JPH0686571B2 - Antibacterial / conductive composition and antibacterial / conductive resin composition - Google Patents
Antibacterial / conductive composition and antibacterial / conductive resin compositionInfo
- Publication number
- JPH0686571B2 JPH0686571B2 JP1260127A JP26012789A JPH0686571B2 JP H0686571 B2 JPH0686571 B2 JP H0686571B2 JP 1260127 A JP1260127 A JP 1260127A JP 26012789 A JP26012789 A JP 26012789A JP H0686571 B2 JPH0686571 B2 JP H0686571B2
- Authority
- JP
- Japan
- Prior art keywords
- antibacterial
- conductive
- weight
- silver
- colloidal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000000844 anti-bacterial effect Effects 0.000 title claims description 95
- 239000000203 mixture Substances 0.000 title claims description 45
- 239000011342 resin composition Substances 0.000 title claims description 13
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 40
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 35
- 150000002484 inorganic compounds Chemical class 0.000 claims description 20
- 229910010272 inorganic material Inorganic materials 0.000 claims description 20
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 18
- 229910052709 silver Inorganic materials 0.000 claims description 18
- 239000004332 silver Substances 0.000 claims description 18
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 17
- 125000004432 carbon atom Chemical group C* 0.000 claims description 16
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 claims description 15
- 239000010457 zeolite Substances 0.000 claims description 15
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 14
- 229910021536 Zeolite Inorganic materials 0.000 claims description 14
- 239000011882 ultra-fine particle Substances 0.000 claims description 12
- 239000008119 colloidal silica Substances 0.000 claims description 9
- 239000000741 silica gel Substances 0.000 claims description 8
- 229910002027 silica gel Inorganic materials 0.000 claims description 8
- 239000000377 silicon dioxide Substances 0.000 claims description 8
- 125000000217 alkyl group Chemical group 0.000 claims description 6
- 150000003377 silicon compounds Chemical class 0.000 claims description 5
- 125000002252 acyl group Chemical group 0.000 claims description 4
- 125000000962 organic group Chemical group 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 3
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 37
- 238000012360 testing method Methods 0.000 description 30
- 239000000499 gel Substances 0.000 description 20
- 150000003961 organosilicon compounds Chemical class 0.000 description 18
- 241000894006 Bacteria Species 0.000 description 17
- 238000000034 method Methods 0.000 description 17
- 229920005989 resin Polymers 0.000 description 14
- 239000011347 resin Substances 0.000 description 14
- 239000002245 particle Substances 0.000 description 12
- 239000000463 material Substances 0.000 description 11
- 239000002609 medium Substances 0.000 description 11
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 10
- 239000000126 substance Substances 0.000 description 10
- -1 γ- Chloropropyl group Chemical group 0.000 description 10
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000010408 film Substances 0.000 description 7
- 239000003960 organic solvent Substances 0.000 description 7
- 239000000047 product Substances 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 239000007864 aqueous solution Substances 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 239000002253 acid Substances 0.000 description 5
- 239000004568 cement Substances 0.000 description 5
- 238000004040 coloring Methods 0.000 description 5
- 238000010828 elution Methods 0.000 description 5
- 239000000835 fiber Substances 0.000 description 5
- 230000002401 inhibitory effect Effects 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 239000000123 paper Substances 0.000 description 5
- 150000003839 salts Chemical class 0.000 description 5
- 229910001961 silver nitrate Inorganic materials 0.000 description 5
- 239000008399 tap water Substances 0.000 description 5
- 235000020679 tap water Nutrition 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 230000000843 anti-fungal effect Effects 0.000 description 4
- 238000009835 boiling Methods 0.000 description 4
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 239000002537 cosmetic Substances 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 230000007062 hydrolysis Effects 0.000 description 4
- 238000006460 hydrolysis reaction Methods 0.000 description 4
- 239000003973 paint Substances 0.000 description 4
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 description 4
- 238000010998 test method Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- 241000588724 Escherichia coli Species 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 241000233866 Fungi Species 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 241000191967 Staphylococcus aureus Species 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000001580 bacterial effect Effects 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 3
- 230000001877 deodorizing effect Effects 0.000 description 3
- 238000002845 discoloration Methods 0.000 description 3
- 239000002612 dispersion medium Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000010440 gypsum Substances 0.000 description 3
- 229910052602 gypsum Inorganic materials 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000000976 ink Substances 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 3
- 229910017604 nitric acid Inorganic materials 0.000 description 3
- 239000011164 primary particle Substances 0.000 description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 239000012085 test solution Substances 0.000 description 3
- TUSDEZXZIZRFGC-UHFFFAOYSA-N 1-O-galloyl-3,6-(R)-HHDP-beta-D-glucose Natural products OC1C(O2)COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC1C(O)C2OC(=O)C1=CC(O)=C(O)C(O)=C1 TUSDEZXZIZRFGC-UHFFFAOYSA-N 0.000 description 2
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
- 240000006439 Aspergillus oryzae Species 0.000 description 2
- 235000002247 Aspergillus oryzae Nutrition 0.000 description 2
- 238000004438 BET method Methods 0.000 description 2
- 239000001263 FEMA 3042 Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- LRBQNJMCXXYXIU-PPKXGCFTSA-N Penta-digallate-beta-D-glucose Natural products OC1=C(O)C(O)=CC(C(=O)OC=2C(=C(O)C=C(C=2)C(=O)OC[C@@H]2[C@H]([C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)O2)OC(=O)C=2C=C(OC(=O)C=3C=C(O)C(O)=C(O)C=3)C(O)=C(O)C=2)O)=C1 LRBQNJMCXXYXIU-PPKXGCFTSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 241000589517 Pseudomonas aeruginosa Species 0.000 description 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 235000011114 ammonium hydroxide Nutrition 0.000 description 2
- 239000003242 anti bacterial agent Substances 0.000 description 2
- 230000001098 anti-algal effect Effects 0.000 description 2
- 229940121375 antifungal agent Drugs 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
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- 238000012136 culture method Methods 0.000 description 2
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- 239000000945 filler Substances 0.000 description 2
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- 239000007789 gas Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 150000002430 hydrocarbons Chemical group 0.000 description 2
- 239000000017 hydrogel Substances 0.000 description 2
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- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
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- 229920000728 polyester Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
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- LRBQNJMCXXYXIU-NRMVVENXSA-N tannic acid Chemical compound OC1=C(O)C(O)=CC(C(=O)OC=2C(=C(O)C=C(C=2)C(=O)OC[C@@H]2[C@H]([C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)O2)OC(=O)C=2C=C(OC(=O)C=3C=C(O)C(O)=C(O)C=3)C(O)=C(O)C=2)O)=C1 LRBQNJMCXXYXIU-NRMVVENXSA-N 0.000 description 2
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- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 description 1
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
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- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000011081 inoculation Methods 0.000 description 1
- 239000002054 inoculum Substances 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000000813 microbial effect Effects 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000012286 potassium permanganate Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000004445 quantitative analysis Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000002964 rayon Substances 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- YPNVIBVEFVRZPJ-UHFFFAOYSA-L silver sulfate Chemical compound [Ag+].[Ag+].[O-]S([O-])(=O)=O YPNVIBVEFVRZPJ-UHFFFAOYSA-L 0.000 description 1
- 229910000367 silver sulfate Inorganic materials 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 230000001954 sterilising effect Effects 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 239000006228 supernatant Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- UQMOLLPKNHFRAC-UHFFFAOYSA-N tetrabutyl silicate Chemical compound CCCCO[Si](OCCCC)(OCCCC)OCCCC UQMOLLPKNHFRAC-UHFFFAOYSA-N 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- ZQZCOBSUOFHDEE-UHFFFAOYSA-N tetrapropyl silicate Chemical compound CCCO[Si](OCCC)(OCCC)OCCC ZQZCOBSUOFHDEE-UHFFFAOYSA-N 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- ILJSQTXMGCGYMG-UHFFFAOYSA-N triacetic acid Chemical compound CC(=O)CC(=O)CC(O)=O ILJSQTXMGCGYMG-UHFFFAOYSA-N 0.000 description 1
- ZLGWXNBXAXOQBG-UHFFFAOYSA-N triethoxy(3,3,3-trifluoropropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCC(F)(F)F ZLGWXNBXAXOQBG-UHFFFAOYSA-N 0.000 description 1
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
- UDUKMRHNZZLJRB-UHFFFAOYSA-N triethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OCC)(OCC)OCC)CCC2OC21 UDUKMRHNZZLJRB-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 1
- JLGNHOJUQFHYEZ-UHFFFAOYSA-N trimethoxy(3,3,3-trifluoropropyl)silane Chemical compound CO[Si](OC)(OC)CCC(F)(F)F JLGNHOJUQFHYEZ-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、抗菌・導電性組成物およびこの組成物を用い
た抗菌・導電性樹脂組成物に関し、さらに詳細には樹脂
やゴムまたは塗料やインキ、接着剤、バッキング剤、セ
メント、石膏、紙、繊維あるいは化粧品およびその他の
材料に添加して、抗菌性、防カビ性、防藻性、導電性、
脱臭性を付与するための、着色性が小さく、分散性がよ
く、さらに耐熱性、耐薬品性がよいため変色もなく、不
溶出性で耐摩耗性、耐候性などにも優れた、表面積の非
常に大きな微粒子状を形成する抗菌・導電性組成物およ
びこの抗菌・導電性組成物を含有する抗菌・導電性樹脂
組成物に関する。TECHNICAL FIELD The present invention relates to an antibacterial / conductive composition and an antibacterial / conductive resin composition using this composition, and more specifically to a resin, rubber or paint. Addition to ink, adhesive, backing agent, cement, gypsum, paper, fiber or cosmetics and other materials, antibacterial, antifungal, antialgal, conductive,
For imparting deodorizing property, it has small coloring property, good dispersibility, and also has good heat resistance and chemical resistance so that it does not discolor, has no elution and is excellent in abrasion resistance, weather resistance, etc. The present invention relates to an antibacterial / conductive composition that forms very large particles and an antibacterial / conductive resin composition containing the antibacterial / conductive composition.
従来より、重金属を利用した抗菌剤は種々開発されてい
るが、抗菌性金属塩の使用による耐熱性や残留酸根の問
題があり、特に樹脂への添加時における変色やガスの発
生、pHの影響などの問題があった。これは、硝酸銀、硫
酸銀、あるいは硝酸銅(II)などの金属塩を使用してい
るためにおきる現象である。特に、抗菌性に優れている
といわれる硝酸銀にこの傾向が強く、この問題の改善が
望まれていた。Conventionally, various antibacterial agents using heavy metals have been developed, but there are problems of heat resistance and residual acid radicals due to the use of antibacterial metal salts, especially discoloration during addition to resin, generation of gas, influence of pH There was such a problem. This is a phenomenon that occurs because a metal salt such as silver nitrate, silver sulfate, or copper (II) nitrate is used. This tendency is particularly strong in silver nitrate, which is said to have excellent antibacterial properties, and improvement of this problem has been desired.
本発明は、かかる従来技術の課題を背景になされたもの
で、抗菌性の付与に非常に優れた殺菌力を有しながら人
体に対しては殆ど害のないコロイダル銀を用いることに
より、より安全性を確保し、さらに熱や酸などによる変
色も防ぐことができ、さらにpHが中性になるため、それ
の障害も除くことができる。しかも超微粒子状の銀を含
有するため導電性に優れ、樹脂に使用した場合、恒久的
な帯電防止が可能である。The present invention has been made against the background of the problems of the prior art, and is safer by using colloidal silver that has a very excellent bactericidal power for imparting antibacterial properties and hardly harms the human body. The property can be secured, and discoloration due to heat, acid, etc. can be prevented, and since the pH becomes neutral, obstacles to it can be eliminated. In addition, since it contains ultrafine particles of silver, it has excellent conductivity, and when it is used as a resin, it is possible to permanently prevent electrification.
本発明は、低・高湿度の雰囲気下で広い範囲の細菌、カ
ビ、あるいは藻類などの微生物に対して強い殺菌力を有
し、耐熱性が良く、500℃でも変色することがなく、し
かも分散性が良く、不溶出性で着色力が小さく、硬度、
耐水性、耐薬品性、耐候性などに優れ、大きな表面積を
もつ導電性の微粒子である抗菌・導電性組成物およびこ
の抗菌・導電性組成物を含有する抗菌・導電性樹脂組成
物を提供することを目的とする。INDUSTRIAL APPLICABILITY The present invention has a strong bactericidal activity against a wide range of bacteria such as bacteria, fungi, or algae in a low and high humidity atmosphere, has good heat resistance, does not discolor even at 500 ° C., and is dispersed. Good, good elution, low coloring power, hardness,
Provided are an antibacterial / conductive composition which is excellent in water resistance, chemical resistance, weather resistance, etc., and is a conductive fine particle having a large surface area, and an antibacterial / conductive resin composition containing the antibacterial / conductive composition. The purpose is to
本発明は、(a)一般式Si(OR1)4(式中、R1は炭素
数1〜5の炭化水素残基を示す)で表されるテトラアル
コキシシランおよび一般式R2Si(OR3)3(式中、R2は
炭素数1〜8の有機基、R3は炭素数1〜5のアルキル基
または炭素数1〜4のアシル基を示す)で表されるオル
ガノアルコキシシランから選ばれる少なくとも1種の有
機ケイ素化合物を固形分換算で3〜50重量%、 (b)コロイダル銀を銀成分換算で0.05〜5重量%、お
よび (c)コロイダルシリカ、コロイダルアルミナ、シリカ
ゲル、ゼオライト、活性炭、超微粒子状の、シリカ、ア
ルミナおよびチタニアよりなる群から選ばれる少なくと
も1種の無機化合物を無水換算で10〜90重量% を主成分とする抗菌・導電性組成物である。The present invention provides (a) a tetraalkoxysilane represented by the general formula Si (OR 1 ) 4 (wherein R 1 represents a hydrocarbon residue having 1 to 5 carbon atoms) and a general formula R 2 Si (OR 3 ) 3 from an organoalkoxysilane represented by the formula (R 2 represents an organic group having 1 to 8 carbon atoms, R 3 represents an alkyl group having 1 to 5 carbon atoms or an acyl group having 1 to 4 carbon atoms) 3 to 50% by weight in terms of solid content of at least one selected organosilicon compound, (b) 0.05 to 5% by weight in terms of silver component of colloidal silver, and (c) colloidal silica, colloidal alumina, silica gel, zeolite, An antibacterial / conductive composition containing activated carbon, ultrafine particles, and at least one inorganic compound selected from the group consisting of silica, alumina and titania as the main component in an amount of 10 to 90% by weight in terms of anhydrous form.
また、本発明は、前記抗菌・導電性組成物を0.02〜30重
量%含有してなる抗菌・導電性樹脂組成物である。Further, the present invention is an antibacterial / conductive resin composition containing 0.02 to 30% by weight of the antibacterial / conductive composition.
本発明は、強力な殺菌力を有し、しかも硝酸銀と異な
り、人体には殆ど害がなく、導電性で耐熱性、耐食性、
耐久性に優れているコロイダル銀の超微粒子状銀を大き
な表面積をもつ無機化合物に付着させ、これを有機ケイ
素化合物により固着し、抗菌性、導電性を最大限に発現
させようとするものである。The present invention has a strong bactericidal activity, and unlike silver nitrate, it has little harm to the human body, is electrically conductive, and has heat resistance, corrosion resistance, and
The ultrafine particle silver of colloidal silver, which has excellent durability, is attached to an inorganic compound having a large surface area, and it is fixed by an organic silicon compound to maximize antibacterial and electroconductivity. .
以下、本発明を構成要件ごとに説明する。The present invention will be described below for each constituent element.
(a)有機ケイ素化合物 本発明で使用される有機ケイ素化合物としては、例えば
一般式Si(OR1)4(式中、R1は炭素数1〜5の炭化水
素残基を示す)で表されるテトラアルコキシシランおよ
び/または一般式R2Si(OR3)3(式中、R2は炭素数1
〜8の有機基、R3は炭素数1〜5のアルキル基または炭
素数1〜4のアシル基を示す。)で表されるオルガノア
ルコキシシランを挙げることができる。(A) Organosilicon Compound The organosilicon compound used in the present invention is represented by, for example, the general formula Si (OR 1 ) 4 (in the formula, R 1 represents a hydrocarbon residue having 1 to 5 carbon atoms). Tetraalkoxysilane and / or the general formula R 2 Si (OR 3 ) 3 (wherein R 2 has 1 carbon atom)
~ 8 organic group, R 3 represents an alkyl group having 1 to 5 carbon atoms or an acyl group having 1 to 4 carbon atoms. ) Organoalkoxysilanes represented by
これらの有機ケイ素化合物は、水の存在により加水分解
し、加水分解物となり、また該加水分解物が重縮合して
部分縮合物を生じ、さらに高分子量化してゲル状物にな
る。本発明の有機ケイ素化合物としては、これらの加水
分解物、部分縮合物も使用できる。また、有機ケイ素化
合物をコロイダル銀と無機化合物との混合液の存在下に
加水分解してもよく、この場合、得られる組成物は、銀
成分を所持した無機化合物を含有するゲル状物となる。
さらにこのゲル状物を加熱すると、完全縮合物であるゲ
ルを生成するものである。These organosilicon compounds are hydrolyzed in the presence of water to form a hydrolyzate, and the hydrolyzate is polycondensed to form a partial condensate, which is further polymerized into a gel. As the organosilicon compound of the present invention, these hydrolyzates and partial condensates can also be used. Further, the organosilicon compound may be hydrolyzed in the presence of a mixed liquid of colloidal silver and an inorganic compound, and in this case, the resulting composition is a gel-like material containing the inorganic compound having a silver component. .
When this gel-like material is further heated, a gel which is a complete condensate is produced.
このように有機ケイ素化合物は、本発明において、ゲル
状物を形成するとともに結合剤としての働きをするもの
である。Thus, in the present invention, the organosilicon compound functions as a binder while forming a gel-like material.
ここで、前記テトラアルコキシシラン中のR1は、炭素数
1〜5のアルキル基であり、例えばメチル基、エチル
基、プロピル基、ブチル基などである。これらのテトラ
アルコキシシランの具体例としては、テトラメトキシシ
ラン、テトラエトキシシラン、テトラプロポキシシラ
ン、テトラブトキシシランなどを挙げることができる。Here, R 1 in the tetraalkoxysilane is an alkyl group having 1 to 5 carbon atoms, and examples thereof include a methyl group, an ethyl group, a propyl group, and a butyl group. Specific examples of these tetraalkoxysilanes include tetramethoxysilane, tetraethoxysilane, tetrapropoxysilane, and tetrabutoxysilane.
また、前記オルガノアルコキシシラン中のR2は、炭素数
1〜8の炭素を有する有機基であり、例えばメチル基、
エチル基、プロピル基などのアルキル基、そのほかγ−
クロロプロピル基、ビニル基、3,3,3−トリフロロプロ
ピル基、γ−グリシドキシプロピル基、γ−メタクリル
オキシプロピル基、γ−メルカプトプロピル基、フェニ
ル基、3,4−エポキシシクロヘキシルエチル基、γ−ア
ミノプロピル基などである。R 2 in the organoalkoxysilane is an organic group having 1 to 8 carbon atoms, such as a methyl group,
Alkyl groups such as ethyl group and propyl group, and γ-
Chloropropyl group, vinyl group, 3,3,3-trifluoropropyl group, γ-glycidoxypropyl group, γ-methacryloxypropyl group, γ-mercaptopropyl group, phenyl group, 3,4-epoxycyclohexylethyl group , Γ-aminopropyl group and the like.
また、オルガノアルコキシシラン中のR2は、炭素数1〜
5のアルキル基または炭素数1〜4のアシル基であり、
例えばメチル基、エチル基、プロピル基、ブチル基、ア
セチル基などである。In addition, R 2 in the organoalkoxysilane has 1 to 1 carbon atoms.
An alkyl group having 5 or an acyl group having 1 to 4 carbon atoms,
For example, a methyl group, an ethyl group, a propyl group, a butyl group, an acetyl group and the like.
これらのオルガノアルコキシシランの具体例としては、
メチルトリメトキシシラン、メチルトリエトキシシラ
ン、エチルトリメトキシシラン、エチルトリエトキシシ
ラン、n−プロピルトリメトキシシラン、n−プロピル
トリエトキシシラン、i−プロピルトリメトキシシラ
ン、i−プロピルトリエトキシシラン、γ−クロロプロ
ピルトリメトキシシラン、γ−クロロプロピルトリエト
キシシラン、ビニルトリメトキシシラン、ビニルトリエ
トキシシラン、3,3,3−トリフロロプロピルトリメトキ
シシラン、3,3,3−トリフロロプロピルトリエトキシシ
ラン、γ−グリシドキシプロピルトリメトキシシラン、
γ−グリシドキシプロピルトリエトキシシラン、γ−メ
タクリルオキシプロピルトリメトキシシラン、γ−メタ
クリルオキシプロピルトリエトキシシラン、γ−メルカ
プトプロピルトリメトキシシラン、γ−メルカプトプロ
ピルトリエトキシシラン、フェニルトリメトキシシラ
ン、フェニルトリエトキシシラン、γ−アミノプロピル
トリメトキシシラン、3,4−エポキシシクロヘキシルエ
チルトリメトキシシラン、3,4−エポキシシクロヘキシ
ルエチルトリエトキシシランなどを挙げることができ
る。Specific examples of these organoalkoxysilanes include:
Methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, n-propyltrimethoxysilane, n-propyltriethoxysilane, i-propyltrimethoxysilane, i-propyltriethoxysilane, γ- Chloropropyltrimethoxysilane, γ-chloropropyltriethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, 3,3,3-trifluoropropyltrimethoxysilane, 3,3,3-trifluoropropyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane,
γ-glycidoxypropyltriethoxysilane, γ-methacryloxypropyltrimethoxysilane, γ-methacryloxypropyltriethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-mercaptopropyltriethoxysilane, phenyltrimethoxysilane, phenyl Examples thereof include triethoxysilane, γ-aminopropyltrimethoxysilane, 3,4-epoxycyclohexylethyltrimethoxysilane, and 3,4-epoxycyclohexylethyltriethoxysilane.
これらのオルガノアルコキシシランは、1種または2種
以上を併用することができる。These organoalkoxysilanes may be used either individually or in combination of two or more.
これらの有機ケイ素化合物のうち、好ましくはテトラエ
トキシシラン、メチルトリメトキシシランである。Of these organosilicon compounds, tetraethoxysilane and methyltrimethoxysilane are preferable.
この有機ケイ素化合物の抗菌・導電性組成物中における
割合は、固形分換算で3〜50重量%、特に5〜25重量%
が好ましく、3重量%未満では結合力が不足して溶出し
たり、また容易に加水分解せず生産性が低下し、一方50
重量%を超えると抗菌性・導電性が発現され難くなった
り、相対的に無機化合物が少なくなったりして好ましく
ない。The proportion of the organosilicon compound in the antibacterial / conductive composition is 3 to 50% by weight, especially 5 to 25% by weight, in terms of solid content.
If it is less than 3% by weight, the binding force is insufficient to elute, and it is not easily hydrolyzed and the productivity is lowered.
If it exceeds 5% by weight, antibacterial properties and electrical conductivity are difficult to be expressed, and the amount of inorganic compounds is relatively small, which is not preferable.
(b)コロイダル銀 コロイダル銀は、黄または赤褐色の水性コロイド状銀
で、本発明においては、抗菌剤ならびに導電剤として使
用される。(B) Colloidal silver Colloidal silver is yellow or reddish brown aqueous colloidal silver, and is used as an antibacterial agent and a conductive agent in the present invention.
このコロイダル銀は、非常に大きな殺菌力があり、しか
も人体に対しては殆ど害がないため、古くから治療や予
防などに広く使用されている。Since this colloidal silver has a very large bactericidal power and has almost no harm to the human body, it has been widely used for treatment and prevention since ancient times.
また、コロイダル銀の銀成分は、金属の中でも最も優れ
た導電体であることは良く知られている。It is well known that the silver component of colloidal silver is the most excellent conductor among metals.
さらに、銀は、耐熱性に優れ、大気中においては耐食性
も良く、耐久性にも優れている。Further, silver has excellent heat resistance, good corrosion resistance in the atmosphere, and excellent durability.
かかるコロイダル銀は、公知の方法である銀の金属塩を
還元する方法により簡単に作成することができる。例え
ば、硝酸銀の水溶液に希薄なアンモニア水を加えて酸化
銀を作り、さらにアンモニア水を加えて錯塩とし、水で
希釈したのち、還元剤のシュウ酸またはタンニン酸の水
溶液を加えて加熱して作成する方法がある。また、還元
方法として水素、炭素、または一酸化炭素還元法、ある
いはアルカリ金属を使用したもの、その他公知の方法が
ある。Such colloidal silver can be easily prepared by a known method of reducing a metal salt of silver. For example, dilute ammonia water is added to an aqueous solution of silver nitrate to make silver oxide, and then ammonia water is added to form a complex salt, which is diluted with water and then added with an aqueous solution of oxalic acid or tannic acid as a reducing agent and heated. There is a way to do it. Further, as a reduction method, there are a hydrogen, carbon, or carbon monoxide reduction method, a method using an alkali metal, and other known methods.
このコロイダル銀は、通常、銀成分が0.02〜1重量%、
粒径が50mμ以下、pHが7.0±1.0であり、好ましくは銀
成分が0.05〜0.2重量%、粒径が10mμ以下のものであ
る。This colloidal silver usually has a silver content of 0.02 to 1% by weight,
The particle size is 50 mμ or less, the pH is 7.0 ± 1.0, preferably the silver component is 0.05 to 0.2% by weight, and the particle size is 10 mμ or less.
なお、銀の殺菌力は微粒子になるほど大きくなる傾向が
みられる。The sterilizing power of silver tends to increase as the particles become finer.
コロイダル銀の本発明の抗菌・導電性組成物に対する割
合は、銀成分換算で0.05〜5重量%、特に0.1〜1重量
%が好ましい。0.05重量%未満では、抗菌性、導電性の
発現ができ難く、一方、5重量%を超えると色が濃くな
って着色性が増したり、加工に手間がかかりすぎたりし
て好ましくない。The ratio of colloidal silver to the antibacterial / conductive composition of the present invention is preferably 0.05 to 5% by weight, and particularly preferably 0.1 to 1% by weight in terms of silver component. If it is less than 0.05% by weight, it is difficult to develop antibacterial properties and electroconductivity, while if it exceeds 5% by weight, the color is deep and the coloring property is increased, and the processing is too time-consuming, which is not preferable.
(c)無機化合物 本発明の無機化合物としては、コロイダルシリカ、コロ
イダルアルミナ、シリカゲル、ゼオライト、活性炭、超
微粒子状の、シリカ、アルミナおよびチタニアからなる
群から選ばれる少なくとも1種の化合物を好ましく使用
する。(C) Inorganic compound As the inorganic compound of the present invention, at least one compound selected from the group consisting of colloidal silica, colloidal alumina, silica gel, zeolite, activated carbon, ultrafine particles of silica, alumina and titania is preferably used. .
これらの無機化合物は、前記(b)コロイダル銀の平均
粒径が5mμ前後の銀成分を大きな表面積をもつ無機化合
物の表面に付着させて銀の抗菌性ならびに導電性を最大
限に発現させることを目的とするものである。These inorganic compounds are used to maximize the antibacterial and electroconductivity of silver by adhering the silver component (b) having an average particle size of colloidal silver of about 5 mμ to the surface of an inorganic compound having a large surface area. It is intended.
次に本発明に使用する無機化合物を成分別に説明する。Next, the inorganic compound used in the present invention will be described for each component.
(コロイダルシリカおよびコロイダルアルミナ) コロイダルシリカは、水またはアルコールを分散媒とし
て無水ケイ酸の超微粒子を水またはアルコール中に分散
させたコロイド溶液で、その粒径は5〜50mμである。
また、その外観は透明性の乳白色膠質液である。(Colloidal Silica and Colloidal Alumina) Colloidal silica is a colloidal solution in which ultrafine particles of silicic acid anhydride are dispersed in water or alcohol using water or alcohol as a dispersion medium, and the particle size thereof is 5 to 50 mμ.
Moreover, its appearance is a transparent milky white colloidal liquid.
コロイダルアルミナは、水を分散媒とするpH2.5〜6の
アルミナゾルであり、アルミナを5〜25重量%含有し、
安定剤として硝酸、塩酸、酢酸などの酸を使用してな
り、その平均粒径が10〜200mμのものである。Colloidal alumina is an alumina sol having a pH of 2.5 to 6 with water as a dispersion medium, containing 5 to 25% by weight of alumina,
An acid such as nitric acid, hydrochloric acid or acetic acid is used as a stabilizer and has an average particle size of 10 to 200 mμ.
(シリカゲル) シリカゲルは、一般式SiO2・nH2Oで表される化合物で、
ガラス状の透明または半透明の粒子で、微細構造が粗シ
ョウをなして、例えば1gのものが450m2以上の大きな表
面積をもつものである。(Silica gel) Silica gel is a compound represented by the general formula SiO 2 · nH 2 O,
The glass-like transparent or translucent particles have a fine structure with a rough show, for example, 1 g has a large surface area of 450 m 2 or more.
(ゼオライト) 本発明におけるゼオライトは、天然または合成ゼオライ
トで、一般式 xM2/nO・Al2O3・ySiO2・zH2O (式中、Mはイオン交換可能な金属イオンを表し、通常
は、1価〜2価の金属であり、nはこの原子価で、xは
金属酸化物の係数、yはシリカの係数、zは結晶水の数
をそれぞれ示す)で表され、その組成比および細孔径、
比表面積などの異なる多くの種類がある。(Zeolite) The zeolite in the present invention is a natural or synthetic zeolite and has a general formula xM 2 / n O · Al 2 O 3 · ySiO 2 · zH 2 O (wherein M represents an ion-exchangeable metal ion, Is a monovalent to divalent metal, n is this valence, x is the coefficient of the metal oxide, y is the coefficient of silica, and z is the number of crystal water, respectively) And pore size,
There are many different types such as specific surface area.
例えば、天然ゼオライトとしては、アナルシン、チャバ
サイト、クリノプチロライト、エリオナイト、フォジャ
サイト、モルデナイトなどがあり、一方、合成ゼオライ
トとしては、A型ゼオライト、X−型ゼオライト、Y−
型ゼオライトなどを挙げることができる。For example, natural zeolites include anarsine, chabazite, clinoptilolite, erionite, faujasite, mordenite and the like, while synthetic zeolites include A-type zeolite, X-type zeolite, Y-type zeolite.
Type zeolite and the like.
好ましくは、表面積が大きく吸着能に優れたゼオライト
であり、天然のモルデナイトまたは前記の合成ゼオライ
トである。Zeolite having a large surface area and excellent adsorption ability is preferable, and natural mordenite or the above synthetic zeolite is preferable.
(活性炭) 活性炭は、有機物質を炭化して得られる炭素物質で黒色
の粒子で、特殊の多孔性構造をもっており、吸着性に優
れている。(Activated carbon) Activated carbon is a carbon substance obtained by carbonizing an organic substance, is black particles, has a special porous structure, and is excellent in adsorptivity.
(超微粒子状の、シリカ、アルミナ、チタニア) 本無機化合物は、精製金属塩の高温加水分解法によって
作成された超微粒子状のシリカ、超微粒子状のアルミ
ナ、または超微粒子状のチタニア(ともに西独、デグサ
社製)を好ましく使用する。(Ultrafine particle silica, alumina, titania) The present inorganic compound is an ultrafine particle silica produced by a high temperature hydrolysis method of a refined metal salt, an ultrafine particle alumina, or an ultrafine particle titania (both in West Germany. , Manufactured by Degussa) are preferably used.
このものは、比表面積(BET法)40〜400m2/g、1次粒子
の平均粒径 7〜40mμを有する。This has a specific surface area (BET method) of 40 to 400 m 2 / g, and an average particle size of primary particles of 7 to 40 mμ.
これらの無機化合物は、本発明の抗菌・導電性組成物中
に無水換算で10〜90重量%、特に40〜80重量%含有され
ていることが好ましい。These inorganic compounds are preferably contained in the antibacterial / conductive composition of the present invention in an amount of 10 to 90% by weight, particularly 40 to 80% by weight, in terms of anhydrous content.
10重量%未満では、コロイダル銀成分を担持する物質が
少なくなり、また生産性が悪くなったりし、一方90重量
%を超えると、相対的にケイ素化合物が少なくなり、結
合力が弱くなったり、また抗菌効果が薄れたりして好ま
しくない。If it is less than 10% by weight, the amount of the substance supporting the colloidal silver component is reduced and the productivity is deteriorated. On the other hand, if it exceeds 90% by weight, the silicon compound is relatively reduced and the bonding strength is weakened. Further, the antibacterial effect is weakened, which is not preferable.
本発明の抗菌・導電性組成物は、有機ケイ素化合物とコ
ロイダル銀ならびに無機化合物を主成分として得られ、
コロイダル銀および無機化合物の存在下に有機ケイ素化
合物を加水分解することが好ましく、この際、有機ケイ
素化合物が水と均一に混合し、加水分解を均一に進める
ための調整剤として親水性有機溶剤を使用することがさ
らに好ましい。The antibacterial / conductive composition of the present invention is obtained by using an organic silicon compound, colloidal silver and an inorganic compound as main components,
It is preferable to hydrolyze the organosilicon compound in the presence of colloidal silver and an inorganic compound. At this time, the organosilicon compound is uniformly mixed with water, and a hydrophilic organic solvent is used as a regulator for uniformly promoting the hydrolysis. It is more preferred to use.
親水性有機溶剤は、コロイダル銀および無機化合物の分
散媒であるとともに、前記有機ケイ素化合物が水によっ
て加水分解された際に極度にゲル化することを防止する
ため、そのほか加水分解物の縮合反応を調節しながら水
分を共沸留去するためのものである。The hydrophilic organic solvent is a dispersion medium for colloidal silver and an inorganic compound, and in order to prevent the organosilicon compound from being extremely gelated when hydrolyzed by water, a condensation reaction of other hydrolysates is performed. It is for azeotropically distilling off water while controlling.
この親水性有機溶剤としては、1価アルコールまたは2
価アルコールであるエチレングリコールもしくはこの誘
導体を挙げることができ、このうち1価アルコールとし
ては炭素数1〜5の低級脂肪族アルコールが好ましく、
具体的にはメタノール、エタノール、n−プロピルアル
コール、i−プロピルアルコール、sec−ブチルアルコ
ール、t−ブチルアルコールなどを挙げることができ、
またエチレングリコールもしくはこの誘導体としてはエ
チレングリコール、エチレングリコールモノブチルエー
テル、酢酸エチレングリコールモノエチルエーテルなど
を挙げることができる。As the hydrophilic organic solvent, monohydric alcohol or 2
Mention may be made of ethylene glycol which is a polyhydric alcohol or a derivative thereof. Among them, a monohydric alcohol is preferably a lower aliphatic alcohol having 1 to 5 carbon atoms,
Specific examples thereof include methanol, ethanol, n-propyl alcohol, i-propyl alcohol, sec-butyl alcohol and t-butyl alcohol,
Examples of ethylene glycol or a derivative thereof include ethylene glycol, ethylene glycol monobutyl ether, and ethylene glycol monoethyl ether acetate.
これらの親水性有機溶剤は、好ましくはi−プロピルア
ルコール、sec−ブチルアルコール、酢酸エチレングリ
コールモノエチルエーテルである。これらの親水性有機
溶剤は、1種でもまた2種以上を併用することもでき
る。These hydrophilic organic solvents are preferably i-propyl alcohol, sec-butyl alcohol and ethylene glycol monoethyl ether acetate. These hydrophilic organic solvents may be used alone or in combination of two or more.
親水性有機溶剤の組成物中における割合は、有機ケイ素
化合物100重量部に対して20〜500重量部、特に50〜150
重量部が好ましく、20重量部未満では有機ケイ素化合物
が水と均一に混合し難く、一方500重量部を超えると相
対的に他の成分が少なくなり、性能が低下したり、生産
性が悪くなったりして好ましくない。The proportion of the hydrophilic organic solvent in the composition is 20 to 500 parts by weight, particularly 50 to 150 parts by weight based on 100 parts by weight of the organosilicon compound.
If the amount is less than 20 parts by weight, it is difficult to uniformly mix the organosilicon compound with water.On the other hand, if it exceeds 500 parts by weight, other components are relatively less, resulting in poor performance or poor productivity. It is not preferable.
また、本発明の抗菌・導電性組成物を調製する際には、
有機ケイ素化合物を加水分解させるために水を存在させ
ることが必要である。When preparing the antibacterial / conductive composition of the present invention,
The presence of water is necessary to hydrolyze the organosilicon compound.
この水としては、通常、前記(b)コロイダル銀中に存
在する水、また無機化合物として水性のコロイダルシリ
カまたはコロイダルアルミナを使用した場合はこの水を
用いることができ、さらに別途、一般水道水、蒸留水あ
るいはイオン交換水を用いることができる。As the water, water present in the (b) colloidal silver is usually used, and when water-based colloidal silica or colloidal alumina is used as the inorganic compound, this water can be used. Distilled water or ion-exchanged water can be used.
水の組成物中における割合は、有機ケイ素化合物100重
量部に対して25〜2,000重量部、特に50〜800重量部が好
ましく、25重量部未満では有機ケイ素化合物の加水分解
が充分に生起しがたく、一方2,000重量部を超えると密
着性が低下し、また生産性が悪くなったりして好ましく
ない。The proportion of water in the composition is 25 to 2,000 parts by weight, particularly preferably 50 to 800 parts by weight, relative to 100 parts by weight of the organosilicon compound, and if less than 25 parts by weight, hydrolysis of the organosilicon compound does not sufficiently occur. On the other hand, if it exceeds 2,000 parts by weight, the adhesiveness is lowered and the productivity is deteriorated, which is not preferable.
本発明の抗菌・導電性組成物には、前記各成分の他に必
要に応じて充填剤あるいは酸を配合することができる。The antibacterial / conductive composition of the present invention may contain a filler or an acid, if necessary, in addition to the above-mentioned components.
ここで、充填剤は、化粧性、熱放射性などを付与するた
めに使用されるもので、例えば有機顔料もしくは無機顔
料である。Here, the filler is used to impart cosmetic properties, heat radiation properties, and the like, and is, for example, an organic pigment or an inorganic pigment.
また、酸は、加水分解触媒として使用されるもので、硝
酸、塩酸、酢酸、マレイン酸、その他の無機酸、有機酸
を挙げることができる。The acid is used as a hydrolysis catalyst, and examples thereof include nitric acid, hydrochloric acid, acetic acid, maleic acid, other inorganic acids and organic acids.
さらに、本発明の抗菌・導電性組成物には、各種界面活
性剤、カップリング剤、キレート剤、アルカリ金属塩
(硬化触媒)、染料などの従来公知のその他の添加剤を
添加することもできる。Further, the antibacterial / conductive composition of the present invention may be added with other conventionally known additives such as various surfactants, coupling agents, chelating agents, alkali metal salts (curing catalysts) and dyes. .
本発明の抗菌・導電性組成物は、まずコロイダル銀を作
成し、これに無機化合物、親水性有機溶剤および有機ケ
イ素化合物を混合して熟成することによりゲル状物を作
成し、これを加熱・乾燥して調製することができる。The antibacterial / conductive composition of the present invention is prepared by first preparing colloidal silver, mixing it with an inorganic compound, a hydrophilic organic solvent and an organic silicon compound and aging to prepare a gel-like material, and heating it. It can be prepared by drying.
本発明の抗菌・導電性組成物を調製する際の具体例とし
ては、例えばコロイダル銀は、硝酸銀の1重量%水溶液
にアンモニアの3重量%水溶液を加え、さらに沈澱した
酸化銀が溶けるまで徐々に加える。この水溶液を水で19
倍に希釈したのち、タンニン酸の3重量%水溶液を数滴
加えて常温または40〜60℃に加温して作成する。このコ
ロイダル銀に、コロイダルシリカ、コロイダルアルミナ
あるいはアルコール、水などを加え、さらにシリカゲ
ル、ゼオライト、活性炭、超微粒子状のシリカ、アルミ
ナまたはチタニアなどを加えて混合し、このように調製
された混合溶液にオルガノアルコキシシランなどの有機
ケイ素化合物を混合して、1,000rpmで約30分撹拌する。As a specific example of preparation of the antibacterial / conductive composition of the present invention, for example, colloidal silver is prepared by adding a 3% by weight aqueous solution of ammonia to a 1% by weight aqueous solution of silver nitrate and gradually dissolving the precipitated silver oxide. Add. This aqueous solution is diluted with water 19
After doubling the dilution, add a few drops of a 3 wt% aqueous solution of tannic acid and warm it to room temperature or 40 to 60 ° C to prepare. To this colloidal silver, colloidal silica, colloidal alumina or alcohol, water, etc. are added, and further silica gel, zeolite, activated carbon, ultrafine particle silica, alumina, titania, etc. are added and mixed, and the mixed solution thus prepared is added. Mix an organosilicon compound such as an organoalkoxysilane and stir at 1,000 rpm for about 30 minutes.
これを常温または低温加熱下で約6時間熟成し、含水ゲ
ルを作成し、得られる含水ゲルを加熱乾燥して最後にボ
ールミルなどで粉砕して本発明の抗菌・導電性ゲル(組
成物)を得ることができる。This is aged at room temperature or low temperature for about 6 hours to prepare a hydrogel, and the hydrogel obtained is dried by heating and finally pulverized with a ball mill or the like to give the antibacterial / conductive gel (composition) of the present invention. Obtainable.
このようにして得られる本発明の抗菌・導電性ゲルの平
均粒径は、特に限定されるものではないが、例えば0.01
〜2μm程度であり、好ましくは0.02〜0.1μmであ
る。本発明の無機化合物(c)としてコロイダルシリ
カ、コロイダルアルミナ、微粒子状の、シリカ、アルミ
ナまたはチタニアを使用した場合は平均粒径が0.01〜0.
1μmくらいになり、無機化合物(c)としてシリカゲ
ル、ゼオライトまたは活性炭を使用した場合は0.05〜2
μmくらいになる。The average particle size of the antibacterial / conductive gel of the present invention thus obtained is not particularly limited, but may be, for example, 0.01
Is about 2 μm, preferably 0.02 to 0.1 μm. When colloidal silica, colloidal alumina, fine particles of silica, alumina or titania is used as the inorganic compound (c) of the present invention, the average particle diameter is 0.01 to 0.
When the silica gel, zeolite or activated carbon is used as the inorganic compound (c), it becomes about 1 μm and is 0.05 to 2
It will be about μm.
本発明の抗菌・導電性組成物は、広い範囲にわたって利
用することができ、例えばあらゆる有機、無機塗料に添
加剤として混入し、抗菌・防カビ、防藻、帯電防止など
の諸機能を付加することが可能である。INDUSTRIAL APPLICABILITY The antibacterial / conductive composition of the present invention can be used over a wide range, for example, it is mixed as an additive in all organic and inorganic coatings to add various functions such as antibacterial / antifungal, antialgal, and antistatic. It is possible.
また、インキ、接着剤、バッキング剤、セメント、石膏
などに混入し、あるいは製紙分野において紙中に漉きこ
むことにより、抗菌性、脱臭性、その他の前記諸機能を
付加することができる。Further, antibacterial properties, deodorizing properties, and other functions described above can be added by mixing with ink, adhesive, backing agent, cement, gypsum, or the like, or by squeezing into the paper in the papermaking field.
さらに、本発明の組成物を医薬品、化粧品に使用するこ
とにより、抗菌性、紫外線吸収性などを付加することが
できる。しかも、本発明の抗菌・導電性組成物は超微粒
子となすことができ、吸油(水)を率が小さく、分散性
に優れているため、前記各種材料に対して均一に分散
し、少量でも抗菌性その他の諸機能が斑なく均一に発現
される。Furthermore, by using the composition of the present invention for medicines and cosmetics, antibacterial properties, ultraviolet absorption properties and the like can be added. Moreover, the antibacterial / conductive composition of the present invention can be formed into ultrafine particles, has a small oil absorption (water) ratio, and has excellent dispersibility, so that it can be uniformly dispersed in various materials described above and even in a small amount. Antibacterial and various other functions are uniformly expressed.
さらに、着色力の非常に小さいものができるので透明に
することもできる。Furthermore, it can be made transparent because it has a very small coloring power.
また、本発明の抗菌・導電性組成物は、コーテイング組
成物として利用することができ、例えばフィルム、繊
維、板、容器、その他あらゆる形状の樹脂成形品の表面
にコートして導電(帯電防止)・抗菌性樹脂製品を得る
ことができる。さらに、天然繊維、紙または金属などの
抗菌化;導電性ガラス、防曇性ガラスまたは導電性セラ
ミックスの製造;抗菌性セメント材、抗菌・帯電防止性
皮革または抗菌性砂の製造などに利用することができ
る。Further, the antibacterial / conductive composition of the present invention can be used as a coating composition. For example, a film, a fiber, a plate, a container, or other surface of a resin molded article of any shape is coated with a conductive material (antistatic).・ It is possible to obtain antibacterial resin products. In addition, antibacterialization of natural fiber, paper or metal; production of conductive glass, anti-fog glass or conductive ceramics; use for production of antibacterial cement material, antibacterial / antistatic leather or antibacterial sand You can
次に、本発明の抗菌・導電性樹脂組成物は、前記抗菌・
導電性組成物を樹脂中に含有させてなるものである。Next, the antibacterial / conductive resin composition of the present invention is
The conductive composition is contained in a resin.
この抗菌・導電性樹脂組成物は、恒久的な抗菌・防カビ
性能を有し、さらに導電性の付与により恒久的に帯電防
止ができるものである。このほかにも吸湿・乾燥性の改
良により結露防止に寄与することも可能である。The antibacterial / conductive resin composition has permanent antibacterial / antifungal properties, and can impart antistatic property to impart permanent antistatic properties. In addition to this, it is possible to contribute to the prevention of dew condensation by improving the moisture absorption and drying properties.
この樹脂としては、アクリル樹脂、塩化ビニル樹脂、ポ
リ塩化ビニリデン、ABS樹脂、エポキシ樹脂、ウレタン
樹脂、ポリアミド、ポリエステル、ポリエチレン、ポリ
プロピレン、ポリスチレン、ポリアセタール、ポリビニ
ルアルコール、ポリカーボネート、フッ素樹脂、ポリエ
ステルエラストマー、ポリアミドエラストマー、フェノ
ール樹脂、不飽和ポリエステル樹脂、メラミン樹脂、ユ
リア樹脂、ジアセテート、トリアセテート、キュプラ、
レーヨン、天然ゴム、スチレン−ブタジエンゴム、ブタ
ジエンゴム、ポリイソプレン、クロロプレンゴムなどの
合成ゴムなどの熱可塑性あるいは熱硬化性樹脂を挙げる
ことができる。This resin includes acrylic resin, vinyl chloride resin, polyvinylidene chloride, ABS resin, epoxy resin, urethane resin, polyamide, polyester, polyethylene, polypropylene, polystyrene, polyacetal, polyvinyl alcohol, polycarbonate, fluororesin, polyester elastomer, polyamide elastomer. , Phenol resin, unsaturated polyester resin, melamine resin, urea resin, diacetate, triacetate, cupra,
Thermoplastic or thermosetting resins such as rayon, natural rubber, styrene-butadiene rubber, butadiene rubber, polyisoprene and synthetic rubber such as chloroprene rubber can be mentioned.
この抗菌・導電性組成物の樹脂中への混合は、原料モノ
マーあるいは反応中間体に混合したのち重合する方法、
重合終了後のポリマーに混練りする方法、ポリマーペレ
ットと混合する方法、成形用ドープに混合する方法など
が挙げられるが、これらの方法に限定されるものではな
い。The mixing of the antibacterial / conductive composition into the resin is carried out by mixing the raw material monomers or reaction intermediates and then polymerizing,
Examples of the method include, but are not limited to, a method of kneading with a polymer after completion of polymerization, a method of mixing with polymer pellets, a method of mixing with a molding dope, and the like.
この抗菌・導電性組成物の抗菌・導電性樹脂組成物中に
おける割合は、通常、0.02〜30重量%、特に0.5〜10重
量%が好ましく、0.02重量%未満では抗菌性、導電性が
発現し難く、一方30重量%を超えると樹脂の特性が失わ
れたり、コストが上昇しすぎたりして好ましくない。The proportion of the antibacterial / conductive composition in the antibacterial / conductive resin composition is usually 0.02 to 30% by weight, particularly preferably 0.5 to 10% by weight, and if less than 0.02% by weight, antibacterial properties and conductivity are expressed. On the other hand, if it exceeds 30% by weight, the characteristics of the resin are lost and the cost rises too much, which is not preferable.
このようにして得られる抗菌・導電性樹脂組成物は、種
々の形態、例えばフィルム、繊維、板、容器、粒状など
に成形することができ、例えば家庭用品(料理用、バス
用などの器具など)、建材、ラップ、パイプ類、農業用
袋やフィルム、あらゆる繊維製品(洋服、靴下、肌着、
ハンカチ、タオル、寝具など)、その他のあらゆる産業
分野において利用される。The antibacterial / conductive resin composition thus obtained can be formed into various forms, for example, films, fibers, plates, containers, granules, and the like. For example, household products (apparatus for cooking, baths, etc.) ), Building materials, wraps, pipes, agricultural bags and films, all textile products (clothes, socks, underwear,
Handkerchiefs, towels, bedding, etc.) and all other industrial fields.
以下、実施例を挙げ本発明をさらに具体的に説明する
が、本発明は特許請求の範囲を越えない限り、以下の実
施例に限定されるものではない。EXAMPLES Hereinafter, the present invention will be described in more detail with reference to examples, but the present invention is not limited to the following examples unless it exceeds the scope of the claims.
なお、実施例中、部および%は、特に断らない限り重量
基準である。In the examples, parts and% are based on weight unless otherwise specified.
参考例 抗菌性、防カビ性、導電性、耐熱性、不溶出性などを調
べるため、第1表に示すA〜Fの6種類の配合物と、比
較例として配合物Gを作製した。Reference Example In order to investigate antibacterial properties, antifungal properties, electrical conductivity, heat resistance, non-elution property, etc., 6 kinds of compounds A to F shown in Table 1 and a compound G were prepared as comparative examples.
ここで、配合物Aは、ステンレス製容器中に、コロイダ
ル銀−1を300部と水300部およびイソプロパノール130
部と水性コロイダルシリカ(pH;2.5)を70部入れ、軽く
撹拌したのち、超微粒子状アルミナ20部とシリカゲル80
部を入れ約10分間撹拌した。この混合液を1時間加熱し
て濃縮液にしたのち、メチルトリメトキシシランを100
部加え、約10分間撹拌して5時間、室温で熟成させた。Here, the compound A is 300 parts of colloidal silver-1, 300 parts of water and 130 parts of isopropanol in a stainless steel container.
Part and 70 parts of aqueous colloidal silica (pH; 2.5), and after light stirring, 20 parts of ultrafine particulate alumina and 80 parts of silica gel
The mixture was put in and stirred for about 10 minutes. The mixture is heated for 1 hour to form a concentrated solution, and then methyltrimethoxysilane is added to 100%.
Then, the mixture was stirred for about 10 minutes and aged for 5 hours at room temperature.
次いで、これを300℃で2時間、加熱して乾燥ゲルを作
製した。この乾燥ゲルをボールミルで2時間粉砕して抗
菌・導電性ゲルを作製した。Then, this was heated at 300 ° C. for 2 hours to prepare a dry gel. The dried gel was crushed with a ball mill for 2 hours to prepare an antibacterial / conductive gel.
配合物B〜Fおよび配合物Gも、同様にして作製した。Formulations B-F and Formulation G were made similarly.
このようにして得られた抗菌・導電性ゲルの一次粒子の
平均径、比表面積、見掛け比重、銀含有量を第2表に示
す。なお、一次粒子の平均径は5万倍の電子顕微鏡写真
により、比表面積はBET法により、見掛け比重は当た
りの重量により、銀含有量は定量分析により測定した。 Table 2 shows the average diameter, specific surface area, apparent specific gravity, and silver content of the primary particles of the antibacterial / conductive gel thus obtained. The average diameter of the primary particles was measured by an electron microscope photograph of 50,000 times, the specific surface area was measured by the BET method, the apparent specific gravity was measured by the weight per unit, and the silver content was measured by the quantitative analysis.
実施例1 抗菌・導電性組成物の抗菌力を調べるため第2表の抗菌
・導電性ゲルをテストピースとし、これらの細菌に対す
る最小発育阻止濃度を測定した。 Example 1 In order to examine the antibacterial activity of the antibacterial / conductive composition, the antibacterial / conductive gel shown in Table 2 was used as a test piece, and the minimum inhibitory concentration against these bacteria was measured.
試験方法は、任意濃度にテストピースを添加した液体培
地に接種用菌液を接種培養後、発育が阻止される最低濃
度をもって最小発育阻止濃度とした。As a test method, the minimum growth inhibitory concentration was defined as the lowest concentration at which growth was inhibited after inoculating and culturing a liquid medium containing a test piece at an arbitrary concentration.
なお、増菌用培地は、Mueller Hinton Broth(Difco社
製)、測定用培地は、0.05%トリトンX−100添加 Muel
ler Hinton Broth(Difco社製)とし、測定用培地10ml
にテストピースを任意量添加後、滅菌し、感受性測定用
培地とした。The medium for enrichment was Mueller Hinton Broth (manufactured by Difco), and the medium for measurement was Muel with 0.05% Triton X-100.
ler Hinton Broth (manufactured by Difco), measuring medium 10 ml
After adding an arbitrary amount of the test piece, it was sterilized to obtain a sensitivity measurement medium.
また、接種用菌液は、継代培養した試験液を増菌用培地
に接触し、37℃、18〜20時間培養後、菌数が約106/mlに
なるように増菌用培地で希釈して作成し、培養は感受性
測定用培地に接種用菌液0.1mlを添加後、35〜37℃で1
〜2日振とう培養した。For the inoculum bacterial solution, subculture the test solution in contact with the enrichment medium, incubate at 37 ° C for 18 to 20 hours, and in the enrichment medium so that the number of bacteria is about 10 6 / ml. Diluted and prepared, the culture is made by adding 0.1 ml of bacterial solution for inoculation to the medium for sensitivity measurement, and
Shake culture was performed for 2 days.
この試験結果を第3表−1に示す。The test results are shown in Table 3-1.
また、抗菌・導電性組成物の抗菌力の持続性を調べるた
めに、第2表の抗菌・導電性ゲルのうちA′、B′、
C′の3種を30日間水道水に浸漬し、その後2時間煮沸
し、常温下で乾燥した。In addition, in order to examine the antibacterial activity of the antibacterial / conductive composition, A ', B', among the antibacterial / conductive gels in Table 2 were used.
The three C's were immersed in tap water for 30 days, then boiled for 2 hours and dried at room temperature.
これを用いて前記の試験方法により細菌に対する最小発
育阻止濃度を測定した。Using this, the minimum inhibitory concentration against bacteria was measured by the above-mentioned test method.
この試験結果を第3表−2に示す。The test results are shown in Table 3-2.
実施例2 抗菌・導電性樹脂組成物の抗菌力を調べるため、樹脂に
抗菌・導電性ゲルを添加混合し、各種の抗菌・導電性樹
脂組成物のテストピースを作成した。作成方法は次の通
りである。 Example 2 In order to investigate the antibacterial activity of the antibacterial / conductive resin composition, antibacterial / conductive gel was added to and mixed with the resin to prepare test pieces of various antibacterial / conductive resin compositions. The creation method is as follows.
(1)フィルム:インフレーション成形法により作成し
た。(1) Film: Created by an inflation molding method.
(2)角板:圧縮成形法により作成した。(2) Square plate: Created by the compression molding method.
(3)織布:常法に従い、溶融紡糸後延伸し、該延伸糸
を精練、織布した。(3) Woven fabric: Melt-spun and drawn according to a conventional method, and the drawn yarn was scoured and woven.
(4)塗膜:酢酸ビニル系塗料に抗菌・導電性ゲルを
添加、混合し、アルミニウム板に塗布した。(4) Coating film: An antibacterial / conductive gel was added to a vinyl acetate paint, mixed, and applied to an aluminum plate.
塗膜:ウレタン樹脂系塗料に抗菌・導電性ゲルを添
加、混合し、靴皮に塗布した。Coating film: An antibacterial / conductive gel was added to a urethane resin-based paint, mixed, and applied to the shoe skin.
該テストピースの内容を第4表に示す。Table 4 shows the contents of the test piece.
第4表中、抗菌・導電性ゲルの添加量の単位は%であ
る。In Table 4, the unit of the addition amount of the antibacterial / conductive gel is%.
次に、第4表のテストピース1〜16を用いて抗菌力試験
を実施した。 Next, an antibacterial activity test was conducted using the test pieces 1 to 16 shown in Table 4.
試験方法は、つぎのとおりである。The test method is as follows.
テストピースにEscherichia coli IFO 3301(大腸
菌)、Staphylococcus aureus IFO 12732(黄色ブドウ
球菌)、Aspergillus niger IFO 4407(黒麹かび)の菌
液を滴下して、細菌は37℃、真菌は30℃で保存し、6お
よび24時間後に細菌はSCDLP液体培地、真菌はGPLP液体
培地でテストピースの菌を洗い出し、洗液を試験液とし
た。Escherichia coli IFO 3301 (Escherichia coli), Staphylococcus aureus IFO 12732 (Staphylococcus aureus), Aspergillus niger IFO 4407 (Koji mold) were added dropwise to the test piece, and the bacteria were stored at 37 ℃ and the fungus was stored at 30 ℃. After 6 and 24 hours, bacteria were washed out from the test piece with SCDLP liquid medium and bacteria with GPLP liquid medium, and the washings were used as test solutions.
この試験液について菌数測定用培地による混釈平板培養
法(細菌:37℃2日間、真菌:25℃7日間)により生存菌
数を測定して、試験片1枚当たりの生菌数に換算した。The number of surviving cells of this test solution was measured by the pour plate culture method (bacteria: 37 ° C for 2 days, fungus: 25 ° C for 7 days) using a culture medium for measuring the number of viable cells per test piece. did.
この試験結果を第5表−1(使用菌名:大腸菌)、第5
表−2(使用菌名:黄色ブドウ球菌)ならびに第5表−
3(使用菌名:黒麹かび)に示す。The test results are shown in Table 5-1 (use bacteria name: E. coli), No. 5
Table-2 (use bacteria name: Staphylococcus aureus) and Table 5
3 (name of bacterium used: black koji mold).
実施例3 本発明の抗菌・導電性組成物の導電性を調べるため、第
2表の各種抗菌・導電性ゲルを用いて100kg/cm2でプレ
スして30×10×5mmのテストピースを作成し、このテス
トピースの体積固有抵抗値(Ω・cm)を測定した。 Example 3 In order to investigate the conductivity of the antibacterial / conductive composition of the present invention, a 30 × 10 × 5 mm test piece was prepared by pressing at 100 kg / cm 2 using various antibacterial / conductive gels shown in Table 2. Then, the volume specific resistance value (Ω · cm) of this test piece was measured.
また、第4表のテストピース中より選択し、この表面抵
抗値(Ω・cm)を測定した。The surface resistance value (Ω · cm) was measured by selecting from the test pieces in Table 4.
この結果を第6表に示す。The results are shown in Table 6.
実施例4 本発明の抗菌・導電性組成物の不溶出性ならびに水中に
おける抗菌性を調べるため、第2表の抗菌・導電性ゲル
B′を用いて、次の方法により試験を行った。 Example 4 In order to examine the insolubility of the antibacterial / conductive composition of the present invention and the antibacterial property in water, an antibacterial / conductive gel B ′ shown in Table 2 was used to perform a test by the following method.
(不溶出性) 水道法の水質基準(昭和53年厚生省令第56号)の試験方
法を用いて、塩素イオン、有機物質(過マンガン酸カリ
消費量)、一般細菌、大腸菌群、銅、鉄、銀、鉛、カド
ミウム、pH値、濁度を測定した。(No elution) Chloride ions, organic substances (potassium permanganate consumption), general bacteria, coliforms, copper, iron using the test method of the water quality standard of the Water Supply Act (Ministry of Health and Welfare Ordinance No. 56 of 1978) , Silver, lead, cadmium, pH value and turbidity were measured.
試験水の調製方法は、抗菌・導電性ゲル200gを水道水4
中に浸漬させ、室温で放置し、24時間経過時に上澄み
液を採取した。また、対照として同一の水道水を同一条
件で保管して、24時間経過時に全量を採取した。Test water is prepared by adding 200 g of antibacterial / conductive gel to tap water 4
The sample was immersed in the solution, allowed to stand at room temperature, and a supernatant was collected after 24 hours. As a control, the same tap water was stored under the same conditions, and the whole amount was collected after 24 hours.
この試験結果を第7表−1に示す。The test results are shown in Table 7-1.
(水中における抗菌性) 第2表の抗菌・導電性ゲルB′および比較例としてG′
を2%(重量/容積)を添加したイオン交換水に、Esch
erichia coli IFO 3301(大腸菌)あるいはPseudomonas
aeruginosa IFO 13275(緑膿菌)の菌液を添加して、3
0℃で保存し、6および24時間後の生菌数を測定した。 (Antibacterial property in water) Antibacterial / conductive gel B'in Table 2 and G'as a comparative example
To 2% (weight / volume) of deionized water,
erichia coli IFO 3301 or Pseudomonas
aeruginosa IFO 13275 (Pseudomonas aeruginosa)
It was stored at 0 ° C., and the viable cell count was measured after 6 and 24 hours.
菌数測定は、標準寒天培地を用いた混釈平板培養法によ
り測定した。The bacterial count was measured by the pour plate culture method using a standard agar medium.
なお、培養は、35℃、48時間とした。The culture was carried out at 35 ° C for 48 hours.
この試験結果を第7表−2に示す。The test results are shown in Table 7-2.
ただし、表中、「1以下」は、本試験で用いた菌数測定
法の測定限界によるもので、菌が検出されなかったこと
を意味する。 However, in the table, "1 or less" means that no bacterium was detected because it was due to the measurement limit of the microbial count method used in this test.
実施例5 本発明の抗菌・導電性組成物の耐熱性、耐沸騰水性、お
よび耐薬品性を調べるため、第2表の抗菌・導電性ゲル
B′とD′の2種を用いて、つぎの方法により試験を行
った。Example 5 In order to examine the heat resistance, boiling water resistance, and chemical resistance of the antibacterial / conductive composition of the present invention, two kinds of antibacterial / conductive gels B'and D'in Table 2 were used. The test was carried out by the method of.
さらに該ゲルを用いて抗菌力を調べるため、実施例1と
同様の方法で細菌に対する最小発育阻止濃度を測定し
た。Further, in order to examine the antibacterial activity using the gel, the minimum inhibitory concentration against bacteria was measured by the same method as in Example 1.
(耐熱性) テストピースを電気炉に入れ、500℃で3時間保存し、
外観を観察した。(Heat resistance) Put the test piece in an electric furnace and store it at 500 ℃ for 3 hours.
The appearance was observed.
(耐沸騰水性) テストピース2%(重量/容量)を水道水に入れ、3時
間煮沸し、外観を観察した。(Boiling resistance) A test piece of 2% (weight / volume) was placed in tap water and boiled for 3 hours, and the appearance was observed.
なお、蒸発した水と同量の水は水道水の沸騰水を随時注
入した。In addition, boiling water of tap water was injected as needed as the same amount of water as the evaporated water.
(耐薬品性) (1)トルエン、キシレン、メチルエチルケトン、アセ
トン、酢酸エチルの混合溶液にテストピースを2%(重
量/容量)混入し、24時間浸漬した。(Chemical resistance) (1) A test piece of 2% (weight / volume) was mixed in a mixed solution of toluene, xylene, methyl ethyl ketone, acetone, and ethyl acetate, and immersed for 24 hours.
(2)2%の硝酸溶液にテストピースを2%(重量/容
量)混入し、24時間浸漬した。(2) A test piece of 2% (weight / volume) was mixed in a 2% nitric acid solution and immersed for 24 hours.
(3)2%の苛性ソーダ溶液にテストピースを2%(重
量/容量)混入し、24時間浸漬した。(3) A test piece of 2% (weight / volume) was mixed in a 2% caustic soda solution and immersed for 24 hours.
以上(1)、(2)、(3)のテストピースの外観を観
察した。The appearance of the test pieces of (1), (2), and (3) above was observed.
この試験結果を第8表−1に、また、該テストピースの
細菌に対する最小発育阻止濃度の測定結果を第8表−2
に示す。The test results are shown in Table 8 and the measurement results of the minimum inhibitory concentration of the test piece against bacteria are shown in Table 8-2.
Shown in.
〔発明の効果〕 以上のように、本発明の抗菌・導電性組成物および抗菌
・導電性樹脂組成物の主な特徴は、下記のとおりであ
る。 [Effects of the Invention] As described above, the main features of the antibacterial / conductive composition and the antibacterial / conductive resin composition of the present invention are as follows.
(1)一般細菌やカビに対し、優れた抗菌性能を長期間
にわたって持続する。(1) An excellent antibacterial performance is maintained for a long period of time against general bacteria and mold.
(2)良導体である銀の性能を長期にわたって持続す
る。(2) The performance of silver, which is a good conductor, is maintained for a long time.
(3)樹脂やゴムならびに樹脂系の塗料やインキ、接着
剤、目地剤、バッキング材に少量添加するだけで、抗菌
性ならびに導電性(帯電防止性)にすることができる。(3) Antibacterial properties and electroconductivity (antistatic properties) can be obtained by adding a small amount to resins and rubbers, resin-based paints and inks, adhesives, joints and backing materials.
(4)セメント、無機系コーテイング剤、石膏、紙、化
粧品その他の材料に少量添加するだけで、抗菌性ならび
に導電性にすることができる。(4) Antibacterial and conductive properties can be obtained by adding a small amount to cement, an inorganic coating agent, gypsum, paper, cosmetics and other materials.
(5)耐熱性に優れ、500℃の高温下でガスの発生や変
色が全くなく、性能劣化しない。(5) It has excellent heat resistance, no gas generation or discoloration at a high temperature of 500 ° C, and no performance deterioration.
(6)微粒子状で分散性が良く、各種材料に均一に分散
する。また、着色性が小さく(添加量により殆ど透明に
なる)材料の外観を損なうことがない。(6) It is in the form of fine particles, has good dispersibility, and is uniformly dispersed in various materials. Further, the coloring property is small (it becomes almost transparent depending on the added amount), and the appearance of the material is not damaged.
(7)耐沸騰水性、耐薬品性、耐候性に優れ、耐摩耗性
も良い。(7) Excellent boiling water resistance, chemical resistance, weather resistance, and good abrasion resistance.
(8)溶出がなく、毒性も殆ど無視できるので、その用
途が広い。(8) It has no elution, and its toxicity is almost negligible, so its versatility is wide.
(9)多孔質で表面積が大きく、脱臭性に優れ、その効
果は長期間にわたって持続する。(9) It is porous, has a large surface area, is excellent in deodorizing property, and its effect lasts for a long time.
(10)水中に少量混入すると、水全体が抗菌性になりし
かも長期間にわたってその効果が持続する。(10) When mixed in water in a small amount, the entire water becomes antibacterial and its effect lasts for a long time.
また、本発明の抗菌・導電性組成物は、コーテイング組
成物として以下の如き特性を有する。The antibacterial / conductive composition of the present invention has the following characteristics as a coating composition.
(1)透明または半透明の導電性および抗菌性の薄膜を
つくる。(1) A transparent or semitransparent conductive and antibacterial thin film is formed.
(2)耐熱性、耐水性、耐候性、耐薬品性、硬度に優れ
た膜が得られる。(2) A film having excellent heat resistance, water resistance, weather resistance, chemical resistance, and hardness can be obtained.
(3)プラスチック、金属、ガラス、セメント、繊維、
皮革、紙、砂その他あらゆる基材にコーテイングするこ
とができる。(3) Plastic, metal, glass, cement, fiber,
It can be coated on leather, paper, sand and any other substrate.
(4)低温(60〜300℃)で短時間(1〜60分)の加熱
により硬化する。(4) It is cured by heating at low temperature (60 to 300 ° C.) for a short time (1 to 60 minutes).
これにより、本発明は、衣食住関連品から工業製品の
他、医療用、農業、漁業用その他広範囲の各種製品を提
供することができるなど数数の利点を有し、工業的意義
は極めて大である。As a result, the present invention has a number of advantages such as being able to provide a wide variety of products such as medical, agricultural, and fishery products in addition to clothing, food and housing related products, as well as industrial products, and has an extremely great industrial significance. is there.
フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 C08L 101/00 LSY 7242−4J C09D 5/14 PQM 6904−4J 5/24 PQW 7211−4J C09J 9/02 JAR 7415−4J 11/02 JAU 7415−4J C09K 3/16 102 B Continuation of the front page (51) Int.Cl. 5 Identification number Office reference number FI Technical display location C08L 101/00 LSY 7242-4J C09D 5/14 PQM 6904-4J 5/24 PQW 7211-4J C09J 9/02 JAR 7415-4J 11/02 JAU 7415-4J C09K 3/16 102 B
Claims (2)
素数1〜5の炭化水素残基を示す)で表されるテトラア
ルコキシシランおよび一般式R2Si(OR3)3(式中、R2
は炭素数1〜8の有機基、R3は炭素数1〜5のアルキル
基または炭素数1〜4のアシル基を示す)で表されるオ
ルガノアルコキシシランから選ばれる少なくとも1種の
有機ケイ素化合物を固形分換算で3〜50重量%、 (b)コロイダル銀を銀成分換算で0.05〜5重量%、お
よび (c)コロイダルシリカ、コロイダルアルミナ、シリカ
ゲル、ゼオライト、活性炭、超微粒子状の、シリカ、ア
ルミナおよびチタニアよりなる群から選ばれる少なくと
も1種の無機化合物を無水換算で10〜90重量% を主成分とする抗菌・導電性組成物。1. A tetraalkoxysilane represented by the general formula Si (OR 1 ) 4 (wherein R 1 represents a hydrocarbon residue having 1 to 5 carbon atoms) and a general formula R 2 Si ( OR 3 ) 3 (In the formula, R 2
Is an organic group having 1 to 8 carbon atoms, R 3 is an alkyl group having 1 to 5 carbon atoms or an acyl group having 1 to 4 carbon atoms), and at least one organic silicon compound selected from organoalkoxysilanes 3 to 50% by weight in terms of solid content, (b) 0.05 to 5% by weight in terms of silver component of colloidal silver, and (c) colloidal silica, colloidal alumina, silica gel, zeolite, activated carbon, ultrafine particles of silica, An antibacterial / conductive composition containing, as a main component, at least one inorganic compound selected from the group consisting of alumina and titania in an amount of 10 to 90% by weight on an anhydrous basis.
〜30重量%含有してなる抗菌・導電性樹脂組成物。2. The antibacterial / conductive composition according to claim 1, which is 0.02.
An antibacterial / conductive resin composition containing up to 30% by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1260127A JPH0686571B2 (en) | 1989-10-06 | 1989-10-06 | Antibacterial / conductive composition and antibacterial / conductive resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1260127A JPH0686571B2 (en) | 1989-10-06 | 1989-10-06 | Antibacterial / conductive composition and antibacterial / conductive resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03122162A JPH03122162A (en) | 1991-05-24 |
| JPH0686571B2 true JPH0686571B2 (en) | 1994-11-02 |
Family
ID=17343671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1260127A Expired - Fee Related JPH0686571B2 (en) | 1989-10-06 | 1989-10-06 | Antibacterial / conductive composition and antibacterial / conductive resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0686571B2 (en) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2618287B2 (en) * | 1990-11-06 | 1997-06-11 | 日本ゼオン株式会社 | Photoreactive harmful substance remover and harmful substance removal method using the same |
| JP2578273B2 (en) * | 1991-08-22 | 1997-02-05 | 第一工業製薬株式会社 | Method for manufacturing multilayer electrode substrate |
| JP3095106B2 (en) * | 1994-03-22 | 2000-10-03 | 住友ベークライト株式会社 | Conductive resin paste |
| DE19936059A1 (en) | 1999-07-30 | 2001-02-01 | J Peter Guggenbichler | Production of antimicrobial plastic articles, especially catheters, involves pretreatment with colloidal metal, especially colloidal silver, before the final moulding process |
| EP1210386B2 (en) * | 1999-07-30 | 2014-10-29 | J. Peter Guggenbichler | Method of producing antimicrobial synthetic bodies with improved long-term behavior |
| WO2005019096A1 (en) | 2003-08-23 | 2005-03-03 | Chul-Sang Jeong | Nanocomposite solution with complex function and method for preparation thereof |
| KR100568611B1 (en) * | 2005-09-23 | 2006-04-07 | 주식회사 엘지화학 | Functional interior materials and its manufacturing method |
| JP5298401B2 (en) * | 2005-10-04 | 2013-09-25 | 旭硝子株式会社 | Method for producing inorganic coating composition, hydrophilic coating film and agricultural film |
| JP4965232B2 (en) * | 2006-11-27 | 2012-07-04 | ナミックス株式会社 | Conductive paste |
| JP2009035620A (en) * | 2007-08-01 | 2009-02-19 | Nobumasa Okuda | Silicone coating composition and preparation method of the same |
| JP2010184958A (en) * | 2009-02-10 | 2010-08-26 | Fukuokaken Sukoyaka Kenko Jigyodan | Coating composition |
| WO2016047568A1 (en) * | 2014-09-22 | 2016-03-31 | 富士フイルム株式会社 | Antibacterial sheet, antibacterial coat, laminated body, and antibacterial fluid |
| JP6388888B2 (en) * | 2016-02-05 | 2018-09-12 | 国立大学法人徳島大学 | Coating composition |
| KR101876145B1 (en) * | 2017-11-21 | 2018-07-06 | 강은영 | Preparing method of carrier with controlled release rate of medicaments |
| FR3091876B1 (en) * | 2019-01-21 | 2024-08-30 | Seb Sa | INDUCTION COMPATIBLE SOL-GEL COATING |
| DE102021205475A1 (en) * | 2021-05-28 | 2022-12-01 | FNT-GmbH | Antimicrobial composition, method of making an antimicrobial composition and use of an antimicrobial composition |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58129072A (en) * | 1982-01-28 | 1983-08-01 | Sutaaraito Kogyo Kk | Electrically conductive primer composition |
| JPS59223735A (en) * | 1983-06-02 | 1984-12-15 | Mitsui Petrochem Ind Ltd | Electroconductive resin composition |
| JPS627747A (en) * | 1985-07-04 | 1987-01-14 | Kanebo Ltd | Hydrophobic antifungal zeolite composition coated with silicone film and its production |
-
1989
- 1989-10-06 JP JP1260127A patent/JPH0686571B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03122162A (en) | 1991-05-24 |
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