JPH07120913B2 - Method for manufacturing chip-shaped electronic component - Google Patents

Description

Description: (a) Field of Industrial Application The present invention relates to a method for manufacturing a chip-shaped electronic component for manufacturing a chip-shaped electronic component in which a plurality of substrates are laminated and external electrodes are formed on the end faces thereof. .

(B) Conventional Technology Conventionally, for example, in a chip-shaped monolithic ceramic capacitor, a plurality of substrates having electrodes of a specific pattern and lead electrodes are laminated to form a laminate, and external electrodes are provided on both end faces of the laminate. Are manufactured by forming.

Further, for example, in a chip-shaped piezoelectric component, a piezoelectric resonator in which electrodes having a specific pattern and lead-out electrodes are formed on both main surfaces of a piezoelectric substrate is laminated between two sealing plates, and an external surface is provided on an end surface of the laminated body. It is manufactured by forming electrodes. The cross-sectional structure of the external electrode formation part of this chip-shaped piezoelectric component is
Shown in the figure.

In FIG. 10, reference numeral 1 denotes a piezoelectric substrate having a vibrating electrode made of an Ag film and a lead electrode formed on both main surfaces, and one lead electrode 5 is shown in the figure. Further, 6 and 7 are sealing plates, respectively, and these three substrates are laminated, and an external electrode 11 made of a film of Ag, Ag / Pd, Cu, Ni or Monel is formed on the end face thereof. As a result, the end portion of the extraction electrode 5 is electrically connected to the external electrode 11.

(C) Problem to be Solved by the Invention However, in the chip-shaped electronic component having the structure shown in FIG. 10, the extraction electrode 5 and the external electrode 11 are only connected in a very small area. Therefore, there is a problem that the wiring is easily broken due to variations in the dimensions of each board.

An object of the present invention is to provide a manufacturing method of a chip-shaped electronic component for manufacturing a chip-shaped electronic component with improved reliability by reliably connecting an external electrode to an extraction electrode formed on a substrate. is there.

(D) Means for Solving the Problem In the method for manufacturing a chip-shaped electronic component of the present invention, a laminated body including a plurality of substrates including a substrate on which an electrode having a specific pattern and an extraction electrode is formed is formed, and then the above-mentioned method is performed. A groove exposing the extraction electrode is formed in a part of the end surface of the stack, and an external electrode is formed so as to cover part or all of the end surface of the stack.

(E) Action In the method for manufacturing a chip-shaped electronic component of the present invention, the extraction electrode is exposed at a part of the end face of the laminate including a plurality of substrates including the substrate on which the electrode having the specific pattern and the extraction electrode are formed. A groove is formed to form an external electrode that covers a part or all of the end surface of the laminate. Therefore, the external electrode can be easily and surely connected to the extraction electrode in the groove. Even if the end surface of the extraction electrode is inside the end surface of the stacked body, the formation of the groove ensures that the end portion of the extraction electrode is exposed in the groove. Further, since the inner surface of the groove is a smooth surface, unlike the other end surfaces of the laminate, the end surface of the extraction electrode and the external electrode are reliably connected. Moreover, when the end face of the extraction electrode is exposed on the slope of the groove, the exposed area increases, and the connection state with the external electrode becomes more reliable. Further, since the lead electrode is exposed by removing a part of the end portion thereof after the formation of the laminated body, it is possible to surely expose the necessary portion of the lead electrode. Further, even when exposing the upper and lower sides or only one side of the extraction electrode, the shape and the like can be arbitrarily designed, and the highly reliable connection between the extraction electrode and the external electrode is achieved while maintaining high sealing property. be able to. Further, the groove can absorb variations in the positional accuracy of the extraction electrode with respect to the substrate and the dimensional accuracy of the substrate itself, and the extraction electrode and the external electrode can be connected easily and reliably. Further, since the groove is formed in the formed laminated body, it can be used without changing the installation for manufacturing the conventional laminated body. That is, new capital investment for manufacturing the laminated body is unnecessary.

(F) Example FIGS. 1 to 3 show an example of the structure of a chip-shaped piezoelectric component manufactured by the method for manufacturing a chip-shaped electronic component of the present invention.

FIG. 1 is an exploded perspective view showing a state before stacking of the stacked body. Reference numeral 1 denotes a piezoelectric substrate. In the figure, a vibrating electrode 2 is formed in the center of the upper surface of the substrate, an extraction electrode 3 is formed on one side of the substrate, a vibrating electrode 4 is formed in the center of the lower surface of the substrate, and an extraction electrode 5 is formed on the side facing the extraction electrode 3. To form a piezoelectric resonator of energy trapping thickness vibration mode. Reference numerals 6 and 7 denote sealing substrates made of ceramic plates, which are laminated on the piezoelectric substrate 1 to form a laminated body. A slight cavity is formed near the vibrating electrode so as not to hinder the vibration of the piezoelectric resonator near the vibrating electrode.

FIGS. 2A to 2C are perspective views also showing a manufacturing procedure after the laminated body is formed. As shown in (A), the piezoelectric substrate 1 is laminated between the two sealing substrates 6 and 7, and then, as shown in (B), grooves 8 and 9 are formed near the formation portions of the extraction electrodes 3 and 5, respectively. Form. As a result, the end faces of the extraction electrodes 3 and 5 are exposed in the grooves 8 and 9, respectively.

As a method of forming a groove in the vicinity of the extraction electrode forming portion on the end surface of the laminate, a known method such as grinding with a grinding machine or sandblasting can be used. Usually, the piezoelectric substrate 1 and the extraction electrode 5 are softer than the sealing plates 6 and 7, so that the entire surface of the end face of the laminated body is sandblasted to form a third layer.
As shown in the figure, grooves 9 are formed in the piezoelectric substrate 1 and the extraction electrode 5 portion.
Can be formed. In the case of grinding, the grinding wheel is positioned so as to come into contact with the vicinity of the extraction electrode forming portion on the end surface of the laminate. It should be noted that grooves can be formed in a large number of laminated bodies at one time by depositing a large number of laminated bodies in a cassette and simultaneously grinding them.

After that, as shown in FIG. 2C, external electrodes 10 and 11 are formed on both end faces of the laminated body to complete the chip-shaped piezoelectric component.

FIG. 3 is a central partial sectional view of the chip-shaped piezoelectric component in the state shown in FIG. 2 (C). As is clear from this figure, the end portion of the extraction electrode 5 is exposed in the groove 9 over a wide area, and the external electrode 11 is formed on the entire surface of the end face of the laminated body. Securely connected to the electrode 11.

Next, examples of other chip-shaped electronic components are shown in FIGS. 4 (A) and 4 (B).
Shown in.

FIG. 4 (A) is a perspective view of the laminated body before the formation of the groove and the external electrode. Reference numerals 31, 32 and 33 are substrates, and 34, 35 and 36 are extraction electrodes formed on these substrates. After forming such a laminated body, as shown in FIG. 4 (B), by forming grooves 37, 38 and the like in the laminated body, the respective extraction electrodes are exposed in the grooves, and further external electrodes 39, 38 are formed. By forming 40 and 41, a three-terminal type chip-shaped electronic component is completed.

Next, examples of other groove shapes formed in the laminated body are shown in FIGS.

The example of FIG. 5 is an example in which a groove is formed in a portion of the sealing plate 7 near the center in the thickness direction, and the extraction electrode 5 is exposed on the upper slope of the groove 9.

FIG. 6 shows an example in which the groove 9 is formed with the extraction electrode 5 as the center, and the extraction electrode 5 is exposed at the bottom of the groove 9.

FIG. 7 is an example in which the exposed area 5 of the extraction electrode 5 is increased by forming the groove 9 in the sealing plate 7 and leaving the extraction electrode 5 almost as it is.

Further, FIG. 8 shows an example in which grooves 9a and 9b are formed in the upper and lower portions of the extraction electrode 5 to expose the end of the extraction electrode 5 for a long time.

In each of the above examples, the sealing plates 6 and 7 were attached to the upper and lower surfaces of the piezoelectric substrate.
However, the present invention can also be applied to a case where a large number of extraction electrodes formed on a large number of substrates are connected to external electrodes on the end faces of the laminated body. FIG. 9 is a partial cross-sectional view of the vicinity of the end portion of the multilayer chip piezoelectric component. here,
Reference numerals 21 and 23 are piezoelectric substrates, 22 and 24 are extraction electrodes formed on the respective piezoelectric substrates, 25, 26 and 27 are sealing plates, 28
Is an external electrode. As shown in the figure, the respective substrates are laminated to form two grooves so that the end surfaces of the extraction electrodes 22 and 24 are exposed in the grooves, and then the external electrode 28 is formed on the entire end surface of the laminated body. In this way, each extraction electrode is a common external electrode
Securely connected to each 28.

In each drawing, the groove for the stacked body is drawn deep for the sake of explanation, but in reality, a shallower groove can provide a sufficient effect.

(G) Effect of the Invention According to the present invention, the end portion of the extraction electrode is surely exposed in the groove formed on the end surface of the laminate, and the external electrode is formed on the end surface of the laminate including this groove. Therefore, the extraction electrode and the external electrode are electrically reliably connected. Therefore, variations in the positional accuracy of the extraction electrode with respect to the substrate and the dimensional accuracy of the substrate itself are absorbed by the groove, and since the extraction electrode and the external electrode are connected in a large area, the chip shape is highly reliable and highly reliable. Electronic parts can be manufactured. Further, even when only the upper and lower sides or only one side of the extraction electrode is exposed, it is possible to connect the extraction electrode with high reliability while maintaining a high hermeticity by making the shape and the like arbitrary. Further, since the groove is formed in the formed laminated body, it can be used without changing the equipment for manufacturing the conventional laminated body, and new capital investment for manufacturing the laminated body is unnecessary. is there.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing the constitution of each substrate constituting a chip-shaped piezoelectric component according to an embodiment of the present invention, and FIG. 2 (A)-
FIG. 3C is a perspective view showing each state during manufacturing of the chip-shaped piezoelectric component, and FIG. 3 is a central partial sectional view of the chip-shaped piezoelectric component. 4 (A) and 4 (B) are diagrams showing the configuration of a three-terminal type chip-shaped electronic component. 5 to 8 are sectional views showing examples of different groove shapes formed in the laminated body. FIG. 9 is a partial cross-sectional view of a multilayer chip piezoelectric component. FIG. 10 is a partial sectional view of a conventional chip-shaped piezoelectric component. 1 …… Piezoelectric substrate, 2,4 …… Vibration electrode, 3,5,34,35,36 …… Extraction electrode, 6,7 …… Seal plate, 8,9,37,38 …… Groove, 10, 11,39,40,41 …… External electrodes, 31,32,33 …… Board.

Claims (1)

[Claims] 1. A laminate comprising a plurality of substrates including a substrate on which an electrode having a specific pattern and an extraction electrode is formed, and thereafter, a groove exposing the extraction electrode is formed on a part of an end face of the laminate. A method for manufacturing a chip-shaped electronic component, comprising forming an external electrode so as to cover a part or all of the end surface of the laminate.