JPH07116835A - Soldering iron - Google Patents

Abstract

(57) [Summary] [Purpose] When attaching chip parts to a board by hand,
The purpose is to attach the chip parts to the board by scissors soldering with the tips of two soldering irons and remove the parts. [Structure] Two soldering irons are screwed into the housing, the tips of the soldering irons are made thin like tweezers, and the soldering irons are arranged in parallel to hold chip parts. [Effect] By soldering the chip parts between them, the soldering and positioning of the parts can be shortened.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering iron suitable for manually mounting and removing chip parts (small parts having no lead wire) such as resistors and capacitors on a printed circuit board. Regarding

[0002]

2. Description of the Related Art As a known example of a soldering iron according to the prior art, there is a structure for simultaneously heating a plurality of electrodes as disclosed in JP-A-55-24726. It was not considered. Therefore, when soldering a chip component manually, first fix the chip component at a predetermined position on the printed board with an adhesive, and then use a soldering iron to solder the electrodes or tweezers. Then, a method of soldering the electrodes by a soldering iron with the other hand while holding the component at a predetermined position on the printed circuit board with one hand is used. Before soldering, the component is fixed so that the length of one side of the chip component is 1 to 3 mm, which is extremely small and lightweight, and the component itself cannot hold the mechanical position like the conventional lead component. , If not fixed,
This is because the position may move during soldering. However, in the former method, the time for fixing the adhesive of the component is increased and the waiting time for the adhesive curing occurs. Further, in the latter method, the soldering operation is performed with one hand, so that the solder cannot be supplied. Further, when the chip component is taken out from the printed circuit board, the solder in the electrode portion is melted with a soldering iron and then pulled up with tweezers. Further, in the case of a component having a plurality of electrodes, the workability is poor because the component cannot be removed unless the solder is melted at all the electrodes at the same time. There has been no conventional technique capable of moving and positioning parts by a soldering iron and further soldering.

[0003]

SUMMARY OF THE INVENTION It is an object of the present invention to improve workability when manually soldering a chip part or when removing a chip part from a printed circuit board.

[0004]

In the present invention, by devising the structure, a soldering iron structure having a mechanism for fixing parts and a mechanism for simultaneously heating a plurality of electrodes is adopted.

[0005]

[Function] During soldering, by making the soldering iron into a tweezers shape, it is possible to hold the component with the soldering iron and bring it onto the board. Therefore, the component case is moved and fixed onto the board and heated. You can do it in one operation. Therefore, the workability of soldering can be improved.

When a component is detached from the substrate, for example, in the case of a component having a plurality of electrodes, it is possible to simultaneously melt the solder of the electrode portion and hold the component and separate it from the substrate in one operation, so that workability is improved. can do.

[0007]

EXAMPLE FIG. 1 shows an example of the present invention. FIG. 1 is a side view of the embodiment, in which a soldering iron grip 3a is fixed by a housing 2. The other grip 3b has a movable structure around the fulcrum 1. A heater 6 is provided at the tip of both grips 3a and 3b through a heat insulating pipe 5, and a tip 7 is provided at the tip of the heater 6. As shown in FIG. 2, the power cord is connected to the heating element 11 in the heater 6 via the housing 2, the grip 3b, and the heat insulating pipe 5. The same applies to the other heater. The heating element 11 heats the tip 7 to melt the solder.
Further, the heat insulating pipe 5 prevents heat from being transmitted to the grip 3b. By providing the spring 4 between both soldering irons, the tip of the soldering iron can be kept open by about 0.5 to 3 cm, so that workability can be further improved. With this structure, it looks like a tweezer-like soldering iron. When soldering is performed, as shown in FIG. 3, the chip component 12 is sandwiched between two tips and pressed against the electrode portion 13 on the printed board 14. At this time, the electrode portion of the chip component 12 and the electrode portion 13 of the printed circuit board are heated to melt the solder, and the land 13 of the printed circuit board 14 of the chip component 12 is connected by the solder. After that, by loosening the gripping force of the grip, the tip is separated by the chip component. This completes the soldering iron. Since the soldering iron can be operated with one hand, the solder can be easily supplied with the other hand. Further, when the chip component 12 is removed from the printed circuit board 14, the melting of the solder and the operation of pinching the component can be performed only by the soldering iron according to the present invention. Compared to this, workability is greatly improved. FIG. 4 shows a structure in which a pipe is provided in the central portion of the soldering iron shown in FIG. The parts are fixed first. The spring 15 has a function to release an excessive force by the spring when the parts are held down by assuming various heights of the parts. The present embodiment is advantageous when the chip component is soldered to a predetermined place on the printed circuit board and when the chip component is not heated because the chip component is not heated.

[0008]

According to the prior art, it took the same time to fix and solder the parts, but according to the present invention, the parts can be moved, fixed and soldered in one operation, so the time required can be halved. .

[Brief description of drawings]

FIG. 1 is a side view of a soldering iron according to an embodiment of the present invention.

FIG. 2 is an enlarged view of a soldering iron tip joint portion and a heater portion of FIG.

FIG. 3 is a diagram in which the soldering iron of FIG. 1 is attached to a substrate.

FIG. 4 is a side view of the soldering iron of FIG. 1 having a suction device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Support point, 2 ... Housing, 3a ... Fixing grip, 3b ... Movable grip, 4 ... Spring, 5 ... Insulating pipe, 6 ... Heater, 7 ... Tip, 8 ... Power cord, 9 ... Nichrome wire, 10 ... Grip joint, 11 ... Heater, 12 ... Parts, 13 ... Land, 14 ... Board, 15 ... Height adjustment spring, 16 ... Pipe, 17 ... Suction pump, 18 ... Foot switch.

Claims (3)

[Claims] 1. A soldering iron, characterized in that two soldering irons are mechanically coupled to each other through one fulcrum, and at least one of the soldering irons can rotate about the fulcrum. 2. The soldering iron according to claim 1, wherein a spring is inserted between the two soldering irons. 3. The soldering iron according to claim 1, further comprising a pipe connected to the pressure reducing device between the two iron tips.