JPH062102A - Method for controlling carburization - Google Patents
Method for controlling carburizationInfo
- Publication number
- JPH062102A JPH062102A JP18738292A JP18738292A JPH062102A JP H062102 A JPH062102 A JP H062102A JP 18738292 A JP18738292 A JP 18738292A JP 18738292 A JP18738292 A JP 18738292A JP H062102 A JPH062102 A JP H062102A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- carburizing
- carburized
- layer
- carburization
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 41
- 238000007747 plating Methods 0.000 claims abstract description 77
- 238000005255 carburizing Methods 0.000 claims abstract description 55
- 239000000203 mixture Substances 0.000 claims abstract description 21
- 150000003839 salts Chemical class 0.000 claims abstract description 9
- 239000003638 chemical reducing agent Substances 0.000 claims abstract description 5
- 239000002562 thickening agent Substances 0.000 claims abstract description 5
- 239000008139 complexing agent Substances 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 239000000945 filler Substances 0.000 claims description 6
- 239000007789 gas Substances 0.000 abstract description 14
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 abstract description 8
- 238000006243 chemical reaction Methods 0.000 abstract description 5
- 229910000365 copper sulfate Inorganic materials 0.000 abstract description 5
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 abstract description 5
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 abstract description 4
- 229920000159 gelatin Polymers 0.000 abstract description 3
- 235000019322 gelatine Nutrition 0.000 abstract description 3
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 abstract description 2
- 239000003345 natural gas Substances 0.000 abstract description 2
- -1 EDTA/2Na Chemical compound 0.000 abstract 1
- 239000001828 Gelatine Substances 0.000 abstract 1
- 239000004067 bulking agent Substances 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 239000007769 metal material Substances 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 description 11
- 239000011248 coating agent Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 229910052810 boron oxide Inorganic materials 0.000 description 3
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 2
- 108010010803 Gelatin Proteins 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 229910002091 carbon monoxide Inorganic materials 0.000 description 2
- 238000010000 carbonizing Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000008273 gelatin Substances 0.000 description 2
- 235000011852 gelatine desserts Nutrition 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 230000003449 preventive effect Effects 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- PQUXFUBNSYCQAL-UHFFFAOYSA-N 1-(2,3-difluorophenyl)ethanone Chemical compound CC(=O)C1=CC=CC(F)=C1F PQUXFUBNSYCQAL-UHFFFAOYSA-N 0.000 description 1
- IXPNQXFRVYWDDI-UHFFFAOYSA-N 1-methyl-2,4-dioxo-1,3-diazinane-5-carboximidamide Chemical compound CN1CC(C(N)=N)C(=O)NC1=O IXPNQXFRVYWDDI-UHFFFAOYSA-N 0.000 description 1
- 229910000984 420 stainless steel Inorganic materials 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- SXRSQZLOMIGNAQ-UHFFFAOYSA-N Glutaraldehyde Chemical compound O=CCCCC=O SXRSQZLOMIGNAQ-UHFFFAOYSA-N 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005256 carbonitriding Methods 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000000571 coke Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- YPTUAQWMBNZZRN-UHFFFAOYSA-N dimethylaminoboron Chemical compound [B]N(C)C YPTUAQWMBNZZRN-UHFFFAOYSA-N 0.000 description 1
- 229940014259 gelatin Drugs 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000005121 nitriding Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 235000011837 pasties Nutrition 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- HELHAJAZNSDZJO-OLXYHTOASA-L sodium L-tartrate Chemical compound [Na+].[Na+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O HELHAJAZNSDZJO-OLXYHTOASA-L 0.000 description 1
- 229940047670 sodium acrylate Drugs 0.000 description 1
- 235000010413 sodium alginate Nutrition 0.000 description 1
- 239000000661 sodium alginate Substances 0.000 description 1
- 229940005550 sodium alginate Drugs 0.000 description 1
- 239000001509 sodium citrate Substances 0.000 description 1
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 1
- 229940074404 sodium succinate Drugs 0.000 description 1
- ZDQYSKICYIVCPN-UHFFFAOYSA-L sodium succinate (anhydrous) Chemical compound [Na+].[Na+].[O-]C(=O)CCC([O-])=O ZDQYSKICYIVCPN-UHFFFAOYSA-L 0.000 description 1
- 239000001433 sodium tartrate Substances 0.000 description 1
- 229960002167 sodium tartrate Drugs 0.000 description 1
- 235000011004 sodium tartrates Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 1
Landscapes
- Solid-Phase Diffusion Into Metallic Material Surfaces (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】この発明は、ペースト状の還元メ
ッキ組成物を被浸炭処理材の所定箇所に塗布し、次にメ
ッキ条件として温度乃至メッキ時間を変えて所望の厚さ
のメッキ膜を形成した後、ガス浸炭処理を施すことによ
り浸炭処理における所望の浸炭層深さを得るようにした
浸炭制御方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention applies a reduction plating composition in the form of a paste to a predetermined portion of a material to be carburized and then forms a plating film having a desired thickness by changing temperature or plating time as plating conditions. The present invention relates to a carburizing control method for obtaining a desired carburized layer depth in carburizing by performing gas carburizing after forming.
【0002】[0002]
【従来の技術】一般に、浸炭処理方法としては、浸炭材
として、木炭、コークス、骨灰、グラファイトなどの粉
末を利用する固体浸炭法と、シアン化カリウムなどを主
成分とした溶融塩中に被浸炭処理材としての例えば歯車
などの部材を入れ、発生する一酸化炭素と窒素で浸炭と
窒化を同時に行う液体浸炭窒化方法と、天然ガス、一酸
化炭素、メタン、エタン、プロパン油蒸気又は、アルコ
ール中で行うガス浸炭法が知られている。2. Description of the Related Art Generally, as a carburizing method, a solid carburizing method using powder of charcoal, coke, bone ash, graphite, etc. as a carburizing material, and a carburized material in a molten salt containing potassium cyanide as a main component. For example, a liquid carbonitriding method in which a member such as a gear is placed and carburizing and nitriding are simultaneously performed with generated carbon monoxide and nitrogen, and performed in natural gas, carbon monoxide, methane, ethane, propane oil vapor or alcohol. A gas carburizing method is known.
【0003】このガス浸炭法においては、浸炭炉内に部
品を挿入し、ヒートパターンで加熱制御して所定の深さ
に浸炭する、浸炭制御が可能である。In this gas carburizing method, it is possible to carry out carburizing control by inserting parts into a carburizing furnace and heating them with a heat pattern to control carburization to a predetermined depth.
【0004】ところが、このような浸炭制御にあって
は、浸炭炉において浸炭ガス濃度及び炉内温度及び処理
時間の調整により浸炭深さを調整することができるもの
の部品の表面に一様な浸炭層が形成されてしまい部品の
形状に応じて、部分的に浸炭深さが異なる浸炭層を形成
することはできない。However, in such carburizing control, the carburizing depth can be adjusted by adjusting the carburizing gas concentration, the temperature in the furnace, and the treatment time in the carburizing furnace, but a uniform carburizing layer is formed on the surface of the component. Therefore, it is impossible to form a carburized layer having a carburized depth partially different depending on the shape of the part.
【0005】部分的に浸炭深さを変える方法としては、
浸炭処理後の部品表面の浸炭層をグライダーで処理し、
その後焼き入れ処理することで部分的に浸炭深さを補正
することが行われているが、手間がかかり、量産性に問
題がある。As a method of partially changing the carburizing depth,
After the carburizing process, the carburized layer on the surface of the part is treated with a glider,
After that, the carburizing depth is partially corrected by performing a quenching process, but it takes time and labor, and there is a problem in mass productivity.
【0006】また、液状乃至ペースト状の浸炭防止材
を、浸炭させたくない部分に塗布した上で浸炭処理する
ことが行われているが、液状乃至ペースト状の浸炭防止
材では塗布装置において一定深さに均一に塗布すること
が困難なことから塗布膜厚による浸炭制御ができない。[0006] Further, although a liquid or paste carburizing preventive material is applied to a portion which is not desired to be carburized and then carburized, a carburizing preventive material in liquid or paste form is applied at a constant depth in a coating device. In addition, since it is difficult to apply the coating uniformly, it is not possible to control carburization by the coating thickness.
【0007】更に、組成変更により、液状塗布を可能と
しても所望の浸炭深さにするたび毎に組成変更が必要と
なり、1つの方法による浸炭制御は困難である。Further, even if the liquid coating is possible by changing the composition, it is necessary to change the composition every time the desired carburizing depth is reached, and it is difficult to control the carburizing by one method.
【0008】また、これら問題点に関連した技術として
は、軸受を対象とした局部的に10〜200 μm の薄メッキ
をするか、或はまだら溶射などの被覆層を形成してから
浸炭することにより、浸炭層深さを適度(半防炭)の状
態にする方法( 特開昭51-41647号公報) が開示されてい
る。As a technique related to these problems, locally carburizing the bearing by thin plating of 10 to 200 μm or forming a coating layer such as mottled thermal spraying and then carburizing. Discloses a method (Japanese Patent Laid-Open No. 51-41647) in which the depth of the carburized layer is moderate (semi-carburized).
【0009】更に、塩浴法や粉末法による金属熱化学処
理(2金属拡散浸透法)において、天然または合成繊維
による金属粉末を包含する自己粘着性テープを局部的に
被覆することにより、局部的に活性炭素の拡散を防止す
る方法( 特開昭51-50240号公報) が開示されている。Further, in the metal thermochemical treatment by the salt bath method or the powder method (two metal diffusion infiltration method), the self-adhesive tape containing the metal powder made of natural or synthetic fiber is locally coated to locally apply it. JP-A-51-50240 discloses a method for preventing the diffusion of activated carbon.
【0010】また、防炭剤を所望の位置に塗布する方法
に関し、防炭剤を塗布する必要のない部分には塗装など
でよく使用されるマスキングテープの代りにロウを予め
塗布し、その後防炭剤を塗布することにより、簡便に精
度良く防炭剤を塗布する方法( 特開昭52-78721号公報)
が開示されている。Further, regarding a method of applying a carburizing agent to a desired position, a wax is preliminarily applied instead of a masking tape which is often used for painting, etc., to a portion which does not need to be coated with a carburizing agent, and then the anti-charging agent is applied. A simple and accurate method of applying a carbonizing agent by applying a carbonizing agent (JP-A-52-78721)
Is disclosed.
【0011】[0011]
【発明が解決しようとする問題点】しかし、特開昭51-4
1647号公報に開示された方法は、10〜200 μm のメッキ
厚さでは浸炭ガスが完全に遮断され、半防炭ではなく完
全防炭となり、更にまだら溶射の場合には浸炭ムラが発
生し、何れも実用上問題がある。[Problems to be Solved by the Invention] However, JP-A-51-4
In the method disclosed in 1647, the carburizing gas is completely cut off at a plating thickness of 10 to 200 μm, it becomes a complete carburizing instead of semi-carburizing, and in the case of mottled spraying, carburizing unevenness occurs, Both have practical problems.
【0012】また、特開昭51-50240号或は特開昭52-787
21号公報に開示された方法では、炭素の浸炭を完全に防
止してしまうので、浸炭深さを自由に調整できないとい
う問題がある。[0012] Further, JP-A-51-50240 or JP-A-52-787.
The method disclosed in Japanese Patent No. 21 completely prevents carburization of carbon, and therefore has a problem that the carburization depth cannot be freely adjusted.
【0013】更に、問題点を解決すべく本発明者らは既
に、各種浸炭処理方式に適用でき、浸炭深さを所望のも
のに調整できる浸炭制御法として、防炭剤を骨材或はホ
ットメルト樹脂中に分散させてシート化乃至テープ化
し、この浸炭制御剤を適時ホットメルト処理することに
より被加工物の浸炭制御面に貼り付けることを提唱し
た。Further, in order to solve the problem, the present inventors have already applied it to various carburizing treatment systems, and as a carburizing control method capable of adjusting the carburizing depth to a desired one, a carburizing agent is used as an aggregate or a hot carburizing agent. It was proposed to disperse it in a melt resin to form a sheet or a tape, and to apply this carburizing control agent to the carburization control surface of a work by subjecting it to hot melt treatment at appropriate times.
【0014】しかしながら、このシート乃至テープ状の
浸炭制御剤は、2次元平面成形品であるので、被加工物
が3次元加工面をもつ場合には貼り付けが困難になる。However, since the sheet- or tape-shaped carburizing control agent is a two-dimensional flat molded article, it becomes difficult to attach it when the workpiece has a three-dimensional processed surface.
【0015】例えば凹曲面と凸曲面が複雑に組み合わさ
れている螺子面や、錐状の深いクボミをもつ面に対して
はその表面垂直方向に対して全てが均一な厚みになるよ
うなシートの製造が困難であり、また貼り付けも困難で
ある。For example, for a screw surface in which a concave curved surface and a convex curved surface are combined intricately, or for a surface having a deep conical concave shape, a sheet having a uniform thickness in the direction perpendicular to the surface is used. It is difficult to manufacture and it is also difficult to attach.
【0016】更に、これに対応できたとしても、被加工
物が数種類に限られる場合は貼り付け機の貼り付け部形
状を限定して使用できるが、少量多品種には不向きであ
る。Further, even if it is possible to cope with this, when the number of kinds of workpieces is limited, the shape of the sticking portion of the sticking machine can be limited and used, but it is not suitable for a large number of small quantities.
【0017】この多品種生産性については、先の液状防
炭剤及びペースト状防炭剤を、例えば溶媒希釈による精
密スプレー塗布により使用可能である。For this multi-product productivity, it is possible to use the above-mentioned liquid anticorrosive agent and pasty anticorrosive agent by, for example, precision spray coating by diluting with a solvent.
【0018】しかし、この場合塗布後のタレの問題や、
局部的な塗布がスプレーパターンに左右されるという問
題、及び浸炭制御に必要である酸化硼素の高濃度配合物
がスラリー特性を有し、且つ酸化硼素の粒径が大きいた
めにスプレーのオリフィスを口径の大きいものとする必
要があり、また酸化硼素の硬さによるオリフィス部分の
摩耗による不都合がある。However, in this case, the problem of sagging after coating,
The problem that the local application depends on the spray pattern, and the high-concentration compound of boron oxide required for carburization control has slurry characteristics, and the diameter of the boron oxide is large, the orifice of the spray is calibrated. Is large, and there is a problem due to abrasion of the orifice portion due to the hardness of boron oxide.
【0019】そこで、この発明では塗布が簡便であり、
且つ生成する浸炭制御膜が均一の厚さとなる浸炭制御法
を提供することを目的とする。Therefore, in the present invention, the application is simple,
Another object of the present invention is to provide a carburization control method in which the carburization control film produced has a uniform thickness.
【0020】[0020]
【問題点を解決するための手段】以上の問題点を解決す
るため、この発明では硫酸銅のような金属塩、EDTA
・2Naのような錯化剤、ホルムアルデヒドのような還
元剤、増粘剤、充填剤からなる還元メッキ組成物を、被
浸炭処理材の所定箇所に塗布し、次にメッキ条件として
温度乃至メッキ時間を変えて所望の厚さのメッキ膜を形
成した後、上記被浸炭処理材にガス浸炭処理を施す浸炭
制御方法を提案するものである。In order to solve the above problems, in the present invention, a metal salt such as copper sulfate, EDTA is used.
· A reduction plating composition consisting of a complexing agent such as 2Na, a reducing agent such as formaldehyde, a thickener, and a filler is applied to predetermined portions of the material to be carburized, and then the plating conditions include temperature and plating time. It proposes a carburization control method in which the carburized material is subjected to gas carburizing treatment after forming a plating film having a desired thickness by changing the above.
【0021】ここで、金属塩としては特に硫酸銅が好ま
しいが、これに限定されずニッケル、クロム、銀など還
元メッキ可能な金属塩を使用することができる。Here, copper sulfate is particularly preferable as the metal salt, but the metal salt is not limited to this, and a metal salt capable of reduction plating such as nickel, chromium and silver can be used.
【0022】また、錯化剤としては、EDTA・2Na
の他に、酒石酸ナトリウム(カリウム)、クエン酸ナト
リウム、コハク酸ナトリウム等を挙げることができる。As the complexing agent, EDTA.2Na
In addition, sodium tartrate (potassium), sodium citrate, sodium succinate and the like can be mentioned.
【0023】還元剤としては、ホルムアルデヒドの他
に、グルタルアルデヒド、ジメチルアミノボラン、硼
酸、硫酸等を挙げることができる。Examples of the reducing agent include glutaraldehyde, dimethylaminoborane, boric acid, sulfuric acid and the like, in addition to formaldehyde.
【0024】増粘剤としては、ゼラチン、アルギン酸ナ
トリウム、アクリル酸ナトリウム、商用で使用される水
溶性チキソトロピック剤等を挙げることができる。Examples of the thickener include gelatin, sodium alginate, sodium acrylate, and commercially available water-soluble thixotropic agents.
【0025】充填剤としては、シリカ系充填剤、カオリ
ン、珪藻土、アルミナ、チタン等の酸化物、チッ化硼化
物等を挙げることができる。Examples of the filler include silica-based fillers, kaolin, diatomaceous earth, alumina, oxides of titanium and the like, and nitrided boride.
【0026】[0026]
【作用】この発明で使用する還元メッキ組成物は増粘
剤、充填剤等を配合してペースト状にしてあるため、従
来のノズル塗布装置による被浸炭処理材である部品の形
状に部分塗布即ちメッキが可能である。Since the reduction plating composition used in the present invention is made into a paste by adding a thickener, a filler, etc., it is partially applied to the shape of a part which is a carburized material by a conventional nozzle coating device. Plating is possible.
【0027】メッキ組成物を被浸炭処理材の表面に塗布
した後、温度10〜80℃の範囲、メッキ時間0.1 〜10分の
間でメッキ反応を行なわせる。After the plating composition is applied to the surface of the material to be carburized, the plating reaction is performed at a temperature in the range of 10 to 80 ° C. for a plating time of 0.1 to 10 minutes.
【0028】このメッキ反応により塗布されたメッキ組
成物中の金属塩は還元剤により還元されて被浸炭処理材
の表面に所望の厚さのメッキ膜を形成する。メッキ反応
終了後、メッキ組成物を洗い流し、この被浸炭処理材に
従来公知のガス浸炭処理を施すのである。The metal salt in the plating composition applied by this plating reaction is reduced by a reducing agent to form a plating film having a desired thickness on the surface of the carburized material. After the completion of the plating reaction, the plating composition is washed away, and the material to be carburized is subjected to a conventionally known gas carburizing treatment.
【0029】なお、メッキ時間乃至加熱或は冷却等の温
度条件の調整によりメッキ反応を促進乃至抑制できるの
で、これらのメッキ条件を調整することにより上記還元
メッキ組成物の塗布後生成するメッキ膜を所望の厚さに
規定できる。The plating reaction can be promoted or suppressed by adjusting the plating time or the temperature conditions such as heating or cooling. Therefore, by adjusting these plating conditions, the plating film formed after the reduction plating composition is applied can be formed. The desired thickness can be specified.
【0030】なお、メッキ法としては還元メッキ法、電
解メッキ法、置換メッキ法があるが、還元メッキ法は以
下の点で有利である。As the plating method, there are a reduction plating method, an electrolytic plating method, and a displacement plating method. The reduction plating method is advantageous in the following points.
【0031】即ち、ピンホールは通常メッキ処理におい
て欠陥とされるが、浸炭処理においてはメッキ膜のピン
ホールを通して浸炭ガスの侵入が起こり、均一なピンホ
ールの存在、発生率により浸炭度が変化するので、浸炭
制御を行なう上で、メッキ膜にピンホールを均一に発生
させ、しかもその発生率を制御させる必要がある。That is, the pinholes are usually regarded as defects in the plating process, but in the carburizing process, the carburizing gas penetrates through the pinholes of the plating film, and the carburizing degree changes depending on the existence and generation rate of the uniform pinholes. Therefore, in carrying out carburization control, it is necessary to uniformly generate pinholes in the plating film and to control the generation rate thereof.
【0032】また、浸炭制御に使用するメッキ膜に求め
られる他の特性としては、浸炭時の高熱処理時にメッキ
膜が剥離しないことが挙げられるが、上記還元メッキ法
においてはこれらの問題に対して以下の点で有利であ
る。Another characteristic required of the plating film used for carburization control is that the plating film does not peel off during the high heat treatment during carburization. It is advantageous in the following points.
【0033】これに対して、還元メッキ法ではメッキ組
成物中から界面活性剤を除くこと及びメッキ条件を規定
することにより、メッキ膜に均一なピンホールを形成
し、しかもその発生率を制御することが可能である。On the other hand, in the reduction plating method, by removing the surfactant from the plating composition and defining the plating conditions, uniform pinholes are formed in the plating film and the generation rate thereof is controlled. It is possible.
【0034】また、還元メッキ法では被浸炭処理材表面
へのメッキ膜の密着性が良好であり、浸炭の際の高温処
理時にメッキ膜が剥離することはない。In the reduction plating method, the adhesion of the plating film to the surface of the carburized material is good, and the plating film does not peel off during the high temperature treatment during carburization.
【0035】これに対して、置換メッキ法においては被
浸炭処理材へのメッキ膜の密着性が十分でなく、浸炭時
にメッキ膜が剥離する虞れがある。On the other hand, in the displacement plating method, the adhesion of the plated film to the material to be carburized is not sufficient, and the plated film may peel during carburization.
【0036】更に、温度乃至メッキ時間等のメッキ条件
を調整しても所定の厚さのメッキ膜を形成するのが困難
である。Further, it is difficult to form a plating film having a predetermined thickness even if the plating conditions such as temperature and plating time are adjusted.
【0037】また、電解メッキ法においては通常メッキ
浴に被浸炭処理材を浸漬することにより行なわれるた
め、被浸炭処理材の全てがメッキされてしまい、部分的
にメッキを行なうにはマスキングが必要となり、作業上
困難を伴う。Further, in the electrolytic plating method, since the carburized material is usually immersed in the plating bath, all the carburized material is plated, and masking is required to partially plate the material. Becomes difficult to work with.
【0038】更に、電解メッキ法においてはピンホール
のない、メッキ膜が形成され、浸炭ガスがこれにより完
全に遮断されてしまう。Further, in the electrolytic plating method, a plating film having no pinhole is formed, and the carburizing gas is completely cut off by this.
【0039】[0039]
【発明の効果】以上要するに、この発明によればペース
ト状の還元メッキ組成物を使用するため、被浸炭処理材
の表面形状が3次元構造を持っていても、メッキ組成物
を部分的に精度良く塗布することが可能である。In summary, according to the present invention, since the paste-like reduction plating composition is used, even if the surface shape of the carburized material has a three-dimensional structure, the plating composition can be partially accurate. It can be applied well.
【0040】なお、メッキ組成物の塗布厚さに関係なく
被浸炭処理材の表面に形成されたメッキ膜の厚さは一定
となるので、メッキ組成物の塗布厚さに関しては多少ラ
フでも構わない。Since the thickness of the plating film formed on the surface of the carburized material is constant regardless of the coating thickness of the plating composition, the coating thickness of the plating composition may be somewhat rough. .
【0041】また、この発明では上述のメッキ組成物を
使用し、温度乃至メッキ時間を調整して還元メッキを行
なうため、被浸炭処理材の表面には均一にピンホールを
有する所望厚みのメッキ膜が形成され、このメッキ膜に
より所望の浸炭制御が可能となる。Further, in the present invention, since the above-mentioned plating composition is used and the reduction plating is performed by adjusting the temperature or the plating time, the plating film having a desired thickness having pinholes uniformly on the surface of the carburized material. Is formed, and this plating film enables desired carburization control.
【0042】[0042]
【実施例】以下、この発明の実施例を示す。 実施例1 テストパネルとしてSCM-420 鋼(50mm ×50mm×5mm)を使
用し、この表面に、硫酸銅 2.5g 、水酸化ナトリウム
4.0g 、EDTA・2Na 6.5g 、ホルムアルデヒド 8.
0g 、ゼラチン10 g、 シリカ系充填剤3g、水150gからな
るメッキ組成物を塗布し、次に処理条件として 4分、10
分、 26分、 34分間で還元メッキ処理した後、メッキ組成
物を洗い流してテストパネルの表面に厚さ0 〜1 μm、1
〜2 μm、2〜3 μm のメッキ膜を形成した。その後ガス
浸炭法により浸炭制御を行なった。EXAMPLES Examples of the present invention will be shown below. Example 1 SCM-420 steel (50 mm x 50 mm x 5 mm) was used as a test panel, and on this surface, 2.5 g of copper sulfate and sodium hydroxide were used.
4.0g, EDTA / 2Na 6.5g, formaldehyde 8.
A plating composition consisting of 0 g, 10 g of gelatin, 3 g of silica-based filler, and 150 g of water was applied.
Min., 26 min., 34 min., And then rinse off the plating composition to a thickness of 0 to 1 μm on the surface of the test panel.
Plating films of ˜2 μm and 2-3 μm were formed. Then, carburization was controlled by the gas carburizing method.
【0043】比較例1 実施例1と同様なテストパネルを使用し、これに電解メ
ッキを施し、このメッキ処理されたテストパネルを研磨
してメッキ厚さを3 μm、 5 μm、7 μm、9 μmに調整
し、その後実施例1と同様にガス浸炭法により浸炭制御
した。Comparative Example 1 A test panel similar to that used in Example 1 was used, electrolytically plated, and the plated test panel was polished to a plating thickness of 3 μm, 5 μm, 7 μm, 9 After adjusting to μm, carburization was controlled by the gas carburizing method as in Example 1.
【0044】比較例2 実施例1と同様なテストパネルを使用し、これを硫酸銅
15g/リットル、硫酸0.75g/リットル、 イオン交換水1リットル からな
るメッキ液中で、浸漬30秒、60 秒、120秒の処理条件で置
換メッキ処理してテストパネルの表面に厚さ1 〜2 μm
のメッキ膜を形成し、その後ガス浸炭法により浸炭制御
を行なった。その実施例1、比較例1、2の結果を下記
の表1に示す。Comparative Example 2 The same test panel as in Example 1 was used, and this was used as copper sulfate.
Immerse in a plating solution consisting of 15 g / liter, sulfuric acid 0.75 g / liter, and ion-exchanged water 1 liter for 30 seconds, 60 seconds, and 120 seconds. μm
The plating film was formed, and then the carburization was controlled by the gas carburizing method. The results of Example 1 and Comparative Examples 1 and 2 are shown in Table 1 below.
【0045】[0045]
【表1】 [Table 1]
【0046】また、実施例1により浸炭制御処理したテ
ストパネルについて、浸炭深さ(mm)とビッカース硬度(H
V)との関係を求め、その結果を図1に示す。同様に、比
較例1により浸炭制御処理したテストパネルについて、
浸炭深さとビッカース硬度との関係を求め、その結果を
図2に示す。Further, with respect to the test panel subjected to the carburization control treatment according to Example 1, the carburization depth (mm) and Vickers hardness (H
The relationship with V) was determined and the results are shown in FIG. Similarly, with respect to the test panel subjected to the carburization control treatment according to Comparative Example 1,
The relationship between carburizing depth and Vickers hardness was determined, and the result is shown in FIG.
【0047】ビッカース硬度が550HV を浸炭深さ限界
(有効硬化深さ)とすれば、図1より実施例1ではブラ
ンクの場合、0.8mm 、メッキ処理時間が浸漬4 分の場合
0.78mm、 浸漬10分の場合0.7mm、浸漬26分の場合0.66mm、
浸漬34分の場合0.61mmであることが明らかである。Assuming that the Vickers hardness of 550 HV is the carburizing depth limit (effective hardening depth), from FIG. 1 in Example 1, the blank is 0.8 mm, and the plating treatment time is 4 minutes.
0.78 mm, 0.7 mm for 10 minutes of immersion, 0.66 mm for 26 minutes of immersion,
It is clear that it is 0.61 mm for 34 minutes of immersion.
【0048】一方、比較例1により浸炭制御処理したテ
ストパネルについては膜厚3 μm、5μm、7 μm、9 μm い
ずれも無浸炭であった。On the other hand, with respect to the test panel subjected to the carburization control treatment in Comparative Example 1, the film thicknesses of 3 μm, 5 μm, 7 μm and 9 μm were not carburized.
【図1】実施例1により浸炭処理したテストパネルの浸
炭深さとビッカース硬度との関係曲線を示す。FIG. 1 shows a relationship curve between carburizing depth and Vickers hardness of a test panel carburized in Example 1.
【図2】比較例1により浸炭処理したテストパネルの浸
炭深さとビッカース硬度との関係曲線を示す。FIG. 2 shows a relationship curve between carburizing depth and Vickers hardness of a test panel carburized in Comparative Example 1.
Claims (1)
元剤、(d) 増粘剤、(e) 充填剤からなる還元メッキ組成
物を、被浸炭処理材の所定箇所に塗布し、次にメッキ条
件として温度乃至メッキ時間を変えて所望の厚さの均一
のピンホールが生成したメッキ膜を形成した後、上記被
浸炭処理材にガス浸炭処理を施すことを特徴とする浸炭
制御方法。1. A reduction plating composition comprising (a) a water-soluble metal salt, (b) a complexing agent, (c) a reducing agent, (d) a thickening agent, and (e) a filler is treated with a material to be carburized. , And then form a plating film with uniform pinholes of desired thickness by changing the temperature or plating time as plating conditions, and then subjecting the carburized material to gas carburization A carburizing control method characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18738292A JPH062102A (en) | 1992-06-23 | 1992-06-23 | Method for controlling carburization |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18738292A JPH062102A (en) | 1992-06-23 | 1992-06-23 | Method for controlling carburization |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH062102A true JPH062102A (en) | 1994-01-11 |
Family
ID=16205037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18738292A Pending JPH062102A (en) | 1992-06-23 | 1992-06-23 | Method for controlling carburization |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH062102A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006054614A1 (en) | 2004-11-16 | 2006-05-26 | Honda Motor Co., Ltd. | Member with inner teeth and method of producing the same |
| JP2007523999A (en) * | 2003-12-23 | 2007-08-23 | ロールス−ロイス・コーポレーション | Method for carburizing steel components |
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1992
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Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007523999A (en) * | 2003-12-23 | 2007-08-23 | ロールス−ロイス・コーポレーション | Method for carburizing steel components |
| JP4931601B2 (en) * | 2003-12-23 | 2012-05-16 | ロールス−ロイス・コーポレーション | Method for carburizing steel components |
| WO2006054614A1 (en) | 2004-11-16 | 2006-05-26 | Honda Motor Co., Ltd. | Member with inner teeth and method of producing the same |
| US7641564B2 (en) | 2004-11-16 | 2010-01-05 | Honda Motor Co., Ltd. | Member with inner teeth and method of producing the same |
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| US10132605B2 (en) | 2016-10-05 | 2018-11-20 | Milwaukee Electric Tool Corporation | Tape measure with compact retraction system |
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| US10876825B2 (en) | 2016-10-05 | 2020-12-29 | Milwaukee Electric Tool Corporation | Tape measure with compact retraction system |
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| US12228393B2 (en) | 2016-10-05 | 2025-02-18 | Milwaukee Electric Tool Corporation | Tape measure with compact retraction system |
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| US12017885B2 (en) | 2017-03-22 | 2024-06-25 | Milwaukee Electric Tool Corporation | Tape measure with epicyclic gear drive for tape retraction |
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