JPH07134809A - Method of manufacturing thin film head - Google Patents

Abstract

(57) [Summary] [Purpose] The present invention has been made for the purpose of providing a method for manufacturing a thin film head having high productivity and good processing accuracy. A method of manufacturing a thin film head in which a thin film 2 and an electrode portion 3 are formed on a substrate 1 and the thin film portion is covered with a protective substrate 4, and the thin film 2 corresponds to one head.
And a substrate 1a in which a large number of patterns P each having a configuration of the electrode portion 3 are arranged vertically and horizontally, and grooves 7 are formed at a constant pitch in a portion of the same size as the substrate 1a and facing each electrode portion 3. A protective substrate material 4a is prepared, and a groove 7 of the protective substrate material 4a is adhered on the surface of the substrate 1a so as to face the electrode portion 3. After this adhesion, the groove is formed from the surface side of the protective substrate material 4a. 7. The surface is ground to a depth of 7, and then a plurality of heads in the column direction are integrally cut in tandem so that the thin film 2 side of the substrate 1 becomes the end face, and then cut in rows to cut into individual heads. Let H.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a hard disk drive (HDD), a digital compact cassette (DC).
The present invention relates to a method of manufacturing a thin film head used in C) and the like.

[0002]

2. Description of the Related Art In recent years, a hard disk drive (HDD) has become widespread as a recording device of a personal computer, and a digital compact cassette (DCC) of tape media is about to be replaced with a conventional analog cassette. A high-density thin film head is used as a recording / reading device for both. Thin film heads are usually formed on a surface of a round or square substrate having a diameter of 3 to 6 inches at the same time, and hundreds to thousands are formed at the same time. Then, the heads are cut into individual heads to complete one head.

An example of a conventional method of manufacturing the above-mentioned thin film head will be described below with reference to the drawings.

FIG. 7 shows a method of manufacturing a thin film head used in a conventional digital compact cassette (DCC) or the like. In FIG. 7, reference numeral 9 in (a) of FIG. 7 is a rectangular substrate having a large number of thin films formed on its surface. This substrate 9 is first cut out as a strip-shaped substrate 10 with a dicing saw or the like as shown by a dotted line. b) As shown in the figure, a protective substrate material 11 having the same strip shape and having a width exposing the electrode portion is adhered onto the strip substrate 10. Next, as shown by the dotted line in the same figure (b), the tape contact surface is cylindrically polished to form a plurality of columns of head material 12 having a curved surface as shown in the figure (c), and this is shown by the dotted line in the same figure. The head chip 13 as shown in FIG. 3D is completed by cutting along the line. The flexible printed board 14 is connected to the electrode portion (not shown) exposed from the protective board 13b on the board 13a.

[0005]

However, in the conventional method of manufacturing a thin film head as described above, a protective substrate material has to be adhered to each of the strip-shaped substrates, which is very difficult to process from one substrate. It took time. Further, as the chip size becomes smaller, it becomes difficult to bond the protective substrate material to the strip-shaped substrate with high accuracy.

The present invention has been made in view of the above problems, and an object thereof is to provide a method of manufacturing a thin film head having high productivity and good processing accuracy.

[0007]

In order to solve the above-mentioned conventional problems, a method of manufacturing a thin film head according to the present invention comprises forming a thin film for a thin film magnetic head and an electrode portion for electrical connection on a substrate to form the thin film. A method of manufacturing a thin film head in which a portion is covered with a protective substrate, wherein a plurality of thin and long patterns corresponding to one head and a set of electrode portions for electrical connection are arranged vertically and horizontally. And a protective substrate material of the same size as this substrate, in which grooves having comb-shaped cross sections are formed at a constant pitch so as to form voids in the column-direction portions facing the respective electrode parts, The surface of the side where the pattern is arranged is adhered so that the groove of the surface on which the groove of the protective substrate material is formed faces the electrode portion, and after this adhesion, from the surface side of the protective substrate material to the depth of the groove. Surface grinding, then the thin film side of the substrate is the end face And column cleaved integrally tandem direction of the plurality of heads such that, cut into individual heads and then row cut, it is an individual thin film head.

[0008]

According to the present invention, the productivity and processing accuracy are remarkably improved by collectively adhering the protective substrate material onto the substrate by the above-mentioned method.

[0009]

Embodiments of the method of manufacturing a thin film head according to the present invention will be described in detail below with reference to FIGS.

According to the present invention, one thin film head H as shown in FIG. 3, that is, a thin film 2 for a thin film magnetic head and an electrode part 3 for electrical connection are formed on a substrate 1, and the thin film part is formed. Two
Is a method of manufacturing the thin film head H in which the protective substrate 4 is covered. In the figure, 5 is a flexible printed circuit board connected to the electrode portion 3, and the head H
It transmits and receives more signals and is connected by wire bonding or the like. The thin film head H configured in this way
The manufacturing method according to the present invention will be described below.

FIG. 1 shows the steps of the manufacturing method,
In the figure, reference numeral 1a shown in FIG. 1 (a) is a substrate which is a material of the substrate 1, and the surface thereof has a structure of the above-mentioned thin film 2 corresponding to one head and an electrode portion 3 for electrical connection. A large number of patterns P, each of which is a set, are arranged vertically and horizontally. As shown in FIG. 2, the pattern P is one pattern P.
It is formed continuously with the upper, lower, left and right patterns P1 to P4 (a part of the pattern is omitted), and here, the upper and lower directions are defined as the column direction for convenience. X and Y are the respective patterns P to P
The four parts are the cutting lines of the vertical and horizontal rows when the thin film head H is finally formed, but these lines X and Y are not actually marked, but are marked at the end or the like. This is done with a marker.

On the other hand, reference numeral 4a shown in FIG. 2 (b) is a protective substrate material which is a material of the protective substrate 4 and has the same size as the substrate 1a. As shown in FIG. 2 (c), a slicer 6 is provided on one surface thereof. Thus, a large number of grooves 7 having the same depth are formed at a constant pitch, and teeth 7a having a comb-shaped cross section are formed. Here, the pitch of the grooves 7 is the same as the pitch of the patterns P on the substrate 1a in the column direction. In the method of manufacturing the thin film head of the present invention, such a substrate 1a and the protective substrate material 4a are prepared in advance.

Next, as shown in FIG. 1D, on the surface of the substrate 1a on which the patterns P are arranged, the groove 7 of the surface on which the groove 7 of the protective substrate material 4a is formed is the electrode. The thin film 2 portion is opposed to the portion 3 by the teeth 7a formed between the grooves 7 of the protective substrate material 4a so that the thin film 2 portion is aligned in the column direction so that the thin film 2 portion is closely attached. In the bonded state, voids are formed in the column-direction portions at the positions facing the electrode portions 3, and the bonded state is shown in FIG.

Next, after the adhesive is completely hardened, in the state shown in FIG. 6E, the surface of the protective substrate 4a is ground from the upper surface side, and the surface is ground to the position shown by the dotted line D-D in FIG. Only the teeth 7a of the protective substrate material 4a will remain on the substrate 1a. Next, as shown in FIG. 2F, a substrate 1a in which only the teeth 7a of the protective substrate material 4a are left is removed along the cutting line X in the column described above with reference to FIG. Cut the column with etc.

FIG. 3G shows a chip array on one strip cut in a column, and at this time, the substrate 1b and the protective substrate 4b are angular, and in this state, in the head for the digital compact cassette, FIG. As shown in FIG. 3C, the tape contact surface, which is the thin film side end surface of the chip array, is cylindrically polished to form the curved substrate 1c and protective substrate 4c shown in FIG. Then, finally, by cutting along the line y portion along the row cutting line Y, one chip-shaped thin film head H is completed as shown in FIG.

As described above, according to this embodiment, the protective substrate material 4a can be bonded to one substrate 1a at a time, and a comparison can be made with the conventional method in which a strip-shaped protective substrate material of several chips is bonded. However, productivity is significantly improved. Further, when the chip size is miniaturized to, for example, about 1 mm, it becomes very difficult to adhere the protective substrate material with high precision, and variations in work may occur in the product. If only the horizontal alignment of the protective substrate material is made accurate, the mounting precision of the protective substrate material of all the chips on the substrate 1a and the thickness of the adhesive can be made uniform, and the product quality can be stabilized. .

Next, another embodiment will be described with reference to FIGS. First, in FIG. 4, the substrate 1a and the protective substrate material 4a are square and have the same size.

Further, in FIG. 5, the protective substrate material 4a is replaced with the substrate 1a.
In this case, one head having a size corresponding to one head is bonded to the outermost peripheral portion of the substrate 1a. In this case, the outermost peripheral portion of the substrate 1a is generally invalid for attachment to the device, like the semiconductor integrated circuit. It is a part or a part which is not stable in performance and is discarded at the time of processing. By doing so, there is an advantage that the expensive protective substrate material 4a can be saved. In addition, at the same time, in order to accurately align the protective substrate material 4a, the protective substrate material 4 is placed inside one head on the substrate 1a.
Bonding a has a greater processing advantage.

Further, FIG. 6 shows an example in which a rectangular protective substrate material 4a is bonded to a round substrate 1a. Round board 1
When the thin film head is formed on a, the entire outer peripheral portion is discarded, and the protective substrate material 4a having a size comparable to the size of the central portion to be finally processed is adhered.

[0020]

INDUSTRIAL APPLICABILITY As described above, according to the present invention, the protective substrate material can be bonded to one substrate at a stretch, and compared with the conventional method of bonding the protective substrate material in strips of several chips in rows. Sex is significantly improved. Further, when the chip size is miniaturized to, for example, about 1 mm, it becomes very difficult to adhere the protective substrate material with high precision, and variations in work may occur in the product. If only the horizontal alignment of the protective substrate material is accurate, the mounting precision of the protective substrate material of all the chips on the substrate 1a and the thickness of the adhesive can be made uniform, and the product quality can be stabilized. , A very effective invention.

[Brief description of drawings]

FIG. 1 is an explanatory process diagram showing a method of manufacturing a thin film head in a first embodiment of the invention.

FIG. 2 is a pattern diagram of a mask of a thin film portion of the thin film head.

FIG. 3 is an external perspective view showing a partially cutaway thin film head manufactured by the same method.

FIG. 4 is a perspective view of a material substrate and a protective substrate material according to a second embodiment.

FIG. 5 is a perspective view of a material substrate and a protective substrate material according to a third embodiment.

FIG. 6 is a plan view of a material substrate and a protective substrate material according to a fourth embodiment.

FIG. 7 is a process explanatory view showing a conventional method of manufacturing a thin film head.

[Explanation of symbols]

 1, 1a Substrate 2 Thin film 3 Electrode part 4 Protective substrate 4a Protective substrate material 7 Groove H Thin film head P pattern

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hiroshi Fujimori 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Koichi Sakai, 1006 Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd.

Claims (3)

[Claims] 1. A method of manufacturing a thin film head, wherein a thin film for a thin film magnetic head and an electrode portion for electrical connection are formed on a substrate, and the thin film portion is covered with a protective substrate. A substrate on which a large number of vertical and horizontal patterns each having a set of a thin film and an electrode portion for electrical connection are arranged, and voids are formed in a column direction portion having the same size as the substrate and facing each electrode portion. A protective substrate material having grooves with a comb-like cross section formed at a constant pitch, and the grooves on the surface of the substrate on which the patterns of the protective substrate material are formed are Bonding so as to face the electrode portion, and after this bonding, surface grinding is performed from the surface side of the protective substrate material to the depth of the groove, and then a plurality of heads in the column direction are formed so that the thin film side of the substrate is the end surface. Cut the row as one,
Then, a method for manufacturing a thin film head is characterized in that the thin film head is cut in rows and cut into individual thin film heads. 2. The method of manufacturing a thin film head according to claim 1, wherein the shape of the protective substrate material is different from the shape of the substrate. 3. The thin-film head according to claim 1, wherein after the row is cut in the longitudinal direction, the substrate and the protective substrate are simultaneously cylindrically polished from the end surface side which is the head surface to form a predetermined tape contact surface. Manufacturing method.