JPH06286376A - Non-contact IC card manufacturing method and non-contact IC card - Google Patents

Abstract

(57) [Summary] [Purpose] A method of manufacturing a non-contact IC card that has sufficient mechanical strength and airtightness, is highly reliable and easy to handle, and has a beautiful appearance, and can be mass-produced at low cost. Contact I
Provide C card. [Constitution] In at least two resin plates constituting a non-contact IC card, at least one resin plate is non-contact I
A concave portion for mounting the C module is formed, and a projection which is an energy director for ultrasonically welding the two resin plates is formed on at least one resin plate, and the non-contact IC module is formed. Is mounted in the recess, and the two resin plates are integrated by ultrasonic welding.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contactless IC card manufacturing method and a contactless IC card. That is, information exchange between the IC circuit and an external data processing device is performed by an electromagnetic induction method in close proximity, or by an electric wave / optical method in a remote manner, so that information is electrically and mechanically connected. TECHNICAL FIELD The present invention relates to a method for manufacturing a non-contact IC card and a non-contact IC card that do not require a contact terminal electrode.

[0002]

2. Description of the Related Art In recent years, the sophistication of information in society has been remarkable, and cards have become indispensable in social life. Compared with conventional magnetic stripe cards, IC cards with built-in or built-in ICs such as microcomputers and memories have the characteristics of high security, high privacy, and large storage capacity. The use is spreading. For example,
In the company, it is used as an employee ID card for multiple purposes such as employee cafeteria / store use, in-house deposit use, welfare use, entry / exit management, attendance management, health management, and financial, medical, sales / service. Trial use has begun in fields such as transportation, manufacturing, and education.

These conventional IC cards are used for exchanging information between the IC circuit of the IC card and an external data processing device.
It has contact terminal electrodes for connection for electrical and mechanical connection. However, since the contact terminal electrode is provided, there are various problems such as ensuring the airtightness of the IC circuit, measures against electrostatic breakdown, poor electrical connection of the terminal electrode, and complicated mechanism of the IC card reading device. There is. In addition, a human operation of inserting or mounting the IC card into the IC card reading device is required,
It has been desired to develop a non-contact IC card capable of exchanging information with a remote data processing device, which is inefficient and complicated in some fields of use and can be used in a portable state without such trouble. Contactless IC cards that are not only carried by people but also capable of remote data communication are manufactured, assembled,
In the field of transportation sorting, etc., it has a very high utility value such as being attached to parts, devices, luggage, transport vehicles, etc. and used as an ID card. Therefore, the contactless I is a method of exchanging information between the IC circuit of the IC card and an external data processing device by an electromagnetic induction method or a radio wave / optical method without contact.
C card was considered.

As a method of manufacturing such a non-contact IC card, a resin substrate having a shape capable of mounting the non-contact IC module is manufactured by injection molding or the like, and after mounting the non-contact IC module on the resin substrate, A manufacturing method is known in which an adhesive tape having desired printing is attached to the resin substrate to cover both front and back surfaces of the resin substrate. In addition, the cardboard board is punched into a shape such that the non-contact IC module can be mounted, and after mounting the non-contact IC module on the cardboard board, a desired size of the same size as the cardboard board is provided on both front and back surfaces of the cardboard board. Temporarily fix the printed paper, and then use a transparent transparent plastic film that is one size larger than the cardboard board. There is known a manufacturing method by so-called lamination, in which the pieces are sandwiched and then sealed by four-way sealing by heat welding or the like.

However, in the former case, since the non-contact IC module is enclosed by the adhesive tape, the adhesive tape may be peeled off from the resin substrate, which is a problem in terms of airtightness. In addition, the adhesive tape was relatively thin and had insufficient mechanical strength and poor durability. Also, in the latter case, the strength against external force such as bending is poor and there is a problem in handling, the durability is very poor such as the notch progressing from the edge part, and it is also cheap to look and gives concern to the user. Met.

[0006]

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned conventional technical drawbacks, whereby sufficient mechanical strength and airtightness can be obtained, and reliability and handleability are excellent. Another object of the present invention is to provide a non-contact IC card manufacturing method and a non-contact IC card that can be mass-produced at a low cost with a beautiful and beautiful contactless IC card.

[0007]

As a result of various studies to achieve the object of the present invention, as a result of at least two resin plates constituting a non-contact IC card, at least one resin plate has a non-contact IC. A recess for mounting the module is formed, and at least one resin plate is formed with a projection which is an energy director for ultrasonically welding the two resin plates, and the non-contact IC module The present invention has been completed by finding that the above-mentioned problems can be achieved by mounting the two resin plates in one piece by mounting them in the recesses and ultrasonically welding them.

[0008]

[Function] Since the front and back surfaces of the non-contact IC card are made of resin plates and are adhered to each other, sufficient mechanical strength and
It is airtight and has excellent reliability and handleability. Further, the resin plate is excellent in printing suitability, beautiful printing is possible, and a high quality non-contact IC card having a good appearance can be manufactured by the manufacturing method of the present invention. In addition, ultrasonic welding does not require an adhesive, has high energy efficiency and high speed, and enables low cost and mass production.

[0009]

The present invention will be described in detail below based on preferred embodiments. FIG. 1 is a configuration diagram of a non-contact IC card of the present invention. In FIG. 1, 1 is a resin plate (front). The resin plate (table) 1 is a resin plate (table) 1 made of a single resin, a laminated resin, a fiber reinforced resin, or the like, and is provided with a recess 4 in which the non-contact IC module 3 of FIG. 1 can be mounted. . Such a recess 4 can be formed by cutting with an engraving machine or a milling machine. In addition, it is suitable for mass production by making a mold and manufacturing it by injection molding. Figure 1
In 2, the resin plate (back) can be made of the same material and the same manufacturing method as the resin plate (front) 1, but it is not necessarily the same and can be freely selected according to the use and purpose. It is possible. The non-contact IC card of the present invention is a protrusion that is an energy director 5 for ultrasonically welding two resin plates to both or at least one of the surfaces where the resin plate (front) 1 and the resin plate (back) 2 are joined. Is formed,
The non-contact IC module 3 is mounted in the recess 4 and then the adhesive surface 7 of the resin plate (front) 1 and the resin plate (back) 2 is attached.
Can be manufactured by pressurizing together and ultrasonically welding.

The resin of the resin plate is preferably a thermoplastic resin, and any thermoplastic resin can be used regardless of the type. Above all, the amorphous resin has excellent weldability and good welding results can be obtained. However, even a crystalline resin will be welded if strong ultrasonic energy is applied. Examples of the amorphous resin that can be used include ABS resin (acrylonitrile butadiene styrene copolymer resin), SAN resin (acrylonitrile styrene copolymer resin), acrylic resin, styrene resin, polysanphon resin, polycarbonate resin, noryl resin, chloride. Examples include vinyl resin. Examples of the crystalline resin that can be used include polyethylene resin, polypropylene resin, polyamide resin, polyacetal resin, and polyester resin.

FIG. 2 shows an example of the non-contact IC module 3 which can be used in the present invention. In FIG. 2, 11 is a printed circuit board.
As shown in 2, I of CPU, memory, analog IC, etc.
The C chip is bonded, and electronic circuit parts such as the capacitor 13 and others are mounted. IC
The chip or the like is electrically connected to a necessary portion of the conductive pattern formed on the circuit board by wire bonding or wireless bonding. In addition, terminal portions having various purposes are provided. In FIG. 2, reference numeral 14 denotes an elliptical coil made of an insulating coated copper wire or the like, which constitutes a loop antenna. The loop antenna 14 is the antenna terminal 1 on the printed circuit board 11.
Connected to 5.

Further, in the lower diagram of FIG. 2, a plurality of contact terminals 16 are provided on the back surface of the printed circuit board 11 and are electrically connected to the front surface by through holes. These contact terminals 16 are provided in an IC module that is non-contact and incapable of IC writing. When performing an operation test of the completed non-contact IC module 3, I
It is used when writing a D code or the like, or when rewriting the contents of the memory in the middle of use in a non-contact IC card having the contact terminal 16. Further, a method is also possible in which the loop antenna 14 receives an electromagnetic wave emitted from an external information processing device, the electric power is obtained from the electromagnetic wave, and the non-contact IC module modulates and reflects the electromagnetic wave to perform a communication operation. As described above, the battery 17 may be built in and a more powerful active operation may be performed by the power of the battery 17.

(Embodiment 1) The present invention will be described with reference to a more specific example. FIG. 3 is a cross-sectional view of the non-contact IC card of the present invention, showing a cross section taken along the line AA ′ in FIG. Resin plate (front) 1 and resin plate (back) 2 in FIG.
Are made by injection molding, and the resin plate (front) 1 and the resin plate (back) 2 are provided with recesses 4 for mounting the non-contact IC module. As shown in FIG. 3 is mounted in this recess 4, and the front and back surfaces of the resin plate are adhered and sealed by ultrasonic welding. Further, desired printing 8 is applied to the surface of the resin plate.

FIG. 4 is a plan view and a sectional view of the resin plate of the non-contact IC card. The recess 4 for mounting the non-contact IC module 3 is surrounded by an energy director 5 for ultrasonic welding, which completely seals the non-contact IC module. In this embodiment, the energy director 5 is a resin plate (back) 2
The recess 6 is formed in the portion of the resin plate (front) 1 that faces the energy director 5, and the welding resin flows into the recess 6 to cause the resin plates on the front and back to float. Without it, the resin plate is completely adhered and fixed.

Next, a method of manufacturing a non-contact IC card having such a structure will be described. FIG. 5 is a diagram showing a manufacturing process of the non-contact IC card of the present invention. In FIG. 5, the resin plate (front) 1 and the resin plate (back) 2 are made by injection molding of ABS resin (not shown). Examples of the ABS resin include ABS resin ABS- manufactured by Denki Kagaku Kogyo Co., Ltd.
QF can be used. In the printing step 51, desired printing 8 is performed on these front and back resin plates. As a printing method, offset printing, screen printing or the like can be used. Next, non-contact with the recesses of the front and back resin plates I
When the C module is mounted and combined through the mounting step 52, and ultrasonic welding is performed while applying pressure in the next ultrasonic welding step 53, ultrasonic energy is concentrated on the energy director 5 and the ABS resin is melted and the front and back sides are pressed by the pressure. When the resin plates come into close contact with each other and the irradiation of ultrasonic waves is stopped, the melted ABS resin is solidified and the front and back resin plates are bonded and integrated even after the pressurization is stopped. As an apparatus for ultrasonic welding, an ultrasonic welding machine BRANSON 8400 (900
W) can be used, and preferable welding conditions when using this apparatus are ultrasonic frequency of 20 to 40 KHz, welding time of 0.1 to 0.2 seconds, and holding time of 0.2 to 0.3 seconds. . If the welding time and holding time are made longer than that, the appearance is impaired and the productivity is lowered. In this way, the non-contact IC card of the present invention can be manufactured.

(Embodiment 2) The present invention will be described with reference to another more specific example. FIG. 6 shows a non-contact IC of the present invention.
FIG. 2 is a cross-sectional view of the card, showing a cross section taken along the line AA ′ in FIG. 1. The resin plate (front) 1 and the resin plate (rear) 2 in FIG. 6 are made by injection molding, and the resin plate (front) 1 and the resin plate (rear) 2 are recessed for mounting the non-contact IC module 3. 4, the non-contact IC module 3 is mounted in the recess 4 as shown in FIG. 6, and the front and back surfaces of the resin plate are adhered and sealed by ultrasonic welding. Further, desired printing 8 is applied to the surface of the resin plate.

FIG. 7 is a plan view and a sectional view of the resin plate. The concave portion 4 for mounting the non-contact IC module 3 is surrounded by the energy director 5 for ultrasonic welding, so that the non-contact IC module can be completely sealed. In this embodiment, a recess 21 and a protrusion 22 having a fitting structure are formed on the resin plate, and a projection which is an energy director 5 for ultrasonically welding the resin plates to each other is provided with a projection having the fitting structure. It is formed on the portion 22. Recess 21 including this energy director 5
In the fitting diagram of FIG. 7, the concave portion 21 has a depth c larger than the height (ba) of the energy director 5, and the height b of the convex portion 22 including the energy director 5 is c. Greater than. That is, it is formed so that (ba) <c <b. If formed in this way, the resin plate (front) 1, the non-contact IC module 3, and the resin plate (back) 2 can be assembled and fitted to each other before ultrasonic welding to form a temporary integrated structure. By doing so, the handleability is good, and the positioning of each component can be easily and accurately performed.

Next, a method of manufacturing a contactless IC card having such a structure can be carried out in the same manner as the manufacturing method described in (Embodiment 1). Therefore, the description will be given here. Omit it.

If the energy director 5 completely surrounds the non-contact IC module 3, in some cases, for example, the dimensional accuracy of the resin plate is very good, the pressure accuracy of the ultrasonic welding machine is good, and the ultrasonic wave distribution is also good. In the case of evenness, when air is enclosed in the non-contact IC card and the pressure of the ultrasonic welding machine is released, the air expands and the non-contact I
The center of the C card may swell. As a method of preventing such entrapment of air, as shown in FIG. 8, a portion 31 of the energy director 5 is provided with a low height portion 31 in which the height of the energy director is reduced, and the ultrasonic welding machine is provided. When pressure is applied by means of air, it is possible to prevent air entrapment without sacrificing airtightness and obtain good results without sacrificing airtightness. Further, as shown in FIG. 8, if an air vent hole 32 is provided in the resin plate, and after ultrasonic welding, the hole is closed by ultrasonic welding, heat fusion, resin sealing or the like, both air venting and airtightness are achieved. it can.

As described above, the injection-molded ABS resin plate is used as the resin plate constituting the non-contact IC card, but the same operation can be performed with other compatible resins. It is also possible to create a required shape by cutting using a multi-layer resin plate in which plastic sheets are laminated or a single resin plate. The cutting process is suitable for trial production or small-lot production because no mold is required. It is also possible that the shape of the recess 6 or the like facing the energy director is formed by injection molding, and the shape of the recess 4 for mounting the non-contact IC module is formed by cutting. By doing so, it is easy to deal with different types of the non-contact IC module 3.
Further, in the embodiment, the recesses for mounting the non-contact IC module are provided only on both the front and back resin plates, but they may be provided only on one resin plate depending on the shape of the non-contact IC module. In the embodiment, the energy director 5 has a structure in which the non-contact IC module is completely surrounded. However, if the airtightness does not have to be perfect, ultrasonic welding may be performed at several spots without completely enclosing it. can do.

[0021]

According to the present invention, since the front and back surfaces of the non-contact IC card are made of resin plates and are adhered to each other, sufficient mechanical strength and airtightness can be obtained, and reliability and durability can be obtained. And it is easy to handle. Further, the resin plate is excellent in printability, can be printed beautifully, and has a beautiful appearance similar to that of a conventional credit card, and a high quality non-contact IC card can be manufactured by the manufacturing method of the present invention. In addition, ultrasonic welding can be performed in a short time, has high productivity, and is suitable for mass production.

[0022]

[Brief description of drawings]

FIG. 1 is a diagram showing a configuration of a non-contact IC card of the present invention.

FIG. 2 is a diagram showing a structure of a non-contact IC module used in the present invention.

FIG. 3 is a sectional view of the non-contact IC card of the present invention.

4A and 4B are a front view and a cross-sectional view of a resin plate constituting the non-contact IC card of the present invention.

FIG. 5 is a diagram showing a manufacturing process of the non-contact IC card of the present invention.

FIG. 6 is a sectional view of the non-contact IC card of the present invention.

7A and 7B are a front view and a cross-sectional view of a resin plate constituting the non-contact IC card of the present invention.

FIG. 8 is a diagram of an energy director provided on a resin plate that constitutes the non-contact IC card of the present invention.

FIG. 9 is a view of an air vent hole provided with a resin plate that constitutes the non-contact IC card of the present invention.

[Explanation of symbols]

 1. Resin plate (front) 2. Resin plate (back) 3. Non-contact IC module 4. 4. Recess for mounting non-contact IC module 5. Energy director 6. Recess facing the energy director 7. Adhesive surface 8. Printing 11. Printed circuit board 12. IC chip bonding section 13. Capacitor 14. Loop antenna 15. Antenna terminal 16. Contact terminal 17. Battery 18. Outline of non-contact IC module 21. Recessed structure recess 22. Convex part of fitting structure 31. Low height part 32. Air vent hole 51. Printing process 52. Mounting process 53. Ultrasonic welding process

Claims (2)

[Claims] 1. At least two constituting a non-contact IC card
In one resin plate, at least one resin plate is formed with a recess for mounting a non-contact IC module,
In addition, at least one resin plate is formed with a projection which is an energy director for ultrasonically welding the two resin plates, the non-contact IC module is mounted in the recess, and the two are welded by ultrasonic welding. A method for manufacturing a non-contact IC card, characterized by integrating a resin plate. 2. At least two constituting a non-contact IC card
In one resin plate, at least one resin plate is formed with a recess for mounting a non-contact IC module,
In addition, at least one resin plate is formed with a projection which is an energy director for ultrasonically welding the two resin plates, the non-contact IC module is mounted in the recess, and the two are welded by ultrasonic welding. A non-contact IC card characterized by integrating a resin plate.