JPH06506984A - Method for selectively coating a nonconductor with carbon particles and use of a copper-containing solution in the method - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] Method for selectively coating a nonconductor with carbon particles and a copper-containing solution in the method usage of The present invention provides a method for selectively coating a nonconductor with carbon particles, and the method. Concerning the use of copper-containing solutions in.

Direct metallization of nonconductors has become extremely important in the printed circuit board industry over the past decade. I've been doing it. In this connection, polypyrrole and carbon particles, i.e. graphite A direct electroplating method using carbon black and/or carbon black is mentioned.

Direct electroplating by applying carbon particles to a nonconductor is used, for example, in the United States. Patent No. 4619741, U.S. Patent No. 4622107, U.S. Patent No. 4 622108, U.S. Patent No. 11631117 and U.S. Patent No. 468 It is described in Publication No. 4560. The common and central features within the state of the art are: , carbon particles (preferably an acidic carbon blank with a particle size greater than 3 pm) ) dispersed in an alkaline surfactant solution. unguided When the body (substrate) is immersed, the carbon film remains attached to its surface.

In this case, a relatively thick layer and a corresponding large A large amount of carbon is deposited, for example, on the copper surface of a printed circuit board.

As for the copper surface, the outer steel of the printed circuit board is not only heavy but also exposed in the case of multi-layer A perforated inner layer also belongs. The inner layer is a copper layer to be electrically applied later. The inner layer is bonded through the tube.

The large amount of carbon has a very detrimental effect, especially in the case of precision drilling, which can lead to clogging. Ru. In addition, excess carbon must be removed from the copper surface in the circulating solution. No. Nonconducting surfaces, e.g. epoxide resins, glass, polytetrafluoroether on polyimide, gluten and other materials used in printed circuit board manufacturing. In order not to remove carbon, copper was removed until it reached 5 Ii m, and the copper surface A copper etching process with almost no carbon is recommended.

This, however, prevents electrical contact to the carbon on the nonconductor. . In galvanic solutions, for example, in the case of multilayers, inner layers bond together. The copper layer is first grown as described above via forward direction copper layer growth (F+on1wach-Ium). The value of Jm is 5. However, multilayers consist of many overlaps, 8 to 16 layers. Since this is technically normal, it will result in poor quality or at least significantly poor quality in the polling hole. The situation where significant layer thickness variations of the copper layer occur, which presents one of the drawbacks of the new method, Elephants can be seen in each layer. This inadequacy limits the use of this preferred technique. .

Another drawback of the method within the state of the art is the drying process after carbon coating. It is. Here, in the case of vertical processing techniques, holes, especially holes with a diameter of less than 0.4 mm, Therefore, a large amount of dispersed carbon remains. Therefore, drying of polling holes is a hassle. The surface to be treated and the exceptionally strong carbon coating make for another highly problematic process.

The problem of the present invention is that only a small amount of carbon is deposited on the copper surface, for example, on a printed circuit board. and to provide a selective method for increasing the deposition of carbon particles on nonconductor surfaces.

The solution to this problem is to introduce the nonconductor into a) a copper-containing solution and b) a polyelectrolytic solution, especially gelatin. C) optionally then with water. d) cleaning the nonconductor surface with a solution containing carbon, a wetting agent and an ionogenic metal compound; This is achieved by contacting the dispersion with e) subsequent, if necessary, further washing with water. be done. Furthermore, the solution to the problem involves using a copper-containing solution in the method. There is.

Preferred embodiments are indicated within the scope of the dependent claims.

The method according to the invention is based on the treatment of the copper surface, in which ■, the copper surface is slightly covered with adhering carbon particles, but not covered at all, whereas the nonconducting surface, i.e. the glass Carbon adhesion to fibers and resin remains highly maintained, 2. Since only mild etching solutions are used according to the method of the invention, the inner layer etchback is avoided, or at least significantly reduced.

According to the present invention, the second problem is as follows: Copper compounds are formed that prevent or make difficult the adsorption of finely distributed carbon or other conductive materials. As a result, a subsequent very gentle process removes the underlying copper layer. By removing this copper compound and the carbon that adheres to it, it is possible to will be resolved.

A substrate so treated has an excellent layer of galvanic copper in the polling hole. With thickness distribution and tight bonding with inner layer copper layer sleeve, solder impact test Heat such as that required at 288°C for 10 seconds during (Lolschocktesl) withstands the process of

Surprisingly, copper (+ ) compounds were found to make gelatin and carbon adsorption difficult.

Monovalent copper compounds that cannot be obtained by direct methods can be produced by anion exchange reactions. be done.

As copper compounds, halides, pseudohalides, chalcogenides, sulfuric acid Salts, hydroxides and especially phosphates come into consideration.

Another step of the method according to the invention, namely treating the nonconductor with an aqueous gelatin solution is a solution containing 0.01% to 5.00% gelatin, preferably 0.2%. can be achieved. In order to produce this aqueous gelatin solution, currently available commercially available gelatin All Latin quality products are suitable. Instead of the gelatin solution, the first method step , a polyacrylate aqueous solution can also be used. Again, purchased at Commercial Heath Acrylate-based polymer dispersions or polyacrylate-containing polymers that can All mixtures are suitable.

After this treatment with gelatin or polyacrylate solution, the nonconductor is preferably water. or washed with distilled water.

Subsequently, the so-treated nonconductor surface is coated with carbon (e.g. graphite and and/or carbon particles in carbon blanks), wetting agents and ionogenic metal compounds ( for example, alkali-, ammonium- or alkaline earth halides). contacting the dispersion.

As added wetting agents, in particular phase transfer catalysts, such as hexadecyltrimethyl bromide Ammonium is suitable. Additionally, phase transfer catalysts containing quaternary nitrogen atoms are commercially available. All are suitable. Furthermore, as a wetting agent, for example, Aerosol OT (cyanamide ) or Cathodip (trademark) are suitable.

Lithium, sodium, and potassium are added as ionogenic metal compounds in the dispersion. um, magnesium, calcium, barium, strontium, ammonium or The fluorides, chlorides, bromides or iodides of copper have proven advantageous.

The method principle of the coating method is that the carbon dispersion is stable as there is no substrate to be covered. It relies on being adjusted so that However, this dispersion is When in contact with the gelatin or polyacrylate layer adhering to the surface, this carbon dispersion The body becomes unstable. As a result of this instability, solidification occurs and the carbon particles become stuck at the phase boundaries. Precipitates by sticking to a body/liquid form. This coagulation control is contained in the dispersion. This is done through an ionogenic metal compound (electrolyte).

At present, the role of oligomeric ionophores on the substrate surface has not yet been identified; However, this results in a high surface concentration of the ions responsible for the coagulation. It is assumed that. This coagulation is possible because the coagulated layer is resistant to washing. It is caused by the involvement of the ionophore of mar.

The method according to the invention can be used with particular advantage for the direct galvanic metallization of nonconductors. Ru. In this connection, ceramics, glasses or fillers can be used as non-conductors. Comprising fiber-reinforced or unreinforced synthetic materials, epoxides, phenolic resins, cyanate ester, polyetherimide, polyimide, fluorine-containing polymer ( Mention may be made of other polymeric materials such as PTFE) or similar materials. So For coating of ABS synthetic material, polyphenylene sulfide, polyester Polyacrylates, polyacrylates and epoxide resins can be used.

The method may be used to produce conductor lines or structures on the above-mentioned polymeric materials. It is equally suitable for Poling hole treatment on printed circuit boards and electromagnetic protection layers and Particular emphasis may be placed on the application to the production of lint substrates.

The method according to the invention comprises a vertical or Suitable for use in horizontal circulation systems.

With the method according to the invention, printed circuit boards, electrodes, heating elements, chip carriers, electronic packages, etc. chips, multi-chip modules, such as buttons, armatures or car parts. Such metallized synthetic parts can advantageously be manufactured.

Example The following examples illustrate methods according to the invention.

method progress 1. Cleaning agent: alkaline and acidic 2. Cleaning 3. Treatment in solution A 4. Cleaning 5. Treatment in solution B 6. Washing 7. Water-soluble polymer 8. Washing 9. Carbon dispersion (graphite/carbon black) 10. Cleaning Jl, Removal of copper(I) compounds in dilute etchant 12, cleaning 13. Air drying at 50°C 14. Activation of copper surface in acidic solution 15. Washing 16. Galvanic copper, 0.5-4A/dm2 (depending on application) Example 1 A printed circuit board with polling holes is processed according to the method sequence described above. Solution A =200g copper(II) chloride/! J liter and solution B is omitted.

The board was thoroughly cleaned by spray jet cleaning, resulting in a clean surface on the outside and inside of the shell. The carbon (graphite) was removed from the side layers.

After 5 minutes of electroplating in an acidic copper electrolyte at 4 A/dm2, the holes are tightly bonded to the copper metal. It was cracked.

Example 2 A printed circuit board with polling holes was processed according to the method sequence described above. Solution A = 200g copper chloride (■)/liter, solution B = 50g trisodium phosphate /liter. As in Example 1, the graphite is easily removed and the electrometal The results were similarly good.

Example 3 A printed circuit board with polling holes was processed according to the method sequence described above. The solution is , solution A = 200g copper chloride/liter, solution B = 50g potassium dihydrogen phosphate um/liter. Treatment for a few seconds in a dilute corrosive liquid (step 1 of the method sequence) Immediately after 1) there was no carbon on the copper surface. 5 minute electrolysis in acidic copper solution After drilling, the holes were tightly copper plated. No more free area in transmitted light test was recognized.

Example 4 A printed circuit board with polling holes was processed according to the method sequence described above. The solution is , solution A = 50 g copper bromide (■) / liter, solution B = 50 g! Hydrogen acid After dipotassium hydrogen dipotassium/liter, the copper surface is cleared of graphite and The copper(I) layer was removed.

After depositing 35 μm of copper in the center of the poling hole, the multilayer was subjected to an impact test (288 °C , 10 seconds), were examined with cut transverses. The inner layer bond is uninterrupted and the poling hole The reeve is perfectly measured from the entrance of the polling hole to the center of the polling hole, and the layer thickness is The cloth is 85%.

Example 5 A printed circuit board pretreated as in Example 3 was treated with pHHO20, 2% kioviol. (Hoechst) with a conditioning solution (water-soluble polymer) processed and further processed according to the method sequence. Carbon removal is done just as quickly. , After the predetermined copper plating time, the through-hole plating was complete.

Example 6 A printed circuit board pretreated as in Example 3 was prepared from pHHO20, 2% gelatin. The conditioner was then treated with a conditioning solution and further processed according to the method sequence. carbon Removal was troublesome and fast, and after the prescribed copper plating time, the through-hole plating was complete.

In transmitted light tests, a copper layer thickness of 511 m was demonstrated to be defect-free.

The printed circuit board, reinforced to 35μm copper, has been impact tested (see above) and passed the It was determined that there was no understanding.

Example 7 The adsorption coating on the nonconducting surface with conductive carbon blank is reinforced with glass fibers. epoxide resin – a two-stage copper-clad printed circuit board based on a synthetic material. Suitable for through-hole plating.

1% Arkopal(TM) N 150 (Hoechs)/diluted H2 The ultrasonically cleaned substrate in SO4 was first soaked in 0.2% gelatin water solution for 15 seconds. It is pretreated while moving horizontally in the liquid.

To prepare the solution, soak the gelatin in water for 10 minutes to swell it, then warm it to dissolve it. and then left at 10°C for 5 hours before being warmed to 20°C.

After cleaning the substrate with deionized water, Sigri's black coating consisting of a 1% water dispersion was applied. Adsorption coating with a leaded carbon blank is carried out. This dispersion is ultrasonic It is done using waves. The dispersion contains 2.5×10-” mol/Q of bromide. It is stabilized as a cation with xadecyltrimethylammonium (CTAB), which is Furthermore, it contains 0.07 m, ol/Q of KCI. The coating is applied in a 30°C solution. It is performed while moving horizontally at the liquid temperature (stroke: 4cm, frequency: 75m) n-'), the coating time is 5 minutes.

After washing with deionized water, dry with compressed air. The resulting carb The thickness of the blank is less than 1 m and the resistance, related to the square, is 104Ω. Ru. Menu for removing carbon black coating from copper coating, 0.5mo I/Q Etched in Cu504/H2SO4 for 5 min at IA/dm2, anode. , further wash. It is then electroplated in the usual manner.

Example 8 Example 1: Covering a printed circuit board with carbon black for through-hole plating The carbon black dispersion was made according to Aerosol OT (trademark). ) (cyanamide) stabilizes it in anionic form. EC-Carphone Black P A 1% dispersion of r1ntex (Commercial W) L6 (Degussa) has 3. 4X10"3m　　　　　/　Q AerosolOT and 0.04mo 1/Q Contains KCI of.

Example 9 The through-hole plating of the copper-covered printed circuit board is carried out in accordance with Example 1 in two stages. , here via coating with graphite. Aqueous graphite dispersion used The body (particle size 0.4-0.61 zm) has the name “Aquadag (trademark) Acheson product with a 1:6 dilution.

The coating time is horizontal movement (stroke: 4 cm, frequency.

50m i n-') and 5 minutes at a solution temperature of 25°C. carbon bran Despite the significantly high resistance of the graphite coating (approximately 1060/square) to the First, the electroplated copper deposit on graphite is better.

Example] O Through-hole plating is carried out as in Example 3 through a cover with graphite. The relevant force However, the bar is Ba5oplast (trademark) 280D (BASF ) is achieved after pre-treating the printed circuit board by immersing it in Ba5opla st280D is a cationically stable water-based polyester based on acrylate. mer dispersion and is used at a dilution of 1:5. The soaking process is carried out for 15 minutes at room temperature. It is performed with a stroke movement for seconds. After washing with deionized water, Phytocoating is performed. In fact, for pre-treatment with gelatin, electroplating results in a small coating (R about 107Ω/square), but electroplating nevertheless It is possible without any problem.

Example 11 By repeatedly coating with graphite, the epoxide resin base is The board is electroplated flat. Soaked in gelatin solution and washed according to Example 3 After that, the epoxide substrate (width: 2 cm, height: 2 cm) was coated with graphite, The coating time is however 2 minutes. After cleaning, the coated substrate is further Soaked in gelatin solution, washed and similarly coated with a second layer of graphite . Such a coating is repeated two more times and then dried with compressed air. It will be done.

During electroplating, the contact to the graphite layer is immersed in a solution and the copper deposit is Spread at the beginning of contact across the graphite layer.

Example 12 Corresponding to Example 5, the glass is also electroplated flat, the form of the material being optional. be. The adhesion of the metallization is of course smaller than that with epoxide resins.

Example 13 The preheated glass substrate (width x height: 2 cm x 2 cm) was heated in a closed container for 5 minutes. Exposure to gaseous hydrofluoric acid at room temperature. At that time, if the surface is not uniform, fuzz will occur. Ru. After rinsing off the product, the substrate is metallized as described in Example 5.

The adhesion of metallized copper coatings is clearly improved compared to untreated glass substrates. The prepared epoxide or glass substrate may be coated with graphite as in Examples 5-8. will be tinged. After the final cleaning, however, the substrate should be dried in an oven for 15 minutes. It can be warmed. The temperature is 120℃ with epoxide substrate and 200℃ with glass. . This treatment increases the electrical conductivity of the graphite layer, resulting in galvanic Copper precipitation precedes quickly. This allows for large amounts of glass, mainly made of glass. The material can also be electroplated.

Example 15 A glass substrate (width x height: 2 cm x 2 cm) is provided with a polymer layer. polymer BASF's rCath, a bonding agent for electrophoretic enamel pulling. odip™, which exists as a water-dilutable dispersion. (Product number FT83-0270). Dispersion application is a diluted polymer dispersion This is done by immersing the substrate in half of the solution, followed by drying at 80° C. for 5 minutes.

The transparent adhesive layer is water resistant and exhibits hydrophobic properties. And as described in Example 5, After graphite coating, galvanic copper is deposited. metallization is polymer Shows better adhesion than uncoated glass. Further increase in adhesion is , achieved by electroplating followed by cross-linking of the polymer.

It is carried out at a baking temperature of 180° C. for 15 minutes.

Example 16 The glass substrate (width x height 2 cm x 2 cm) is provided with a water-insoluble gelatin layer. Cor gelatin solution containing 0.5% formaldehyde. , by briefly immersing the substrate in the solution (T=20°C) and then drying with compressed air. This is done by A graphite consisting of the dispersion used in Example 3 without any further pretreatment. It is adsorbed and coated with phthalate for 2 minutes at a temperature of 25°C (kinetic ). This is washed and dried with compressed air.

It is then dipped into the graphite dispersion twice for an additional 2 minutes and dried again.

This procedure is repeated two more times. Subsequently, copper metallization is performed electrically in a conventional manner. will be blocked.

Example 17 Through-hole plating of printed circuit boards with copper cladding on both sides is coated with graphite. This is achieved through For this purpose, the graphite dispersion described in Example 3 is used. However, the dilution is 1:4. Furthermore, Arkopon(TM) TP]v, That is, an anionic surfactant from Hoechst is added at a concentration of 70 ppm.

The coating of the cleaned substrate as in Example 1 was immersed briefly in the dispersion and This is done by blowing compressed air into the polling hole without restriction and drying it at 80℃ for 5 minutes. It will be done. Etched according to Example 1 and then electroplated with copper.

Example 18 Through-hole plating of printed circuit boards ° Epoxide with poling holes (diameter <1 mm) Resin-Multilayer 0.5% A r k o p o n N150 (HOEC) (ST) and an aqueous solution containing 5% sulfuric acid. Cleaning time is ultrasonic It takes 2 minutes when used at the same time.

After cleaning with tap water (30 seconds), the substrate was washed with 100 g/Q sulfuric acid peroxide for 1 minute at room temperature. immersed in an aqueous solution containing sodium oxide and 20 g/Q sulfuric acid, and then washed. It will be done. Subsequently, the substrate was exposed to 200 g/Q of copper chloride at a temperature of 40°C for 1 minute. Treated with hydrochloric acid solution (pH 1,8). After washing with tap water, the substrate is soaked in gelatin solution. immersed in water, further washed, and then coated with carbon blank as in Example 1. However, it is for 2 minutes.

The substrate was cleaned and then treated with 50 g/Q sodium sulfate peroxide for 2 minutes at room temperature. and 50 g/Q of sulfuric acid.

After cleaning with a vigorous jet, the substrate is dried with hot air at 110'Ic.

Finally, the substrate was heated for 40 minutes at room temperature at a current density of 4 A/dm2. Electrically copper plated with Cuprac ID GS (Schering) Ru.

Example 19 Through-hole plating of printed circuit boards: epoxide with poling holes (diameter <1 mm) The resin multilayer (Starrr-FIex) was cleaned according to example 18. be done. After cleaning with tap water (30 seconds), the substrate was incubated at room temperature for 1 minute at 100. g/Q's It was immersed in an aqueous solution containing sodium sulfate peroxide and 20 g/Q of sulfuric acid, and is washed. Subsequently, the substrate was exposed to 200 g/Q salt for 1 minute at a temperature of 40°C. It was treated in a hydrochloric acid solution of copper chloride (pH 1,8), washed again, and then resuspended at 40°C in the same way. treated with a 10% solution of potassium dihydrogen phosphate.

After washing with tap water, the substrate is immersed in a gelatin solution according to Example 18 and further washed. and then a coating with graphite is made according to Example 17, but for 2 minutes. It is.

The substrate was cleaned and then treated with 50 g/Q sodium sulfate peroxide for 1 minute at room temperature. It is immersed in an aqueous solution containing 50 g/R of sulfuric acid. After cleaning with a vigorous jet, The substrate is dried with hot air at 110'C.

Finally the substrate is electroplated with copper as in Example 18.

Copy and translation of written amendment) Submission (Article 184-8 of the Patent Law) October 22, 1993 Day 1. International application number PCT/DE92100315 2. Name of the invention Method for selectively coating a nonconductor with carbon particles and a copper-containing solution in the method usage of 3. Patent applicant Address: Day 10553, Berlin, Federal Republic of Germany, Erasmusstler Se 20-24 Name Atotech Deutschland Gesellschaft Mint Beschlenk Tel Hafrang Nationality: Federal Republic of Germany 5. Date of submission of written amendment April 16, 1993 6. List of attached documents The scope of the claims 16 The substrate is ready for the next method step, i.e. a. treatment with a copper-containing solution; b. Adding a nonconductor with an aqueous solution of 0.01 to 5.00% gelatin or polyacrylate. covering; C1 optionally washing with water, d, carbon, wetting agent and ionogen metallization contacting with a dispersion containing the compound; and e. If necessary, wash with water. A method of selectively coating a nonconductor with carbon particles.

2. Using graphite and/or carbon black as carbon particles A method of coating a nonconductor with carbon particles according to claim 1, characterized in that:

3. Using an anionic or cationic surfactant or a phase transition catalyst as a wetting agent A method of coating a nonconductor with carbon particles according to claim 1.

4. Characterized by using copper (1) and/or copper (II) solution as the copper-containing solution A method of coating a nonconductor with carbon particles according to claim 1.

5. Copper(1)-containing solution contains carbonate, chloride as an anion or a mixture of anions. substances, chromates, citrates, hydroxides, bromides, iodides, sulfates, sulfides, The method according to claim 4, characterized in that it contains a phosphate or a thiocyanate.

6. Claim 4, characterized in that the copper concentration is 0.5 to 100.0 g/Q. Method.

7. The pH value of the copper solution is in the acidic range, preferably between pH 1 and 4. The method of claim 4.

8. Lithium, sodium, potassium, magneto as ionogenic metal compounds Fluorination of sium, calcium, barium, strontium, ammonium or copper The carbon particles according to claim 1, characterized in that carbon particles, chlorides, bromides, or iodides are used. How to coat a nonconductor with a

9. As carbon particles, graphite with an average particle size of less than 50 μm and/or an average particle size Claim 1 or 2, characterized in that carbon black of less than 5 pm is used. Law.

10. Polymer, hepteramic or glass coatings, especially direct galvanization 13. Use of at least one method of claims 1 to 12 for dimetallization.

11. Claims 1 to 12 for producing conductor lines or structures on polymeric materials Usage of at least one method.

12. Creation for direct galvanic metallization of pole holes in printed circuit boards Use of at least one method of Systems 1-12.

13. At least one method of claims 1 to 12 for manufacturing a printed circuit board Usage of.

14. At least claims 1 to 12 in a circulation device that is operated horizontally and continuously. Also one method usage.

15. Copper(1) and/or for pretreatment of the nonconductor before coating with carbon particles Or copper (method using old containing solution).

Continuation of front page (81) Specified times EP (AT, BE, CH, DE.

DK, ES, FR, GB, GR, IT, LU, MC, NL, SE), CA, JP, KR, US (72) Inventor Gaussmann Hans Beter German Confederation Republic Day 4400 Musister Stadtlohnweg 33 (7 2) Inventor: Marco Hartmud, Federal Republic of Germany, Day 1000 Bell Lin 41 Hanger Strasse 85

Claims (18)

[Claims] 1. method steps a. treatment with a copper-containing solution; b. A nonconductor is made with an aqueous solution of 0.01 to 5.00% gelatin or polyacrylate. covering; c. optionally washing with water; d. Carbon, wetting agents and ionogen metallization contacting with a dispersion containing the compound; and e. Wash with water if necessary A method for selectively coating a nonconductor with carbon particles, characterized by: 2. Using graphite and/or carbon black as carbon particles A method of coating a nonconductor with carbon particles according to claim 1. 3. Using anionic or cationic surfactants or phase transfer catalysts as wetting agents A method of coating a nonconductor with carbon particles according to claim 1. 4. Characterized by using a copper (I) and/or copper (II) solution as the copper-containing solution A method of coating a nonconductor with carbon particles according to claim 1. 5. Copper(I)-containing solutions contain carbonate, chloride, chromate, quenchate as anions. phosphates, hydroxides, bromides, iodides, sulfates, sulfides, phosphates, thiocyanates Process according to claim 4, characterized in that it contains an acid salt or an anion mixture. 6. Copper(I) halide is formed in the first step, which is then converted into another copper(I) halide in the second step. The method according to claim 4, characterized in that the copper(I) compound is converted into a copper(I) compound. 7. The copper surface is treated with a solution of copper(II) salts to yield copper(I) compounds. The method according to claim 4, characterized in that: 8. Claim 4, characterized in that the copper concentration is 0.5 to 100.0 g/l. Method. 9. The PH value of the copper solution is in an acidic range, preferably between pH 1 and 4. The method of claim 4. 10. The copper(I) compounds that are first formed on the copper surface are carbonates, chlorides, and chromates. , citrate, hydroxide, bromide, iodide, sulfate, sulfide, phosphate, thio Contains solutions of cyanates or mixtures of those mentioned in concentrations of 1 to 100 g/l 8. The method of claim 7, wherein the method is modified according to treatment in an aqueous solution. 11. As ionogenic metal compounds, lithium, sodium, potassium, and Fluorination of sium, calcium, barium, strontium, ammonium or copper The carbon particles according to claim 1, characterized in that carbon particles, chlorides, bromides, or iodides are used. How to coat a nonconductor with a 12. As carbon particles, graphite and/or average particles with an average particle size of less than 50 μm Claim 1 or 2, characterized in that carbon black with a diameter of less than 5 μm is used. Method. 13. Coatings of polymers, ceramics or glasses, especially direct galvanization At least one method according to claims 1 to 12 for dimetallization. 14. Characterized by being used to produce conductor lines or structures on polymeric materials 13. The method of at least one of claims 1-12. 15. Used for direct galvanic metallization of printed circuit board boreholes. 13. The method of at least one of claims 1 to 12, characterized in that: 16. Claims 1 to 1 characterized in that the product is used for manufacturing printed circuit boards. At least one method of 2. 17. At least one of claims 1 to 12 in a horizontally operated continuous circulation device One way. 18. Copper(I) and/or copper(II) to coat the nonconductor with carbon particles ) method using a solution containing