. The running speed of the long base material was set to 3 to 15 m / min, and the plating raw material was heated by the electron beam heating method. The mask was placed so that the distance between the mask and the substrate was 5 mm.

[0048]

[Table 1]

An experiment was conducted in which a long base material running under the above vapor deposition conditions was plated. In Experiment 1, the plating layer 3 was formed only on the base material portions corresponding to the openings 9a, 9b, 9c of the mask 6, respectively. Formed. The plating layers are different in width corresponding to the width of the opening (W ₉ etc.), and the plating film thickness is different in thickness corresponding to the length of the opening (L ₉ etc.). Things were formed.
No plating layer was formed on the base material portion that did not correspond to the opening.

As a result of Experiment 2, a plating layer having a thickness continuously changed in the width direction of the substrate was obtained. The film thickness was thickest near the center and became thinner toward the edges, and had a mountain-shaped cross section corresponding to the opening of the mask.

In Experiment 3, the one having five plating layers in the width direction of the substrate was obtained. The plating layer is Al-Cu-
It was formed alternately with Al-Cu-Al. In Experiment 4, three plating layers having different widths and film thicknesses were formed in a wave pattern. As a comparative experiment, vacuum deposition plating was performed under the same vapor deposition conditions as above without setting a mask.

As a result, a plating layer on the entire surface of the substrate is obtained,
The plating film thickness was slightly thinner at the end in the width direction of the substrate. However, this degree of difference in film thickness is not intentionally controlled, and it is difficult to obtain an arbitrary film thickness by the method of the comparative experiment as in the present invention.

[0053]

Since the method for producing a vapor-deposited plating material according to the present invention is configured as described above, a plating layer having a different film thickness depending on the location can be obtained by this method. The difference in the film thickness can be set continuously or discontinuously, and the setting can be easily performed. Further, there is an effect that the plating forming step can be performed in one step.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a plating processing chamber in a method for manufacturing a vapor-deposited plated material according to an embodiment of the present invention.

FIG. 2 (a) is a plan view showing a mask used in the method for producing a vapor-deposited plated material according to the first embodiment of the present invention and its vicinity,
(B) is sectional drawing in the BB line of (a).

FIG. 3A is a plan view showing a mask used in the method for producing a vapor-deposited plated material according to the second embodiment of the present invention and the vicinity thereof;
(B) is sectional drawing in the BB line of (a).

FIG. 4A is a plan view showing a mask used in the method for producing a vapor-deposited plated material according to the third embodiment of the present invention and its vicinity;
(B) is sectional drawing in the BB line of (a).

FIG. 5A is a plan view showing a mask used in the method for producing a vapor-deposited plating material according to Example 4 of the present invention and the vicinity thereof,
(B) is sectional drawing in the BB line of (a).

FIG. 6A is a plan view showing a mask used in the method for producing a vapor-deposited plating material according to Embodiment 6 of the present invention and the vicinity thereof;
(B) is sectional drawing in the BB line of (a).

FIG. 7 is a perspective view showing a case where two plating source evaporation sources and two masks are used in the method for producing a vapor deposition plated material according to the present invention.

FIG. 8A is a plan view showing a mask used in the method for producing a vapor-deposited plated material according to Example 7 of the present invention and its vicinity;
(B) is sectional drawing in the BB line of (a).

FIG. 9 (a) is a plan view showing a mask used in the method for producing a vapor-deposited plated material according to Example 8 of the present invention and the vicinity thereof,
(B) is sectional drawing in the BB line of (a).

FIG. 10 (a) is a perspective view showing a case of moving a mask in the method for producing a vapor-deposited plated material according to the present invention, (b),
FIG. 3C is a plan view showing the surface of the base material on which the plating layer is formed.

FIG. 11 is a perspective view showing a state of conventional vapor deposition plating.

[Explanation of symbols]

 1 Long base material 2,2a, 2b, 2c, 2d, 2e, 2f, 2g Plating layer 3 Plating raw material vapor flow 4 Plating raw material evaporation source 5 Plating chamber 6,6d, 6e, 6f, 6g, 16 Mask 8 Protection Plate 9,9a, 9b, 9c, 9d, 9e, 9f, 9g Opening 11 Mask drive 12 Plated area 13 Non-plated area

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Atsushi Kihara 2222 Ikeda, Ikeda, Igami, Onoue-cho, Kakogawa-shi, Hyogo Pref., Kakogawa Research Area, Kobe Steel Co., Ltd. (72) Kuniyasu Araga Oue-cho, Kakogawa-shi, Hyogo Ikeda character Exploring Ikeda 2222 Address 1 Kobe Steel Co., Ltd. in Kakogawa Research Area (72) Inventor Junji Kawafuku Ikeda character, Ikeda, Onoe Town, Kakogawa City, Hyogo Prefecture 2222 Address 1 Kobe Steel Works Inc., Kakogawa Research Area

Claims (9)

[Claims] 1. A baffle plate having an opening is provided between a running long strip-shaped base material and a plating source evaporation source, and vapor is plated on the base material by vapor passing through the opening. A method for producing a vapor-deposited plated material, characterized in that a plate obtained by arbitrarily changing the opening length of the opening in the traveling direction is used as a plate along a direction orthogonal to the traveling direction. 2. A baffle plate having an opening is provided between the running long strip-shaped base material and a plating source evaporation source, and vapor deposition plating is performed on the base material by steam passing through the opening, A method for manufacturing a vapor-deposited plated material, characterized in that a plurality of openings having different opening lengths in the traveling direction are formed as a plate along a direction orthogonal to the traveling direction. 3. At least one of the openings of claim 2 is
The method for producing a vapor-deposited plating material according to claim 2, wherein the opening length in the traveling direction is arbitrarily changed along a direction orthogonal to the traveling direction. 4. A baffle plate having an opening is provided between a running long strip-shaped base material and a plating source evaporation source, and vapor deposition plating is applied to the base material by steam passing through the opening, A method for producing a vapor-deposited plated material, characterized in that the plate is repeatedly reciprocated in a direction orthogonal to the traveling direction of the base material. 5. The method for manufacturing a vapor-deposited plated material according to claim 4, wherein the baffle plate is a baffle plate having an opening length in the traveling direction which is arbitrarily changed along a direction orthogonal to the traveling direction. . 6. The vapor-deposited plated material according to claim 4, wherein a plurality of openings having different opening lengths in the traveling direction are formed as a baffle plate along a direction orthogonal to the traveling direction. Method. 7. The method for producing a vapor-deposited plated material according to claim 1, wherein two or more baffle plates are provided along the traveling direction. 8. A baffle plate having an opening is provided between a plating raw material evaporation source and a long strip-shaped base material which runs, and the same or different method is used for performing vapor deposition plating on the base material by vapor passing through the opening. A plurality of plating source evaporation sources accommodating the plating raw materials are provided along the traveling direction of the base material, the baffle plate is provided for each of the plating source evaporation sources, and an opening provided in each baffle plate Is provided for each baffle plate and is set so as to be at the same position or different positions when viewed in a direction orthogonal to the traveling direction of the base material. Method of manufacturing wood. 9. At least one of the openings provided in the baffle plate is such that the opening length of the opening in the traveling direction is arbitrarily changed along a direction orthogonal to the traveling direction. A method for producing the vapor-deposited plated material described.