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JPH0671120B2 - Optical integrated device - Google Patents

Optical integrated device

Info

Publication number
JPH0671120B2
JPH0671120B2 JP9940187A JP9940187A JPH0671120B2 JP H0671120 B2 JPH0671120 B2 JP H0671120B2 JP 9940187 A JP9940187 A JP 9940187A JP 9940187 A JP9940187 A JP 9940187A JP H0671120 B2 JPH0671120 B2 JP H0671120B2
Authority
JP
Japan
Prior art keywords
optical
filter element
optical filter
semiconductor laser
integrated device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP9940187A
Other languages
Japanese (ja)
Other versions
JPS63264708A (en
Inventor
貴陽 沼居
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP9940187A priority Critical patent/JPH0671120B2/en
Publication of JPS63264708A publication Critical patent/JPS63264708A/en
Publication of JPH0671120B2 publication Critical patent/JPH0671120B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Semiconductor Lasers (AREA)
  • Optical Integrated Circuits (AREA)

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は、光交換用の光集積素子に関する。The present invention relates to an optical integrated device for optical switching.

(従来の技術) 波長多重化された光信号から任意の光信号を選択する機
能を有する光フィルタ素子は、光伝送,光交換,光情報
処理等において広範な用途に応用可能なキーデバイスの
1つである。そして、いずれの用途においても光フィル
タ素子の特性として十分な波長選択度と選択波長の広い
可変同調幅が必要とされている。また、構造として光集
積回路化が不可決なことから、任意の選択したい波長の
みを透過する透過型の波長選択フィルタであることも必
要である。
(Prior Art) An optical filter element having a function of selecting an arbitrary optical signal from wavelength-multiplexed optical signals is one of key devices applicable to a wide range of applications in optical transmission, optical switching, optical information processing, and the like. Is one. In any application, sufficient wavelength selectivity and variable tuning width with a wide selection wavelength are required as the characteristics of the optical filter element. Further, since it is inevitable to make an optical integrated circuit as a structure, it is also necessary to be a transmissive wavelength selection filter that transmits only an arbitrary desired wavelength.

従来から、透過型の波長選択フィルタに関しては、いく
つかの検討がなされている。その中で、半導体基板上に
光導波路層を結晶成長によって形成し、光導波路層上に
波長選択性のある光帰還構造を設けた構造の光フィルタ
素子が研究されている。この文献の例として1986年発行
のアブライド・フィジックス・レターズ(Applied Phys
ics Letters)第49巻125ページに記載のR.C.Alffernen
他著の論文をあげることができる。
BACKGROUND ART Heretofore, some studies have been made on transmissive wavelength selection filters. Among them, an optical filter element having a structure in which an optical waveguide layer is formed on a semiconductor substrate by crystal growth and an optical feedback structure having wavelength selectivity is provided on the optical waveguide layer has been studied. An example of this reference is the Applied Physics Letters, published in 1986.
ics Letters) RC Alffernen, Vol. 49, page 125
I can give you other papers.

(発明が解決しようとする問題点) しかしながら、これら従来から提案され、検討されてき
た光フィルタ素子は光を放出しないから、その光フィル
タ素子への光の注入、あるいは光フィルタ素子からの光
の取り出しの際に光軸合わせが大変難しいという欠点が
あった。
(Problems to be Solved by the Invention) However, since these conventionally proposed and examined optical filter elements do not emit light, injection of light into the optical filter element or light emission from the optical filter element There was a drawback that it was very difficult to align the optical axis when taking out.

本発明の目的は、光軸合わせの容易な光フィルタ素子を
提供することにある。
An object of the present invention is to provide an optical filter element whose optical axis can be easily aligned.

(問題点を解決するための手段) 本発明の光集積素子は、光フィルタ素子と半導体レーザ
が並列に配置され、前記光フィルタ素子と前記半導体レ
ーザが同一の導波路に光学的に結合していることを特徴
としている。
(Means for Solving the Problems) In the optical integrated device of the present invention, an optical filter device and a semiconductor laser are arranged in parallel, and the optical filter device and the semiconductor laser are optically coupled to the same waveguide. It is characterized by being.

(作用) 従来の光フィルタ素子に光を注入するときは、実際に光
が注入されたかどうかをテレビカメラなどを用いて素子
端面を観察しながら光軸を調整していた。この作業は熟
練を要し、しかも非能率的である。
(Operation) When light is injected into the conventional optical filter element, the optical axis is adjusted while observing the element end face by using a television camera or the like to see whether or not the light is actually injected. This task requires skill and is inefficient.

一方、半導体レーザのスペクトル測定などを行う時はレ
ンズを1個用いるだけで、比較的容易に光ファイバに光
を注入することができる。この時は、半導体レーザの出
力光を光ファイバに注入し、光ファイバからの光出力を
モニタし、それが最大になるように半導体レーザ,レン
ズ,光ファイバの位置を調節している。
On the other hand, when the spectrum of a semiconductor laser is measured, it is possible to inject light into the optical fiber relatively easily by using only one lens. At this time, the output light of the semiconductor laser is injected into the optical fiber, the optical output from the optical fiber is monitored, and the positions of the semiconductor laser, the lens, and the optical fiber are adjusted so as to maximize the output.

以上のことから、半導体レーザと光フィルタ素子とが並
列に配置され、かつこれらが同一の導波路に光学的に結
合された光学の光集積素子を用いれば、光軸合わせを半
導体レーザを発振させることによって容易に行なうこと
ができる。また、光フィルタ素子として動作させる際に
は、半導体レーザに電流を注入しないでおけば、入射光
のうち半導体レーザ側へ分岐した光は半導体レーザの活
性層で吸収されてしまい透過してこない。一方、入射光
のうち光フィルタ素子側へ分岐した光は、光フィルタ素
子の透過特性に従って、特定の波長の光だけが透過す
る。従って、この光集積素子の光フィルタ素子としての
特性は半導体レーザを並列に集積することにより劣化し
ない。
From the above, if an optical optical integrated device in which a semiconductor laser and an optical filter element are arranged in parallel and these are optically coupled to the same waveguide is used, optical axis alignment causes oscillation of the semiconductor laser. This can be done easily. Further, when operating as an optical filter element, if no current is injected into the semiconductor laser, the light branched to the semiconductor laser side of the incident light is absorbed by the active layer of the semiconductor laser and does not pass through. On the other hand, of the incident light, the light branched to the optical filter element side transmits only the light of a specific wavelength according to the transmission characteristics of the optical filter element. Therefore, the characteristics of the optical integrated element as an optical filter element are not deteriorated by integrating the semiconductor lasers in parallel.

(実施例) 次に図面を参照して本発明を詳細に説明する。第1図
は、本発明の一実施例の光集積素子の構造を示す平面図
である。第2図は、半導体レーザ200の構造を示す斜視
図、第3図は光フィルタ素子300の構造を示す斜視図で
ある。以下、製作手順に従いながら本実施例の構造につ
いて説明する。まず、n形InP基板110上の半導体レーザ
200部と光フィルタ素子部300に周期2400Åのλ/4シフト
回折格子を形成する。次に1回目のLPE成長によってノ
ンドープInGaAsP光ガイド層120(λg=1.3μm,厚さ0.3
μm),n形InPバッフア層130(厚さ0.1μm),ノンド
ーブ活性層140(λg=1.53μm,厚さ0.1μm),p形InP
クラッド層150(厚さ0.2μm)を順次成長する。光に光
導波路部100と光フィルタ素子部300のInPクラッド層150
と活性層140とを選択的に除去する。次に2回目のLPE成
長において全体にp形InPクラッド層160を形成する。
(Example) Next, this invention is demonstrated in detail with reference to drawings. FIG. 1 is a plan view showing the structure of an optical integrated device according to an embodiment of the present invention. FIG. 2 is a perspective view showing the structure of the semiconductor laser 200, and FIG. 3 is a perspective view showing the structure of the optical filter element 300. The structure of this embodiment will be described below according to the manufacturing procedure. First, a semiconductor laser on the n-type InP substrate 110
A λ / 4 shift diffraction grating having a period of 2400Å is formed in 200 parts and the optical filter element part 300. Next, by the first LPE growth, the undoped InGaAsP optical guide layer 120 (λg = 1.3 μm, thickness 0.3
μm), n-type InP buffer layer 130 (thickness 0.1 μm), non-dove active layer 140 (λg = 1.53 μm, thickness 0.1 μm), p-type InP
The clad layer 150 (thickness 0.2 μm) is sequentially grown. InP clad layer 150 of optical waveguide 100 and optical filter element 300
And the active layer 140 are selectively removed. Next, in the second LPE growth, the p-type InP clad layer 160 is formed over the entire surface.

次に埋め込み構造とするために、メサエッチングを行な
った後、3回目のLPE成長によって埋め込み成長を行な
う。ここでは、埋め込み構造として二重チャンネルブレ
ーナ埋め込み構造を用いた。最後に基板側と成長層側に
電極を形成した後、半導体レーザ200と光フィルタ素子3
00および光導波路100の間の電気的な分離を行なうため
に、中央のメサ付近を除いて溝を形成する。その後、光
との結合をよくするためにプラズマCVD装置を用いて素
子の両端面にSiN膜170を形成する。この端面の反射率は
2%以下であった。半導体レーザ200,光フィルタ素子30
0の長さはともに300μm、光導波路100も含めた本実施
例の光集積素子の長さは600μmである。また半導体レ
ーザ200,光フィルタ素子300の幅はともに300μmで、間
の溝の幅は50μmである。
Next, in order to obtain a buried structure, after performing mesa etching, buried growth is performed by third LPE growth. Here, a double channel brenched embedded structure was used as the embedded structure. Finally, after forming electrodes on the substrate side and the growth layer side, the semiconductor laser 200 and the optical filter element 3
For electrical isolation between 00 and the optical waveguide 100, a groove is formed except in the vicinity of the central mesa. After that, a SiN film 170 is formed on both end faces of the device by using a plasma CVD device in order to improve the coupling with light. The reflectance of this end face was 2% or less. Semiconductor laser 200, optical filter element 30
The length of 0 is 300 μm, and the length of the optical integrated device of this embodiment including the optical waveguide 100 is 600 μm. The semiconductor laser 200 and the optical filter element 300 both have a width of 300 μm, and the width of the groove between them is 50 μm.

こうして試作した素子の特性の一例を次に示す。光フィ
ルタ素子300,半導体レーザ200に電流を注入しない時の
透過波長は、1.5563μm、光フィルタ素子300のみに電
流を80mA注入すると透過波長は1.5505μmとなり透過波
長は連続して58Å変化した。また、半導体レーザ200の5
mW出力時の発振波長は1.5560μmであった。第4図に光
フィルタ素子300のみに電流を注入した時の透過特性を
示す。透過阻止波長域は65Å、透過波長の10dB減衰幅は
0.5Åであった。
An example of the characteristics of the element thus prototyped is shown below. The transmission wavelength when current was not injected into the optical filter element 300 and the semiconductor laser 200 was 1.5563 μm, and when the current was injected into the optical filter element 300 only at 80 mA, the transmission wavelength was 1.5505 μm, and the transmission wavelength continuously changed by 58Å. Also, 5 of the semiconductor laser 200
The oscillation wavelength at mW output was 1.5560 μm. FIG. 4 shows the transmission characteristics when current is injected only into the optical filter element 300. The transmission blocking wavelength range is 65 Å, the transmission wavelength 10 dB attenuation width is
It was 0.5Å.

この実施例では本発明の特徴とする光軸調整の容易性に
ついても顕著な改善が見られる。すなわち、従来の光フ
ィルタ素子では光軸調整に1時間近く要していたが、本
発明の光集積素子では、10分と大幅に改善された。
In this embodiment, the easiness of adjusting the optical axis, which is a feature of the present invention, is significantly improved. That is, the conventional optical filter element required about 1 hour for the optical axis adjustment, but the optical integrated element of the present invention was significantly improved to 10 minutes.

さて、本実施例では光フィルタ素子として第3図に示す
構造の光フィルタ素子を用いたが、他の構造の素子であ
っても光フィルタの機能を果たすものであれば、どんな
ものでもよい。さらに、素子の材料および組成は、上述
の実施例に限定する必要はなく、他の半導体材料や誘電
体材料などであってもよい。また、位相シフト構造も外
部から位相シフト量を制御できるような構成にすれば、
さらに波長可変範囲を広げることができる。また、本実
施例では、位相シフト構造として、位相シフト回折格子
を用いたが、これはなにも位相シフト回折格子に限定す
る必要はなく、均一な回折格子を有し、かつ導波路の幅
あるいは厚みを変えた、いわゆる等価的な位相シフト構
造であってもよい。また導波路100のテーパ部にスイッ
チを設け、フィルタ動作時のロスを減少させてもよい。
Although the optical filter element having the structure shown in FIG. 3 is used as the optical filter element in this embodiment, any element having another structure may be used as long as it can function as an optical filter. Furthermore, the material and composition of the element are not limited to those in the above-mentioned embodiments, and other semiconductor materials or dielectric materials may be used. Also, if the phase shift structure is configured to control the phase shift amount from the outside,
Furthermore, the variable wavelength range can be expanded. Further, in the present embodiment, the phase shift diffraction grating is used as the phase shift structure, but this is not limited to the phase shift diffraction grating, and it has a uniform diffraction grating and the width of the waveguide. Alternatively, a so-called equivalent phase shift structure in which the thickness is changed may be used. Further, a switch may be provided in the tapered portion of the waveguide 100 to reduce the loss during the filter operation.

(発明の効果) 従来の光フィルタ素子では、光軸調整に1時間程度費し
ていたが、本発明の光集積素子では光軸調整が10分程度
に短縮され、光軸調整の容易性が大幅に改善された。
(Effect of the Invention) In the conventional optical filter element, the optical axis adjustment was spent for about one hour, but in the optical integrated element of the present invention, the optical axis adjustment is shortened to about 10 minutes, and the optical axis adjustment is easy. Greatly improved.

【図面の簡単な説明】[Brief description of drawings]

第1図は本発明の一実施例の光集積素子の構造を示す平
面図である。第2図は第1図実施例に集積されている半
導体レーザの構造を示す斜視図である。第3図は第1図
実施例に集積されている光フィルタ素子の構造を示す斜
視図である。第4図は本実施例の光集積素子の透過特性
を示す図である。 100……光導波路、200……半導体レーザ、300……光フ
ィルタ素子、110……基板、120……光ガイド層、130…
…バッフア層、140……活性層、150,160……クラッド
層、170……SiN膜。
FIG. 1 is a plan view showing the structure of an optical integrated device according to an embodiment of the present invention. FIG. 2 is a perspective view showing the structure of the semiconductor laser integrated in the embodiment of FIG. FIG. 3 is a perspective view showing the structure of the optical filter element integrated in the embodiment of FIG. FIG. 4 is a diagram showing the transmission characteristics of the optical integrated device of this embodiment. 100 ... Optical waveguide, 200 ... Semiconductor laser, 300 ... Optical filter element, 110 ... Substrate, 120 ... Optical guide layer, 130 ...
... buffer layer, 140 ... active layer, 150, 160 ... cladding layer, 170 ... SiN film.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】光フィルタ素子と半導体レーザが並列に配
置され、前記光フィルタ素子と前記半導体レーザが同一
の導波路に光学的に結合していることを特徴とする光集
積素子。
1. An optical integrated device, wherein an optical filter device and a semiconductor laser are arranged in parallel, and the optical filter device and the semiconductor laser are optically coupled to the same waveguide.
JP9940187A 1987-04-21 1987-04-21 Optical integrated device Expired - Lifetime JPH0671120B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9940187A JPH0671120B2 (en) 1987-04-21 1987-04-21 Optical integrated device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9940187A JPH0671120B2 (en) 1987-04-21 1987-04-21 Optical integrated device

Publications (2)

Publication Number Publication Date
JPS63264708A JPS63264708A (en) 1988-11-01
JPH0671120B2 true JPH0671120B2 (en) 1994-09-07

Family

ID=14246471

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9940187A Expired - Lifetime JPH0671120B2 (en) 1987-04-21 1987-04-21 Optical integrated device

Country Status (1)

Country Link
JP (1) JPH0671120B2 (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6872305B2 (en) 2000-10-09 2005-03-29 U.S. Filter Wastewater Group, Inc. Membrane filtration system
US6884350B2 (en) 2000-11-13 2005-04-26 U.S. Filter Wastewater Group, Inc. Modified membranes
US6955762B2 (en) 2001-11-16 2005-10-18 U. S. Filter Wastewater Group, Inc. Method of cleaning membranes
US6974554B2 (en) 2001-04-04 2005-12-13 U.S. Filter Wastewater Group, Inc. Potting method
US7018533B2 (en) 2001-09-18 2006-03-28 U.S. Filter Wastewater Group, Inc. High solids module
US7226541B2 (en) 2001-06-20 2007-06-05 Siemens Water Technology Corp. Membrane polymer compositions
US7264716B2 (en) 1999-04-20 2007-09-04 Siemens Water Technologies Corp. Membrane filtration manifold system
US7387723B2 (en) 2004-04-22 2008-06-17 Siemens Water Technologies Corp. Filtration apparatus comprising a membrane bioreactor and a treatment vessel for digesting organic materials
US7455765B2 (en) 2006-01-25 2008-11-25 Siemens Water Technologies Corp. Wastewater treatment system and method
US7563363B2 (en) 2005-10-05 2009-07-21 Siemens Water Technologies Corp. System for treating wastewater
US7632439B2 (en) 2002-02-12 2009-12-15 Siemens Water Technologies Corp. Poly(ethylene chlorotrifluoroethylene) membranes
US8858796B2 (en) 2005-08-22 2014-10-14 Evoqua Water Technologies Llc Assembly for water filtration using a tube manifold to minimise backwash

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7264716B2 (en) 1999-04-20 2007-09-04 Siemens Water Technologies Corp. Membrane filtration manifold system
US6872305B2 (en) 2000-10-09 2005-03-29 U.S. Filter Wastewater Group, Inc. Membrane filtration system
US6884350B2 (en) 2000-11-13 2005-04-26 U.S. Filter Wastewater Group, Inc. Modified membranes
US6974554B2 (en) 2001-04-04 2005-12-13 U.S. Filter Wastewater Group, Inc. Potting method
US7226541B2 (en) 2001-06-20 2007-06-05 Siemens Water Technology Corp. Membrane polymer compositions
US7018533B2 (en) 2001-09-18 2006-03-28 U.S. Filter Wastewater Group, Inc. High solids module
US6955762B2 (en) 2001-11-16 2005-10-18 U. S. Filter Wastewater Group, Inc. Method of cleaning membranes
US7632439B2 (en) 2002-02-12 2009-12-15 Siemens Water Technologies Corp. Poly(ethylene chlorotrifluoroethylene) membranes
US7387723B2 (en) 2004-04-22 2008-06-17 Siemens Water Technologies Corp. Filtration apparatus comprising a membrane bioreactor and a treatment vessel for digesting organic materials
US8858796B2 (en) 2005-08-22 2014-10-14 Evoqua Water Technologies Llc Assembly for water filtration using a tube manifold to minimise backwash
US7563363B2 (en) 2005-10-05 2009-07-21 Siemens Water Technologies Corp. System for treating wastewater
US7455765B2 (en) 2006-01-25 2008-11-25 Siemens Water Technologies Corp. Wastewater treatment system and method

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JPS63264708A (en) 1988-11-01

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