JPH065997A - Flexible printed wiring board - Google Patents
Flexible printed wiring boardInfo
- Publication number
- JPH065997A JPH065997A JP18626392A JP18626392A JPH065997A JP H065997 A JPH065997 A JP H065997A JP 18626392 A JP18626392 A JP 18626392A JP 18626392 A JP18626392 A JP 18626392A JP H065997 A JPH065997 A JP H065997A
- Authority
- JP
- Japan
- Prior art keywords
- flexible printed
- polyimide film
- wiring board
- printed circuit
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920001721 polyimide Polymers 0.000 claims abstract description 19
- 239000000853 adhesive Substances 0.000 claims abstract description 13
- 230000001070 adhesive effect Effects 0.000 claims abstract description 13
- 239000011888 foil Substances 0.000 claims abstract description 7
- 239000002985 plastic film Substances 0.000 claims abstract description 6
- 229920006255 plastic film Polymers 0.000 claims abstract description 6
- 239000007864 aqueous solution Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000004642 Polyimide Substances 0.000 claims description 3
- 239000000126 substance Substances 0.000 abstract description 5
- 238000007788 roughening Methods 0.000 abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 3
- 238000004381 surface treatment Methods 0.000 abstract 2
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 12
- 229920000459 Nitrile rubber Polymers 0.000 description 6
- 238000005452 bending Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 150000003949 imides Chemical class 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920001470 polyketone Polymers 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Landscapes
- Treatments Of Macromolecular Shaped Articles (AREA)
- Laminated Bodies (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、接着性、外観の透明性
に優れたフレキシブル印刷回路用基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible printed circuit board having excellent adhesiveness and transparency in appearance.
【０００２】[0002]
【従来の技術】従来より、プラスチックフィルムと金属
箔とを接着剤を介して接着させてなる積層体が、フレキ
シブル印刷回路用基板として用いられている。これらの
基板は、電子機器内で折り曲げて収納されたり、屈曲可
動部配線等に使用されている。従って、フレキシブル印
刷回路用基板は、折曲げや屈曲可動によってプラスチッ
クフィルムと金属箔とが剥離しないことが要求されてい
る。2. Description of the Related Art Conventionally, a laminate formed by adhering a plastic film and a metal foil with an adhesive has been used as a substrate for a flexible printed circuit. These substrates are folded and stored in electronic equipment, or used for bending movable portion wiring and the like. Therefore, the flexible printed circuit board is required not to separate the plastic film and the metal foil from each other by bending or bending.
【０００３】しかるに、従来のフレキシブル印刷回路用
基板は、プラスチックフィルムとしてポリエステル系や
ポリイミド系フィルムを用いていたが、ポリエステルフ
ィルムは耐熱性が悪く、またポリイミド系フィルムはそ
の表面に未反応物等が残留しているため、接着を阻害す
るという問題があり、その表面を物理的に粗化して接着
性を向上させる方法が採られていた。このためフレキシ
ブル印刷回路用基板の透明性が低く、外観的に劣るもの
であった。However, conventional flexible printed circuit boards have used polyester-based or polyimide-based films as plastic films. However, polyester films have poor heat resistance, and polyimide-based films have unreacted substances on their surfaces. Since it remains, there is a problem of inhibiting the adhesion, and a method of physically roughening the surface to improve the adhesiveness has been adopted. For this reason, the transparency of the flexible printed circuit board was low and the appearance was inferior.
【０００４】[0004]
【発明が解決しようとする課題】本発明は、上記の事情
に鑑みてなされたもので、接着性、外観性に優れ、かつ
従来の好適な特性をも保持したフレキシブル印刷回路用
基板を提供しようとするものである。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and provides a substrate for a flexible printed circuit which is excellent in adhesiveness and appearance and also retains the conventional suitable characteristics. It is what
【０００５】[0005]
【課題を解決するための手段】本発明者は、上記の目的
を達成しようと鋭意研究を重ねた結果、ポリイミド系フ
ィルム表面を特定の水溶液で処理粗面化することによっ
て、上記の目的を達成できることを見いだし、本発明を
完成したものである。Means for Solving the Problems As a result of earnest studies to achieve the above object, the present inventor achieved the above object by roughening the surface of a polyimide film with a specific aqueous solution. The inventors have found what is possible and completed the present invention.
【０００６】即ち、本発明は、プラスチックフィルムと
金属箔とが接着剤を介して接着構成されているフレキシ
ブル印刷回路用基板において、予め 0.1〜30重量％のア
ルカリ性水溶液で表面処理したポリイミド系フィルムを
用いることを特徴とするフレキシブル印刷回路用基板で
ある。That is, the present invention relates to a flexible printed circuit board in which a plastic film and a metal foil are bonded together via an adhesive, and a polyimide film which has been surface-treated in advance with an alkaline aqueous solution of 0.1 to 30% by weight. A flexible printed circuit board characterized by being used.
【０００７】以下、本発明を詳細に説明する。The present invention will be described in detail below.
【０００８】本発明に用いるポリイミド系フィルムとし
ては、例えばポリピロメリット酸イミド系フィルム、ポ
リビフェニルイミド系フィルム、ポリケトンイミド系フ
ィルム、ポリアミドイミド系フィルム、ポリエーテルイ
ミド系フィルム等が挙げられる。Examples of the polyimide film used in the present invention include polypyromellitic imide film, polybiphenylimide film, polyketone imide film, polyamide imide film, and polyether imide film.
【０００９】上述のポリイミド系フィルムを処理するア
ルカリ性水溶液としては、例えば水酸化ナトリウム水溶
液、水酸化カリウム水溶液、水酸化リチウム水溶液等が
挙げられ、これらは単独又は 2種以上混合して使用する
ことができる。アルカリ性水溶液の濃度としては、 0.1
〜30重量％であることが望ましい。この濃度が 0.1重量
％未満では接着性向上に効果なく、また30重量％を超え
るとポリイミド系フィルムが加水分解を起こし、フィル
ムとしての物性が低下し好ましくない。フィルムを処理
する方法については特に制限はなく、浸漬法、スプレー
法、その他の方法が使用される。Examples of the alkaline aqueous solution for treating the above-mentioned polyimide film include sodium hydroxide aqueous solution, potassium hydroxide aqueous solution, lithium hydroxide aqueous solution, etc. These may be used alone or in combination of two or more kinds. it can. The concentration of alkaline aqueous solution is 0.1
It is desirable to be 30% by weight. If the concentration is less than 0.1% by weight, the adhesiveness is not improved, and if it exceeds 30% by weight, the polyimide film is hydrolyzed and the physical properties of the film are deteriorated, which is not preferable. The method of treating the film is not particularly limited, and a dipping method, a spray method, or another method may be used.
【００１０】本発明に用いる接着剤としては、フレキシ
ブル印刷回路基板用接着剤としての特性を満足させるも
のであれば制限はなく、広く使用することができる。例
えばアクリロニトリルブタジエンゴム／フェノール樹脂
系接着剤、アクリロニトリルブタジエンゴム／エポキシ
樹脂系接着剤、アクリルゴム／エポキシ樹脂系接着剤、
カルボキシ含有アクリロニトリルブタジエンゴム／フェ
ノール樹脂系接着剤、カルボキシ含有アクリロニトリル
ブタジエンゴム／エポキシ樹脂系接着剤等が挙げられ、
これらは単独又は 2種以上混合して使用することができ
る。The adhesive used in the present invention is not limited as long as it satisfies the characteristics as an adhesive for flexible printed circuit boards, and can be widely used. For example, acrylonitrile butadiene rubber / phenol resin adhesive, acrylonitrile butadiene rubber / epoxy resin adhesive, acrylic rubber / epoxy resin adhesive,
Carboxy-containing acrylonitrile butadiene rubber / phenol resin adhesives, carboxy-containing acrylonitrile butadiene rubber / epoxy resin adhesives, and the like,
These may be used alone or in combination of two or more.
【００１１】本発明に用いる金属箔としては、銅箔、ア
ルミニウム箔、錫箔、鉄箔等が挙げられ、これらの中で
も銅箔が好ましく使用される。Examples of the metal foil used in the present invention include copper foil, aluminum foil, tin foil, iron foil and the like, and among these, copper foil is preferably used.
【００１２】[0012]
【作用】本発明のフレキシブル印刷回路用基板は、ポリ
イミド系フィルムをアルカリ性水溶液で表面処理するこ
とによって、ポリイミド系フィルム上の接着を阻害する
未反応物等を除去して接着性を向上させ、またポリイミ
ド系フィルム上に物理的な粗化を行わないため、外観の
優れた透明性を得ることができる。The flexible printed circuit board of the present invention improves the adhesiveness by surface-treating the polyimide film with an alkaline aqueous solution to remove unreacted substances that inhibit the adhesion on the polyimide film. Since physical roughening is not performed on the polyimide film, transparency with an excellent appearance can be obtained.
【００１３】[0013]
【実施例】本発明を実施例によって具体的に説明する
が、本発明はこれらの実施例によって限定されるもので
はない。以下の実施例および比較例において「部」とは
「重量部」を意味する。EXAMPLES The present invention will be specifically described with reference to examples, but the present invention is not limited to these examples. In the following examples and comparative examples, "part" means "part by weight".
【００１４】実施例１ アクリロニトリルブタジエンゴムのニポール１４３２Ｊ
（日本ゼオン社製、商品名）40部、エポキシ樹脂のＹＤ
−７０１１（東都化成社製商品名、エポキシ当量470 ）
58部、ジシアンジアミド（日本カーバイド社製） 1.8
部、およびイミダゾール２Ｅ４ＭＺ（四国化成社製、商
品名） 0.2部を、メチルエチルケトンとトルエンの混合
溶剤に溶解し、接着剤を得た。Example 1 Nipol 1432J of acrylonitrile butadiene rubber
(Nippon Zeon Co., Ltd., trade name) 40 parts, epoxy resin YD
-7011 (trade name manufactured by Tohto Kasei Co., Ltd., epoxy equivalent 470)
58 parts, dicyandiamide (manufactured by Nippon Carbide Co., Ltd.) 1.8
Parts and 0.2 parts of imidazole 2E4MZ (manufactured by Shikoku Kasei Co., Ltd.) were dissolved in a mixed solvent of methyl ethyl ketone and toluene to obtain an adhesive.
【００１５】厚さ25μm のポリイミドフィルムカプトン
（イー・アイ・デュポン社製、商品名）を 5重量％の水
酸化ナトリウム水溶液に70℃にて 1分間浸漬した後、水
洗、乾燥した。アルカリ処理したフィルムに上記接着剤
を、ロールコーターで厚さ25μm になるように塗布して
乾燥半硬化させた後、接着剤を塗布した面に厚さ35μm
の圧延銅箔を、温度 120℃，速度 0.5m ／min ，圧力 5
kg／cm2 の条件で、ロールにより積層成形した。次い
で、 150℃のオーブン中で 2時間硬化させてフレキシブ
ル印刷回路用基板を製造した。A 25 μm-thick polyimide film Kapton (trade name, manufactured by EI DuPont) was immersed in a 5% by weight aqueous sodium hydroxide solution at 70 ° C. for 1 minute, washed with water and dried. After applying the above adhesive to the alkali-treated film with a roll coater to a thickness of 25 μm and drying and semi-curing it, apply a thickness of 35 μm on the adhesive-coated surface.
Rolled copper foil with temperature of 120 ℃, speed of 0.5m / min, pressure of 5
Lamination molding was performed with a roll under the condition of kg / cm 2 . Then, it was cured in an oven at 150 ° C. for 2 hours to manufacture a flexible printed circuit board.
【００１６】実施例２ 実施例１においてポリイミドフィルムカプトン（イー・
アイ・デュポン社製、商品名）の替わりに、アピカル２
５ＡＨ（鐘淵化学工業社製、商品名）を用いた以外はす
べて実施例１と同一にして、フレキシブル印刷回路用基
板を製造した。Example 2 In Example 1, the polyimide film Kapton (E.
Apical 2 instead of I-Dupont product name
A flexible printed circuit board was manufactured in the same manner as in Example 1, except that 5AH (trade name, manufactured by Kanegafuchi Chemical Industry Co., Ltd.) was used.
【００１７】比較例 実施例１においてポリイミドフィルムカプトン（イー・
アイ・デュポン社製、商品名）を 5重量％の水酸化ナト
リウム水溶液で処理しないで、それ以外はすべて実施例
１と同様にしてフレキシブル印刷回路用基板を製造し
た。Comparative Example The polyimide film Kapton (E.
A flexible printed circuit board was manufactured in the same manner as in Example 1 except that I DuPont, trade name) was not treated with a 5 wt% sodium hydroxide aqueous solution.
【００１８】比較例２ 実施例１において、ポリイミドフィルムとしてカプトン
（イー・アイ・デュポン社製、商品名）の替わりに、表
面を粗面化したアピカル２５Ｍ（鐘淵化学工業社製、商
品名）を用い、 5重量％の水酸化ナトリウム水溶液で処
理しないで、それ以外はすべて実施例１と同様にしてフ
レキシブル印刷回路用基板を製造した。Comparative Example 2 In Example 1, instead of Kapton (manufactured by E. I. Dupont) as the polyimide film, Apical 25M (manufactured by Kanegafuchi Chemical Industry Co., Ltd.) having a roughened surface was used. Was used in the same manner as in Example 1 except that it was not treated with a 5% by weight sodium hydroxide aqueous solution.
【００１９】実施例１〜２および比較例１〜２で製造し
たフレキシブル印刷回路用基板について、引剥し強さ、
半田耐熱性、外観（透明性）について試験を行ったの
で、その結果を表１に示した。本発明のフレキシブル印
刷回路用基板は、いずれの特性においても優れており、
本発明の効果を確認することができた。With respect to the flexible printed circuit boards manufactured in Examples 1 and 2 and Comparative Examples 1 and 2, the peeling strength,
Tests were conducted on solder heat resistance and appearance (transparency), and the results are shown in Table 1. The flexible printed circuit board of the present invention is excellent in any characteristics,
The effect of the present invention could be confirmed.
【００２０】[0020]
【表１】 ＊1 ：ＩＰＣ−ＦＣ−２４０Ｂによる。 ＊2 ： 300℃ 1分間、フロート。○印…異常なし。 ＊3 ：○印…良好、×印…やや不透明。[Table 1] * 1: According to IPC-FC-240B. * 2: 300 ° C for 1 minute, float. ○: No abnormality * 3: ○: Good, ×: Slightly opaque.
【００２１】[0021]
【発明の効果】以上の説明および表１から明らかなよう
に、本発明のフレキシブル印刷回路用基板は、接着性、
半田耐熱性、外観（透明性）に優れ、かつほかの特性も
従来品と同様にそなえたもので、電子機器の屈曲可動部
用等に好適なものである。As is clear from the above description and Table 1, the flexible printed circuit board of the present invention has excellent adhesiveness,
It is excellent in solder heat resistance and appearance (transparency), and has other characteristics similar to the conventional products, and is suitable for bending movable parts of electronic devices.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｂ３２Ｂ 15/08 Ｒ Ｃ０８Ｌ 79:08 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Internal reference number FI technical display location B32B 15/08 R C08L 79:08
Claims (1)
剤を介して接着構成されているフレキシブル印刷回路用
基板において、予め 0.1〜30重量％のアルカリ性水溶液
で表面処理したポリイミド系フィルムを用いることを特
徴とするフレキシブル印刷回路用基板。1. A flexible printed circuit board in which a plastic film and a metal foil are bonded together via an adhesive, wherein a polyimide-based film which has been surface-treated in advance with an alkaline aqueous solution of 0.1 to 30% by weight is used. Flexible printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18626392A JPH065997A (en) | 1992-06-20 | 1992-06-20 | Flexible printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18626392A JPH065997A (en) | 1992-06-20 | 1992-06-20 | Flexible printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH065997A true JPH065997A (en) | 1994-01-14 |
Family
ID=16185226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18626392A Pending JPH065997A (en) | 1992-06-20 | 1992-06-20 | Flexible printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH065997A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009226658A (en) * | 2008-03-21 | 2009-10-08 | Ube Ind Ltd | Laminated film, surface-treated polyimide film used in laminated film, and method of treating surface of polyimide film |
| WO2011021639A1 (en) * | 2009-08-20 | 2011-02-24 | 宇部興産株式会社 | Polyimide film and process for producing polyimide film |
| CN112203422A (en) * | 2020-09-14 | 2021-01-08 | 珠海市晶昊电子科技有限公司 | Surface treatment method of printed circuit board cover film |
-
1992
- 1992-06-20 JP JP18626392A patent/JPH065997A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009226658A (en) * | 2008-03-21 | 2009-10-08 | Ube Ind Ltd | Laminated film, surface-treated polyimide film used in laminated film, and method of treating surface of polyimide film |
| WO2011021639A1 (en) * | 2009-08-20 | 2011-02-24 | 宇部興産株式会社 | Polyimide film and process for producing polyimide film |
| CN102575034A (en) * | 2009-08-20 | 2012-07-11 | 宇部兴产株式会社 | Polyimide film and method for producing polyimide film |
| JP5594289B2 (en) * | 2009-08-20 | 2014-09-24 | 宇部興産株式会社 | Polyimide film and method for producing polyimide film |
| US9393720B2 (en) | 2009-08-20 | 2016-07-19 | Ube Industries, Ltd. | Polyimide film and process for producing polyimide film |
| CN112203422A (en) * | 2020-09-14 | 2021-01-08 | 珠海市晶昊电子科技有限公司 | Surface treatment method of printed circuit board cover film |
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