JPH0638445B2 - Substrate transfer device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention supports substrates one by one like a spin chuck in a substrate rotation processing device such as a spin scrubber, a spin coater, and a spin developer, or a susceptor in a lamp annealing device. The present invention relates to a substrate transfer device that supplies and conveys an unprocessed substrate to a substrate support of a substrate processing unit, and discharges and conveys a processed substrate from the substrate support.

<Prior Art> A substrate rotation processing apparatus automatically feeds / unloads a substrate to / from a spin chuck of a substrate processing unit, and a conventional substrate transfer apparatus includes a substrate feeding unit and a substrate ejection unit. Are arranged opposite to each other around the spin chuck of the substrate, and the substrate transfer tool is arranged between the substrate supply part and the substrate discharge part so as to be reciprocally movable by the transfer tool moving means, and the substrate transfer tool is used to supply the substrate. The unprocessed substrate is transferred from the unit to the spin chuck, and the processed substrate on the spin chuck is transferred to the substrate discharge unit.

As the substrate transfer device, the applicant of the present invention has filed Japanese Patent Application No. 53-73.
No. 372 (Japanese Examined Patent Publication No. 56-49451) proposed "a substrate attaching / detaching device in a spin coater". FIG. 4 is a cross-sectional view of the principal part of the apparatus of the embodiment of the invention of the above prior application in the substrate carrying direction. This apparatus includes a supply side transfer device 51 which is a substrate supply unit.
And a discharge side transfer device 52 which is a substrate discharge part are respectively constituted by a belt transfer mechanism, and each substrate mounting surface is higher in the supply side transfer device 51 than the substrate mounting surface of the spin chuck 53, and the discharge side transfer device. At 52, the substrate is placed lower than the substrate mounting surface of the spin chuck 53, and the substrate transfer tool 54 that moves horizontally along the rail 55 is attached to the supply side transport device 5.
1 and the unprocessed substrate mounting section 54a located at the intermediate height of each substrate mounting surface of the spin chuck 53, and the spin chuck 5
3 and the processed substrate placing section 54b located at the intermediate height of each substrate placing surface of the discharge side transfer device 52 are divided into two substrate placing sections. When the substrate transfer tool 54 moves the substrate to a position near the spin chuck 53 and the discharge-side transfer device 52, the substrate transfer tool 54 moves the substrate. A hitting side 56 and a hitting pin 57 are attached so as to be tiltable so as to retract downward,
As will be described later, while the substrate transfer tool 54 is horizontally moved by the moving means 50 from the standby position in the vicinity of the supply-side transfer device 51 toward the discharge-side transfer device 52 for one reciprocal movement, the spin chuck 53 is not yet moved. Supply of processing substrate and spin chuck 53
The processed substrates are discharged at once. That is, at the standby position corresponding to the supply-side transfer device 51, the unprocessed substrate placement section 54a of the substrate transfer tool 54 is pushed out of the supply-side transfer device 51 so as to be pushed out.
₁ is placed on the unprocessed substrate placement section 54a, and then the substrate transfer tool 54 is horizontally moved toward the discharge side transfer device 52 by the transfer tool moving means 50.

When passing through the spin chuck 53 in the middle of this horizontal movement, both the substrate placement sections 54a, 5a of the substrate transfer tool 54 are
The step portion 54c formed at the boundary of 4b is formed by the spin chuck 5
In contact with the conveying direction rear edge of the treated W ₂ on 3, placing the the treated substrate W ₂ in the treated substrate mounting置区fraction 54b. When the substrate transfer tool 54 reaches the discharge-side transfer device 52, the hit pin 57 rises and abuts on the rear end of the processed substrate W _{2 in} the transfer direction. In this state, the substrate transfer tool 54 is moved to the standby position. By returning movement, processed substrate W ₂
Is placed on the discharge side transfer device 52 from the substrate transfer tool 54.
Next, when the substrate transfer tool 54 passes through the spin chuck 53 in the course of returning to the standby position, the contact side 56 is activated and comes into contact with the rear edge of the unprocessed substrate W _{1 in} the transport direction, so that the unprocessed substrate W ₁ is unprocessed. The substrate is placed on the spin chuck 53 from the substrate transfer tool 54, and then the substrate transfer tool 54 returns to the standby position.

<Problems to be Solved by the Invention> Although the above-mentioned prior invention is useful, it is recognized that there still exist some disadvantages. This is the substrate transfer tool 54.
The transfer operation of the processed substrate W ₂ from the discharge side transfer device 52 to the discharge side transfer device 52 and the transfer operation of the unprocessed substrate W ₁ from the substrate transfer tool 54 to the spin chuck 53 are performed by the hit pin 57 or the hit side 56.
At, for performing by moving the substrate transfer tool 54 in the direction of the supply-side transfer apparatus 51 while preventing the horizontal movement of the substrate W ₁ · W _2, of the substrate W ₁ · W ₂ during the placing The lower surface is in sliding contact with the substrate transfer tool 54, which causes inconveniences such as fine scratches on the lower surface of the substrate and attachment of dirt. In addition, from the spin chuck 53 to the substrate transfer tool 54
Even in the transfer operation of the processed substrate W _{2 to} and from the substrate transfer tool 54, the stepped portion 54 c of the substrate transfer tool 54 pushes the processed substrate W ₂ on the spin chuck 53 in the transport direction. Since the transfer is performed, the lower surface of the processed substrate is brought into sliding contact with the upper surface of the spin chuck 53, so that the lower surface of the substrate is finely scratched or has dirt attached thereto.

An object of the present invention is to provide a substrate transfer device that solves the above inconvenience.

<Means for Solving Problems> The present invention solves the above-mentioned inconvenience and enables the transfer of substrates. An unprocessed substrate mounting section is provided on the substrate supply unit side to discharge the substrate. The substrate transfer tool provided with a processed substrate placement section located above the unprocessed substrate placement section on the side of the section, and the substrate transfer section, from the substrate supply section through the substrate processing section, Reciprocating the section to the board discharge part,
And, the substrate transfer tool has a first height position where the unprocessed substrate mounting section and the processed substrate mounting section are respectively lower than the mounting height of the substrate on the substrate supporting tool. The transfer tool moving means for moving up and down to a second height position which is the upper side, and the substrate supply section are arranged above and below the unprocessed substrate mounting section of the substrate transfer tool at the first height position. A supply unit elevating means for elevating and lowering, and a discharging unit elevating means for elevating and lowering the substrate discharging part so as to be above and below the processed substrate mounting section of the substrate transfer tool at the second height position. Is a substrate transfer device.

<Operation> The position where the unprocessed substrate placement section corresponds to the substrate supply unit is the standby position of the transfer tool moving means, and at this standby position, the transfer tool moving means maintains the state of the first height position. Further, the state in which the supply unit elevating means is raised to a position higher than the unprocessed substrate placement section of the substrate transfer tool at the first height position is maintained. In this standby state, in order to start the transfer of the substrate, first, the elevating unit elevating means is lowered to move the unprocessed plate placed on the substrate supply unit to the unprocessed substrate of the substrate transfer tool. Place in the storage section.

Next, move the substrate transfer tool horizontally toward the substrate support by the transfer tool moving means so that the processed substrate placement section of the substrate transfer tool is close to the substrate support of the substrate processing section. From the first height position to the second height, and the processed substrate mounted on the substrate support is placed on the processed substrate mounting section of the substrate transfer device. Place it.

Next, the transfer tool moving means is horizontally moved toward the substrate discharging section so that the processed substrate mounting section of the substrate transferring tool is located at the substrate discharging section, and then the discharging section elevating means is moved to the first position. The processed substrate is raised from below to above the processed substrate mounting section at the two-height position, and the processed substrate is mounted on the substrate discharge section.

Further, after this, the substrate transfer tool is horizontally moved toward the substrate support by the transfer tool moving means so that the unprocessed substrate placement section of the substrate transfer tool is close to the substrate support, and then lowered. ,
The substrate transfer tool is lowered from the second height position to the first height position, and the unprocessed substrate is placed on the substrate support tool.

Finally, the moving means is horizontally moved to the standby position. In this way, the unprocessed substrate and the processed substrate are transferred at one time by a series of operations in which the substrate transfer tool is reciprocated once and moved up and down once.

<Embodiment> FIG. 1 is a perspective view of a substrate transfer apparatus according to the present invention, and FIG. 2 is a perspective view of essential parts of a substrate transfer tool.

In FIG. 1 and FIG. 2, reference numeral 1 is a spin chuck that constitutes a substrate support arranged in a substrate processing section of a substrate rotation processing apparatus, and a substrate is supplied before and after the substrate processing section in which the spin chuck 1 is arranged. A substrate placing device 2 that constitutes a part and a substrate placing device 3 that constitutes a substrate discharging part are additionally disposed. The substrate transfer tool 4 is used to load the substrate from the supply-side substrate mounting device 2 to the spin chuck 1 and transfer the substrate from the spin chuck 1 to the discharge-side substrate mounting device 3. ing.

The substrate mounting apparatus 2 on the supply side includes the first air cylinder 11
And the lift plate 12 supported by the piston rod,
It is vertically provided on the lift plate 12, and is composed of pins 13 for mounting the unprocessed substrate W ₁ at a three-point support shape at the upper end thereof, and is fed and supplied by an arm-type substrate feeding device 41 which swings in the horizontal direction. The unprocessed substrate W ₁ is placed so that it can be moved up and down. The substrate mounting device 3 on the ejection side is also configured in the same manner, and further, the processed substrate W ₂ is vertically laid by the second air cylinder 15. The height positions of the two substrate placement devices 2 and 3 will be described later.

The substrate transfer tool 4 is cantilevered at the upper end of the transfer tool moving means 5 to be described later so as to be pushed out above the supply-side substrate mounting apparatus 2 and the spin chuck 1 and the discharge-side substrate mounting apparatus 3. And a pair of substrate mounting arms 22 and 23 arranged on the lower surface of the connecting arm 21. As shown in FIG. 2, the substrate mounting arms 22 and 23 are formed of members having an L-shaped side cross section and an inverted L-shaped member facing each other. The upper surface of the lower end protruding portion of the substrate mounting arms 22 and 23 is located directly below the connecting arm 21. As a boundary, the supply side is formed lower than the discharge side, and the lower supply side is the unprocessed substrate placement section 24a on which the unprocessed substrate W ₁ is placed, and the higher discharge side is the process on which the processed substrate is placed. There are two sections 2 with different heights as the mounted substrate mounting section 24b.
It is divided into 4a and 24b.

In this embodiment, since the processed substrate mounting section 24b is higher than the unprocessed substrate mounting section 24a, the processed substrate W _{2 which} has undergone the required processing (for example, cleaning processing) in the spin chuck 1 is not processed. Since it is always located above the substrate W _1, it is possible to eliminate the adhesion of fine contaminant particles and the like attached to the untreated plate W ₁ to the treated substrate W ₂ .

The moving means 5 that supports the above-mentioned substrate transfer tool 4 horizontally moves between the substrate mounting device 2 on the supply side and the substrate mounting device 3 on the discharge side, and moves up and down, and will be described later. The transfer tool traveling drive means 35, the base frame 31, the elevating frame 32, the elevating frame raising support rails 37, the air cylinder 38, and the like. The base frame 31 is movably attached to a pair of horizontally arranged guide shafts 33 in a vertically parallel state along the above section, and a timing belt 34 connected and fixed to a lower end thereof is provided with a timing belt 34. By rotating the transfer tool traveling drive means 35 composed of a motor in the forward and reverse directions, the section is reciprocated left and right.

The elevating frame 32 is attached to the base frame 31 so as to elevate vertically in a straight direction, and a roller 36 is rotatably supported at the lower end of the outer surface of the elevating frame 32. Further, the elevating frame raising support rail 37 is arranged in parallel with the guide shaft 33 in a state of receiving the roller 36 from below, and the elevating frame raising support rail 37 is raised and lowered by the third air cylinder 38. It is becoming like this. Similarly to the first and second air cylinders 11 and 15, the third air cylinder 38 has its body fixed to the main frame of the main body of the substrate rotation processing apparatus, and its piston rod has the piston rod of the lifting frame lifting support rail 37. It is in contact with the lower surface. It should be noted that the third air cylinder 38 is provided, although not shown, in order to vertically move the elevating frame elevating and supporting rail 37. And these two third air cylinders 38.3
8 is advanced to raise the elevating / lowering frame elevating support rail 37, so that the elevating / lowering frame 32 is elevated via the rollers 36. However, the height of the elevating frame 32 is hereinafter referred to as a first height position when the piston rod of the third air cylinder 38 is not advanced, and the height in the advanced state is referred to as a second height position. .

It should be noted that the heights of the respective substrate transfer surfaces in the above-mentioned substrate mounting device 2 on the supply side and the substrate mounting device 3 on the discharge side, the height position of each of the substrate transfer tools 4 when rising and the height when descending. The position is as described below.

The first height position of the substrate transfer tool 4, that is, the height of the substrate transfer tool 4 in a state where the piston rod of the third air cylinder 38 is not advanced, is the unprocessed substrate mounting section 24a.
Also, both of the processed substrate mounting section 24b are set to a height lower than the height on which the substrate is mounted on the spin chuck 1, and the second height position, that is, the third air cylinder 38. The height of the substrate transfer tool 4 with the piston rod advanced is set higher than the height on which the substrates are placed on the spin chuck 1 in both the sections 24a and 24b.

In the substrate mounting apparatus 2 on the supply side, the height (hereinafter referred to as the third height position) in the state where the first air cylinder 11 is not advanced is the first height position of the substrate transfer tool 4. The height of the unprocessed substrate placing section 24a is set to be lower than that of the untreated substrate placing section 24a, and the height when the first air cylinder 11 is advanced (hereinafter referred to as the fourth height position) is the first height. It is set higher than the height of the unprocessed substrate mounting section 24a at the position.

In the discharge-side substrate mounting apparatus 3, the height (hereinafter referred to as the fifth height position) in a state where the second air cylinder 15 is not advanced is the second height position of the substrate mounting tool 4. Set to a height lower than the height of the treated substrate placement section 24b,
The height of the second air cylinder 15 in the advanced state (hereinafter referred to as the sixth height position) is set higher than the height of the processed substrate placement section 24b at the second height position. ing.

Next, the operation of the above-described substrate placing device will be described.

In a state where the substrate is placed by the spin chuck 1 of the substrate processing unit and a predetermined process is performed, the substrate transfer tool 4 has the unprocessed substrate placement section 24a at the pin 13 of the substrate placement device 2 on the supply side. In the standby position where the substrate mounting arms 22 and 23 are located on both front and rear sides, the substrate transfer tool 4 is at the first height position, and the supply side substrate mounting device 2 is at the fourth height position. When the substrate processing in the substrate processing unit is completed, the first air cylinder 11 is retracted to lower the supply-side substrate placing device from the fourth height position to the third height position, and the substrate is transferred. The unprocessed plate W ₁ on the substrate mounting device 2 on the supply side is transferred to the unprocessed substrate mounting section 24a of the tool 4.

The transfer tool traveling drive means 35 operates, and the substrate transfer tool 4 moves to the substrate processing section side in the state of the first height position. By this movement, the processed substrate mounting section 24b is moved to the spin chuck 1
It enters into the lower side of the processed substrate W ₂ held above.

Then, when the substrate transfer tool 4 reaches the position corresponding to the spin chuck, the third air cylinder 38 is advanced and the lifting frame lifting support rail 37 is lifted to lift the lifting frame 3.
2 is set to the second height position, and at the time of this rise, the processed substrate W ₂ on the spin chuck 1 is scooped up by the processed substrate mounting section 24b. When the lifting operation of the third air cylinder 38 is completed, the transfer tool traveling drive means 35 is activated, and the substrate transfer tool 4 corresponds to the unloading side substrate mounting device 3 while the elevating frame 32 is in a raised state. Move to the position.

When the substrate transfer tool 4 reaches such a position, the second air cylinder 15 is advanced to raise the discharge-side substrate placement device 3 from the fifth height position to the sixth height position. At the same time, the processed substrate W ₂ held by the processed substrate placing section 24b is transferred onto the discharge side substrate placing device 3. When the raising operation of the second air cylinder 15 is completed, the transfer tool traveling drive means 35 is reversely operated, and the substrate transfer tool 4 is retracted until the unprocessed substrate mounting section 24a is positioned above the spin chuck. At the time of this retreating operation, the contact side 42 described later contacts the left end of the unprocessed substrate W ₁ held by the unprocessed substrate mounting section 24a, and the center of the substrate is positioned above the center of the substrate mounting surface. After that, the third air cylinder 38 is retracted, the elevating frame 32 is lowered to the first height position, and the unprocessed plate W ₁ is placed on the spin chuck 1. Finally, the elevating frame 32 is moved to the reciprocating position while maintaining the first height position.

Incidentally, the skilled Sehhen 42 untreated plate W ₁ and abutting portions, shall apply in arcuate same curvature as the outer circumference of the untreated plate, except when to place the unprocessed plate ₁ to the spin chuck 1 In order not to hinder the movement of the substrate transfer tool 4, it is attached so as to be retracted downward. Further, when it is not necessary to strictly align the unprocessed substrate mounting position with respect to the spin chuck 1, the contact side 42 may not be provided.

Further, in the above-described embodiment, the substrate supply unit and the substrate discharge unit are constituted by the substrate placing devices 2 and 3 which are respectively movable up and down. However, as in the second embodiment shown in FIG. May be assembled so that it can be raised and lowered directly.

In FIG. 3, the arm type substrate transfer means 41 constituting the substrate supply unit is moved up and down by the cylinder 45, and the arm rotation drive source 44 carries in the unprocessed substrate. Another arm type substrate transfer means 43 constituting the substrate discharge part is the cylinder 4.
The arm rotation drive source 46 elevates and lowers at 7, and the processed substrate is discharged. The substrate supply unit and the substrate discharge unit are not limited to the above-mentioned ones, and may use a belt conveying means.

Although the above description is based on the embodiment, the present invention is not limited to the above description, and various modifications and applications are possible.

<Effects of the Invention> In the substrate transfer device according to the present invention, the substrate is transferred by the substrate transfer tool that moves not only horizontally but also vertically along the substrate. Since there is no sliding contact with a substrate support (eg, a spin chuck in a substrate rotation processing device) in the supply unit, the substrate discharge unit, and the substrate processing unit, it is possible to eliminate the inconvenience such as scratches and dust attached to the lower surface of the substrate.

Further, it is possible to supply the unprocessed substrate to the substrate processing unit and discharge the processed substrate from the substrate support member in one go back and forth from the substrate supply unit to the substrate discharge unit to return to the supply side transport device. To high productivity.

Furthermore, by higher position than the treated substrate mounting置区partial 24b unprocessed substrate mounting置区fraction 24a of the substrate transfer tool 4, will be the treated substrate W ₂ is distribution upward than the untreated substrate W ₁ , without contaminating particles or the like attached to the unprocessed substrate W ₁ is attached to the treated substrate W _2, cleanliness can be ensured for the treated substrate W _2.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a substrate transfer device, FIG. 2 is a perspective view of a substrate transfer tool, and FIG. 3 is a perspective view of a substrate transfer device showing a second embodiment. FIG. 4 is a vertical sectional side view of a conventional substrate transfer device. 1 ... Substrate support, 2 ... Supply-side substrate placing device, 3 ...
... Ejection-side substrate placement device, 4 ... Substrate transfer device, 5 ... Transfer device moving means, 24a ... Unprocessed substrate placement section, 24b ...
… Processed substrate placement category.

Continuation of front page (51) Int.Cl. ⁵ Identification number Office reference number FI technical display location B65G 47/82 D 8010-3F H01L 21/027 21/304 D 8831-4M H05K 13/02 T 8509-4E ( 72) Inventor Masahiro Himoto 322 Furukawa-cho, Fushimi-ku, Kyoto-shi, Kyoto Prefecture Rakusai factory, Dainippon Screen Mfg. Co., Ltd. (56) Reference JP-A-58-118125 (JP, A)

Claims (1)

[Claims] 1. A substrate for supplying and transporting an unprocessed substrate from a substrate supply unit to a substrate support of a substrate processing unit of a substrate processing apparatus, and discharging and transporting a processed substrate from the substrate support of the substrate processing unit to a substrate discharge unit. In the transfer apparatus, an unprocessed substrate placement section is provided on the substrate supply section side, and a processed substrate placement section is provided on the substrate ejection section side above the unprocessed substrate placement section. The substrate transfer tool and the substrate transfer tool are reciprocally moved in a section from the substrate supply section through the substrate processing section to the substrate discharge section, and the substrate transfer tool is
The unprocessed substrate placement section and the processed substrate placement section are
A transfer tool moving means for moving up and down to a first height position which is lower and a second height position which is higher than the mounting height of the substrate on the substrate support, and substrate supply The feeding unit elevating means for raising and lowering the unit so as to be above and below the unprocessed substrate placement section of the substrate transfer tool at the first height position, and the substrate discharging unit at the second height position. A substrate transfer device comprising: a discharge part elevating means for elevating and lowering the processed substrate mounting section of the substrate transfer tool so as to move upward and downward.