JPH07167892A - Probe assembly, manufacture thereof, and probe card for measurement of ic using the same - Google Patents

Abstract

PURPOSE:To enable easy and inexpensive attainment of a probe assembly for measurement of the characteristics of IC, or the like, which has outer leads formed at a minute pitch. CONSTITUTION:A probe assembly 11 having a construction wherein recessed grooves 5 having uniform depths are formed over the full length of metal layers 2 exposed on at least one plane 4A of a cubic laminated block 4 prepared by laminating a plurality of thin insulating layers 1 and metal layers 2 alternately at a prescribed pitch and the base part 17B of a probe 17 is fixed in each of these recessed grooves 5 over the full length thereof, while the fore end part 17A thereof is made a free end. A probe card is constructed by mounting a plurality of probe assemblies 11 thus constructed on a printed wiring board. Accordingly, a plurality of probes 17, the fore end parts thereof in particular can be arranged and held at a very minute pitch and, moreover, at an equal interval, and furthermore, the probe assemblies of low inductance and low capacitance can be assembled easily relativery and with an excellent yield.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe card for measuring, for example, a semiconductor integrated circuit device (hereinafter simply referred to as "IC") in which electronic circuits are integrated with extremely high density and a large number of outer leads are led out. The present invention relates to a probe assembly that constitutes a part of the probe assembly and a method for manufacturing them.

[0002]

2. Description of the Related Art In order to measure and evaluate the characteristics of ICs, a plurality of contact pins having a structure having elasticity are arranged at a predetermined pitch and fixed in resin in a socket type or a plurality of probes. An example is a probe card type which is arranged at a pitch of and fixed with a resin.

However, in these conventional techniques, for example, in order to measure the characteristics of an ultra high density IC in which a large number of outer leads having a width of 0.12 mm are led out at a pitch of 0.3 mm, It was difficult to arrange the contact pins and the probes with a high precision and at a so-called fine pitch, and it was very difficult to arrange and assemble the contact pins and the probes with a pitch of 0.3 mm or less, and they could not be easily manufactured. In addition, it was difficult to produce a large number of products in small quantities.

Further, in the probe card type, the probes have to be arranged radially, the size becomes large, and the deformation of the probes must be taken care of, which makes maintenance difficult and causes a cost increase. There is a problem.

Therefore, in the invention disclosed in Japanese Patent Application Laid-Open No. 5-36457, "Electronic parts, applied device and manufacturing method thereof", which was filed by the applicant and published on February 12, 1993, Solved various problems.

That is, the disclosed fine pitch electrode and IC measuring socket have two kinds of different materials, for example, a thickness of 0.15 mm, as shown in FIGS. 1 to 3 of the publication. Glass epoxy resin insulation layer 1
And a thin layer of a metal layer 2 such as copper having a thickness of 0.15 mm are alternately laminated to form a multilayer laminate 3, which is cut into blocks in the stacking direction to form a cubic laminated block 4
Then, the metal layer 2 of the laminated block 4 is subjected to etching processing or electric discharge machining, and the metal layer 2 of approximately 50% of the thickness of the laminated block 4 is removed from above to form a deep groove, and in the next step. The metal layer 2 remaining in these grooves is further subjected to etching or electric discharge machining to form the through holes 5 to complete the electrode holder 6, and the base 12 of the contact pin 7 having a special structure is embedded in the grooves. Then, the wiring terminal 8 is inserted into the through hole 5 to complete the electrode assembly 20,
This electrode assembly 20 is fixed in the recess 10 of the socket base 9 shown in FIG. 2 to provide a QF having fine pitch electrodes.
The P-type IC measurement socket has been completed.

Further, as shown in FIGS. 4 and 5 of the above-mentioned publication, the fine pitch electrode and the IC measuring socket of the second invention do not have a concave groove formed in the laminated block and have a through hole. 5 is formed by etching, the wiring terminal 8 of the contact pin 7 is inserted into each of the through holes 5, and the base 12 of the contact pin 7 is directly adhered to each metal layer 2 of the cut surface with the adhesive 17. , And fix it to complete the electrode assembly 20A.
The individual QFP type IC measurement sockets having fine pitch electrodes are completed by mounting and fixing the individual pieces in the recesses 10 at four locations of the socket base 9.

Furthermore, as shown in FIGS. 6 to 8 of the publication, as a fine pitch electrode and an IC measuring socket of the third invention, a test pin 36 is provided in addition to the wiring terminal 32 and a base portion 31. Using the contact pin 30 having a special structure formed below the same, and using the laminated block in the same manner, but without forming a concave groove in the metal layer 2 of the cut surface,
A through hole 32 into which the wiring terminal 32 can be inserted and the test pin 36 can be inserted, and an electrode steadying and guide hole 41 for preventing steadying of the contact pin 30 is formed by etching. The wiring terminal 32 and the test pin 36 are inserted, the base 31 of the contact pin 30 is directly adhered and fixed to each metal layer 2 of the cut surface with an adhesive, and the epoxy resin 42 is filled between the bases 31. Then, each contact pin 30 is fixed so as not to swing in the pitch direction to complete the electrode assembly 40. Four of these electrode assemblies 40 are mounted and fixed in the four recesses 10 of the socket base 9A, The QFP type IC measuring socket 37 having fine pitch electrodes has been completed.

As shown in FIG. 9, the QFP type IC measuring socket 37 according to the third aspect of the present invention can be used as an IC measuring tester such as a probe type.

[0010]

However, all of the IC measuring sockets disclosed in the above publications use contact pins, and these contact pins are used as wiring terminals in addition to test pins. , A connecting portion, an elastic portion, a base portion and the like, which is formed with a special structure and has a long overall length, and each portion has a width, and therefore,
Inductance increases with respect to high-frequency signals, and since each part has a width, conductance increases between contact pins, and since the test pins and the IC outer leads are in surface contact, the contact area is large. Due to the large size, many outer leads have 0.3 mm
There is some difficulty in measuring the characteristics of an ultra-high-density IC for high-frequency signals, which is derived at minute intervals of about the pitch or less.

Therefore, from the viewpoint of measuring the characteristics of the IC for high-frequency signals with extremely high accuracy, the characteristics of the IC in a state in which the probe type measuring device mainly used for measuring the characteristics of the IC in the semiconductor wafer state is packaged. It is desirable to use for the measurement of. This probe type does not damage the outer leads of the IC either.

However, it is very difficult to assemble and arrange a plurality of probes into a probe aggregate by arranging and holding the plurality of probes at an extremely fine pitch and at even intervals, and requires a high level of technology. However, the yield is low, and the products that are about to be released at present are extremely expensive.

[0013]

Therefore, according to the present invention,
A thin layer of one of the two types of the probe assembly, which is exposed on at least one plane of a cubic laminated block in which a plurality of two types of thin layers of different materials are alternately laminated at a predetermined pitch. A through hole having a small diameter is formed in the one type thin layer at the tip portion of the laminated block, or the groove is exposed at the tip surface of the tip portion. A thin layer of the same quality as the material used to form a notch with a predetermined depth, and fix the base of the probe in each groove, and the tip of the probe in each through hole or notch in the stacking direction. The above problems were solved by fitting each tip of the probe so that it can move in the vertical direction although it cannot move.

Further, according to the present invention, a plurality of the above-mentioned probe aggregates are attached directly or to a probe aggregate retainer or the like, and the probe aggregate retainer is provided with an opening at the center and its periphery. For mounting on an electric circuit wiring board on which an electric circuit is formed, the probe is mounted so that each tip of the probe is located on the opening side, and the base of each probe is connected to the electric circuit for IC measurement. A probe card was constructed to solve the above problems.

Furthermore, according to the present invention, it is possible to use different materials.
A plurality of types of thin layers are alternately laminated to form a multilayer laminate having a predetermined pitch, and the multilayer laminate is laminated in the laminating direction.
It is necessary to cut a cube-shaped laminated block of a specified length, width, and thickness, and to further reduce the thickness of a part of the laminated block over the entire width to reduce the thickness of the laminated block. 2 exposed by applying masking to the exposed surface
Among the thin layers of different types of material, one type of thin layer is chemically treated to form a groove and a thickness slightly recessed from the surface of the laminated block over the entire length of the one type of thin layer of the laminated block. Minute through holes or cutouts are formed at the tips of the thin laminated block portions, the tips of a plurality of L-shaped probes are fitted into the through holes or cutouts, and the bases of the probes are provided in the recesses. The problem was solved by adopting a method of manufacturing the probe assembly by fixing the probe assembly in a groove.

[0016]

Therefore, according to the present invention, a plurality of probes, especially the tips thereof can be arranged and held at an extremely fine pitch and at equal intervals, and a probe assembly having low inductance and low capacitance can be provided. The probe assembly or the probe card can be provided at a low cost because it can be assembled relatively easily with a high yield and can be easily mass-produced.

[0017]

Embodiments of the probe assembly of the present invention, a method for manufacturing the same, and an IC measuring probe card using the same will be described below with reference to the drawings. First, a first embodiment of the present invention will be described with reference to FIGS. 1 is a perspective view showing several steps of a method for manufacturing a probe assembly according to a first embodiment of the present invention, and FIG. 2 is a view for explaining steps subsequent to the step of FIG. FIG. 3 is a perspective view showing a base of the manufactured semi-finished product, and FIG. 3 is a view for explaining a step subsequent to the step of FIG. 2, showing a part of the base completed by performing a surface treatment. FIG. 4 is a diagram for explaining a process subsequent to the process of FIG. 3, and is a perspective view of the probe assembly in a state in which the probe is mounted on the base, and FIG. 5 is a view of FIG. It is a perspective view of the probe card for IC measurement which is the 1st Example of this invention in the state which incorporated the probe aggregate | assembly into the printed wiring board, and FIG. 6 is sectional drawing on the AA line of FIG. 7 is B in FIG.
FIG. 9 is a partial cross-sectional view of the probe assembly or the like on line B, and FIG. 8 shows a state in which the probe assembly of FIG. 4 is incorporated in a printed wiring board with a configuration different from that shown in FIG.
9 is a perspective view of a C measurement probe card, and FIG. 9 is a cross-sectional view taken along the line AA of FIG. 8 in which the probe card of FIG. 8 is shown in an inverted manner.

In FIG. 1A, reference numeral 1 indicates an insulating layer.
For this insulating layer 1, for example, a glass epoxy resin having a plate thickness of 0.15 mm including the thickness of the adhesive is used. Code 2
Indicates a metal layer, which also has a thickness of 0.15 mm including the thickness of the adhesive and has the same area as the insulating layer 1, for example, copper which is a good electric conductor. These are alternately laminated and adhered one by one, and the metal layer is laminated in a multi-layered layer at least as many as the number of outer leads led out to one side of the IC, and the insulating layer 1 is always the outermost layer. Then, the layers are laminated as shown in FIG. In this step, it is advisable to perform bonding while performing vacuum pressing so that no bubbles are generated between the layers.

Next, the multi-layer laminate 3 is cut along the line AA shown in FIG. 7A in the laminating direction and at a right angle to its longitudinal direction, and strips as shown in FIG. It is cut out into a shape and further cut into one unit of laminated blocks 4 as shown in FIG. As a result, the structure of the cut laminated block 4 is composed of two planes, the metal layer 2 is a metal layer having a rectangular cross section, and the plurality of rectangular metal layers are parallel to each other at a predetermined pitch. These prismatic metal layers are arranged and filled with insulating resin, and the prismatic metal layer and the insulating resin form the two planes, and the prismatic metal layers are exposed over both planes. .

Next, the surface of the cut laminated block 4 is washed, and all the other surfaces except the upper surface 4A are cleaned, for example,
Although not shown in the drawing, the layered block 4 covered with a resist film is set in an etching device or an electric discharge machining device, and the laminated block 4 is subjected to etching or electric discharge machining from the upper surface 4A, and laminated as shown in FIG. The groove 5 having a depth of about 0.5 to 1 mm is formed on the exposed surface of the entire metal layer 2 of the block 4. Due to the configurations of the multilayer laminated body 1 and the laminated block 4, the concave grooves 5 are naturally formed in parallel with each other at equal intervals.

In the next step, after cleaning, as shown in FIG. 3, gold plating layers 6 and 7 are applied to the respective grooves and the surface of each metal layer 2 exposed on the lower surface 4B of the laminated block 4. Further, solder is applied to the surfaces of the gold plating layers 6 and 7 to form solder layers 8 and 9. The gold plating layer 6 and the solder layer 8 are deposited to make the depth of the groove 5 about 150 μm. In this embodiment, the structure shown in FIG. 3 is referred to as a base 10.

Next, as shown in FIG.
The tip portion 17A of the probe 17 in the form of a needle having a diameter of μm is a free end, and the base portion 17B is attached to each of the concave grooves 5,
When soldered and fixed, the probe assembly 11 according to the first embodiment of the present invention is completed. The illustrated probe 17
Although a needle having a linear structure was used, a needle having a hook-like structure may be used.

5 to 7 show the first QFP of the present invention.
The type IC measurement probe card 20 is shown. The probe card 20 has an opening 12 formed in the center thereof, and each of the openings 12 has a width of 0.
Four probe assemblies 11 are mounted on a printed wiring board 16 on which a plurality of 15 mm electrode terminals 13 (a part of which is shown in FIG. 7) and a wiring circuit 14 connected to them are printed. Has been done.

The solder layer 1 is previously formed on the surface of the electrode terminal 13.
5 is formed. The solder layer 9 coated on each metal layer 2 exposed on the lower surface 4B of the probe assembly 11 is just placed on the electrode terminal 13 such that the tip portions 17A of the probe 17 face the opening 12 side. It is aligned and placed as described above, heated, melted and soldered. This alignment can be performed by applying a technique of directly soldering the bare chip of the IC to the printed wiring board.

A probe card 20A showing a modified construction of the probe card 20 is shown in FIGS. In this probe card 20A, a support base 30 is put on the probe assembly 11 and fixed to the printed wiring board 16. The surface of the support base 30 is formed by an inclined surface, and such a support base 30 is obtained by obliquely cutting the laminated block 4 shown in FIG. 1B from the laminated stack 4 shown in FIG. 1B. be able to. Since this support base 30 has the same number of laminated layers as the insulating layer 1 and the metal layer 2 of the base 10 of the probe assembly 11, the respective metal layers 2 of both can be joined by soldering.
By using such a support base 30, the probe 1
As shown in FIG. 9, it is possible to incline the tip 17A of the No. 7 diagonally downward, and such a structure facilitates contact of the tip 17A with the outer lead 101 of the QFP IC 100. . Reference numeral 31 is a protective plate of the probe 17.

Next, with reference to FIGS. 10 to 16, the probe assembly of the present invention, its manufacturing method and I using the same.
A second embodiment of the C measurement probe card will be described. 10 is a view for explaining a step that follows the steps shown in FIG. 1, and is a perspective view of a state in which a laminated block is subjected to cutting processing, and FIG. 11 is a cutting processing subsequent to the step of FIG. 13 is a perspective view for explaining a step of applying a resist to a part of the laminated block subjected to the step, FIG. 12 is a perspective view for explaining an exposure step following the step of FIG. 11, and FIG.
FIG. 14 is a perspective view for explaining a step of etching a laminated block whose surface is masked by the exposure of FIG. 12, and FIG. 14 shows a semi-finished product base obtained by the etching of FIG. FIG. A is a top perspective view thereof, FIG. B is a bottom perspective view thereof, and FIG. C is a perspective view of a part of the tip portion thereof. FIG. 15 illustrates a step following the step of FIG. FIG. 1A is a diagram for
4 is a perspective view of the step of mounting the probe on the base shown in FIG.
16B is a perspective view of the probe assembly in a completed state, and FIG. 16 shows an IC measurement probe card showing a state in which the probe assembly of FIG. 15 is incorporated in a printed wiring board. Is a top perspective view thereof, and FIG. B is A of FIG.
It is sectional drawing on the -A line.

The laminated block 4 obtained in the cutting step of FIG. 1 is shown again in FIG. 10A.
From B, it is cut in the thickness direction within the range shown by the dotted line P, and processed into a laminated block 40 having a tip portion 41 and a base portion 42 of the shape shown in FIG. In this case, a plurality of laminated blocks 4 are fixed in a straight line to the base using wax,
Mass production is possible by cutting. Base 4 of this laminated block 40
2 has a thickness of 3 mm, and the tip 41 has a thickness of 0.5 mm.
I made it to the degree.

Next, as shown in FIG. 11, after washing the laminated block 40, all the other surfaces except the lower surface 40B of the base 42 where the metal layer 2 is exposed, that is, the upper surface 40A, A resist is applied to the tip surface 40C of the tip portion 41, the back surface 40D, the back surface 40E of the tip portion 41, and the front surface 40F of the base portion 42.

Then, in the exposure step of FIG. 12, a resist film on the upper surface 40A and the tip portion 41 are formed by using a mask (not shown) for forming a through hole in the metal layer 2 of the tip portion 41. The portion of the back surface 40E on which the through holes of the resist film are to be opened and the back surface 40B are covered and exposed to ultraviolet rays. Then, the resist other than the portion where the through hole is to be formed is hardened, and then the resist which is not exposed is removed.

Next, in the etching process of FIG. 13, the laminated block 40 in this state is immersed in an etching solution to perform etching. After a lapse of a predetermined time, it is taken out and washed.

In FIG. 14, a through hole 46 is formed in each of the laminated blocks 40 (FIG. 14A) in which the metal layer 2 is etched, that is, each metal layer 2 of the tip portion 41 (FIG. 14C), and the back surface of the base portion 42. The base 45 in which the concave groove 47 (FIG. 14B) is formed in each metal layer 2 exposed in 40B is completed. These through holes 46 are preferably long holes. This is because there is a need for a space that can absorb the bending of the probe even if the probe bends due to the impact when it comes into contact with the outer lead of the IC during the measurement described later. Therefore,
Their long diameter is about 2 to 4 times the short diameter. The short diameter is regulated by the thickness of the metal layer 2, and in this embodiment, it is 0.1
It is 5 mm.

Subsequently, as shown in FIG. 15A, the probes 48 are attached to the through holes 46 and the concave groove 47 of the base 45, respectively. Before this mounting process, this base 4
5 is plated with gold to form a base layer, and a bonding layer of silver, indium, solder or the like is further formed thereon. The probe 48 is L-shaped, and its tip portion 48A is passed through the through hole 46 of the base 45 to
8B is mounted in each groove 47. Then, by heating in a reflow furnace and taking out, one unit of the second probe assembly 50 of the present invention in which each probe 48 is bonded and fixed to the metal layer 2 of each groove 47 is completed.

Each probe 48 of this probe assembly 50
The leading end 48A of the base 45 is restricted in movement in the stacking direction of the base 45 by the insulating layers 1 adjacent to each other, that is, in the pitch direction. However, the tip portion 48A can rotate in the vertical direction around the base portion 48B fixed by the concave groove 47. That is, the tip portion 48A is in a state of being loosely fitted in the through hole 46.

In FIG. 15B, a single protective plate indicated by reference numeral 49 is adhered and covered on the surface of the base portion 48B of each probe 48 of this probe assembly 50. The protective plate 49 is fixed to the probe assembly 50 as needed. If it has a certain thickness, it can also serve as a support base when it is fixed to a printed wiring board or the like.

The probe assembly 50 shown in FIG.
As shown in FIG. 16, the individual pieces are fixed to the printed wiring board 16 in the same manner as described with reference to FIG. Also in this case, the probe aggregates 50 are arranged so that the tip portions 48A of the probes 48 face each other toward the opening 12 side, and the base portions 48B of the probes 48 protruding from the base 45 are cut. Thus, the second probe card 2 of the present invention
OB is completed.

17 and 18 show a probe card according to a third embodiment of the present invention. FIG. 17 shows a step of incorporating the probe assembly into a support member, FIG. 17A is a perspective view mainly showing the structure of the support member, and FIG. 17B shows the probe assembly in the support member of FIG. FIG. 18 is a perspective view showing the assembled state, and FIG. 18 shows the probe card equipped with the support member incorporating the probe assembly shown in FIG. 17B, and FIG. A shows the perspective view and FIG. Is A in the figure
3 is a cross-sectional view taken along the line AA of FIG.

As shown in FIG. 17A, the support member 60 is composed of a flat cube, and a recess 61 is formed at the center of the upper surface side portion of each side of the support member 60. 62 is formed. Reference numeral 63 indicates a screw hole.

In each of the recesses 61 of the supporting member 60 having such a structure, the probe assembly 50 with the protective plate 49 shown in FIG. 15B is placed with the protective plate 49 down (in the state shown in FIG. 17). When they are fitted and fixed, B in the figure
As shown in FIG.
A is completed.

This probe assembly built-in support member 60
Screws A are inserted into the screw holes 63 and fixed to the printed wiring board 16A on which the wiring circuit 14 is provided in advance.
When the eight base portions 48B are respectively connected to the wiring circuit 14, the third probe card 20C of the present invention is completed.

As shown in FIG. 15B, the protective plate 49 is attached to the lower surface 42B of the base 42 of the base 45 of the probe assembly 50.
The metal layer 2 exposed on the lower surface 42B of the metal layer 2
Since the base 48B of the probe 48 is covered,
Each metal layer 2 no longer functions as an electrically conductive member.

Therefore, when adopting such a configuration,
The metal layer 2 need not be a metal such as copper. Therefore, as a material for forming the multi-layer laminate 3 shown in FIG. 1, for example, a thermosetting resin such as epoxy-based resin or phenol-based resin (for example, glass epoxy resin, PE) is used for the insulating layer 1.
T, PI) and a thermoplastic resin such as a vinyl type (for example, vinyl chloride or vinyl acetate) or styrene type resin instead of the metal layer 2 is used, and is composed of a thermosetting resin layer and a thermoplastic resin layer. It is possible to form a laminated body and cut it to obtain a laminated block 40 as shown in FIG. 10B.

The through hole 46 and the concave groove 47 shown in FIG. 14 can be formed by dissolving the thermoplastic resin layer with a solvent. As an example of the solvent, a ketone solvent such as methyl ethyl ketone can be used. Therefore, in the present invention, the multi-layer laminate means the insulating layer 1 and the metal layer 2.
It is not limited to those composed of and. In short, any material may be used as long as it is different in material and capable of forming the through hole 46 and the concave groove 47 by chemical treatment such as etching and dissolution.

Next, an improved probe assembly 50A of the second probe assembly 50 of the present invention shown in FIG. 15B will be described with reference to FIG. The probe assembly 50 shown in FIG. 15B is configured by inserting the tip end portion 48A of the probe 48 into the through hole 46, but if this structure is adopted, it takes time and effort to insert the tip end portion 48A, and the tip end portion 48A is also inserted. The position of 41 is located at a position retracted from the tip surface 40C of the tip portion 41 of the base 45, and it is difficult to approach the base portion of the outer lead 101 of the IC. It is desirable that the tip portion 41 of the probe 48 is brought into contact with the base portion of the outer lead 101 as much as possible, and the probe card can be made compact.

Therefore, the probe assembly 5 shown in FIG.
0A is configured in consideration of this point, and it has a through hole 4 in each metal layer 2 of the tip portion 41 of the base 45.
Without forming 6, the notch 46A is formed in each metal layer 2 exposed on the tip surface 40C of the tip 41, and the tip 48A of the probe 48 is fitted into each notch 46A. . Other structures and configurations of this probe assembly 50A are similar to those of the probe assembly 50.

The notches 46A can be formed at the same time when the groove 47 is formed. These notches 46A can be formed to a uniform depth by etching. In this case, the depth of the notch 46A is formed to be approximately the same as the depth of the concave groove 47. However, the notch 46A only has to play a role of preventing the tip portion 48A of the probe 48 from being displaced in the stacking direction of the base 45. Therefore, if the probe 48 has a circular cross section, the depth of the notch 46A is at least. It may be formed with a depth that is half the thickness of the probe 48.

FIG. 20 shows a method of using the probe card 20C shown in FIG. This probe card 20C
Is brought closer to the IC 100 to be measured from below, and the tip portion 48A of the probe 48 is brought into contact with the lower surface of the horizontal portion of the outer lead 101 of the IC 100 for measurement. FIG. 9B shows the contact state of the tip portion 48A of the probe 48 when the outer lead 101A measures the IC 100 in which the outer lead is formed in a gull wing type.

FIG. 5 shows the probe card 20 in which the probe assembly 11 shown in FIG. 4 is directly connected to the wiring circuit 14 of the printed wiring board 16. FIG. 21 shows the probe assembly 11.
Another connection structure for connecting to the printed wiring board 16 is shown by way of example. In this embodiment, a rubber connector is used as the connecting member, and FIG.
Further, FIG. B shows a sectional side view of only the rubber connector.

In this embodiment, the rubber-in connector 70 is used as a means for connecting the probe assembly 11 to the printed wiring board 16. This rubber-in connector 70 is shown in Figure B.
As shown in FIG. 2, a thin conductive wire 72 is finely printed in parallel on the surface of a rod-shaped rubber 71 having a substantially semi-elliptical cross section.
6 is connected to a predetermined position, and the lower surface 4B of the probe assembly 11 is bonded thereon. With this configuration, the plurality of conducting wires 72 connect the gold plating layer 7 of the probe assembly 11 (in this case, the solder layer 9 is unnecessary), that is, each metal layer 2 to the wiring circuit 14 of the printed wiring board 16. can do. This connection structure can be connected relatively easily as compared with the connection structure shown in FIGS. 5 and 6.

FIG. 22 shows still another connection structure. In the probe card 20D having the connection structure shown in this figure, the rubber assembly is provided with the probe assembly 11 shown in FIG.
0, the flexible printed wiring board 80 and the wiring member 14 of the printed wiring board 16 using the supporting member 60 shown in FIG.
22 is a perspective view showing a part thereof.

A wiring circuit 81 is formed on the flexible printed wiring board 80 used for this probe card 20D. In this wiring circuit 81, the width of the portion located on the lower surface of the probe assembly 11 is narrow, but Printed wiring board 1
The end portion connected to the wiring circuit 14 formed in the peripheral portion of 6 is formed wide. The flexible printed wiring board 80 is fixed to the bottom of the recess 61 of the support member 60, and the rubber-in connector 70 supported by the support member 73 thereon.
To fix. Then, the probe assembly 11 is mounted thereon in the same manner as described above, and the connecting structure is adopted in which the pressing plate 85 is pressed from above and the screw 86 is screwed into the screw hole 63 and fixed to the support member 73.

The probe assembly having such a connection structure is fixed to the printed wiring board 16, and the flexible printed wiring board 8 is formed.
When the wiring circuit 81 of the terminal 0 of 0 is connected to the wiring circuit 14 of the corresponding printed wiring board 16, the probe card 2
0D is obtained.

The shape of the probes 10 and 48 used in the above-mentioned embodiments is shown by needles whose bases 10B and 48B are circular in cross section, but they may be square. In short, the groove 5,
Anything that fits exactly in 47 may be used.

In the above description, the probe assembly for packaging the IC chip and inspecting the characteristics of the completed IC,
Although the probe card and the manufacturing method thereof have been described, it goes without saying that the present invention can also be applied to a probe assembly for inspecting the characteristics of an IC chip formed on the surface of a semiconductor wafer, a probe card, and the like.

[0054]

As described above, the probe assembly of the present invention, the method of manufacturing the same, and the IC measurement probe card using the same include a plurality of probes, particularly the tip portion thereof at an extremely fine pitch, and Since they can be arranged and held at equal intervals, adjacent probes do not come into contact with each other. Moreover, a probe assembly having a low inductance and a low capacitance can be assembled relatively easily and with high yield.

In particular, the manufacturing method of the present invention can form the concave groove of the member supporting the probe finely and uniformly, unlike the case where machining is performed by forming with a drill or the like, and Since they can be processed at once, they are suitable for mass production, and a probe assembly or probe card can be manufactured at low cost.

[Brief description of drawings]

FIG. 1 is a perspective view showing several steps of a method of manufacturing a probe assembly according to a first embodiment of the present invention.

2 is a perspective view showing a base of an etched semi-finished product, which is a view for explaining a process subsequent to the process of FIG. 1. FIG.

FIG. 3 is a diagram for explaining a step that follows the step of FIG. 2, and is a perspective view showing a part of a base that has been completed by performing a surface treatment.

FIG. 4 is a view for explaining a step that follows the step of FIG. 3, and is a perspective view of the probe assembly in a state where the probe is mounted on the base and completed.

5 is a perspective view of an IC measurement probe card according to the first embodiment of the present invention in which the probe assembly of FIG. 4 is incorporated in a printed wiring board.

6 is a cross-sectional view taken along the line AA of FIG.

7 is a partial cross-sectional view of the probe assembly and the like taken along the line BB of FIG.

8 shows a state in which the probe assembly of FIG. 4 is incorporated in a printed wiring board in a configuration different from that shown in FIG.
It is a perspective view of a C measurement probe card.

9 is an inverted view of the probe card of FIG.
3 is a cross-sectional view taken along the line AA of FIG.

FIG. 10 is a diagram for explaining a step that follows the steps shown in FIG. 1, and is a perspective view of a state in which a laminated block is subjected to cutting processing.

11 is a perspective view for explaining a step of applying a resist to a part of a laminated block which has been subjected to a cutting process following the step of FIG.

12 is a perspective view for explaining an exposure process following the process of FIG.

13 is a perspective view for explaining a step of performing etching processing on the laminated block whose surface is masked by the exposure of FIG.

14 shows a base of a semi-finished product obtained by the etching process of FIG. 13, in which FIG. A is a top perspective view thereof, FIG. B is a bottom perspective view thereof, and FIG. It is a perspective view of a part.

15 is a diagram for explaining a process subsequent to the process of FIG. 14, wherein FIG. 15A is a perspective view of a process of mounting the probe on the base shown in FIG. 14, and FIG. 15B is a completed probe. It is a perspective view of an aggregate.

16 shows an IC measurement probe card showing a state in which the probe assembly of FIG. 15 is incorporated in a printed wiring board. FIG. 16A is a top perspective view thereof, and FIG.
It is sectional drawing on the -A line.

FIG. 17 shows a step of incorporating the probe assembly shown in FIG. 15B into a support member, wherein FIG. A is a perspective view mainly showing the structure of the support member, and FIG. It is a perspective view showing the state where the probe aggregate was incorporated in the member.

FIG. 18 shows a third embodiment of the IC measurement probe card of the present invention in which the support member incorporating the probe assembly shown in FIG. 17B is mounted, and FIG. FIG. 2B is a sectional view taken along the line AA of FIG.

FIG. 19 is a partial perspective view of a probe assembly according to a second embodiment of the present invention.

20A and 20B show a method of using the probe card shown in FIG. 18, FIG. 20A being a cross-sectional view thereof, and FIG. 20B being a tip portion of a probe when measuring an IC in which outer leads are formed in a gull-wing type. It is a partially expanded sectional view showing.

FIG. 21 shows a connection structure in which the probe assembly shown in FIG. 4 is connected to a printed wiring board by using a rubber-in connector, and FIG. 21A is a partially enlarged sectional view thereof, and FIG.
FIG. 6 is a sectional side view showing only a rubber-in connector.

22 is a partial perspective view of a probe card showing a connection structure in which the probe assembly shown in FIG. 4 is connected to a printed wiring board by using a rubber-in connector and a flexible printed wiring board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Insulating layer 2 Metal layer 3 Multilayer laminated body 4 Laminated block 4A Upper surface 4B Lower surface 5 Groove 10 Base 11 Probe assembly 12 Opening 13 Electrode terminal 14 Wiring circuit 16 Printed wiring board 16A Printed wiring board 17 Probe 17A Tip part 17B Base portion 20 Probe card 20A Probe card 20B Probe card 20C Probe card 20D Probe card 30 Support stand 31 Protective plate 40 Laminated block 40A Upper surface 40B Lower surface 40C Tip surface 41 Tip portion 41A Top surface 41B Bottom surface 42 Base portion 45 Base 46 Through hole 46A Groove 47 48 probe 48A tip part 48B base 50 probe assembly 50A probe assembly 60 support member 60A probe assembly built-in support member 61 recess 62 opening 63 screw hole 70 rubber-in connector 71 Rubber 72 Conductive Wire 80 Flexible Printed Wiring Board 81 Wiring Circuit 85 Suppression Plate 100 QFP Type IC 101 Outer Lead 101A Gull Wing Type Outer Lead

Claims (8)

[Claims] 1. A depth over the entire length of a thin layer portion of the one type of material exposed on at least one plane of a cubic laminated block in which a plurality of thin layers made of different materials are alternately laminated at a predetermined pitch. Forming a uniform groove, the base of the probe is fixed in the groove of the entire length, and the tip end is a free end. 2. The plurality of thin layers according to claim 1 are composed of an insulating layer and a metal layer, the material in which the groove is formed is a metal layer, and each metal layer is an electrode. A plurality of openings are provided in the central part, and an electric circuit wiring board in which an electric circuit is provided in the peripheral part is mounted so that the tip of the probe is located on the opening side in the peripheral part of the opening. An IC measurement probe card, characterized in that each electrode covered with the good electrical conductor of the assembly is connected to the predetermined electric circuit directly or via an elastic connector. 3. A thin layer portion of the one type of material exposed on at least one plane of a cubic laminated block in which a plurality of thin layers of different materials are alternately laminated at a predetermined pitch,
A groove having a uniform depth over the entire length thereof and a through hole having a small diameter is formed at each tip portion of the groove, or the groove exposed on another plane intersecting with the plane in the longitudinal direction of each groove. Form a uniform notch in a thin layer of the same material as the material formed, fix the base of the probe in the groove of these full length, respectively, the tip of the probe in each of the through holes or notches A probe assembly characterized in that each tip of the probe is fitted so that it cannot move in the stacking direction but can move in the vertical direction. 4. A cube-shaped laminated block comprising a thick portion and a thin portion, in which a plurality of thin layers made of different materials are alternately laminated at a predetermined pitch A groove having a uniform depth is formed in the thin layer portion of the one kind of material exposed in one plane on the laminated block, and a small diameter is formed at each tip of the laminated block having the thin thickness. A through hole is formed, or a predetermined notch is formed on the tip surface exposed on another plane intersecting the upper surface of each tip, and the probe base is fixed in the groove over the entire length of the groove. The probe is characterized by being fitted into each through hole or notch so that the tip of the probe cannot move in the stacking direction but can move in the vertical direction. Aggregation. 5. The probe assembly according to any one of claims 1, 3, and 4, wherein one protective plate is fitted from above the base portion of the probe fixed to each groove. A probe assembly that does. 6. A plurality of probe aggregates according to claim 1, and a plurality of probe aggregates according to claim 3 are mounted on a probe aggregate support member, and the probe aggregate support member has a central opening. The probe is mounted on the periphery of the opening of the electric circuit wiring board in which an electric circuit is formed on the periphery thereof so that each tip of the probe is located on the opening side, and the base of each probe is connected to the electric circuit. IC characterized by being configured
Measurement probe card. 7. A plurality of probe aggregates according to claim 1, and a plurality of probe aggregates according to claim 5, and each tip portion of the probe is located at a central portion of an electric circuit wiring board on which an electric circuit is formed in a peripheral portion. As described above, an IC measuring probe card is characterized in that it is mounted via an elastic connector or a flexible electric circuit wiring board and fixed. 8. A plurality of thin layers made of different materials are alternately laminated to form a multilayer laminate having a predetermined pitch, and the multilayer laminate has a predetermined length, width and thickness in the stacking direction. It is cut into a cube-shaped laminated block, and a part of the laminated block in the length direction is processed over its entire width to reduce its thickness, and the necessary surface of this processed laminated block is masked and exposed. The thin layer of the one type of material is chemically treated to form a concave groove slightly recessed from the surface of the laminated block and the laminated block portion having a small thickness over the entire length of the one type of thin layer of the laminated block. Characterized in that minute through holes or notches are formed in each of the plurality of L-shaped probes, the tips of a plurality of L-shaped probes are fitted into the through holes or notches, and the base of each probe is fixed to each of the grooves. To manufacture a probe assembly Law.