JPH07104891A - High-performance equipment - Google Patents

Abstract

(57) [Summary] (Modified) [Objective] The present invention relates to a high-performance terminal, and
It has expandability such as a configuration that can expand the hardware and enhance the function, expand the support of the device, and realize the connection of the hard disk with an external cable so that the configuration according to the usage form can be taken. The device is provided. [Structure] The basic structure of a high-performance terminal is a base board, an expansion PL and an option board size BIO board, and a 3.5 "device mounting part is provided for device expansion. A 5 "device mounting portion is prepared, a built-in hard disk is made into a unit, and an external cable is provided so that the unitized device can be arbitrarily reconfigured from the outside. [Effect] By adopting the above structure, it is possible to easily enhance the function with the same configuration method, it is highly expandable in device selection, and it is also possible to improve maintainability and assembly by unitizing each part. it can.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure of an information processing apparatus having a device system such as an HDD and an FPDD, a package of a memory, a processor module, etc., a power supply, a cooling fan, etc., and a casing of the information processing apparatus. The present invention relates to a housing structure of an information processing apparatus, which is formed into a shape and includes a front panel that forms a front surface and a main body housing that forms a rear portion. Further, it particularly relates to a cooling structure in the information processing apparatus.

[0002]

2. Description of the Related Art Conventionally, as a technique for cooling an information processing apparatus, for example, as disclosed in Japanese Patent Application Laid-Open No. 2-82693, there is provided an intake fan and an exhaust fan for circulating air in and out of a housing, It has been practiced to provide a partition wall so as to separate the flow of air and to make the cooling path multi-channel to improve the cooling efficiency. In addition, a technique of increasing the dust-proof property and cooling efficiency by using a double structure of the housing is disclosed in Japanese Patent Laid-Open No.
-108800 publication. Further, regarding the front panel, switches and devices are generally formed by a small window and opened to the front. Also,
The replacement of the device is changed with the device of the same size, and when adding the device, it is general that the device is formed in a different casing.

[0003]

SUMMARY OF THE INVENTION In the above conventional technique,
The influence of the temperature rise due to the heat generation distribution of the heating element, the noise increase due to the position of the cooling fan, and the complexity of the flow path due to the high-density mounting of the case became a problem. , The low noise structure of the entire case was not a heavy sentence.

The present invention provides a substrate having a heating element such as an IC chip and an LSI package, a hard disk, a device,
The purpose of the invention is to improve the cooling performance and reduce noise of an electronic device equipped with a power source and the like.

Further, if a switch or a small panel of devices is provided on the front panel, it becomes difficult to develop the design and a large number of molds are required, which causes a high cost.

An object of the present invention is to provide a housing structure of an electronic device which allows various design developments and is easy to operate.

[0007]

In order to achieve the above object, a structure in which a flow path of a housing is divided, a cooling fan is provided between heating elements, and a cooling flow path outlet is installed below It is what

Further, the high heat generating portion is provided with a local cooling fan for local cooling, or the cooling fan is inclined and mounted.

Further, the cooling air flowing out from the cross flow fan is mounted so as to be directly applied to the power source.

An exhaust port is provided at the bottom of the electronic device, and a punching material having a diameter of 2 mm is provided at the exhaust port.

Further, in order to achieve the above object, the present invention has a structure in which a front panel can be opened and closed, or a laterally slidable panel is provided in the front panel.

[0012]

The temperature rise in the case can be reduced by dividing the flow path of the case, providing a cooling fan between the heating elements, and providing the cooling flow path outlet at the bottom.
The temperature distribution of the heating element can be made uniform, which is effective in reducing the noise of the entire housing.

Further, by providing a local cooling fan for local cooling in the high heat generating portion or mounting the cooling fan at an angle, it is possible to supply effective cooling air, and thus the IC chip, the LSI.
Substrate having a heating element such as a package, hard disk,
This is effective in satisfying the reliability of devices, power supplies, etc.

Further, by mounting the cooling air flowing out from the cross flow fan so as to directly hit the power source, effective cooling air can be supplied.

Further, the exhaust port is provided at the bottom of the electronic device, and the exhaust port is provided with a punching material having a diameter of 2 mm.
It is possible to discharge from the entire exhaust port of the electronic device, reduce the exhaust wind speed, eliminate the collision noise on the floor, and reduce noise.

Further, by providing an opening / closing panel on the front panel, allowing the front panel to be opened / closed, and being removable from the housing, operability, maintainability, expandability, etc. can be facilitated.

[0017]

EXAMPLES Examples of the present invention will be shown below.

1. Overall Configuration 1.1 System Configuration Diagram (Block Diagram) FIG. 1 shows a system outline of a computer which is an embodiment of the present invention. This system unit comprises a high-speed RISC (Restore Instruction Set Computer) processor module 1 with a cache memory, a large-capacity MS (main memory) 2 for processing programs and data, and an ISDL (Initial System Diagnostic). A stick and loader (ROM) 3 (read-on memory) is connected through a system bus 4 for connecting various peripheral control units and a memory / bus control unit 5. The system bus 4 is an HDD.
(Hard disk drive) 6, FPDD (floptical disk drive) 7, CMT (cassette magnetic tape)
Device 8 and DAT (digital audio tape) device 9 and other SCSI devices, RS-232C device 10, LA
N (local area network) 11, audio equipment 12, uninterruptible power supply 13, and BIO that collectively controls various controllers that connect and control the Centronics 14.
(Basic I / O connection) 15, display 16, display, keyboard 17, and GC for controlling connection of mouse 18
Equipped with (graphic control) 10, FDD (floppy disk drive) adapter, image
It has the expandability to connect and control various adapters such as J Scanner scanner adapter.

FIG. 2 shows an outline of the logical configuration of the system. On the main BASE board 21, RISC processor module 1, MS board 22, BIO board 15, G
SC80 (system control) which mounts each board of the C board 23 and further controls the processor bus 24, the memory bus 25, the ISDL ROM 3, and the system bus 4
26 is implemented. RISC processor module 1
Is composed of a high-speed RISC chip 27 and a large capacity cache memory 28 and is connected to a processor bus 24 of 4 bytes / 66.6 MHz. The MS board 22 can be mounted in a maximum of 6 slots in a set of two, and is connected to the memory bus of 8 bytes / 33.3 MHz together with the ISDL ROM3. Various I
The BIO board 15 that controls / O is 4 bytes / 33.3.
Connected to the MHz system bus 14 and connected to the GC board 2
3. Other optional adapters can be connected.

1.2 External View FIGS . 3 to 5 are external views of a computer 31 which is an embodiment of the present invention. FIG. 3 is a perspective view of the computer 31, which has a front panel 32 on the front and a display LED 33 on the front panel 32.
There is a system operation display. The front panel 32 has an opening / closing panel 34 that can be opened and closed. Further, a skirt 35 that can be separated from the front and the rear and is removable, a caster 36 and a cable cover 37 on the back surface, both side plates 38 on both side surfaces, and a top plate 39 on the upper surface are provided on the bottom portion. On both side plates 38,
There is an air supply port 3A. The skirt 35 has a stopper 3B on the rear side for not blocking the air supply port of the computer 31.
FIG. 4 shows a rear view of the computer 31. The cable cover 37 has an air supply port 3C.

FIG. 5 is a rear view of the computer 31 with the cable cover 37 removed. External SCSI on the back
Connector 41, input connector 42, service outlet 43, HDD cooling air supply port 44, RISC processor module cooling air supply port 45, SCSI1 connector 46, SCSI2 connector 47, LAN connector 48,
UPS connector 49, PR connector 4A, RS-232
There are a C connector 4B, an audio connector 4C, and a termination connector 4D.

FIG. 6 is a perspective view showing a state in which the open / close panel 34 of the front panel 32 of the computer 31 of FIG. 3 is slid sideways to the center of the housing 51 and opened. The power switch (ON) 52, the power switch (OFF) 53, the FPDD 7, and the DAT 9 are on the front side in the open state. By opening and closing the open / close panel 34, it is possible to access the computer 31. Further, when the device of the computer 31 is not accessed, the opening / closing panel 34 is closed to protect the device from dust.

FIG. 7 is a computer 31 showing another embodiment according to the present invention, and FIG. 7 is an external view of the computer 31 with the front panel 32 removed. A hinge 61 is provided above and below the end of the casing 51 of the computer 31, and the front panel 32 is attached by hooking on the hinge 61 and opened 90 degrees to the casing 51. In addition, at the position of 90 degrees, the front panel 32 has the housing 5
It has a structure that can be removed by pulling it out in the upper direction.
The front panel 32 can be fixed to the housing 51 with a latch 62. Even when the front panel 32 is open to the front, the power switch (ON) 52, the power switch (OFF) 53, the FPDD 7 and the DAT 9 can be operated, and the display LED 33 can be confirmed. The main switch 63,
There is a maintenance display LED 64 and a reset switch 65. By opening the front panel 32, the operation of these switches and the LED can be confirmed. In addition,
In this embodiment, the FPDD 7 and the DAT 9 are used and the 3.5 makeup panel 66 and the 5 makeup panel 67 are used. However, for example, when the device is changed, the front panel 32 is not changed and the makeup is changed. By changing the panels 66 and 67, it has a structure that can be made into a series corresponding to various functions.

1.3 Mounting Structure FIGS. 8 to 9 show a computer 31 which is an embodiment of the present invention.
The mounting structure of is shown.

FIG. 8 is a perspective view of the computer 31 as seen from the back side. FIG. 9 is a perspective view showing the front of the computer 31. As shown in FIG. 8, a BASE board 21, which is a main board, is mounted in the center of the inside of the computer 31. The GC board 23, the BIO board 15, the RISC processor module 1, and the audio board 72 are BASE from the direction perpendicular to the BASE board 21.
It is mounted on the board 21. Further, the option board 73 can be mounted on the BASE board 21 with a maximum of 5 slots. In addition, the MS board 22 is mounted as one slot in a set of two and has a maximum of 6 slots (total of 1 slot).
(2 sheets) It can be mounted on the BASE board 21.
Also, from the upper side in the horizontal direction with respect to the BASE board 21,
An expansion platter 74 is mounted, and an option board 73 is mounted in two slots on the expansion platter 74. Also, by replacing the expansion platter 74, EISA
Slots can be used. FIG. 10 shows an enlarged view of the mounting diagram of the RISC processor module 1. BAS
A guide 75 for mounting the RISC processor module 1 is mounted on the E-board 21. By adding the RISC processor module 1 to this guide, the RISC processor module 1 can be reliably mounted on the connector 21 on the BASE board.

FIG. 11 is a diagram showing a method of fixing the RISC processor module 1. In order to fix the RISC processor module 1 mounted on the BASE board 21, a fixing part 77 is incorporated in the BIO bracket 78. The fixing component 77 has a recessed portion, and the RISC processor module 1 is fixed by fitting a part of the substrate of the RISC processor module 1 in the recessed portion (see FIG. 12). In order to cool the RISC processor module 1, which particularly generates heat, an axial fan 79 having an outer dimension of 60 × 60 × 25 mm is mounted. A power source 7A is mounted on the lower right of the rear surface. From FIG. 9, up to four HDD units 7B can be mounted. Also, 3.5 device bracket 7C and 5 device bracket 7D that can mount both 3.5-inch and 5-inch devices
Is installed. A cooling fan unit 7E for cooling all the mounted components of the computer 31 is mounted on the lower right of the front surface. A caster is provided on the bottom surface of the computer 31.
36 and a skirt 35, and a punching material 71 having a diameter of about 2 mm is provided in the exhaust portion of the computer 31.

1.3.1 Cooling and Noise FIGS. 13 to 17 show the cooling air flow path structure of the computer 31 of this embodiment.

The flow channel structure of this embodiment is divided into a device side and a package side. First, the route of the cooling air passing through the device side will be described (see FIG. 15). The cooling air passing through the device side enters from the air supply port 3C of the cable cover 37 on the rear surface of the device and the air supply port 3A behind the side plate on the right side of the device. This air supply port is opened in consideration of the heat generation amount and the upper limit temperature of each device.

For example, the HDD 6 side is 100 W, FPDD
7. If the DAT9 side is 75W and the upper limit temperature of all devices is the same, the ratio of the opening area of this air supply port is
4: 3. The absolute value of the opening area is obtained from the static pressure-air volume relationship of the main fan used this time. Further, the former is an H provided on the rear frame for each HDD.
It flows in from the DD cooling port 44 and horizontally passes between the 3.5-inch HDDs 6. And HDD6 mounting part and FPDD
7. After flowing through the clearance of the DAT 9 mounting portion to the lower side of the housing, it is sucked by the cross flow fan 81. In the latter case, the device cover 8 provided inside the side plate
The cooling air flows to the vicinity of the front surface of the housing through the second opening 82A, and is blown to the FPDD 7, DAT 9, etc. from this opening (see FIG. 13). Then, as in the former case, the HDD
The cooling air in the former case merges with the clearances between the 6 mounting portion and the FPDD 7 and DAT 9 mounting portions, flows downward in the vertical direction of the housing, and is then sucked by the cross flow fan 81. As in the above example, the air volume is distributed by the opening area (flow passage cross-sectional area) of the air supply port, the opening and the like. Further, the route of the cooling air on the package side will be described (see FIG. 16). Similar to the device side, the cooling air on the package side flows in from the air supply port 3C of the cable cover 37 on the rear surface of the device and the air supply port 3A behind the side plate on the left side of the device. In the former case, the cooling air flows in from the air supply port 45 for cooling the RISC processor on the rear frame, flows in parallel in the space formed by the BIO board 15 and the partition wall 70 toward the front of the device, and the RISC processor module 1 , MS board 22, and BASE board 21. An axial flow fan 79 for local cooling is provided on the upstream side of the RISC processor module 1 to supply high-speed cooling air to the RISC processor module 1 having high heat generation.

The axial fan 79 is mounted at an angle of 20 degrees with respect to the vertical direction. This is RIS
Since the C processor module 1 generates a large amount of heat and is the heart of the computer 31, high reliability is required, and therefore it is necessary to improve the cooling performance.
That is, by mounting the axial fan 79 while tilting it, the radiation fins 8 on the RISC processor module 1 are mounted.
3. Cooling air can be collided with the memory surface 84,
The heat transfer from the heat radiation fins 83 and the memory surface 84 to the air can be improved. As a result, the RISC processor module 1 can be compared with the conventional case where the axial fan 79 is not tilted.
The temperature can be reduced and reliability can be secured. In addition, the cooling air that has flowed in from the side surface plate on the left side of the housing receives the BIO board 1 from the opening 85A of the package duct cover 85.
It flows into the option board 72 part above 5 (see FIG.
4), flowing horizontally toward the front of the device. The cooling air that has flowed in from the rear port of the device and the cooling air that has flowed in from the side plate on the left side of the device merge at the front of the device, and then the ventilation provided in the partition wall (central frame) that separates the inside of the device into the device part and the package Flow through the ports 68, 69 from the package portion on the left side of the device to the device portion on the right side of the device.
The cooling air that has passed through the ventilation port 69 is sucked into the cross flow fan 81 as it is.

Further, the cooling air having passed through the ventilation port 68 merges with the cooling air of the device section described above, and the FPDD7, DAT9
After passing through the clearances between the HDD 6 mounting portion and the FPDD 7 and DAT 9 mounting portions to the lower side of the housing, the air is sucked by the cross flow fan 81.

As in the case of the device section, the air volume is distributed by the opening area (flow passage cross-sectional area) of the air supply port, the opening and the like.
After the cross flow fan 81 flows out, it flows horizontally along the board of the power supply 7A, passes through the punching material 71 with a diameter of 2 mm installed on the floor surface, passes through the skirt 35 at the bottom of the housing, and goes outside the computer 31. It is released (see Figure 17). The cooling air flows through the device section and the package section in parallel with the respective heat generating elements, so that the pressure loss in the flow path can be reduced and the cooling capacity of the cross flow fan 81 can be maximized. In addition, by increasing the length of the air flow passage, it is difficult to transmit noise flowing out of the cross flow fan 81 to the outside of the housing, and noise can be reduced. Further, the cooling air is joined by making good use of the characteristic of the cross flow fan 81 that the cooling air can be uniformly sucked into the blades. That is, effective use of the cooling air can be easily performed.

Since the velocity of the cooling air after flowing out of the cross flow fan 81 is high and the width of the blades is almost uniform, the heat transfer coefficient in the power source portion of the high heat generating element is increased, and the reliability of the power source is increased. Can be secured. Also, punching material 7
By placing 1 on the floor surface, dust contained in the cooling air,
Dust or the like is less likely to be discharged to the outside of the computer 31, the wind velocity distribution when flowing out to the floor surface can be made uniform, and the collision noise of the cooling wind on the floor surface can be reduced. Further, by providing the skirt 35, the sound generated when the floor surface is collided and the sound generated by the cross flow fan 81 are generated by the computer 31.
Make it difficult to release to the outside.

1.3.2 EISA conversion structure FIG. 18 shows an EI in a computer 31 which is an embodiment of the present invention.
Expansion platter 91 for EISA that can use SA slot
The mounting structure figure which mounts is shown. From the direction perpendicular to the BASE board 21, the EISA conversion board 92 is BASE
It is mounted on the board 21. By mounting the EISA conversion board 92 on the BASE board 21, the GC board can be installed.
The board 23 is lowered by one slot, and the option board 73 can be mounted in a maximum of 4 slots. The EISA expansion platter 91 is joined by the connector 93 on the EISA expansion platter 91 and the connector 94 on the BASE board 21. In order to use the EISA expansion platter 91 as an EISA slot, the synchronous bus on the BASE board 21 is converted by the EISA conversion board 92, and the EIS is converted.
The A conversion board 92 is connected to the EISA expansion platter 91 by a connection cable connector 95. EISA
A slot panel 96 is attached to the expansion platter 91 for EIS.
After converting to A slot panel 97, EISA board
One card 98 can be mounted.

FIG. 19 shows a computer which is an embodiment of the present invention.
A conversion structure for mounting the EISA on the data 31 is shown. The expansion platter 74 mounted on the computer 31 is
It can be removed by removing the stopped screw and pulling it up in the direction opposite to the arrow. EI
When mounting the SA expansion platter 91, guide 99
Insert it in the direction of the arrow while aligning it with the connector 93 on the EISA expansion platter 91 and the BASE board 21.
The upper connector 94 is joined and screwed. See also EI
To replace the SA slot panel 97, the fixed screw is removed, the slot panel 96 is removed, and the EISA slot panel 97 is attached to this position and screwed. The above process is a conversion structure unique to the platter section and the slot section without removing the mounted product of the computer 31, such as the BASE board 21, which leads to improvement of workability at the time of replacement. .

2. Partial configuration 2.1 Package part 2.1.1 BASE board The RISC processor module 1 is mounted and the clock circuit 101 for determining the performance ratio is provided, and the clock frequency can be switched by the DIP-SW. Is a circuit for meeting the requirement of performance UP after user delivery. The structure is a slot 10 for a synchronous bus, which is intended for high-speed bus.
2 has a maximum of 5 slots, and the conventional compatible asynchronous bus slot 103 has a maximum of 5 slots, so that both option boards 73 can be mounted. By adopting this configuration, it is possible to use the option board 73 from the conventional model, and to provide a device having future expandability for speeding up. In addition, the slot 10 for MS board
4 is provided for 6 slots and the MS boards 22 having different capacities are mounted, so that an inexpensive structure having a small memory capacity can be taken as an expensive structure having a large capacity. In addition,
Currently, 8MB, 16MB, 32 per slot (2)
MB, 64 MB, and 128 MB configurations are possible. In addition, the RS-232C (4B), which is a general-purpose I / O interface from the BASE board, is provided for four ports, and eight connectors for supplying DC power to the built-in device are provided. Furthermore, the audio board 72 for audio
Is provided as a base function.

2.1.2 Expansion Platter The BASE board 21 is provided with an asynchronous bus compatible with the prior art, but is provided with an expansion platter 74 for the purpose of expanding two slots by expanding the options.

By this, the function can be improved and
Further, by replacing the expansion platter 74, it is possible to provide a device that can be used as an EISA slot and further improve the function. To provide it as an EISA slot, it is realized by converting the synchronous bus on the BASE board 21 into an EISA bus by a bus conversion circuit (conversion board) and connecting it. With this configuration, different option interface slots with the same structure can be provided with the same idea.

2.1.3 BIO board The basic logic part is the BASE board 21 and BASE of the CPU part.
It consists of the BIO15 board of the IC I / O bus section. The BIO board 15 is a board whose main function is to control various I / O interfaces as shown in FIG. The feature of this time is that by implementing the BIO board 15 in the option board size, it is easy to give optional expandability even though it is a basic part. For example, the current single-ended type SC
2 SI interface circuits are provided, but in the future 1 circuit single-end type and another 1 circuit will provide WIDE type SCSI interface, enabling future expandability. It is a method to do. The mounting position of the BIO board 15 is located in the synchronous bus slot 105 of the CPU board shown in FIG. 21, and can be structurally treated as the same as the option board 73. 2.2 Device section FIG. 28 is a computer 31 that is an embodiment of the present invention.
3 is a detailed view of the device part of FIG. FIG. 22 is a mounting diagram of the device unit. FIG. 23 shows a partial sectional view of FIG. The device is screwed to the 3.5 device bracket 7C with the HD bush 110. When the device is screwed with the HD bush 110 sandwiched, the housing 51
And have an insulated structure.

FIG. 24 is a diagram in which the device is housed in the 3.5 device bracket 7C and mounted in the housing 51.
3.5 device bracket 7C is 3.5 decorative panel 66
At the same time, the front cover 111 of the housing 51 is screwed together. 3.5 Device bracket 7C for housing 5
By screwing to 1
By absorbing with 1, the damage to other devices due to vibration can be prevented. In addition, the 3.5 device bracket 7C has an air supply port 112 necessary for cooling the device. 25 to 28 show a state where the device is mounted on the 5-device bracket 7D. FIG. 25 shows 3.
It is a figure which mounted three 5-inch type | system | group devices horizontally in 5 device bracket 7D. In addition, FIG. 26 shows the full height of a 5-inch device with a 5-device bracket 7D.
FIG.

FIG. 27 is a view in which 3.5-inch and 5-inch devices (half height) are mounted vertically on a 5-device bracket 7D.

FIG. 28 is a diagram in which two 5-inch devices (half height) are vertically mounted on the 5-device bracket 7D. By using the 5 device bracket 7D, up to 3 3.5-inch devices can be laterally mounted.
Up to two 5-inch devices can be mounted vertically (up to two (half height)). The 3.5-device bracket 7C can also mount up to two 3.5-inch devices laterally. By vertically mounting the 5-inch device, the size of the housing 51 in the horizontal direction can be minimized. The 5 decorative panel 67 also has a structure in which only the panel with the device hole changed is replaced according to the mounting form of the device. By providing each decorative panel, the cooling structure of the housing 51 is optimized and foreign matter is prevented from entering the inside of the housing.

2.3 HDD unit 2.3.1 HDD unit structure FIG. 29 is a right side view of the HDD unit, FIG. 30 is a bottom view,
FIG. 31 shows a rear view. 32 is a perspective view showing the procedure for removing the HDD of the HDD unit.

The HDD unit 7B is composed of HDD6 and HDD.
Bracket 113, HDD signal cable 116, HDD
It is composed of a power supply cable 117. HDD6 is H
It is fixed to the DD bracket 113 with a screw. Two external SCSI connector 41 of HDD signal cable 116
Is the signal connector panel surface 1 of the HDD bracket 113.
15 is fixed with a screw, and the internal connector 118 is HD
Connected to D.

One connector of the HDD power supply cable 117 is fixed in a power supply connector panel 119 which is vertically formed from the bottom surface of the HDD bracket 113, and the other connector is connected to the HDD 6. The HDD power feeding cable 117 fixed to the power feeding connector panel 119 is connected to the HDD power feeding relay cable 120.
Is connected, and the other of the HDD power feeding relay cables is BASE.
It is connected to the board 21 and supplies power to the HDD 6. H
The DD bracket 113 is made of metal such as iron and has a thickness of about 1 mm. The HDD bracket 113 is formed so as to surround a part of the HDD right side surface 121, the HDD bottom surface 122, and the HDD upper surface 123. Except for the part where the HDD bottom 122 and the HDD bracket 113 are fixed with screws,
A space is provided between the HDD 6 and the HDD bracket 113. Especially HDD bottom 122 and HDD bracket 113
The space with the bottom is larger than the others. On the bottom surface of the HDD bracket 113, a ventilation hole 124 is provided at a position on the downstream side on the cooling flow path. Further, the HDD bracket 113 has two tabs 126 formed by bending a metal plate vertically downward from the horizontal portion of the HDD bracket 113 where the HDD left side 125 side of the HDD 6 is screwed. The outside of the bent portion 127 of the claw 126 is rounded on a circular arc, and the radius of the circular arc is about 1 mm. Also, the HDD bracket 1 on the left side 125 of the HDD
The screwing portion of 13 has a horizontal cutout hole 128A, and on the HDD right side surface 121 side, it is a vertical combination hole 128B of a screw head relief hole and a continuous horizontal cutout hole. Cage, loosen the screw HD
By sliding D6 to the HDD left side 125 side, the HDD 6 can be removed without removing the screws.
Next, the structure of the HDD unit 7B mounting portion of the housing will be described. 33 is a perspective view of the HDD unit mounting portion, FIG. 34 is a perspective view of the HDD duct panel, and FIG. 35 is a cross-sectional view showing a fixing structure of the HDD unit.

The HDD unit mounting portion is an L-shaped HDD frame 129, a central frame 130, and a ceiling frame 13.
1, the rear frame 132, and the HDD duct panel 133. The HDD unit 7B is horizontally mounted in the HDD unit mounting portion in four stages, one for each stage. The bottommost HDD unit is supported from below by the bottom surface of the HDD frame 129, and the second and higher HDD units are
It is supported from below by HDD guides 134 and 135 that are horizontally formed from the HDD frame and the back frame toward the inside of the HDD unit mounting portion. The central frame 130 has the claws 1 of the HDD bracket 113.
Square holes 136 are provided at positions corresponding to 26 parts. The square hole 136 is provided at a position where the upper side of the square hole is about 0.3 mm lower than the upper surface of the horizontal portion of the claw 126 of the HDD bracket 113. The HDD unit 7B includes the claw 126 of the HDD bracket 113 and the square hole 13 of the central frame 130.
It is fixed to the housing by fitting with 6 and screwing the right side surface of the HDD bracket 113. Square hole 1 as above
The upper side of 36 is lower than the upper surface of the horizontal portion of the claw 126 of the HDD bracket 113, but when the HDD unit 7B is screwed to the housing, the roundness of the bend of the claw 126 serves as a guide. The part is pressed into the square hole 136. On the rear frame 132, at the position corresponding to the external SCSI connector 41 of the HDD unit 7B, H
HDD connector window 137 and H for connecting the DD external cable
A DD cooling air supply port 44 is provided. The daisy chain connection of the HDD is made by connecting the external S from the HDD connector window 137.
This is performed by connecting the CSI cable 41 to the HDD unit 7B. The HDD frame 129 has a connector hole 138 and a ventilation hole 139 for connecting the HDD power feeding relay cable 120 to the HDD unit 7B. The HDD duct panel 133 is fixed in parallel to the ceiling frame 131 with a rivet or the like in a space. HDD duct panel 1
33 has a ventilation hole 140 having the same area as the ventilation hole 124 of the HDD bracket 113 on the downstream side of cooling. Based on the above, each HDD has an external SCSI connector and the HDD and the external SCSI connector are unitized, so HDDs with interface specifications such as WIDECSI that have different external connection connectors can also be replaced in units. It can be installed in a computer. Further, it is possible to mount HDDs having two or more types of interface specifications in the same housing.

Therefore, a highly expandable device can be provided. Further, since the HDD bracket 113 is provided for each HDD, vibration during operation of the HDD is less likely to be transmitted to other HDDs, and the reliability of the device is improved. Further, in the mounting structure of the HDD unit 7B, the claw 1 of the HDD bracket 113 is
Since the claw 126 is press-fitted into the square hole 136 of the central frame 130 located at a position lower than the upper surface of the horizontal portion of the 26 part by the tightening force of the screw, the HDD unit can be fixed without any play. The claw 126 portion is bent vertically downward and fits into the square hole 136 by the plate thickness of the claw 126 portion, and the claw does not project to the package side, thus saving mounting space.

2.3.2 HDD cooling structure FIG. 36 shows a sectional view of the HDD mounting portion. When the HDD unit is mounted in the housing, an independent cooling duct 141 is formed for each HDD. That is, the cooling duct 141 is
It is a space surrounded by the central frame 130 and the HDD bracket 113.
Bottom surface of the cooling duct 141 constitutes the ceiling surface of the cooling duct 141, and in the uppermost HDD, the HDD duct panel 133 has the cooling duct 1
It constitutes the ceiling surface of 41. The size of the cooling duct is, for example, about 6 × 100 mm ^{2 on} the upper surface of the HDD 6, about 10 × 30 mm ^{2 on} the side surface of the HDD 6, and about 40 × on the bottom surface of the HDD 6.
80 mm ² and the flow passage area on the HDD bottom side is the HDD top side,
It is more than twice the total of the flow passage area on the side surface side. Further, the bottom surface of the HDD bracket 113, which is the ceiling surface of the cooling duct, and the HDD duct panel 133 are provided with the ventilation holes 124 and 140 on the downstream side of the cooling flow path as described above. The areas of the ventilation holes 124 and 140 are substantially the same as the flow path area on the HDD bottom side. FIG. 37 shows the flow of cooling air in the HDD unit mounting portion. The cooling air is
Each HDD from each HDD cooling air supply port 44 on the system 132
Flows into the cooling duct of. In the cooling duct, HDD
Cooling air flows horizontally toward the front of the device along the top, bottom and side surfaces of the HDD, and the ventilation holes 139 on the HDD frame 129.
After passing through, it flows vertically below the casing and is sucked into the cross flow fan. The HDD cooling air supply port 44 on the rear frame 132 is located at a position corresponding to the upper portion of the cooling duct.

On the rear frame side under the cooling duct, the HDD signal cable 116 of the HDD unit 7B,
The HDD power supply cable 117 is provided, and as a result, the flow passage area of the inlet where cooling air flows into the HDD bottom side is reduced. With the above structure, first, the vent hole 139 on the outlet side of the cooling duct, that is, on the HDD frame 129.
The cooling air suction force of the cross flow fan that acts on the HDD has a large effect on the flow path on the HDD bottom side having a large flow path cross-sectional area.
Here, at the inlet of the flow path on the HDD bottom side, the flow path inlet area is narrow due to the cable inside the HDD unit, and it is difficult for cooling air to flow. On the other hand, the bottom of the cooling duct, that is, H
On the bottom surface of the DD bracket 113, there is a ventilation hole 124 having substantially the same area as the flow path cross-sectional area on the HDD bottom surface side. Therefore H
The suction force of the cross flow fan acting on the flow path on the bottom side of the DD acts on the flow path above the HDD one step below, and most of the cooling air flows through the flow path above the HDD. Moreover, the upper part of the HDD is
Since the cross-sectional area of the flow path is narrow, the wind speed of the cooling air becomes high. Furthermore, the cooling air sucked up from the flow path one step below the HDD
The cooling air is used to cool the bottom surface, which allows the entire surface of the HDD to be cooled. This is because the HDD 6 has an operating temperature condition such that the surface temperature of the HDD bottom surface 122 is about 75, for example.
Since the surface temperature of the HDD upper surface 123 is 55 ° C. or lower and the upper surface cooling condition is severe, it is necessary to improve the cooling performance of the HDD upper surface 123. That is, H
By increasing the wind speed of the cooling air on the upper part of the DD, the heat transfer coefficient from the upper part of the HDD to the air is improved, whereby the temperature of the upper surface of the HDD can be reduced and the reliability of the HDD can be secured.

In the uppermost HDD, the suction force of the cross-flow fan acting on the flow path in the HDD duct panel 133 acts on the ventilation holes 140 on the HDD duct panel 133, and like the lower HDD, The cooling air on the upper surface of the HDD flows at high speed. In the bottom HDD, the ventilation hole 124 on the bottom surface of the HDD bracket is
Blocked by 9. Therefore, there is no possibility that the suction force of the fan is directly applied to the flow path on the bottom surface of the lowermost HDD and the wasteful cooling air flows.

2.3.3 HDD connection method FIGS. 38 to 39 show a plurality of HDDs built in the computer 31.
The DD unit 103 part is shown. The HDD unit 103 has two external SCSI connectors 41,
The I1 cable 105 enables connection with each HDD unit 103 and each SCSI port 104.

FIG. 38 shows a state in which a plurality of HDD unit sections are daisy-chained to the same built-in SCSI port, and FIG. 39 shows each HDD unit section has a different built-in SCSI port.
The state where the daisy chain is connected to the port is shown. Figure 3
As shown in FIG. 8 and FIG. 39, the constitution can be easily changed by changing the connection of the external SCSI cable without changing the mounting of each built-in HDD unit.

2.4 Power Supply Mounting Structure FIG. 40 shows a configuration diagram of the power supply 7A of the computer 31 which is an embodiment of the present invention. 41 is a plan view of the power supply frame 150, and FIG. 42 is a right side view of the power supply frame 150. The power supply frame 150 is formed by bending one aluminum plate to stop the mating surface. From FIG. 42, the cutout portion 1
The input connector 42 in FIG. 40 is fitted into 51,
It is screwed. The notch portion 152 is fitted with the service outlet 43 for supplying power at the time of expansion by press fitting. From FIG. 41, the cut-and-raised part 153 is provided with a hole for attaching the power supply 7A to the housing 51 of the computer 31. FIG. 40 shows a configuration diagram of the power supply 7A. FIG. 43 shows an assembly diagram in which the input connector 42 mounted on the power supply 7A, the service outlet 43, the electric wire 154, and the power supply cable connector 155 are connected.

This FIG. 43 is used as an input section. Conventionally, when there is an input connector and a service outlet that are press-fitted into the input section, when incorporating them into a power source, they are often attached to a separate component and then incorporated into the power source. This time power supply 7
In A, the power supply frame 150 is provided with the cutout portion 151 and the cutout portion 152, so that the input portion can be directly incorporated into the power supply. AC / DC unit 1
56 is supplied by a power cable connector 155. A single epoxy-based substrate is applied to the AC / DC unit 156, and there are capacitors and the like as mounted components. Further, the AC / DC unit 156 has a built-in rectifying / smoothing circuit for the main AC voltage, a noise filter circuit, an auxiliary power supply circuit, and a high voltage prevention circuit due to lightning. Also,
This AC / DC part 156 is a spacer 15 with a metal fitting.
Two 7 and two ordinary spacers 158 are attached to the power frame 150 by a one-touch method. The AC / DC unit 156 includes a cable connector 159,
Through 160, the DC / DC unit 161 receives 280V voltage and 0.7A current, and the DC / DC unit 162 receives 280V voltage.
Voltage and 0.6A current are supplied respectively. DC / D
The C section 161 has specifications of 5V voltage, 30A current, and 150W power. The DC / DC unit 161 has a voltage of + 12V, 1
The specifications are 0 A current, -12 V voltage, 0.5 A current, and 126 W power. These two DC / DC units 161, 162
From the electric power is supplied to the electronic circuit inside the computer 31. The DC / DC units 161 and 162 are mounted by mounting mounting components on an aluminum-based substrate. Also, DC / D
The aluminum base boards of the C portions 161 and 162 are directly screwed to the power supply frame 150. This DC / DC
A high heat conductive grease 163 is applied between the parts 161 and 162 and the power supply frame 150. This DC
The / DC units 161 and 162 are the places that generate the most heat in the power supply 7A. The DC / DC parts 161 and 162 are cooled with a single aluminum plate to increase the heat dissipation area of the aluminum plate and improve the heat dissipation characteristics.
By mounting the DC / DC units 161 and 162 in the frame, it is possible to use a power supply frame without using individual cooling fins or the like.
The heat is dissipated to the entire system 150. Further, the cooling air 164 is applied so as to hit any surface of the power supply frame 150 from a direction perpendicular to the power supply 7A mounted in the computer. FIG. 44 shows an embodiment in which the power source 7A is attached to the computer 31. Power supply 7A to pedestal 165,
It is placed on 166 and 167 and inserted into the computer 31 so as to slide in the direction of the arrow. Pedestal 165
167 has tabs 168 and 169. When the power source 7A is completely inserted into the computer 31, the tabs 168 and 169 are provided.
169 is inserted into a hole formed in the power frame 150 and is firmly fixed. Also, fix the front side with screws. In FIG. 45, the main switch 63 is connected to the computer 3
An example for mounting the device on the No. 1 will be shown. The main switch 63 is an AC / DC unit 156 mounted on the power supply 7A.
Is connected by an electric wire. Main switch 63 tab 1
70 is inserted into the hole 171 of the housing 51, and fixed with screws.

[0055]

Since the present invention is constructed as described above, it has the following effects. Reduced temperature rise in the housing by dividing the cooling flow path in the housing and installing a cooling fan between heating elements, mounting the cooling fan at an angle, and installing the cooling flow path outlet below As a result, the wind velocity distribution when flowing out to the floor can be made uniform, and the noise of the entire housing can be reduced.

Further, by using the cooling air flowing out of the cross flow fan for cooling the power source, the cooling air can be effectively used.

Further, by using the device bracket which can mount various devices, the expandability of the device can be achieved.

[Brief description of drawings]

FIG. 1 is a schematic diagram of a computer system according to an embodiment of the present invention.

FIG. 2 is a schematic diagram of a logical configuration of a computer system that is an embodiment of the present invention.

FIG. 3 is a perspective view of a computer showing an embodiment of the present invention.

FIG. 4 is a rear view of a computer showing an embodiment of the present invention.

FIG. 5 is a rear view of the computer according to the embodiment of the present invention with the rear cover opened.

FIG. 6 is a perspective view showing a state in which an opening / closing panel of a front panel of a computer according to an embodiment of the present invention is opened.

FIG. 7 is an external view of a computer according to an embodiment of the present invention with a front panel removed.

FIG. 8 is a front perspective view of a computer according to an embodiment of the present invention.

FIG. 9 is a rear perspective view of a computer showing an embodiment of the present invention.

FIG. 10 is a mounting diagram of a RISC processor module showing an embodiment of the present invention.

FIG. 11 is a method for fixing a RISC processor module according to an embodiment of the present invention.

FIG. 12 is a detailed view of a method for fixing a RISC processor module showing an embodiment of the present invention.

FIG. 13 is a flow path structure on the device side of a computer showing an embodiment of the present invention.

FIG. 14 is a flow path structure on the package side of a computer showing an embodiment of the present invention.

FIG. 15 is a route diagram of cooling air passing through a device side of a computer according to an embodiment of the present invention.

FIG. 16 is a route diagram of cooling air passing through the package side of the computer according to the embodiment of the present invention.

FIG. 17 is a route diagram of cooling air passing under the computer according to the embodiment of the present invention.

FIG. 18 is an EI for a computer showing an embodiment of the present invention.
Mounting diagram with expansion platter for SA

FIG. 19 is an EI for a computer showing an embodiment of the present invention.
Conversion structure with SA

FIG. 20 is a block diagram of a computer showing an embodiment of the present invention.

FIG. 21 is a computer implementation diagram showing an embodiment of the present invention.

FIG. 22 is a mounting view of a device section showing an embodiment of the present invention.

FIG. 23 is a partial cross-sectional view of a device part showing an embodiment of the present invention.

FIG. 24 is an implementation diagram of a computer device showing an embodiment of the present invention.

FIG. 25 is a mounting state diagram of a device showing an embodiment of the present invention.

FIG. 26 is a mounting state diagram of a device showing an embodiment of the present invention.

FIG. 27 is a mounting state diagram of a device showing an embodiment of the present invention.

FIG. 28 is a mounting state diagram of a device according to an embodiment of the present invention.

FIG. 29 is a computer HD showing an embodiment of the present invention.
Right side view of D unit

FIG. 30 is a computer HD showing an embodiment of the present invention.
Bottom view of D unit

FIG. 31 is a computer HD showing an embodiment of the present invention.
Rear view of D unit

FIG. 32 is a computer HD showing an embodiment of the present invention.
Perspective view showing the HDD removal procedure of D unit

FIG. 33 is a computer HD showing an embodiment of the present invention.
Perspective view of D mounting section

FIG. 34 is a computer HD showing an embodiment of the present invention.
Perspective view of D duct panel

FIG. 35 is an HD diagram for a computer showing an embodiment of the present invention.
Sectional drawing which shows the fixed structure of D unit.

FIG. 36 is a computer HD showing an embodiment of the present invention.
Sectional view of D mounting section

FIG. 37 is a computer HD showing an embodiment of the present invention.
Flow diagram of cooling air in the D mounting section

FIG. 38 is a diagram showing a plurality of HDD units connected to the same built-in SCSI in a computer showing one embodiment of the present invention.

FIG. 39 is a block diagram illustrating a computer including an H according to an embodiment of the present invention.
Diagram of DD units connected to separate internal SCSI

FIG. 40 is a configuration diagram of a power frame of a computer showing an embodiment of the present invention.

FIG. 41 is a plan view of a power frame of a computer showing an embodiment of the present invention.

FIG. 42 is a right side view of the power frame of the computer according to the embodiment of the present invention.

FIG. 43 is an assembly view of components connected to a power supply of a computer according to an embodiment of the present invention.

FIG. 44 is a mounting diagram of the power supply of the computer showing one embodiment of the present invention.

FIG. 45 is a mounting view of a main switch of a computer showing an embodiment of the present invention.

[Explanation of symbols]

1 ... High-speed RISC processor module, 2 ... Large capacity MS for program and data processing, 3 ... ISDL ROM,
4 ... System bus, 5 ... Memory / bus controller, 6 ... HD
D, 7 ... FPDD, 8 ... CMT, 9 ... DAT, 10 ... R
S-232C equipment, 11 ... LAN, 12 ... Audio equipment, 13 ... Uninterruptible power supply, 14 ... Centronics, 1
5 ... BIO board, 16 ... Display, 17 ... Keyboard, 18 ... Mouse, 19 ... Display control unit, 21 ... BAS
E board, 22 ... MS board, 23 ... GC board, 24
... processor bus, 25 ... memory bus, 26 ... SC8
0, 27 ... High-speed RISC chip, 28 ... Large-capacity cache memory, 31 ... Computer, 32 ... Front panel, 33 ... Display LED, 34 ... Open / close panel, 35 ... Skirt, 36 ... Caster, 37 ... Cable cover, 3
8 ... Both side plates, 39 ... Top plate, 3A ... Air supply port, 3B ... Stopper, 3C ... Air supply port, 41 ... External SCSI connector, 4
2 ... Input connector, 43 ... Service outlet, 44 ...
HDD cooling air inlet, 45 ... RISC processor cooling air inlet, 46 ... SCSI1 connector, 47 ... SCS
I2 connector, 48 ... LAN connector, 49 ... UPS connector, 4A ... PR connector, 4B ... RS-232C connector, 4C ... Audio connector, 4D ... Termination connector, 51 ... Casing, 52 ... Power switch (ON), 53 ...
Power switch (OFF), 61 ... Hinge, 62 ... Latch, 63 ... Main switch, 64 ... Maintenance display LED,
65 ... Reset switch, 66 ... 3.5 Decorative panel, 6
7 ... 5 makeup panel, 68 ... ventilation port, 69 ... ventilation port, 70
... Partition wall, 71 ... Punching material, 72 ... Audio board, 73 ... Option board, 74 ... Expansion platter, 7
5 ... Guide, 76 ... Connector, 77 ... Fixing part, 78
… BIO bracket, 79… Axial fan, 7A… Power supply,
7B ... HDD unit, 7C ... 3.5 device bracket, 7D ... 5 device bracket, 7E ... Cooling fan unit, 81 ... Cross flow fan, 82 ... Device cover, 82A ... Opening part, 83 ... Radiating fin, 84 ... Memory surface , 85 ... Package duct cover, 85A ... Opening portion, 91 ... EISA expansion platter, 92 ... EISA conversion board, 93 ... Connector, 94 ... Connector, 95 ... Connection cable connector, 96 ... Slot panel, 97 ... EI
SA slot panel, 98 ... EISA board, 99 ...
Guide, 101 ... Clock circuit, 102 ... Synchronous bus slot, 103 ... Asynchronous bus slot, 104 ... MS
Board slot, 105 ... External SCSI cable, 1
10 ... HD bush, 111 ... Front cover, 112
… Air supply port, 113… HDD bracket, 114… SCS
I port, 115 ... Signal connector panel, 116 ... HD
D signal cable, 117 ... HDD power feeding cable, 118
… Internal connector, 119… Power supply connector panel, 1
20 ... HDD feeding relay cable, 121 ... HDD right side surface, 122 ... HDD bottom surface, 123 ... HDD upper surface, 124
… Ventilation hole, 125… Left side of HDD, 126… Claw, 127
... Bending part, 128A ... Notch hole, 128B ... Combination hole, 129 ... HDD frame, 130 ... Central frame, 131 ... Ceiling frame, 132 ... Rear frame, 1
33 ... HDD duct panel, 134 ... HDD guide, 1
35 ... HDD guide, 136 ... Square hole, 137 ... HDD connector window, 138 ... Connector hole, 139 ... Ventilation hole, 14
0 ... Ventilation hole, 141 ... Cooling duct, 150 ... Power supply frame, 151 ... Notch part, 152 ... Notch part, 153
... Cut-and-raised part, 154 ... Electric wire, 155 ... Power cable connector, 156 ... AC / DC part, 157 ... Spacer, 1
58 ... Spacer, 159 ... Cable connector, 160 ...
Cable connector, 161 ... DC / DC section, 162 ... D
C / DC part, 163 ... Grease, 164 ... Cooling air, 16
5 ... Pedestal, 166 ... Pedestal, 167 ... Pedestal, 168 ... Claw, 169 ... Claw, 170 ... Claw, 171 ... Hole

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical display location G06F 1/00 320 E (71) Applicant 000233077 Hitachi Techno Engineering Co., Ltd. 4 Kanda Surugadai, Chiyoda-ku, Tokyo 3rd place (72) Inventor Masakatsu Horii 1st Horiyamashita, Hadano-shi, Kanagawa Prefectural Computer Electronics Co., Ltd. (72) Inventor Masashi Mitani 4-chome, 3rd Kanda Surugadai, Chiyoda-ku, Tokyo Hitachi Techno Engineering Co., Ltd. (72 ) Inventor Noriichi Saito 4-3, Kanda Surugadai, Chiyoda-ku, Tokyo Within Hitachi Techno Engineering Co., Ltd. (72) Inventor Yoshihiro Kondo 810 Shimoimaizumi, Ebina, Kanagawa Stock Company Hitachi Ltd. Office Systems Division (72) Invention Koichi Kato 810 Shimoimaizumi, Ebina City, Nagawa Prefecture, Ltd.Hitachi, Ltd. Office Systems Division, 72, Incorporator Kanji Tanabe, Ltd., 810 Shimoimaizumi, Ebina City, Ebina, Kanagawa Prefecture, Ltd., Office Systems Division, Hitachi, Ltd. (72) Hiroaki Kadota, Kanagawa 810 Shimoimaizumi, Ebina City, Ltd., Office Systems Division, Hitachi, Ltd. (72) Naoya Maruta, 1 Horiyamashita, Horiyamashita, Hadano City, Kanagawa Prefecture (72), Hitoshi Sadamitsu, Izumi Shimoimazumi, Ebina City, Kanagawa Prefecture Office No. 810, Hitachi, Ltd. Office Systems Division (72) Inventor Kazuo Iemura, No. 1 Horiyamashita, Hadano City, Kanagawa Prefecture, Hitachi Computer Electronics Co., Ltd. (72) Junichi Funatsu, No. 1 Horiyamashita, Hadano City, Kanagawa Prefecture Hitachi Comp. Computer Engineering Co., Ltd.

Claims (12)

[Claims] 1. An information processing apparatus for mounting a device system such as an HDD and an FPDD, a package such as a memory and a processor module, a power supply and a cooling fan, wherein the device system, the package system, the power supply and the like are each cooled. High-performance electronic equipment device. 2. An information processing apparatus for mounting a device system such as HDD and FPDD, a package such as a memory and a processor module, a power supply and a cooling fan, wherein a partition plate for dividing the device side and the package side is provided in a housing, A high-performance electronic device device characterized in that small holes are provided at two positions above and below the partition plate and a power source is provided behind the cooling fan. 3. The information processing apparatus according to claim 1, wherein the axial flow fan is tilted from a vertical direction in an information processing apparatus having a cross flow fan for cooling the entire body and an axial flow fan for local cooling. Features high-performance electronic equipment. 4. The information processing apparatus according to claim 1, wherein the axial flow fan has an inclination angle of 20 degrees in the information processing apparatus in which a cross flow fan for cooling the whole body and an axial flow fan for local cooling are mounted. High-performance electronic equipment device characterized by the above. 5. The information processing apparatus according to claim 1, wherein H
A high-performance electronic equipment device characterized in that a small edge is provided at the rear of a mounting metal plate of a DD, and the HDD and the metal plate are superposed. 6. The high-performance electronic device apparatus according to claim 1, wherein the cooling fan is a cross flow fan having a length substantially equal to the length of the housing. 7. The information processing apparatus according to claim 1, wherein the device system is divided into front and rear two places, and an air supply port of a crossflow fan is provided vertically below the intermediate gap between the two devices. High-performance electronic equipment. 8. An external I / O in the logical structure of the system
A high-performance electronic equipment device characterized in that a new I / O interface can be easily expanded by integrating and separating the interface system on a single independent board. 9. A high performance electronic equipment device characterized in that a removable expansion platter is provided in the logical structure of the system so that the slot can be switched to a slot compatible with a standard bus (eg EISA bus). 10. A device for mounting a plurality of SCSI devices (HDD) in an electronic device capable of incorporating a plurality of devices, a connector for a digital chain is provided externally for each device unit, and an internal device is connected using an external cable. High-performance electronic equipment that can be easily reconfigured. 11. A housing structure for an electronic device according to claim 1, wherein the opening / closing panel of the front panel is provided with a function of laterally sliding and opening. 12. A housing structure for an electronic apparatus according to claim 1, wherein a 3.5-inch or 5-inch device that can be mounted vertically and horizontally is used.