JPH06249878A - Probe unit and manufacture thereof - Google Patents

Abstract

PURPOSE:To provide a probe unit which can make the load for an inspected surface constant, can provide the excellent electric conductivity by increasing the contact surface pressure, can cope with the fine pitch of 300mum of less, and improve the pitch precision. CONSTITUTION:Probe pins 2 each of which consists which of an extremely thin metal wire having a wire diameer of 150mum are fixed in a prescribed pitch on an insulating base board 3, projecting a part of the probe pin 2 from the base board 3. The projection part 2b is curved to an inspected surface A side and buckling-shaped to an arcuate form having the self elasticity, and a tapered contact peak part 2d is formed at the top edge of the projection part 2b.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe unit used for inspecting the electrical continuity of a liquid crystal display (LCD), a semiconductor integrated circuit (IC) or the like,
In detail, the load on the surface to be inspected is kept constant, and the surface pressure at the time of contact can be increased to obtain good electrical contact instantaneously. The present invention relates to a structure and manufacturing method of a probe pin improved so as to improve accuracy.

Generally, a clock, a calculator, or a personal computer,
When manufacturing a liquid crystal display used in a display device such as a word processor or a screen device of a television, or a semiconductor integrated circuit used in an electronic device, various product inspections are performed in this manufacturing process. For example, conductor wire of liquid crystal substrate, IC
Conventionally, a probe unit 30 as shown in FIG. 8 and FIG. 9 has been adopted when conducting a circuit wiring continuity inspection. This is because a large number of probe pins 32 are arranged at a predetermined pitch on a resin base 31, and each probe pin 32 is brought into contact with, for example, each conductor line 36 formed in a grid pattern on a liquid crystal substrate 35. This is to check the electrical continuity. When the probe unit 30 is manufactured, conventionally, a metal wire made of a tungsten wire or a beryllium copper wire having a wire diameter of about 250 μm is tapered to form a probe pin 32 having a contact 32a, and then the probe pin 32 is formed. Spring 38 in case 37
Elastically supported by. And this one by one resin base 3
1 is used.

On the other hand, in the above liquid crystal display,
The number of pixels is increasing to support higher image quality, and in recent years, liquid crystal substrates with 100,000 to 300,000 pixels have been developed, and in the near future, those with 800,000 to 3 million pixels will also be developed. Conceivable. On the other hand, in the semiconductor integrated circuit, the miniaturization of the IC substrate and the densification of the circuit wiring have been advanced along with the miniaturization of the electronic equipment. Such increase in the number of pixels,
Since the pitch of each wiring becomes narrower as the circuit wiring becomes higher in density, it is necessary to reduce the pitch and the pin diameter of the probe pins 32 as well. In order to cope with such a narrowing of the pitch, conventionally, a plurality of probe units 30 are stacked so that the probe pins 32 of them are alternately arranged in a staggered manner to form a housing. The method of reducing the pitch of is used.

[0004]

However, in the above-mentioned conventional probe unit, since each probe pin is supported by the spring, the spring property of each probe pin tends to vary. As a result, there is a problem that the load on the surface to be inspected varies, and good electrical contact cannot be obtained. In some cases, the surface to be inspected or the probe pin may be damaged.

Therefore, the applicant of the present invention has developed a probe unit capable of obtaining good electrical contact by making the load on the surface to be inspected constant (Japanese Patent Application No. 4-2728).
No. 65). As shown in FIG. 7, this probe unit includes a resin substrate 40 and a body portion 41 a of a probe pin 41.
And the protruding portion 41 of the probe pin 41.
b is formed so as to be inclined with respect to the surface A to be inspected, and a tip portion 41c that abuts the surface A to be inspected is formed to be bent upward in an R shape, and the lower surface of the tip portion 41c makes contact. Have been a child. According to this probe unit, when the probe pins 41 are in contact with each other, variations in the load can be prevented.
Since it can be absorbed by sliding c, each tip 41c
Simultaneously and uniformly contact the surface A to be inspected, and stable inspection performance is obtained.

By the way, the probe pin 41 is suitable for a liquid crystal display in which the contact length of the surface to be inspected can be long, but it is insufficient for use in a semiconductor integrated circuit. That is, since the integrated circuit has a substrate area smaller than that of a liquid crystal display and a contact length of circuit wiring as a surface to be inspected is also short, the tip end portion 4 of the probe pin 41 is small.
It may be difficult to slide 1c to absorb variations in load. In the case of such a surface to be inspected having a short contact length, it is necessary that the variation of the load can be absorbed simultaneously with the contact of the probe pin and the conductivity can be obtained in a short time.
For that purpose, it is necessary to improve the contact pressure,
Improvement in this respect is required.

Further, in the above-mentioned conventional method of laminating probe units to narrow the pitch, it takes time to manufacture and the structure is complicated, so that there is a limit to the narrowing of the pitch, for example, 300 μm or less. There is a problem that it is not possible to deal with the fine pitch of. Here, the wire diameter of the metal wire rod itself used for the probe pin is, for example, 100
It is considered that the problem due to the lamination of the above units is solved by setting the thickness to less than μm. However, generally, if the metal wire material is made extremely thin, the rigidity and strength of the steel wire itself are reduced. As a result, it becomes difficult to hold the metal ultrafine wire in a straight line on the resin base, and the pitch accuracy corresponding to the fine pitch cannot be obtained.

The present invention has been made in view of the above-mentioned conventional circumstances, and the load on the surface to be inspected can be made constant, and the surface pressure at the time of contact can be increased, so that good electrical contact can be instantaneously obtained. It is also possible to provide a probe unit and a method of manufacturing the same that can hold a resin base when the wire diameter of the metal wire rod itself is made small and can cope with a fine pitch and improve pitch accuracy. I am trying.

[0009]

Therefore, the invention of claim 1 is to provide probe pins made of a metal fine wire having a wire diameter of 150 μm or less on an insulating base at predetermined pitches, and from the base to the probe pins. A part of the protrusion is fixed and the protrusion is curved toward the surface to be inspected and is bent and formed into an arc shape having self-elasticity, and the tip of the protrusion is formed into a taper shape on the surface to be inspected. The probe unit is characterized in that a contact point portion that abuts with a high surface pressure is formed.

The invention of claim 2 is characterized in that the tapered tip surface of the metal ultrafine wire is coated with a hard coating having excellent conductivity and corrosion resistance. The invention of claim 3 is the metal ultrafine wire. Is characterized by adopting a low carbon dual phase steel wire with a tensile strength of 300 Kgf / mm ² or more.

According to a fourth aspect of the present invention, there is provided a method for manufacturing the probe unit, wherein metal fine wires for probe pins having a wire diameter of 150 μm or less are arranged on an insulating base at a predetermined pitch and from the base to the above. Part of the metal ultrafine wire is projected and fixed,
The protrusion is curved toward the surface to be inspected and is bent and formed into an arc shape that is self-elastic, and the tip of the protrusion is tapered by applying tensile force and drawing while heating the tip of the protrusion. It is characterized by forming contact points. According to a fifth aspect of the present invention, the protruding portion of the metal ultrafine wire is bent and formed into an arc shape having self-elasticity, and then the tip of the protruding portion is chemically or electrolytically polished to form a tapered contact point. It is characterized by having been given.

Here, in order to fix the metal ultrafine wire to the insulating base, for example, by heating the metal ultrafine wire while pressing it against the base, the portion of the base where the ultrafine wire abuts is melted, As a result, a method of embedding a metal ultrafine wire or a method of bonding with an adhesive can be adopted. Further, it is preferable to adopt a thermoplastic resin such as polycarbonate, polyether, or ether ketone for the insulating base.

The bending of the protruding portion of the metal ultrafine wire can be realized by pressing the protruding portion with a mold while applying tension to the protruding portion. The heating method of the protruding tip of the metal ultrafine wire is as follows:
Infrared heating, laser heating, direct current heating, or induction heating can be used.

Further, the hard coating is made of Ag, Au, Pt, etc. having excellent conductivity and corrosion resistance, and TiN, B having high hardness.
An alloy material with N, AlN, etc. can be adopted. As a method for forming these coatings, means such as electroplating, hot dipping, or sputtering can be adopted.

Furthermore, as the metal ultrafine wire, stainless wire, piano wire, amorphous wire, or low carbon dual phase steel wire can be adopted. By using these metals, the rigidity and strength in the case of ultrafine wire can be obtained. Can be secured. In particular, when the low-carbon dual-phase steel wire is adopted, the strength, rigidity, durability, and toughness can be improved as compared with the stainless wire, piano wire, etc., and the diameter can be further reduced. This low-carbon dual-phase steel wire is produced by subjecting a wire containing Fe as a main component to which C, Si, and Mn are added to strong working by cold drawing. It has a fibrous fine metal structure, which makes the wire diameter 100
Tensile strength of 300 Kgf / mm ² or more at μm or less
(See JP-A-62-20824).

[0016]

According to the probe unit of the first aspect of the present invention, the protruding portion of the metal ultrafine wire is bent and formed so as to be curved toward the surface to be inspected, and the tip end which abuts the surface to be inspected is tapered. Since the pointed portion is formed, the contact pointed portion of the probe pin comes into contact with the surface to be inspected and, at the same time, the protrusion is deformed by its self-elasticity, whereby the load applied to the surface to be inspected can be made constant. In addition, the contact point pressure at the tip momentarily bites into the surface to be inspected, the contact surface pressure is greatly increased, and good electrical conductivity can be obtained. As a result, the semiconductor integrated circuit with a short contact length on the surface to be inspected can be obtained. It can be used in circuits, etc., and stable inspection performance can be obtained.

Further, since metal ultrafine wires having a wire diameter of 150 μm or less are fixed to the insulating base at a predetermined pitch, it becomes possible to hold the ultrafine wires in a straight line, which has been difficult in the past.
It can handle fine pitches of 300 μm or less, and the error range of pitch accuracy can be ± 20 μm or less. As a result, it is possible to solve the problems in productivity and structure when stacking the conventional probe units.

Further, in the invention of claim 2, since the hard coating excellent in conductivity and corrosion resistance is formed on the outer surface of the contact point,
It is possible to avoid wear deterioration of the contact point portion and improve the life, and also to reduce the contact resistance with the surface to be inspected and improve the conductivity.

Further, in the invention of claim 3, since the low carbon dual phase steel wire is adopted as the ultrafine metal wire, the tensile strength of 300 to 600 Kgf / mm ² can be obtained with the wire diameter of 150 μm or less. Therefore, when this is adopted, the strength, rigidity, and toughness can be improved while reducing the diameter, and the function as a probe pin can be further improved.

In the manufacturing method according to the fourth aspect of the invention,
A protruding portion of the metal ultrafine wire from the insulating base is bent and formed into an arc shape having a curved self-elasticity, and a tensile force is applied to the protruding portion while heating the protruding portion to disconnect the tapered contact point. Therefore, the invention of claim 5 is
Since the protruding portion of the metal ultrafine wire is bent and formed into an arc shape having self-elasticity, and a tapered contact point is formed at the tip of the protruding portion by chemical polishing or electrolytic polishing, a large number of pins can be formed simultaneously and simultaneously. They can be formed into the same shape, the processing accuracy and pin tip accuracy can be improved, and productivity can be improved, as compared with the conventional case of forming one pin at a time.

[0021]

Embodiments of the present invention will be described below with reference to the drawings. 1 to 6 are views for explaining a probe unit and a method of manufacturing the probe unit according to an embodiment of the present invention. In this embodiment, a case where the present invention is applied to a probe unit used for a continuity test of a semiconductor integrated circuit will be described as an example. In the figure, 1 is a probe unit of the present embodiment, in which 80 to 130 probe pins 2 are arranged with a pitch of 300 μm or less and a pitch error of ± 20 μm or less,
This is arranged on a thermoplastic resin base 3 made of polycarbonate. The probe pin 2 has a wire diameter
Ni film 5 on the surface of low carbon dual phase steel wire 4 of 20-150 μm
Is formed by electroplating or the like, and a noble metal film 6 made of Au, Ag, Pt or the like is also formed by coating on the surface of the Ni film 5 by plating.

The low-carbon dual-phase steel wire 4 is manufactured by subjecting a metal wire rod to strong working by cold drawing as described above, and the working cells generated thereby are arranged in a unidirectional fiber form. The tensile strength is
It is 300 to 600 Kgf / mm ² . The low carbon dual phase steel wire 4 is subjected to a stretcher annealing treatment, which is a heat treatment at a predetermined temperature while applying a tension to the low carbon dual phase steel wire 4. By this heat treatment, the probe pin 2 which is linearly stretched is formed.

The Ni film 5 has a working strain due to plastic working during cold drawing of the metal wire, which improves self-lubricating property and corrosion resistance, and at the same time as the noble metal film 6. The adhesiveness and adhesiveness of are improved. The noble metal film 6 has a working strain due to plastic working when the metal wire coated with the Ni film 5 is further drawn by cold drawing to a thickness of about several μm. As a result, the pinholes or particles generated during plating are crushed during the wire drawing, resulting in a smooth surface with no defects.

Each probe pin 2 is composed of a main body 2a located on the resin base 3 and a protrusion 2b protruding outward from the base 3. Approximately 1/2 of the main body 2a in the diameter direction is embedded in the resin base 3, and the remaining part is exposed on the lower surface of the base 3. This is because the low carbon dual phase steel wire 4 is placed in a tension state on the resin base 3 in the wiring process described later and the main body portion 2a is heated by heating the main body portion 2a in this state. The resin base 3 which is in contact with is melted and embedded.

On the lower surface of the main body 2a of each probe pin 2 of the probe unit 1, a TAB (Tape
Automated Bondig) is attached, and the TAB is connected to a measuring instrument. The TAB is formed by patterning a wiring to which each probe pin 2 is connected to a flexible film by an etching method or the like, and each wiring of the TAB and each probe pin 2 are collectively and simultaneously subjected to thermocompression bonding. It is connected. In addition to the TAB, COB (flexible printed circuit board), COG (glass substrate), or the like can be used as the one connected to the probe unit 1.

The protruding portion 2b of the probe pin 2 is then
Is bent and formed in an arc shape that is curved from the shoulder portion 2c thereof toward the surface A to be inspected, so that the projecting portion 2b has so-called self-elasticity that is elastically deformed by the descending amount of the probe unit 1. Further, a tapered contact tip portion 2d having a needle-like shape is formed at the tip of the protruding portion 2b that abuts the surface A to be inspected. Further, a hard coating (not shown) is coated on the outer surface of the tapered contact point 2d, which is made of Ag, Au, Pt or the like having excellent conductivity and corrosion resistance and TiN, BN, A having high hardness.
It is made of an alloy material such as 1N.

Next, a method of manufacturing the probe unit 1 will be described. In the manufacturing method of this embodiment, a first step of manufacturing a low-carbon dual-phase steel wire 4 from a metal wire rod and a second step of arranging the low-carbon dual-phase steel wire 4 on the resin base 3 at a predetermined pitch. It comprises a step and a third step of forming the probe pin 2 by bending the low carbon dual phase steel wire 4 to form the probe pin 2. Less than,
Each of the above steps will be described in detail.

First Step First, a hard wire 5 is coated on a metal wire, which is a base material of a low carbon dual phase steel wire, by electroplating or the like, and the hard film 5 is subjected to a strong working by cold wire drawing to form the hard film 5. In addition to imparting a processing strain due to plastic working, a metal wire having a predetermined wire diameter is formed.
Next, the surface of the metal wire is coated with a noble metal film 6, and the noble metal film 6 is subjected to strong working by cold drawing as well.
Add processing strain due to plastic working. This wire drawing process is repeated until the specified wire diameter is obtained,
A low carbon dual phase steel wire 4 having a size of 0 μm or less is obtained.

Then, while pulling the low carbon dual phase steel wire 4 in a tensioned state, the low carbon dual phase steel wire 4 is heat treated by being held in a heating furnace heated to, for example, 430 ° C. for 30 seconds. Then, the steel wire 4 is wound around the bobbin 14. As a result, the low-carbon dual-phase steel wire 4 linearly drawn straight is manufactured. The temperature and holding time in this heat treatment are not particularly limited, and the temperature and time suitable for removing the processing strain without lowering the strength may be set.

Second Step First, the wiring device 8 shown in FIG. 5 is prepared. This wiring device 8 has a rectangular fixed base 9 and a pair of clamps 10a, 10b arranged so as to be movable in the a direction with respect to the fixed base 9.
And a heating control device 12 configured to be movable in the a direction and the b direction, and the control device 12 has a +
A pole electrode 12a and a-pole electrode 12b are provided so as to project.

Further, a rectangular plate-shaped mother base 13 used for the wiring work in the second step is prepared. The mother base 13 is made of a thermoplastic resin such as polycarbonate, and other materials such as polyether and ether ketone can be used. A rectangular opening window 13a is formed on one edge of the mother base 13.
And one side portion of the window 13a of the mother base 3 serves as a holding base 13b during bending processing described later, and the other side serves as the resin base 3 described above. The resin base 3 and the holding base 13b are formed as separate parts.
It is also possible to fix b at an interval and use this interval as the window 13a.

Then, the mother bases 13 are arranged in parallel on the fixed base 9 of the wiring device 8 and each mother base 13 is fixed with screws. Next, the bobbin 14 on which the low carbon two-phase structure steel wire 4 is wound is set on the wiring device 8, and the low carbon two-phase structure steel wire 4 is inserted between the clamp devices 10a and 10b and hung. While passing, the steel wire 4 is supported by the clamp device 10a in a tensioned state by applying tension to the steel wire 4.

Next, the clamp devices 10a and 10b are moved in the direction a to set the low carbon dual phase steel wire 4 at a predetermined position passing over the window 13a of each mother base 13. In this state, both electrodes 12a, 12b of the heating control device 12 are energized to heat and press the steel wire 4 to, for example, 180 to 220 ° C., and the control device 12 is moved along the steel wire 4 in the b direction.
Then, the portion of the mother base 13 on which the steel wire 4 abuts is melted, and the steel wire 4 is embedded in the mother base 3 in a state of traversing the window portion 13a, whereby the low carbon dual phase steel wire 4 is formed.
1/2 or more, for example 70%, in the diametrical direction is embedded in the mother base 13, and the remaining part is exposed on the upper surface of the base 13. In this case, a V-shaped groove may be formed in advance in a portion of the mother base 13 in which the steel wire 4 is embedded, and the steel wire 4 may be arranged in this groove. In forming the groove, the width and depth of the groove are appropriately set so as to sandwich the lower surface of the steel wire 4.

When the first wiring is completed, the clamp devices 10a and 10b are moved by a predetermined pitch to perform the second wiring. After repeating such wiring work in sequence to embed 80 to 130 low carbon dual phase steel wires 4,
The steel wires 4 at both edges of each mother base 13 are cut and separated (see FIG. 3 (a)). When performing the above wiring work, a large number of low carbon dual phase steel wires 4 may be arranged at a predetermined pitch, and the steel wires 4 may be simultaneously embedded. The fixing to the mother base 13 may be performed with an adhesive.

Third Step A die device 15 for pin-forming the mother base 13 with the above wiring.
Then, the device 15 clamps the holding base 13b side and the resin base 3 side of both ends of the mother base 13 in the steel wire 4 direction, respectively. In this state, both edges of the window portion 13a of the mother base 13 are cut to separate the mother base 13 into both bases 3 and 13b (FIG. 3).
(See (b)).

Subsequently, as shown in FIG. 4, the resin base 3 is clamped and fixed, and tension is applied to the holding base 13b to form the low carbon dual phase steel wire 4 between the bases 3 and 13b. Pull in tension. In this state, the first mold 15a of the mold device 15 is
With the steel wire 4 (see FIG. 4 (a)), the steel wire 4 is laid down along the mold 15a, and the second mold 1 is attached to the first mold 15a.
5b is pressed to form a curved portion on the steel wire 4 corresponding to the protruding portion 2b of the probe pin 2 (see FIG. 4 (b)).

Then, the first and second molds 15a, 15
While the protruding portion 2b is pressed and sandwiched by b, the protruding portion 2b is heated by the heating device 20. Subsequently, the holding base 13b
A tension is applied to the wire to draw the heated portion of the protrusion 2b to form a tapered contact point 2d. After that, the holding base 13b side portion of the steel wire 4 is cut. After that, a hard film is coated on the tip surface of each contact point 2d by a sputtering method or the like. As a result, the probe unit 1 of this embodiment is manufactured (see FIGS. 1 and 2). Each of the above-mentioned TAB wirings is attached by thermocompression bonding to the main body portion 2a of each probe pin 2 of the probe unit 1 manufactured in this manner, and this is attached to an inspection device (not shown).

Next, the function and effect of this embodiment will be described. As shown in FIGS. 1 and 2, the probe unit 1 according to the present embodiment is for conducting a continuity inspection of a wiring formed in a pattern on a circuit board 17 of a semiconductor integrated circuit. The probe unit 1 is arranged on each wiring of the circuit board 17, and the probe unit 1 is vertically lowered so that the tip of the contact point 2d of each probe pin 2 contacts each wiring which is the surface A to be inspected of the circuit board 17. Contact. This checks the electrical continuity.

In this case, as shown in FIG. 1, the protruding portion 2b of each probe pin 2 is curved from the shoulder portion 2c thereof toward the surface A to be inspected, and the tip is tapered. It's sharp. Therefore, at the same time when the contact point 2d bites into the surface A to be inspected, the protrusion 2b elastically deforms, whereby a high contact surface pressure can be obtained momentarily while keeping the load applied to the surface A to be inspected constant. As a result, extremely good electrical conductivity can be obtained, and stable inspection performance can be obtained.

In this embodiment, the low carbon dual phase steel wire 4 is arranged on the resin base 3 at a predetermined pitch, and the portion of the resin base 3 on which the steel wire 4 abuts is heated and melted. Thus, since the steel wire 4 is embedded and fixed in the diameter direction of 1/2 or more, the ultrafine steel wire 4 having a wire diameter of 150 μm or less can be reliably held straight. As a result, the error range of pitch accuracy, which was difficult in the past, can be reduced to ± 20 μm or less, and fine pitch of 300 μm or less can be achieved, which enables high density of IC pads. As a result, it is possible to eliminate the need for stacking the probe units as in the conventional case, and thus it is possible to improve productivity as much as that and contribute to cost reduction and size reduction.

Further, in the manufacturing method of this embodiment, since the protruding portion 2b of the probe pin 2 is molded and the tensile force is applied to the protruding portion 2b to heat the protruding portion 2b to form the contact point 2d, a large number of them are formed. The pins can be formed into the same shape at the same time, and the processing accuracy and the pin tip accuracy can be improved, and productivity can be improved, as compared with the conventional case of forming the pins one by one. By the way, the conventional pin tip accuracy is limited to ± 30 to 35 μm, but in this embodiment, it can be set to ± 20 μm or less.
In addition, the above-mentioned taper portion is subjected to chemical polishing, after being bent and formed.
Alternatively, it may be formed by electrolytic polishing, and in this case also, the pin tip accuracy can be improved.

Further, since the low carbon dual phase steel wire 4 is adopted for the probe pin 2, the strength, rigidity, toughness and the like of the wire itself can be improved and the wire diameter can be made extremely small. As a result, the inspection performance of the probe pin 2 can be further improved.

In the above embodiment, the case where a part of the probe pin 2 in the diametrical direction is embedded is described, but the present invention is not limited to this, and for example, in the longitudinal direction of the probe pin 2. A part of the steel wire 4 may be buried and the remaining part may be exposed, or the entire end of the steel wire 4 may be exposed from the end surface of the resin base 3.

In the above embodiment, the probe unit employed in the semiconductor integrated circuit has been described as an example.
The use of the probe unit of the present invention is not limited to this, and it can be applied to the inspection of liquid crystal displays, and in short, it can be applied to the probe pin for the continuity inspection of high-density contacts.
Further, although the low-carbon dual-phase steel wire is adopted in the above-mentioned embodiment, the present invention may adopt a stainless wire or a piano wire, and in this case, substantially the same effect as the above-mentioned embodiment can be obtained.

[0045]

As described above, according to the probe unit and the method of manufacturing the unit of the present invention, the wire diameter is 150 μm.
The probe pins made of the following metal ultrafine wires are fixed to the insulating base at a predetermined pitch, and a part of the probe pins is protruded from the base, and the protrusion is bent and formed to be curved toward the surface to be inspected. Since the tapered contact point is formed at the tip, the contact point bites into the surface to be inspected, the load applied to the surface to be inspected can be made constant, and a momentary high contact surface pressure can be obtained. It has the effect of achieving stable inspection, and is capable of handling fine pitches of 300 μm or less and improving pitch accuracy.

[Brief description of drawings]

FIG. 1 is a side view illustrating a probe unit according to an exemplary embodiment of the present invention.

FIG. 2 is a perspective view showing an inspection method using the probe unit of the above embodiment.

FIG. 3 is a process drawing for explaining the manufacturing method for the unit of the embodiment.

FIG. 4 is a process diagram for explaining a method for forming a protrusion and a contact point of the example unit.

FIG. 5 is a schematic configuration diagram showing a wiring device used in the method of manufacturing the unit of the embodiment.

FIG. 6 is a cross-sectional view of a probe pin of the example unit.

FIG. 7 is a side view of the probe unit for explaining the establishment process of the present invention.

FIG. 8 is a perspective view showing a conventional probe unit.

FIG. 9 is a cross-sectional view showing the structure of a conventional probe unit.

[Explanation of symbols]

 1 Probe Unit 2 Probe Pin 2b Projection 2d Contact Point 3 Resin Base (Insulating Base) 4 Low Carbon Dual Phase Steel Wire (Extra-fine Metal Wire) 5 Hard Film 6 Noble Metal Film A Surface to be Inspected

Claims (5)

[Claims] 1. A probe pin made of a metal ultrafine wire having a wire diameter of 150 μm or less is fixed on an insulating base at a predetermined pitch, and a part of the probe pin is protruded from the base, and the protrusion is formed. Part is curved toward the surface to be inspected and is bent and formed in an arc shape having self-elasticity, and the tip of the protrusion is formed into a taper shape to form a contact point which comes into contact with the surface to be inspected at a high surface pressure. A probe unit characterized by the above. 2. The probe unit according to claim 1, wherein a surface of the contact point of the probe pin is coated with a hard film having excellent conductivity and corrosion resistance. 3. The probe unit according to claim 1, wherein the fine metal wire is a low carbon dual phase steel wire having a tensile strength of 300 kgf / mm ² or more. 4. A metal fine wire for a probe pin having a wire diameter of 150 μm or less is fixed on an insulating base at a predetermined pitch, and a part of the metal fine wire is projected from the base, and the projection is made. Portion is curved toward the surface to be inspected and is bent and formed in an arc shape having self-elasticity, and the tip of the protruding portion is heated and a tensile force is applied to draw it to make a taper contact with the tip. A method for manufacturing a probe unit, which comprises forming a pointed portion. 5. A metal fine wire for a probe pin having a wire diameter of 150 μm or less is fixed on an insulating base at a predetermined pitch, and a part of the metal fine wire is projected from the base, and the projection is made. Characterized in that the portion is curved toward the surface to be inspected and is bent in an arc shape having self-elasticity, and then a tapered contact point is formed at the tip of the protruding portion by chemical polishing or electrolytic polishing. Manufacturing method of probe unit.