JPH06177489A - Semiconductor laser device - Google Patents

Abstract

(57) [Abstract] [Purpose] To downsize the semiconductor laser device and simplify the polarization plane adjustment mechanism. A flat surface 16 parallel to the minor axis direction of the output pattern of the light emitter 10 is provided on an envelope 15 that houses the light emitter 10. This flat surface 16 can be used as a posture reference surface of the envelope 15, and adjustment becomes easy.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor laser device having a semiconductor laser element housed in a predetermined envelope.

[0002]

2. Description of the Related Art For example, a semiconductor laser device is used as a light source in an optical pickup device of a magneto-optical disk device, and a conventional example thereof is shown in FIG.

In FIG. 1, a light emitting body 1 made of a semiconductor laser element is held by a holding member 2 and an envelope 3 is provided.
It is housed in. The light emitted from one end surface of the light emitting body 1 is transmitted as a signal light through the cover glass 4 provided in the envelope 3 and is emitted to the outside. The light emitted from the other end surface of the light emitting body 1 is incident on the monitor light receiving element 5 for detecting the light amount as monitor light.

Further, the envelope 3 is provided with signal electrode terminals 6, 7 and 8 for applying a drive current to the light emitting body 1 and outputting a light receiving signal of the monitor light receiving element 5.

[0005]

However, such a conventional device has the following disadvantages.

That is, the laser light emitted from the light emitter 1 has a polarization component, and therefore the field pattern has an elliptical shape. For this reason, it is necessary to position the polarization plane of the laser light so that it coincides with the polarization plane of the optical system of the optical pickup device used in the magneto-optical disk device. A mechanism for

On the other hand, in the optical pickup device, various devices of the optical system are being downsized in order to downsize the device in order to improve the data access speed. Since it was necessary to incorporate a positioning mechanism into the optical pickup device, it was difficult to realize miniaturization.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a semiconductor laser device capable of realizing miniaturization of an incorporated device.

[0009]

According to the present invention, in a semiconductor laser device in which a semiconductor laser device is housed in a predetermined envelope, the output light of the semiconductor laser device is polarized on the outer side of the envelope. A flat surface parallel to the wave front is provided, and this flat surface is used as the attitude reference surface of the envelope.

Further, in the semiconductor laser device in which the semiconductor laser element is housed in a predetermined envelope, a flat surface parallel to the polarization plane of the output light of the semiconductor laser element is provided on the outer side of the envelope. The flat surface serves as a posture reference plane of the envelope, and the envelope is provided with two signal electrodes for supplying a drive signal to the semiconductor laser device.

Further, in a semiconductor laser device in which a semiconductor laser element is housed in a predetermined envelope, the envelope is made of a conductive material, and the output of the semiconductor laser element is provided on the outer side of the envelope. Provide a flat surface parallel to the plane of polarization of light,
This flat surface is used as the attitude reference plane of the envelope, and one signal electrode for supplying a drive signal to the semiconductor laser device is attached to the envelope, and the envelope is used as the semiconductor. It also serves as the other signal electrode for supplying a drive signal to the laser element.

Further, in a semiconductor laser device in which a semiconductor laser element is housed in a predetermined envelope, the envelope is made of a conductive material, and the output of the semiconductor laser element is provided on the outer side of the envelope. Provide a flat surface parallel to the plane of polarization of light,
The flat surface is used as a posture reference plane of the envelope, and a holder member for accommodating the envelope is provided, and the holder member is brought into contact with the flat surface to regulate the posture of the envelope. A positioning surface is provided.

Further, in a semiconductor laser device in which a semiconductor laser element is housed in a predetermined envelope, the envelope is made of a conductive material, and the output of the semiconductor laser element is provided on the outer side of the envelope. Provide a flat surface parallel to the plane of polarization of light,
The flat surface is used as a posture reference plane of the envelope, and a holder member for accommodating the envelope is provided, and the holder member is brought into contact with the flat surface to regulate the posture of the envelope. A positioning surface is provided, and a hole for inserting a jig for adjusting the attitude of the envelope is bored.

[0014]

Therefore, since a part of the envelope is used as the attitude reference plane, the positioning mechanism of the semiconductor laser device is simplified, and the mounting mechanism of the semiconductor laser device can be simplified and downsized. It is possible to downsize an optical pickup device or the like that uses a laser device.
Further, since the monitor light receiving element is omitted, the semiconductor laser device can be downsized. Moreover, since the attitude of the envelope can be adjusted by using the holder member, the work for mounting the semiconductor laser device becomes easy.

[0015]

Embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

FIG. 1 shows a semiconductor laser device according to an embodiment of the present invention.

In FIG. 1, a light emitting body 10 composed of a semiconductor laser device (chip) is a cylindrical envelope 1 with an edge.
The light emitting body 10 is housed in the envelope 11.
Signal electrode terminals 12 and 13 for applying a drive signal are additionally provided. The envelope 11 has an opening (not shown) for passing the light output from the light emitting body 10,
A cover glass (not shown) is attached to close the opening.

Therefore, in this case, since the light receiving element for monitoring the output light level of the light emitter 10 is not included, the envelope 11 can be downsized.

FIG. 2 shows a semiconductor laser device according to another embodiment of the present invention. In addition, in FIG.
The same parts and corresponding parts are designated by the same reference numerals.

In FIG. 1, the envelope 11 is made of a metal material and also serves as one electrode for applying a drive signal to the light emitting body 10, for example, a cathode (cathode) terminal.

Therefore, in this case, since the connection of the cathode terminal can be realized by the envelope 11, the space required for wiring can be reduced, and the structure of the portion in which this semiconductor laser device is incorporated can be miniaturized. You can

3 (a) and 3 (b) show a semiconductor laser device according to still another embodiment of the present invention. In the figure, the same parts as those in FIG. 1 and the corresponding parts are designated by the same reference numerals.

In the figure, an envelope 15 for accommodating the light-emitting body 10 has a substantially cylindrical shape, an outer side portion of which is formed into a flat surface 16 parallel to the end surface of the light-emitting body 1, and is made of a metal material. The envelope 15 also serves as the cathode terminal.

The flat surface 16 of the envelope 15 is formed parallel to the minor axis direction of the visual field pattern PP of the light output from the light emitting body 10.

Therefore, in this case, since the flat surface 16 of the envelope 15 can be used as a reference surface for determining the attitude of the semiconductor laser device, the positioning mechanism of the device for mounting the semiconductor laser device can be simplified. You can

FIG. 4 shows a semiconductor laser device according to still another embodiment of the present invention. In the figure, the same parts as those in FIG. 1 and the corresponding parts are designated by the same reference numerals.

In the figure, a thick cylindrical anode electrode member 19 made of a metallic material is provided between the light-emitting body 10 and an envelope 18 made of a metallic material, and a cylindrical insulating member 20. It is provided through.

Therefore, in this case, since the semiconductor laser device has no protrusion, the device structure can be remarkably downsized.

5A and 5B show a semiconductor laser device according to still another embodiment of the present invention. In the figure, the same parts as those in FIGS. 1 and 4 and corresponding parts are designated by the same reference numerals.

In the figure, an envelope 22 for accommodating the light-emitting body 10 has a substantially cylindrical shape and is formed on a flat surface 23 parallel to the end surface of the light-emitting body 1 on the outer side thereof, and is made of a metallic material. Also serves as the cathode terminal. The flat surface 23 of the envelope 22 is formed parallel to the minor axis direction of the visual field pattern (not shown) of the light output from the light emitting body 10.

Further, an electrode member 24 constituting an anode terminal is arranged between the light emitting body 10 and the envelope 22. The envelope 22 is filled with an insulating material 25,
The anode terminal (electrode member 24) and the envelope 22 (cathode terminal) are insulated from each other.

The holder member 26 is formed with a hole 27 having a circular cross section capable of accommodating the envelope 22, and a positioning screw 29 is screwed from one end surface 28 of the hole 27. Therefore, the envelope 22 is inserted into the hole 27 in a state where the flat surface 23 can be locked by the screw 29, and the flat surface 23 is locked by the screw 29 to position the envelope 22. You can

6A and 6B show another example of the holder member. In addition, in FIG.
The same reference numerals are given to the same portions as (b) and the corresponding portions.

In the figure, the holder member 30 has a hole 3 for accommodating the envelope 22 with the flat surface 23 facing downward.
1 is formed. Further, the upper part of the holder member 30 is
Two-direction inclined surfaces 32 and 33 are formed, and screws 3 for fixing the envelope 22 are formed on these inclined surfaces 32 and 33.
4, 35 are screwed together.

Therefore, the envelope 22 is fixed to the holder member 30 by inserting the envelope 22 into the hole 31 of the holder member 30 and tightening the screws 34 and 35 with the screws 34 and 35 being loosened. can do.

7A and 7B show a semiconductor laser device according to still another embodiment of the present invention. In the figure, the same parts as those in FIG. 1 and corresponding parts are designated by the same reference numerals.

In the figure, an envelope 37 for accommodating the light emitting body 10 is made of a metal material formed in a substantially cylindrical shape and also serves as a cathode terminal. A band-shaped anode terminal 38 is provided at a substantially central portion in the axial direction of the envelope 37 while being insulated from the envelope 37.

The holder member 39 is used to hold the envelope 37, and the conductive locking member 40 presses the anode terminal 38 from above, thereby enclosing the envelope 37.
To fix. The locking member 40 also serves as an electrode member for external connection.

FIGS. 8A and 8B show a semiconductor laser device according to still another embodiment of the present invention. In the figure, the same parts as those in FIG. 1 and corresponding parts are designated by the same reference numerals.

In the figure, an envelope 42 for accommodating the light emitting body 10 is made of a metal material formed into a substantially cylindrical shape, and a drive signal is sent to the light emitting body 10 through an opening for emitting the output light of the light emitting body 10. Electrodes 43 and 44 for applying the voltage are attached.

The holder member 45 is for holding the envelope 42, and has a rising portion 47 in which a housing hole 46 for fitting the envelope 42 is formed, and a rising portion 47. The seat portion 48 is connected to each other in the orthogonal direction.
Further, terminal members 49 and 50 that come into contact with the electrodes 43 and 44 are attached to the seat portion 48.

It should be noted that the terminal members 49 and 50 are used for the light emitter 10.
It is positioned so that it does not interfere with the output light of.

FIGS. 9A and 9B show a semiconductor laser device according to still another embodiment of the present invention. In the figure, the same parts as those in FIG. 1 and the corresponding parts are designated by the same reference numerals.

In the figure, an envelope 52 for accommodating the light-emitting body 10 has a substantially cylindrical shape, and its outer portion is formed with flat surfaces 53 and 54 parallel to the end surface of the light-emitting body 1, and the flat surface 53. A groove 55 parallel to the axial direction of the envelope 52 is provided at the center of the
Are formed. In this case, the anode terminal and the cathode terminal can be arbitrarily configured.

Further, the holder member 56 is formed with a hole 57 capable of accommodating the envelope 52, and the groove 5 of the envelope 52 is formed.
On the surface corresponding to No. 5, a long hole 58 parallel to the short axis direction of the visual field pattern (not shown) of the output light of the light emitting body 10 is formed.

Therefore, when the jig 59 for adjustment is inserted from the long hole 58, the tip of the jig 59 is inserted into the groove 55, and the jig 59 is appropriately operated, the direction of the envelope 52 is changed. Can be adjusted.

Therefore, in this case, the mounting direction of the envelope 52 on the holder member 56 can be adjusted appropriately, and the adjusting mechanism on the device side in which this semiconductor laser device is incorporated can be simplified.

10A and 10B show a semiconductor laser device according to still another embodiment of the present invention. In the figure, the same parts as those in FIG. 1 and the corresponding parts are designated by the same reference numerals.

In the figure, an envelope 60 for accommodating the light-emitting body 10 is made of a metal material formed in a substantially cylindrical shape, and a groove 61 is formed in a circumferential direction at a substantially central portion in the axial direction thereof. . Further, electrodes 62 and 63 are provided on the one end surface of the envelope 60 at the upper and lower positions of the light emitting body 10, respectively.

Further, the holder member 65 is formed with a hole 67 capable of accommodating the envelope 60, and a hole 68 is formed on one surface thereof. Therefore, this hole 68
The direction of the envelope 60 can be adjusted by inserting the adjustment jig 69 from the above, inserting the tip of the jig 69 into the groove 61, and operating the jig 69 appropriately.

[0051]

As described above, according to the present invention,
Since a part of the envelope is used as the attitude reference plane, the positioning mechanism of the semiconductor laser device can be simplified, and the mounting mechanism of the semiconductor laser device can be simplified and downsized. The pickup device and the like can be downsized. Further, since the monitor light receiving element is omitted, the semiconductor laser device can be downsized. Further, since the holder member can be used to adjust the posture of the envelope, there is an effect that the work for mounting the semiconductor laser device becomes easy.

[Brief description of drawings]

FIG. 1 is a schematic diagram showing a semiconductor laser device according to an embodiment of the present invention.

FIG. 2 is a schematic view showing a semiconductor laser device according to another embodiment of the present invention.

FIG. 3 is a schematic view showing a semiconductor laser device according to still another embodiment of the present invention.

FIG. 4 is a schematic view showing a semiconductor laser device according to still another embodiment of the present invention.

FIG. 5 is a schematic view showing a semiconductor laser device according to still another embodiment of the present invention.

FIG. 6 is a schematic view showing a semiconductor laser device according to still another embodiment of the present invention.

FIG. 7 is a schematic view showing a semiconductor laser device according to still another embodiment of the present invention.

FIG. 8 is a schematic view showing a semiconductor laser device according to still another embodiment of the present invention.

FIG. 9 is a schematic view showing a semiconductor laser device according to still another embodiment of the present invention.

FIG. 10 is a schematic view showing a semiconductor laser device according to still another embodiment of the present invention.

FIG. 11 is a schematic view showing a conventional example of a semiconductor laser device.

[Explanation of symbols]

10 luminous body 11,15,18,22,37,42,52,60 envelope 26,30,37,45,56,65 holder member

Claims (5)

[Claims] 1. A semiconductor laser device in which a semiconductor laser device is housed in a predetermined envelope, and a flat surface parallel to the polarization plane of the output light of the semiconductor laser device is provided on the outer side of the envelope. A semiconductor laser device, wherein the flat surface serves as a posture reference surface of the envelope. 2. A semiconductor laser device in which a semiconductor laser device is housed in a predetermined envelope, and a flat surface parallel to the polarization plane of the output light of the semiconductor laser device is provided on the outer side of the envelope. The flat surface is used as a posture reference plane of the envelope, and the envelope is provided with two signal electrodes for supplying a drive signal to the semiconductor laser device. . 3. A semiconductor laser device comprising a semiconductor laser element housed in a predetermined envelope, wherein the envelope is made of a conductive material, and the output of the semiconductor laser element is provided on the outer side of the envelope. A flat surface parallel to the plane of polarization of light is provided, and this flat surface is used as the attitude reference plane of the envelope, and one signal electrode for supplying a drive signal to the semiconductor laser device to the envelope. A semiconductor laser device, characterized in that the envelope is also used as the other signal electrode for supplying a drive signal to the semiconductor laser element. 4. A semiconductor laser device comprising a semiconductor laser element housed in a predetermined envelope, wherein the envelope is made of a conductive material, and the output of the semiconductor laser element is provided on the outer side of the envelope. A flat surface parallel to the plane of polarization of light is provided, and the flat surface is used as a posture reference plane of the envelope, while a holder member for housing the envelope is provided.
A semiconductor laser device, comprising: a positioning surface that is in contact with the flat surface and regulates the posture of the envelope. 5. A semiconductor laser device comprising a semiconductor laser element housed in a predetermined envelope, wherein the envelope is made of a conductive material, and the output of the semiconductor laser element is provided on the outer side of the envelope. A flat surface parallel to the plane of polarization of light is provided, and the flat surface is used as a posture reference plane of the envelope, while a holder member for housing the envelope is provided.
A positioning surface for contacting the flat surface to regulate the attitude of the envelope is provided, and a hole for inserting a jig for adjusting the attitude of the envelope is provided. Characteristic semiconductor laser device.