JPH0694400B2 - Method for producing GaAs single crystal - Google Patents
Method for producing GaAs single crystalInfo
- Publication number
- JPH0694400B2 JPH0694400B2 JP63294719A JP29471988A JPH0694400B2 JP H0694400 B2 JPH0694400 B2 JP H0694400B2 JP 63294719 A JP63294719 A JP 63294719A JP 29471988 A JP29471988 A JP 29471988A JP H0694400 B2 JPH0694400 B2 JP H0694400B2
- Authority
- JP
- Japan
- Prior art keywords
- crucible
- gaas
- melt
- lid
- single crystal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910001218 Gallium arsenide Inorganic materials 0.000 title claims description 51
- 239000013078 crystal Substances 0.000 title claims description 32
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 238000003786 synthesis reaction Methods 0.000 claims description 20
- 239000002994 raw material Substances 0.000 claims description 15
- 239000000155 melt Substances 0.000 claims description 10
- 229910052785 arsenic Inorganic materials 0.000 claims description 8
- 229910052733 gallium Inorganic materials 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 7
- 239000000565 sealant Substances 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 4
- 238000000859 sublimation Methods 0.000 claims description 2
- 230000008022 sublimation Effects 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 46
- 230000015572 biosynthetic process Effects 0.000 description 18
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000002194 synthesizing effect Effects 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052810 boron oxide Inorganic materials 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
Description
【発明の詳細な説明】 [産業上の利用分野] 本発明はGaAs単結晶の製造方法に係り、特にGaAsの直接
合成引き上げ法によるGaAs単結晶の製造方法に関するも
のである。TECHNICAL FIELD The present invention relates to a method for producing a GaAs single crystal, and more particularly to a method for producing a GaAs single crystal by a direct synthesis pulling method of GaAs.
[従来の技術] 第2図はGaAs(ガリウム砒素)単結晶の直接合成引き上
げ法(LEC法)の一例を示すものである。図示するよう
に、圧力容器2内には、ルツボ4がサセプタ5及びルツ
ボ軸11を介して設置されている。このルツボ4内に原料
としてGa(ガリウム)9及びAs(砒素)8を、液体封止
剤としてB2O3(酸化硼素)7を収容する。そして、上記
ルツボ4をヒータ6で加熱しGa9とAs8とを反応させてGa
As融液を合成する。その後、このルツボ4直上に位置す
る引き上げ軸1に固定された種結晶3を降下させ、種結
晶3の一端を上記GaAs融液に接触させた後、引き上げる
ことで種結晶の先端に新たなGaAs結晶を成長させてい
る。[Prior Art] FIG. 2 shows an example of a direct synthesis pulling method (LEC method) of a GaAs (gallium arsenide) single crystal. As shown in the drawing, a crucible 4 is installed in the pressure vessel 2 via a susceptor 5 and a crucible shaft 11. Ga (gallium) 9 and As (arsenic) 8 are stored in the crucible 4 as raw materials, and B 2 O 3 (boron oxide) 7 is stored as a liquid sealant. Then, the crucible 4 is heated by the heater 6 to cause Ga9 and As8 to react with each other so that Ga
As to synthesize melt. After that, the seed crystal 3 fixed to the pulling shaft 1 located right above the crucible 4 is lowered, one end of the seed crystal 3 is brought into contact with the GaAs melt, and then the seed crystal 3 is pulled up to bring a new GaAs to the tip of the seed crystal. Growing crystals.
[発明が解決しようとする課題] ところで、上記As8はGaAs融液を合成する温度において
蒸気圧が50〜60kg/cm2と高く、非常に揮散し易い性質を
有している。そのため従来は、このAs8の揮散を防止す
るためにGaAs液面を覆うべく上記液体封止剤としてB2O3
7を用いているが、十分な効果は得られていない。これ
は融解したB2O37とAs8が完全に接触していなかった
り、接触していてもAs8が気泡となってB2O37中に侵入
してしまうことによる。[Problems to be Solved by the Invention] By the way, the above As8 has a high vapor pressure of 50 to 60 kg / cm 2 at a temperature for synthesizing a GaAs melt, and has a property of being very easily volatilized. Therefore, conventionally, in order to prevent the volatilization of As8, B 2 O 3 was used as the liquid sealant to cover the GaAs liquid surface.
7 is used, but a sufficient effect is not obtained. This is because the molten B 2 O 3 7 and As8 are not completely in contact with each other, or even if they are in contact with each other, As8 becomes bubbles and penetrates into B 2 O 3 7.
そこで、このAs8の揮散を考慮してルツボ4内に予めAs8
をGa9よりも多く収容する方法がとられているが、その
揮散量が常に一定になるとは限らず、得られる融液組成
のバラツキが大きいという問題があった。Therefore, considering the volatilization of As8, the As8
However, the amount of volatilization is not always constant, and there is a large variation in the composition of the melt obtained.
また、揮散したAs8は炉内の低温部で凝集するため、こ
れが炉内を汚染し、炉内の清掃が非常に大変であるとい
う問題があった。In addition, since the volatilized As8 aggregates in the low temperature portion of the furnace, it contaminates the inside of the furnace and cleaning the inside of the furnace is very difficult.
本発明は上述の如き従来の課題に鑑みて創案されたもの
であり、その目的は直接合成引き上げ法によるGaAs融液
合成時のAsの揮散を防止することができるGaAs結晶の製
造方法を提供することにある。The present invention was created in view of the conventional problems as described above, and an object thereof is to provide a method for producing a GaAs crystal capable of preventing the volatilization of As during the synthesis of a GaAs melt by the direct synthesis pulling method. Especially.
[課題を解決するための手段] 上記目的を達成すべく本発明は、側壁面にテーパを有す
るルツボ内に原料としてGa及びAsを、液体封止剤として
B2O3を収容すると共に、該ルツボの上部開口部を予め上
記Ga及びAsを原料として作成した蓋体をルツボ側壁面に
接触させて支持することにより閉塞した後、該ルツボ底
部はGaAsが溶融する温度に、ルツボ上部はAsの昇華温度
以上でかつ蓋体の溶融温度以下の温度に加熱してGaとAs
とを反応させGaAs融液を合成し、該合成反応の終了後、
ルツボの上方から種結晶を降下させることにより上記蓋
体を圧してルツボ内に割り落として融液に溶解させた
後、該融液に種結晶の一端をつけてGaAs単結晶を引き上
げるようにしたことを特徴とするGaAs単結晶の製造方法
である。[Means for Solving the Problems] In order to achieve the above object, the present invention uses Ga and As as raw materials in a crucible having a tapered side wall surface as a liquid sealant.
After accommodating B 2 O 3 and closing the upper opening of the crucible by contacting and supporting the lid body made in advance with Ga and As as the raw material in contact with the side wall surface of the crucible, the bottom of the crucible was made of GaAs. The upper part of the crucible is heated to a temperature above the sublimation temperature of As and below the melting temperature of the lid to melt Ga and As.
Are reacted to synthesize a GaAs melt, and after the synthesis reaction is completed,
After lowering the seed crystal from above the crucible, the lid was pressed to be broken into the crucible and dissolved in the melt, and one end of the seed crystal was attached to the melt to pull up the GaAs single crystal. This is a method of manufacturing a GaAs single crystal characterized by the above.
[作用] 上記構成によれば、GaAsを原料として作成した蓋体を用
いてGaAs融液合成中のルツボの上部開口部を閉塞するこ
とによってルツボ内からのAsの揮散を抑制しAsの揮散に
よる融液組成の変動及び炉内の汚染を大幅に防止できる
ものである。また、この蓋体を上記合成終了後にルツボ
内に落として融解させてしまうため、その後の結晶引き
上げ作業に全く支障をきたすことがない。[Operation] According to the above configuration, by using the lid made of GaAs as a raw material to block the upper opening of the crucible during the GaAs melt synthesis, the volatilization of As from the inside of the crucible is suppressed and the vaporization of As is caused. It is possible to largely prevent the fluctuation of the melt composition and the contamination in the furnace. Further, since the lid body is dropped into the crucible after the above synthesis and melted, the crystal pulling operation thereafter is not hindered at all.
ここで、上記ルツボの上部開口部を閉塞する蓋体の材質
はGaAsであることを要するが、高い蒸気圧を有するドー
プした結晶を作成する際には、蓋体の材質にドーパント
を添加したものを用いることが望ましい。これは上記合
成終了後に蓋体を合成した融液に融解するためである。Here, the material of the lid that closes the upper opening of the crucible needs to be GaAs, but when a doped crystal having a high vapor pressure is prepared, a dopant is added to the material of the lid. Is preferred. This is because after the above synthesis, the lid melts into the synthesized melt.
さらに、上記蓋体は合成中の融液に接触することなくル
ツボ上又は内部上方に支持されていることを要する。こ
れは、落とし蓋の様に合成前の原料Gaや合成中のGaAs融
液に接触してしまうと以下の様な4つの欠点が生じるか
らである。Further, the lid body is required to be supported on the crucible or inside the crucible without coming into contact with the melt being synthesized. This is because if the raw material Ga before synthesis and the GaAs melt during synthesis are brought into contact with each other like a dropping lid, the following four defects will occur.
GaAs製の蓋体の温度が上昇し、その表面からAsが揮
散してしまう。As the temperature of the GaAs lid rises, As vaporizes from the surface.
原料Gaと蓋体が接触していると、GaAsの融点以下の
温度でもGaAsがGaに溶解してしまう。If the raw material Ga and the lid are in contact with each other, GaAs will dissolve in Ga even at a temperature below the melting point of GaAs.
蓋体に遮られてAsとB2O3が接触しなくなるとB2O3中
にAsの気泡ができ易くなってしまう。When As and B 2 O 3 do not come into contact with each other because of being blocked by the lid, As bubbles easily form in B 2 O 3 .
原料が平坦に置かれていないと蓋体も傾いてルツボ
側壁との間に隙間ができてしまい、目的とする効果が得
られない。If the raw material is not placed flat, the lid will also tilt and a gap will be created between the crucible side wall and the desired effect cannot be obtained.
そして、ルツボ底部をGaAs合成温度にした時に原料の上
方で支持されている蓋体が熱的に損傷を受けない程度冷
えていることが必要である。そのためには、ルツボ底部
から上記蓋体までの距離がある程度必要であるが、この
距離はホットゾーン構造や合成条件等により変化するた
め一律に規定することはできない。Then, when the bottom of the crucible is heated to the GaAs synthesis temperature, it is necessary that the lid supported above the raw material is cold enough not to be thermally damaged. For that purpose, a certain distance is required from the bottom of the crucible to the lid, but this distance cannot be uniformly defined because it varies depending on the hot zone structure, synthesis conditions and the like.
[実施例] 本発明の一実施例を示す前に、従来技術による比較例を
示す。前記第2図に示した装置を用いてGaAs単結晶の直
接合成引き上げを行った。まず、直径6インチの熱分解
ボロンナイトライド(PBN)製ルツボ4内に原料として3
000gのGa9と3235gのAs8とを、液体封止剤としてり600g
のB2O37を収容した。そして、ヒータ6でルツボ4を90
0℃まで加熱した。このときの圧力容器2内の圧力は、
アルゴンガス雰囲気で70kg/cm2とした。この条件で合成
したGaAs融液に、上記ルツボ4直上に位置する引き上げ
軸1に固定された種結晶3を降下させ、その種結晶3の
一端を接触させてGaAs単結晶を引き上げた。この結晶取
り出し後のルツボ4の内容物及び結晶の重量と、ルツボ
4内に収容した原料の重量の差から求めたAs8の揮散量
は126gであった。[Example] Before showing an example of the present invention, a comparative example according to a conventional technique will be described. Direct synthesis and pulling of a GaAs single crystal was carried out using the apparatus shown in FIG. First of all, as a raw material, a pyrolysis boron nitride (PBN) crucible 4 with a diameter of 6 inches was used as a raw material
600 g of 000 g of Ga9 and 3235 g of As8 as a liquid sealant
B 2 O 3 7 of the. Then use heater 6 to move crucible 4 90
Heated to 0 ° C. The pressure in the pressure vessel 2 at this time is
The pressure was 70 kg / cm 2 in an argon gas atmosphere. The seed crystal 3 fixed to the pulling shaft 1 located right above the crucible 4 was lowered into the GaAs melt synthesized under these conditions, and one end of the seed crystal 3 was brought into contact with the GaAs single crystal to pull it up. The volatilization amount of As8 determined from the difference between the weight of the contents and crystals of the crucible 4 after taking out the crystals and the weight of the raw material contained in the crucible 4 was 126 g.
次に、第1図に本発明の一実施例を示す。図示するよう
に、上方に向けて順次拡径するように側壁面にテーパを
つけた上部直径6インチのPBN製ルツボ4を用い、この
ルツボ4内に原料として3000gのGa9と3130gのAs8とを、
液体封止剤として600gのB2O37を収容した。その後、直
径148mm,厚さ1mmのGaAs多結晶円板12からなる蓋体をル
ツボ4の上部開口部を閉塞するように設置した。この円
板12は、上記ルツボ4の側壁面がテーパを有しているこ
とにより、ルツボ4の底面から80mmぐらいのことろでル
ツボ4内でその側壁に支持されている。またこの円板12
は合成終了後、ルツボ4内に割って落とし易いように、
その裏面に予め十字型の傷を設けた。Next, FIG. 1 shows an embodiment of the present invention. As shown in the drawing, a PBN crucible 4 having an upper diameter of 6 inches, whose side wall surface is tapered so that the diameter is gradually increased upward, is used. 3000 g of Ga9 and 3130 g of As8 are used as raw materials in the crucible 4. ,
600 g of B 2 O 3 7 was contained as a liquid sealant. After that, a lid made of a GaAs polycrystalline disk 12 having a diameter of 148 mm and a thickness of 1 mm was installed so as to close the upper opening of the crucible 4. Since the side wall surface of the crucible 4 has a taper, the circular plate 12 is supported by the side wall of the crucible 4 within about 80 mm from the bottom surface of the crucible 4. Also this disk 12
After the synthesis is completed, split it into the crucible 4 so that it can be easily dropped.
A cross-shaped scratch was previously formed on the back surface.
この状態でヒータ6を用いてルツボ4を加熱しGaAs融液
を合成した。このGaAs融液合成時の雰囲気は上記比較例
と同様にアルゴンガス70kg/cm2とした。GaAs融液合成の
終了ポイントは、ルツボ4下に設置した熱電対10により
温度を検知することで判定できた。即ち、GaAs融液の合
成が開始されると温度が急激に上昇し、終了すると低下
して安定になる。よって、上記GaAs多結晶円板12でルツ
ボ4内を直接観察できなくとも、GaAs融液合成の作業に
おいては何ら支障は無かった。GaAsの融液合成が終了し
た後、さらに上記ルツボ4を1240℃まで加熱してGaAs融
液を作成した後、上記ルツボ4の直上に位置された引き
上げ軸1を降下して、これに固定された種結晶3の先端
で上記GaAs多結晶円板12を割りルツボ4内に落とした。
このルツボ4内に落ちたGaAsの多結晶片(GaAs多結晶円
板12の破片)は、合成したGaAs融液に溶解して完全に無
くなった。その後、このGaAs融液からGaAs単結晶を引き
上げた。前述の比較例と同様の条件で求めたAs8の揮散
量は僅か11gであった。その後、同条件で10回の実験を
行なったところAs8の揮散量は常に8〜12gの範囲に入っ
ており、バラツキが非常に少なく再現性の良いことを確
認することができた。In this state, the crucible 4 was heated using the heater 6 to synthesize the GaAs melt. The atmosphere for synthesizing the GaAs melt was 70 kg / cm 2 of argon gas as in the comparative example. The end point of the GaAs melt synthesis can be determined by detecting the temperature with the thermocouple 10 installed under the crucible 4. That is, when the synthesis of the GaAs melt is started, the temperature rises sharply, and when it ends, the temperature drops and becomes stable. Therefore, even if the inside of the crucible 4 could not be directly observed by the GaAs polycrystalline disk 12, there was no problem in the work of GaAs melt synthesis. After the melt synthesis of GaAs is completed, the crucible 4 is further heated to 1240 ° C. to prepare a GaAs melt, and then the pull-up shaft 1 located directly above the crucible 4 is lowered and fixed to this. The GaAs polycrystalline disk 12 was dropped into the crucible 4 at the tip of the seed crystal 3.
The GaAs polycrystal pieces (broken pieces of the GaAs polycrystal disk 12) dropped in the crucible 4 were completely dissolved by dissolving in the synthesized GaAs melt. Then, a GaAs single crystal was pulled from this GaAs melt. The volatilization amount of As8 obtained under the same conditions as in the comparative example was only 11 g. After that, when the experiment was performed 10 times under the same conditions, the volatilization amount of As8 was always in the range of 8 to 12 g, and it was confirmed that there was very little variation and good reproducibility.
[発明の効果] 以上要するに本発明によれば、ルツボ内がAs雰囲気にな
るためGaAs融液合成前及び合成時のAsの揮散を大幅に減
少させることができる。[Advantages of the Invention] In short, according to the present invention, since the atmosphere in the crucible is the As atmosphere, the volatilization of As before and during the GaAs melt synthesis can be greatly reduced.
これによりGaAs融液組成のコントロールを正確に行なう
ことができ、引き上げ単結晶の特性バラツキを大幅に減
少させることができる。As a result, the composition of the GaAs melt can be accurately controlled, and the characteristic variation of the pulled single crystal can be greatly reduced.
また、蓋体を原料と同じGaAsで作成するため、GaAs融液
の合成後、蓋体をルツボ内に落として融解してしまうこ
とができ、蓋体を設けても合成作業と引き上げ作業とを
一貫して行なうことができる。Also, since the lid is made of the same GaAs as the raw material, the lid can be dropped into the crucible and melted after the GaAs melt has been synthesized. Can be done consistently.
加えて、蓋をGaAsで作成するため炉内を汚染することが
無い。In addition, since the lid is made of GaAs, the inside of the furnace is not contaminated.
さらに、Asの揮散量を大幅に減少させることができるた
め、結晶成長終了後の炉内掃除を非常に軽減することが
できる。Furthermore, since the amount of As volatilized can be greatly reduced, cleaning inside the furnace after completion of crystal growth can be greatly reduced.
またさらに、Asの揮散量の大幅な減少により、結晶観察
用の覗き窓の曇りが無くなり炉内の観察が容易になる。Furthermore, since the volatilization amount of As is greatly reduced, the observation window for observing crystals is not fogged and observation inside the furnace is facilitated.
そして、Asの揮散量の大幅な減少により、ルツボ内に余
分なAsを収容しなければならない量を減少させることが
でき、経済性を向上させることができる。Further, due to the large reduction in the amount of As vaporized, the amount of extra As that must be accommodated in the crucible can be reduced, and the economical efficiency can be improved.
第1図は本発明の一実施例を説明するための概略縦断面
図、第2図は従来例を説明するため概略縦断面図であ
る。 図中、3は種結晶、4はルツボ、7はB2O3、8はAs、9
はGa、12は蓋体である。FIG. 1 is a schematic vertical sectional view for explaining an embodiment of the present invention, and FIG. 2 is a schematic vertical sectional view for explaining a conventional example. In the figure, 3 is a seed crystal, 4 is a crucible, 7 is B 2 O 3 , 8 is As, 9
Is Ga and 12 is a lid.
Claims (1)
してGa及びAsを、液体封止剤としてB2O3を収容すると共
に、該ルツボの上部開口部を予め上記Ga及びAsを原料と
して作成した蓋体をルツボ側壁面に接触させて支持する
ことにより閉塞した後、該ルツボ底部はGaAsが溶融する
温度に、ルツボ上部はAsの昇華温度以上でかつ蓋体の溶
融温度以下の温度に加熱してGaとAsとを反応させGaAs融
液を合成し、該合成反応の終了後、ルツボの上方から種
結晶を降下させることにより上記蓋体を圧してルツボ内
に割り落として融液に溶解させた後、該融液に種結晶の
一端をつけてGaAs単結晶を引き上げるようにしたことを
特徴とするGaAs単結晶の製造方法。1. Ga and As as a raw material and B 2 O 3 as a liquid sealant are contained in a crucible having a tapered side wall surface, and the upper opening of the crucible is made of the Ga and As as a raw material in advance. After closing the lid by contacting and supporting the side wall of the crucible to close it, the bottom of the crucible is at a temperature at which GaAs melts, and the top of the crucible is at a temperature above the sublimation temperature of As and below the melting temperature of the lid. After heating, Ga and As are reacted to synthesize a GaAs melt, and after the completion of the synthesis reaction, the seed crystal is lowered from above the crucible to press the lid and crack it into the crucible to form a melt. A method for producing a GaAs single crystal, characterized in that, after melting, one end of a seed crystal is attached to the melt to pull up the GaAs single crystal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63294719A JPH0694400B2 (en) | 1988-11-24 | 1988-11-24 | Method for producing GaAs single crystal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63294719A JPH0694400B2 (en) | 1988-11-24 | 1988-11-24 | Method for producing GaAs single crystal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02141493A JPH02141493A (en) | 1990-05-30 |
| JPH0694400B2 true JPH0694400B2 (en) | 1994-11-24 |
Family
ID=17811423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63294719A Expired - Fee Related JPH0694400B2 (en) | 1988-11-24 | 1988-11-24 | Method for producing GaAs single crystal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0694400B2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60161389A (en) * | 1984-01-27 | 1985-08-23 | Toshiba Corp | Manufacture of compound single crystal |
-
1988
- 1988-11-24 JP JP63294719A patent/JPH0694400B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02141493A (en) | 1990-05-30 |
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