JPH0677683A - Electrical circuit substrate - Google Patents

Abstract

(57) [Abstract] [Purpose] When mounting a module assembly that has a chassis on an electric circuit board, mount the module assembly on a common chassis regardless of the presence of electrical components between the module assembly and the board. I will. [Structure] A module assembly 11 in which steps A and B are provided on a mounting foot 13a of a chassis 13 is formed, and a module assembly 1
When the electrical component is not wired between 1 and the substrate 14, the mounting foot 13a is inserted into the mounting hole 15 provided in the substrate 14 and mounted so that the step B is placed on the substrate 14. When wiring the resistor 16 and the capacitor 17 between the module assembly 11 and the substrate 14, the mounting hole 1 provided in the substrate 14
The mounting foot 13a is inserted into 5a and mounted so that the step A is placed on the substrate 14. [Effect] Since the number of parts is reduced by using the common chassis, the parts storage location can be effectively used, and the time and effort at the time of ordering and shipping the parts are greatly reduced.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a module mounted on a board, and more particularly to a module mounting chassis.

[0002]

2. Description of the Related Art When mounting a module assembly 1 on a board as shown in FIG. 5 and no parts are placed on the board 3 on the back side of the modulator 2, a chassis 4 having short mounting legs 4a as shown in FIG. Further, when the electrical components such as the resistor 5 and the capacitor 6 are mounted on the substrate 3 on the back side of the modulator 2 as shown in FIG. 7, the chassis 7 having long mounting legs 7a as shown in FIG. 8 is used.

[0003]

As described above, two types of chassis with different mounting legs are prepared depending on the presence or absence of electrical components to be mounted on the substrate on the back side of the modulator. Two types of module assembly were needed.

Therefore, as component management, it is necessary to manage module assemblies having the same modulator but different mounting feet, which results in a very large number of managements, and there are problems such as incorrect component generation, shipment, and mounting.

[0005]

In order to solve the above problems, the present invention provides a chassis with mounting feet having a plurality of steps for adjusting the height of a module assembly. The mounting hole corresponding to the shape of is provided in the substrate.

[0006]

The number of parts management is reduced by half by using the common chassis even if the mounting height of the module assembly is different.

[0007]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is an external perspective view of a module assembly of the present invention, FIG. 2 is a diagram showing how the module assembly is mounted on a substrate when no electrical component is mounted on the back surface of the modulator, and FIG. It is an attachment state figure to a substrate at the time of carrying.

Reference numeral 11 is a module assembly having a modulator 12 and a chassis 13. On both sides of the chassis 13, mounting feet 13 a, 13 a for mounting the module assembly 11 on the board 14 are provided. As shown in FIG. 4, the mounting foot 13a is provided with two mounting steps A and B symmetrically.

If no electrical components are wired on the substrate 14 on the back surface of the modulator 12, a hole 15 for inserting the width L of the mounting foot 13a is provided on the substrate 14 so that the step B of the mounting foot 13a is placed. .

On the other hand, the substrate 14 on the back surface of the modulator 12
When wiring the electrical components such as the resistor 16 and the capacitor 17, the board 15 is provided with a hole 15a into which the width L ₁ of the mounting foot 13a is inserted so that the step A of the mounting foot 13a is placed.
In any of the above cases, after mounting the chassis 13 on the board 14, the mounting feet 13a are fixed from the back side of the board 14 by soldering or the like.

[0011]

Since the present invention is constructed as described in the above embodiments, it has the following effects. By providing two mounting steps on the chassis mounting feet, a common chassis can be used without replacing the chassis even if electrode parts such as resistors and capacitors are wired on the substrate on the back of the modulator. The number of managed parts is halved.

As a result, parts management is facilitated, the storage location of parts can be effectively used, and the time and effort for ordering and shipping parts are greatly reduced.

Also in the assembly process, component mounting errors are greatly reduced, and quality and workability are improved.

[Brief description of drawings]

FIG. 1 is an external perspective view of a module assembly according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of the essential parts of an embodiment in which the module assembly of the present invention is attached to a substrate.

FIG. 3 is a cross-sectional view of essential parts of another embodiment for attaching the module assembly of the present invention to a substrate.

FIG. 4 is an enlarged front view illustrating a chassis mounting foot of the present invention.

FIG. 5 is a cross-sectional view of an essential part of an embodiment for attaching a conventional module assembly to a substrate.

FIG. 6 is a front view of the module assembly.

FIG. 7 is a cross-sectional view of an essential part of another embodiment for attaching a conventional module assembly to a board.

FIG. 8 is a front view of the same module assembly.

[Explanation of symbols]

11 Module Assembly 13 Chassis 13a Mounting Feet 14 Board 15,15a Mounting Holes A, B Mounting Steps L, L ₁ Mounting Feet Width

Claims (1)

[Claims] 1. An electric circuit board in which a module having a shield case is mounted on a board in an inverted chassis, and a plurality of steps are provided on the mounting feet of the chassis, and mounting holes matching the shape of the mounting feet are provided. An electric circuit board provided on the board.