JPH07118424B2 - Coil device - Google Patents
Coil deviceInfo
- Publication number
- JPH07118424B2 JPH07118424B2 JP61267650A JP26765086A JPH07118424B2 JP H07118424 B2 JPH07118424 B2 JP H07118424B2 JP 61267650 A JP61267650 A JP 61267650A JP 26765086 A JP26765086 A JP 26765086A JP H07118424 B2 JPH07118424 B2 JP H07118424B2
- Authority
- JP
- Japan
- Prior art keywords
- terminal fitting
- soldering
- terminal
- coil
- melting point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005476 soldering Methods 0.000 claims description 29
- 230000008018 melting Effects 0.000 claims description 21
- 238000002844 melting Methods 0.000 claims description 21
- 238000003466 welding Methods 0.000 claims description 21
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 13
- 229920003002 synthetic resin Polymers 0.000 claims description 3
- 239000000057 synthetic resin Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 17
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 238000004804 winding Methods 0.000 description 4
- 210000000078 claw Anatomy 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
Landscapes
- Coils Of Transformers For General Uses (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は端子金具に、コイルの端末線を溶着し、かつ配
線用口出し線を半田付けするタイプのコイル装置に関す
るものである。Description: TECHNICAL FIELD The present invention relates to a coil device of a type in which a terminal wire of a coil is welded to a terminal fitting and a lead wire for wiring is soldered.
第６図および第７図に示す従来のコイル装置について説
明する。このコイル装置は合成樹脂製のコイルボビン１
を備え、その鍔12にコイル軸方向に延在する端子台14を
一体に形成する。端子台14の片面に端子金具５を載置す
る。端子金具５の表面には錫メッキ（図示せず）が施さ
れている。コイルボビン１に巻回されたコイル３の端末
線31は端子金具５に溶着される。The conventional coil device shown in FIGS. 6 and 7 will be described. This coil device is a coil bobbin 1 made of synthetic resin.
The terminal block (14) extending in the coil axial direction is integrally formed with the collar (12). The terminal fitting 5 is placed on one side of the terminal block 14. The surface of the terminal fitting 5 is tin-plated (not shown). The terminal wire 31 of the coil 3 wound around the coil bobbin 1 is welded to the terminal fitting 5.
端末線31の溶着は、端末線31を端子金具５の爪部51に仮
止めし、上側電極62、下側電極64を該当箇所に当接し、
通電してなされる。この際に、溶着箇所は1000℃前後の
高温となる。16は端子台14に形成した電極用貫通穴であ
って、下側電極64が適宜に出入りする。To weld the terminal wire 31, the terminal wire 31 is temporarily fixed to the claw portion 51 of the terminal fitting 5, and the upper electrode 62 and the lower electrode 64 are brought into contact with the corresponding portions,
It is done by energizing. At this time, the welding location becomes a high temperature of around 1000 ° C. Reference numeral 16 denotes an electrode through hole formed in the terminal base 14, through which the lower electrode 64 appropriately enters and leaves.
第６図、第７図には図示していないが、その溶着箇所
に、溶着後に配線用口出し線が半田付けされる。したが
って、端子金具５における溶着箇所はその後における半
田付け箇所でもある。Although not shown in FIGS. 6 and 7, a lead wire for wiring is soldered to the welded portion after the welding. Therefore, the welded portion of the terminal fitting 5 is also the soldering portion thereafter.
端子金具５の表面には、図外の低融点皮膜（錫メッキ）
が施されている。これは半田付けを良好にするためのも
のであって、これ自体は周知に属する。しかして、半田
付けに先立つ前記溶着時の熱の影響でせっかくの低融点
皮膜が溶融飛散する。このため、半田による図外の配線
口出し線の接続が不確かで、接続不良となることがあ
る。On the surface of the terminal fitting 5, a low melting point film (tin plating) not shown
Has been applied. This is for good soldering and is well known per se. Then, the low melting point coating is melted and scattered due to the influence of heat at the time of welding prior to soldering. For this reason, the connection of the wiring lead-out wire (not shown) by solder is uncertain, and the connection may be defective.
本発明の目的は、以上の難点を除き、半田付けの信頼性
を高めることである。An object of the present invention is to improve the reliability of soldering, except for the above difficulties.
本発明においては、端子金具における溶着箇所から離れ
た箇所に配線用口出し線を半田付けする。また、端子金
具における溶着箇所と半田付け箇所との間に抜き穴を形
成する。In the present invention, the lead wire for wiring is soldered to a portion of the terminal fitting that is away from the welded portion. In addition, a hole is formed between the welded portion and the soldered portion of the terminal fitting.
端子金具における溶着箇所は溶着時に高温となる。その
熱は端子金具自身を伝わって半田付け箇所（この段階で
はまだ半田付けはなされていないので、より正確には半
田付け予定箇所）へ波及する。本発明の抜き穴は溶着箇
所・半田付け箇所相互間に介在し、前者から後者への熱
伝導を抑制する。The welded portion of the terminal fitting becomes hot during welding. The heat propagates through the terminal metal fittings and spreads to the soldering point (more accurately, the soldering point has not been soldered at this stage). The hole of the present invention is interposed between the welding portion and the soldering portion to suppress heat conduction from the former to the latter.
抜き穴の影響で半田付け箇所の温度が抑制され、そこに
おける低融点皮膜の蒸発飛散が緩和される。このため、
半田付け箇所（半田付け予定箇所）に対してなされるそ
の後の半田付けが良好となる。Due to the effect of the holes, the temperature of the soldered portion is suppressed, and the evaporation and scattering of the low melting point film there is moderated. For this reason,
Subsequent soldering to the soldering spot (scheduled soldering spot) will be good.
第１図〜第５図は本発明を適用した放電灯用安定器であ
る。以下、これについて説明するが、この説明に前記第
６図および第７図の部品符号を適宜に転用し、重複する
説明の一部を割愛する。1 to 5 show a ballast for a discharge lamp to which the present invention is applied. Hereinafter, this will be described, but the part numbers in FIGS. 6 and 7 are appropriately diverted to this description, and a part of the overlapping description will be omitted.
本実施例においては、合成樹脂製のコイルボビン１の鍔
12にそのコイル軸方向に延在する端子台14を一体に形成
する。端子台14の片面（上面）に端子金具５を載置す
る。端子金具５の表面に低融点皮膜59（第３図参照）を
形成する。コイルボビン１に巻回されたコイル３の端末
線31を端子金具５に溶着する。端子金具５における溶着
箇所52から離れた箇所に配線用口出し線９を半田付けす
る。端子金具５における溶着箇所52と半田付け箇所53と
の間に抜き穴54を形成する。In this embodiment, the collar of the coil bobbin 1 made of synthetic resin is used.
A terminal block (14) extending in the axial direction of the coil is integrally formed with (12). The terminal fitting 5 is placed on one surface (top surface) of the terminal block 14. A low melting point film 59 (see FIG. 3) is formed on the surface of the terminal fitting 5. The terminal wire 31 of the coil 3 wound around the coil bobbin 1 is welded to the terminal fitting 5. The lead wire 9 for wiring is soldered to a portion of the terminal fitting 5 away from the welded portion 52. A hole 54 is formed between the welded portion 52 and the soldered portion 53 of the terminal fitting 5.
第２図における上側の端末線31はコイル３の巻終端（巻
き終わり）である。下側の端末線31はコイル３の巻始端
（巻き始め）である。そのいずれの端子部構造も同一で
ある。The upper end wire 31 in FIG. 2 is the winding end (winding end) of the coil 3. The lower terminal wire 31 is the winding start end (winding start) of the coil 3. The structure of any of the terminals is the same.
本実施例の低融点皮膜59は錫メッキされたものである。
58は配線用口出し線９を半田付け箇所53に接続する半田
である。低融点皮膜（本実施例では錫メッキ）59の融点
は約232℃である。半田58の融点は約183℃であり、半田
接続を良好にするための錫メッキの前記融点よりも少し
低い。端末線31を溶着箇所52に溶着する際の温度は約10
00℃であり、錫メッキの前記融点をはるかに越える。端
末線31の溶着はコイル装置（放電灯用安定器）の組立工
程に属し、配線用口出し線９の半田付けはその後の機器
（本実施例では放電灯器具）への組付け工程に属する。
したがって、溶着時の熱で固化後の半田58が再溶解され
る心配はないが、半田接続のための低融点皮膜59は事前
に形成されるので、溶着時の熱の影響を受ける。55は端
子金具５における半田付け箇所53の端縁を曲げ立てて形
成した半田留めである。The low melting point film 59 of this embodiment is tin-plated.
Reference numeral 58 is solder for connecting the lead wire 9 for wiring to the soldering point 53. The melting point of the low melting point film (tin plating in this embodiment) 59 is about 232 ° C. The melting point of the solder 58 is about 183 ° C., which is a little lower than the melting point of tin plating for good solder connection. The temperature when welding the terminal wire 31 to the welding point 52 is about 10
It is 00 ° C, which is far above the melting point of tin plating. The welding of the terminal wire 31 belongs to the assembling process of the coil device (ballast for discharge lamp), and the soldering of the wiring lead wire 9 belongs to the assembling process to the subsequent device (discharge lamp fixture in this embodiment).
Therefore, there is no concern that the solder 58 after solidification will be redissolved by the heat at the time of welding, but since the low melting point film 59 for solder connection is formed in advance, it is affected by the heat at the time of welding. Reference numeral 55 is a solder retainer formed by bending the edge of the soldering portion 53 of the terminal fitting 5.
抜き穴54の役割について説明する。この説明に第３図を
使用するが、これは溶着後であって、半田58を施す前の
様子を示す。端子金具５における溶着箇所52は溶着時に
約1000℃もの高温となる。抜き穴54はその熱が溶着箇所
52から半田付け箇所（より正確には半田付け予定箇所）
53へ波及するのを軽減する熱抵抗体として作用する。抜
き穴54は抜き穴54箇所の端子金具５断面積を狭くして熱
伝導を制限する。The role of the hole 54 will be described. FIG. 3 is used for this explanation, but this shows a state after the welding and before the solder 58 is applied. The welded portion 52 of the terminal fitting 5 has a high temperature of about 1000 ° C. during welding. The hole 54 has its heat welded
52 to the soldering point (more accurately, the planned soldering point)
Acts as a thermal resistor to reduce the spread to 53. The holes 54 reduce the cross-sectional area of the terminal fitting 5 at the holes 54 to limit heat conduction.
高温となる溶着箇所52における溶着後の低融点皮膜59
は、第３図のごとく原形を留めないほどに乱れる。低融
点皮膜59が溶融飛散して端子金具５の地肌が露出し、あ
るいは低融点皮膜59が薄くなり、あるいは溶けた低融点
皮膜59の残滓が溜まる。また、低融点皮膜59の酸化も進
む。Low melting point film 59 after welding at the welding point 52 where the temperature becomes high
Is so disturbed that the original shape is not retained as shown in FIG. The low melting point film 59 is melted and scattered to expose the background of the terminal fitting 5, or the low melting point film 59 becomes thin, or the residue of the melted low melting point film 59 is accumulated. Further, the oxidation of the low melting point film 59 also progresses.
これに対し、抜き穴54を越えた半田付け箇所53の方は、
抜き穴54の作用で相対的に低温に保持されるために、低
融点皮膜59がなお原形を保ち、酸化の程度も軽微とな
る。このため、半田付け箇所53に対するその後の半田付
けが良好となり、半田付け後における半田58を介してな
される端子金具５・配線用口出し線９間接続の信頼性が
向上する。On the other hand, the soldering point 53 beyond the hole 54 is
Since the hole 54 maintains the relatively low temperature, the low melting point film 59 still maintains its original shape, and the degree of oxidation is also slight. For this reason, the subsequent soldering to the soldering portion 53 becomes good, and the reliability of the connection between the terminal fitting 5 and the lead wire 9 for wiring made through the solder 58 after soldering is improved.
端子金具５における溶着箇所52・半田付け箇所53間の距
離を大きくすれば、半田付け箇所53の低温保持に有利と
なるが、それは端子金具５の大形化に繋がる。このた
め、その間に熱抵抗体として作用する抜き穴54を介在さ
せ、低温保持を実現する。Increasing the distance between the welded portion 52 and the soldered portion 53 in the terminal fitting 5 is advantageous for keeping the soldered portion 53 at a low temperature, but this leads to an increase in the size of the terminal fitting 5. Therefore, a low temperature holding is realized by interposing a through hole 54 acting as a thermal resistor therebetween.
抜き穴54は半田付け箇所53に形成される溶融半田（58）
の広がりを制限する役割も負う。抜き穴54の縁まで進ん
だ溶融半田（58）はそこで止まる。溶融半田（58）が抜
き穴54を越えず、あるいは抜き穴54へ落ち込まないの
は、溶融半田（58）に表面張力が作用するためである。
半田付け箇所53に形成される溶融半田（58）の広がりは
一方の抜き穴54と他方の半田留め55で制約され、そこで
盛り上がって固化し、配線口出し線９を強固に接続す
る。The holes 54 are the molten solder (58) formed at the soldering points 53.
Also plays a role in limiting the spread of. The molten solder (58) that has reached the edge of the hole 54 stops there. The reason why the molten solder (58) does not pass through the hole 54 or fall into the hole 54 is that surface tension acts on the molten solder (58).
The spread of the molten solder (58) formed at the soldering location 53 is restricted by the one hole 54 and the other soldering hole 55, and rises and solidifies there to firmly connect the wiring lead wire 9.
本発明は、低融点皮膜を形成した端子金具を用い、端子
金具における溶着箇所から離れた箇所に配線用口出し線
を半田付けし、端子金具における溶着箇所と半田付け箇
所との間に抜き穴を形成したものである。これによれ
ば、溶着時に溶着箇所で発生する熱が半田付け箇所へ伝
導し難くなる。The present invention uses a terminal fitting formed with a low melting point film, and solders a lead wire for wiring to a location apart from the welding location in the terminal fitting, and forms a hole between the welding location and the soldering location in the terminal fitting. It was formed. According to this, it becomes difficult for the heat generated at the welding portion during welding to be transferred to the soldering portion.
このため、半田付け箇所の温度が抑制され、そこでの低
融点皮膜の蒸発飛散が緩和される。したがって、半田付
け箇所（半田付け予定箇所）に対してなされる配線用口
出し線の半田接続の信頼性が向上する。Therefore, the temperature of the soldered portion is suppressed, and the evaporation and scattering of the low melting point film there is alleviated. Therefore, the reliability of the solder connection of the lead wire for wiring, which is made to the soldering location (scheduled soldering location), is improved.
第１図は本発明に係るコイル装置の要部断面図、第２図
は配線用口出し線接続前におけるその平面図、第３図は
その低融点皮膜の状況を説明する部分拡大断面図、第４
図はその端子金具を示す断面図、第５図は同端子金具の
平面図、第６図は従来のコイル装置を示す要部断面図、
第７図はその平面図である。 1:コイルボビン 12:鍔 14:端子台 3:コイル 31:端末線 5:端子金具 51:爪部 52:溶着箇所 53:半田付け箇所 54:抜き穴 55:半田留め 58:半田 59:低融点皮膜 9:配線用口出し線FIG. 1 is a cross-sectional view of an essential part of a coil device according to the present invention, FIG. 2 is a plan view thereof before connecting a lead wire for wiring, and FIG. Four
FIG. 5 is a sectional view showing the terminal fitting, FIG. 5 is a plan view of the terminal fitting, and FIG. 6 is a sectional view showing essential parts of a conventional coil device.
FIG. 7 is a plan view thereof. 1: Coil bobbin 12: Tsuba 14: Terminal block 3: Coil 31: Terminal wire 5: Terminal fitting 51: Claw part 52: Welding part 53: Soldering part 54: Drain hole 55: Soldering 58: Solder 59: Low melting point film 9: Lead wire for wiring
Claims (1)
2）にそのコイル軸方向に延在する端子台（14）を一体
に形成し、前記端子台（14）の片面に端子金具（５）を
載置し、前記端子金具（５）の表面に低融点皮膜（59）
を形成し、前記コイルボビン（１）に巻回されたコイル
（３）の端末線（31）を前記端子金具（５）に溶着し、
前記端子金具（５）における前記溶着箇所（52）から離
れた箇所に配線用口出し線（９）を半田付けし、前記端
子金具（５）における前記溶着箇所（52）と前記半田付
け箇所（53）との間に抜き穴（54）を形成したことを特
徴とするコイル装置。1. A collar (1) of a coil bobbin (1) made of synthetic resin.
The terminal block (14) extending in the axial direction of the coil is integrally formed in 2), the terminal fitting (5) is placed on one surface of the terminal block (14), and the terminal fitting (5) is placed on the surface of the terminal fitting (5). Low melting point film (59)
And the terminal wire (31) of the coil (3) wound around the coil bobbin (1) is welded to the terminal fitting (5),
A lead wire for wiring (9) is soldered to a portion of the terminal fitting (5) away from the welding location (52), and the welding location (52) and the soldering location (53) of the terminal fitting (5) are soldered. ), And a hole (54) is formed between the coil device and the coil device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61267650A JPH07118424B2 (en) | 1986-11-12 | 1986-11-12 | Coil device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61267650A JPH07118424B2 (en) | 1986-11-12 | 1986-11-12 | Coil device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63122206A JPS63122206A (en) | 1988-05-26 |
| JPH07118424B2 true JPH07118424B2 (en) | 1995-12-18 |
Family
ID=17447626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61267650A Expired - Lifetime JPH07118424B2 (en) | 1986-11-12 | 1986-11-12 | Coil device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07118424B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101981468B1 (en) * | 2017-05-12 | 2019-05-24 | 주식회사 모다이노칩 | Choke coil |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6086810A (en) * | 1983-10-19 | 1985-05-16 | Hitachi Lighting Ltd | Ballast for fluorescent lamp |
-
1986
- 1986-11-12 JP JP61267650A patent/JPH07118424B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63122206A (en) | 1988-05-26 |
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| JPS5996742A (en) | Soldering process |
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