JPH0644691B2 - Fixed structure of dielectric resonator controlled oscillator - Google Patents
Fixed structure of dielectric resonator controlled oscillatorInfo
- Publication number
- JPH0644691B2 JPH0644691B2 JP58033283A JP3328383A JPH0644691B2 JP H0644691 B2 JPH0644691 B2 JP H0644691B2 JP 58033283 A JP58033283 A JP 58033283A JP 3328383 A JP3328383 A JP 3328383A JP H0644691 B2 JPH0644691 B2 JP H0644691B2
- Authority
- JP
- Japan
- Prior art keywords
- dielectric resonator
- dielectric
- controlled oscillator
- adhesive
- resonator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000853 adhesive Substances 0.000 claims description 19
- 230000001070 adhesive effect Effects 0.000 claims description 18
- 239000000758 substrate Substances 0.000 description 15
- 125000006850 spacer group Chemical group 0.000 description 5
- 239000004020 conductor Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P7/00—Resonators of the waveguide type
- H01P7/10—Dielectric resonators
Landscapes
- Control Of Motors That Do Not Use Commutators (AREA)
- Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)
Description
【発明の詳細な説明】 本発明は、高い周波数安定度を要求される誘電体共振器
制御発振器に関する。The present invention relates to a dielectric resonator controlled oscillator that requires high frequency stability.
誘電体共振器制御発振器において周波数安定度を高める
ためにその固定機構をも含めた誘電体共振器のＱ０を上
げることが必要である。In the dielectric resonator controlled oscillator, it is necessary to increase Q 0 of the dielectric resonator including its fixing mechanism in order to improve frequency stability.
従来、誘電体共振器のＭＩＣ基板への固定には、第１図
に示すように誘電体共振器２そのものをＭＩＣ基板３に
直接接着剤５により接着する構造あるいは、第２図に示
すように誘電体共振器２の直径と同程度またはそれ以下
の誘電体スペーサ６を介して、接着する機構（第２図）
がよく用いられていた。Conventionally, for fixing the dielectric resonator to the MIC substrate, as shown in FIG. 1, the dielectric resonator 2 itself is directly bonded to the MIC substrate 3 with an adhesive 5, or as shown in FIG. Mechanism for bonding via a dielectric spacer 6 having a diameter equal to or smaller than the diameter of the dielectric resonator 2 (Fig. 2)
Was often used.
しかし、これらの構造は、前者では、誘電体共振器がＭ
ＩＣ基板の裏面導体４に近づいているために、その導体
損によりＱ０が著しく劣化し、その点を改善した後者で
も、誘電体共振器の固着された誘電体製スペーサをＭＩ
Ｃ基板に接着させる接着剤が誘電体共振器の下方に近接
しているがため、その誘電体損が同様に、Ｑ０を劣化さ
せるという欠点を残している。なお、誘電体共振器と誘
電体スペーサを接着する接着剤に、ｔａｎδの低いもの
を使用する例が特開昭４９−４８２６３号に示されてい
るが、低ｔａｎδの接着剤（例えば低融点ガラスなど）
では、摂氏数１００℃の高温で接着する必要があるので
ＭＩＣ基板に容易に使うことはできない。したがって、
ＭＩＣ基板には、一般の接着剤を用いなければならな
い。たとえば低ｔａｎδの接着剤をＭＩＣ基板に使うこ
とができても、接着に対し高温度の環境を設定する必要
があり、いろいろ問題点が多い。本発明の目的は誘電体
共振器のＱ０の劣化を極力小さくして周波数安定度を向
上させることのできる誘電体共振器制御発振器の固定構
造を提供することにある。However, in the former, these structures have a dielectric resonator of M
For approaching the back conductor 4 of the IC substrate, significantly degraded Q 0 due to the conductor loss, even in the latter with improved that point, the fixed dielectric spacer made of a dielectric resonator MI
Since the adhesive for adhering to the C substrate is close to the lower side of the dielectric resonator, the dielectric loss also deteriorates Q 0 . An example of using an adhesive having a low tan δ as an adhesive for adhering the dielectric resonator and the dielectric spacer is disclosed in JP-A-49-48263, but an adhesive having a low tan δ (for example, a low melting point glass Such)
Then, since it is necessary to bond at a high temperature of several hundred degrees Celsius, it cannot be easily used for the MIC substrate. Therefore,
A general adhesive must be used for the MIC substrate. For example, even if an adhesive having a low tan δ can be used for the MIC substrate, it is necessary to set a high temperature environment for adhesion, which causes various problems. An object of the present invention is to provide a fixed structure of a dielectric resonator controlled oscillator that can improve the frequency stability by minimizing the deterioration of Q 0 of the dielectric resonator.
前記目的を達成するために本発明による誘電体共振器制
御発振器の固定構造は少なくとも一方向の長さが誘電体
共振器の直径より大きい面を有する誘電体製サポートに
誘電体共振器を固着し、前記誘電体製サポートを、前記
固着面の反対面の誘電体共振器直下の部分より離れた面
に接着剤を塗付してＭＩＣ基板に固定するように構成し
てある。To achieve the above object, the fixing structure of a dielectric resonator controlled oscillator according to the present invention has a dielectric resonator fixed to a dielectric support having a surface whose length in at least one direction is larger than the diameter of the dielectric resonator. The dielectric support is fixed to the MIC substrate by applying an adhesive to a surface of the dielectric support opposite to the fixing surface, which is separated from the portion directly below the dielectric resonator.
以下、本発明について図面を参照して詳細に説明する。Hereinafter, the present invention will be described in detail with reference to the drawings.
本発明の誘電体共振基制御発振器の固定構造は、問題点
の殆どない誘電体共振器と誘電体製サポート（従来の誘
電体製スペーサに対応するもの）の固定は従来技術によ
り行い、重大な問題点のある誘電体製サポートとＭＩＣ
基板の固定を、接着剤ではなく構造を従来にないものと
することによって解決している。In the fixing structure of the dielectric resonator-based controlled oscillator of the present invention, the fixing of the dielectric resonator and the dielectric support (corresponding to the conventional dielectric spacer), which has almost no problems, is performed by the conventional technique. Dielectric support and MIC with problems
The fixing of the substrate is solved by using a non-conventional structure instead of an adhesive.
第３図は本発明による誘電体共振器制御発振器のうちの
誘電体共振器部分のみを示す実施例で、同図(a)はＭＩ
Ｃ基板の上方より見た平面図、同図(b)はその右側面
図、同図(c)は(a)のＡＡ部分の断面図をそれぞれ示して
いる。これは誘電体製サポート７が直方体の例を示した
もので、この直方体は誘電体共振器２を搭載する面の一
辺が少なくとも誘電体共振器２の直径より大きくなつて
いる。誘電体共振器２は誘電体サポート７の中央部に例
えば低tan δの材料（低融点ガラスなど）からなる接着
剤によって固着され、さらに誘電体製サポート７の裏面
はＭＩＣ基板３に接着剤５によつて接着される。このと
きの誘電体製サポート７の裏面の接着剤を付ける位置は
誘電体共振器を搭載した直下の面より充分離れた面が選
択される。したがつて誘電体製サポート７は誘電体共振
器搭載部の直下方ではなくその両端部がＭＩＣ基板３に
接着される。FIG. 3 is an embodiment showing only the dielectric resonator portion of the dielectric resonator controlled oscillator according to the present invention.
A plan view seen from above the C substrate, FIG. 6B is a right side view thereof, and FIG. 6C is a sectional view of the AA portion of FIG. This shows an example in which the dielectric support 7 is a rectangular parallelepiped, and one side of the surface on which the dielectric resonator 2 is mounted is larger than at least the diameter of the dielectric resonator 2 in this rectangular parallelepiped. The dielectric resonator 2 is fixed to the central portion of the dielectric support 7 with an adhesive made of, for example, a low tan δ material (low melting point glass, etc.), and the back surface of the dielectric support 7 is attached to the MIC substrate 3 with the adhesive 5. Glued together. At this time, the surface of the back surface of the dielectric support 7 to which the adhesive is applied is selected to be sufficiently distant from the surface immediately below the surface on which the dielectric resonator is mounted. Therefore, the dielectric support 7 is adhered to the MIC substrate 3 at both ends thereof, not directly below the dielectric resonator mounting portion.
誘電体共振器制御発振器では誘電体共振器の真下の位置
の電磁界密度が大きいが、この固定構造ではその位置に
誘電体損の大きい接着剤３が存在しないため接着剤の誘
電体損による誘電体共振器のＱ０の劣化はほとんど生じ
ることはない。In the dielectric resonator controlled oscillator, the electromagnetic field density at a position directly below the dielectric resonator is large, but in this fixed structure, the adhesive 3 having a large dielectric loss does not exist at that position. The deterioration of Q 0 of the body resonator hardly occurs.
以上、誘電体製サポートが直方体である例を示したが、
誘電体共振器の直下方で接着剤が接着しないような形状
であれば、直方体に限られるものではない。The example in which the dielectric support is a rectangular parallelepiped has been shown above.
The shape is not limited to the rectangular parallelepiped as long as the adhesive does not adhere to the area directly below the dielectric resonator.
本発明は以上詳しく説明したように誘電体共振器をＭＩ
Ｃ基板に接着する際のＱ０の劣化を防止できるので、高
安定な発振器を実現できる。またＭＩＣ基板への接着に
用いる接着剤の選択も自由度が増し、作業性が良く、よ
り接着力のある接着剤を選択できる。As described in detail above, the present invention provides a dielectric resonator with an MI.
Since it is possible to prevent Q 0 from deteriorating when it is bonded to the C substrate, it is possible to realize a highly stable oscillator. In addition, the degree of freedom in selecting an adhesive used for bonding to the MIC substrate is increased, workability is good, and an adhesive having more adhesive strength can be selected.
第１図は従来の誘電体共振器部分の正面図、第２図は他
の従来例で同図(a)(b)はそれぞれ誘電体共振器部分の平
面図、正面図を示している。第３図は本発明による誘電
体共振器部分の一実施例で同図(a)(b)(c)はそれぞれ平
面図、右側面図、断面図を示している。 １……マイクロストリツプライン ２……誘電体共振器、３……ＭＩＣ基板 ４……金属シヤーシ、５……接着剤 ６……誘電体製スペーサ ７…… 〃 サポートFIG. 1 is a front view of a conventional dielectric resonator portion, FIG. 2 is another conventional example, and FIGS. 1 (a) and (b) are a plan view and a front view of the dielectric resonator portion, respectively. FIG. 3 shows an embodiment of the dielectric resonator portion according to the present invention, and FIGS. 3 (a), 3 (b) and 3 (c) are a plan view, a right side view and a sectional view, respectively. 1 ... Micro strip line 2 ... Dielectric resonator 3 ... MIC substrate 4 ... Metal chassis 5 ... Adhesive agent 6 ... Dielectric spacer 7 ... 〃 Support
Claims (1)
直径より大きい面を有する誘電体製サポートに誘電体共
振器を固着し、前記誘電体製サポートを、前記固着面の
反対面の誘電体共振器直下の部分より離れた面に接着剤
を塗付してＭＩＣ基板に固定するように構成した誘電体
共振器制御発振器の固定構造。1. A dielectric resonator is fixed to a dielectric support having a surface whose length in at least one direction is larger than the diameter of the dielectric resonator, and the dielectric support is fixed on a surface opposite to the fixed surface. A fixing structure of a dielectric resonator controlled oscillator configured to apply an adhesive to a surface separated from a portion directly below the dielectric resonator and fix the dielectric resonator controlled oscillator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58033283A JPH0644691B2 (en) | 1983-03-01 | 1983-03-01 | Fixed structure of dielectric resonator controlled oscillator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58033283A JPH0644691B2 (en) | 1983-03-01 | 1983-03-01 | Fixed structure of dielectric resonator controlled oscillator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59158601A JPS59158601A (en) | 1984-09-08 |
| JPH0644691B2 true JPH0644691B2 (en) | 1994-06-08 |
Family
ID=12382201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58033283A Expired - Lifetime JPH0644691B2 (en) | 1983-03-01 | 1983-03-01 | Fixed structure of dielectric resonator controlled oscillator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0644691B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10196900T1 (en) * | 2000-11-13 | 2003-10-02 | Remec Oy Oulu | Dielectric resonator |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4948263A (en) * | 1972-09-14 | 1974-05-10 | ||
| JPS5398765A (en) * | 1977-01-26 | 1978-08-29 | Matsushita Electric Ind Co Ltd | Oscillator |
-
1983
- 1983-03-01 JP JP58033283A patent/JPH0644691B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59158601A (en) | 1984-09-08 |
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