JPH06177203A - Semiconductor device and manufacture thereof - Google Patents

Abstract

(57) [Abstract] [Purpose] For a semiconductor device using a tape carrier package, mitigating the effects of heat generated during lead bonding and shrinkage during curing of the sealing resin, and also reduces thermal resistance. The purpose is to make the tape multi-layered at low cost. [Structure] 1) A tape having a frame-shaped support ring around a semiconductor chip, and a plurality of leads attached to and extending from the inside and outside of the support ring are applied to the tape.
A semiconductor device in which the lead extending inside the support ring is connected to the semiconductor chip, and the semiconductor chip is resin-sealed, and has a frame-like shape having a through-hole conductor on the support ring of the tape. A substrate is attached, 2) the attachment of the substrate uses an adhesive, or a hole is formed in the tape at a position corresponding to the through-hole conductor, and the through-hole conductor and the lead are joined, or Both are configured to be performed in combination.

Description

Detailed Description of the Invention

[0001]

The present invention relates to TAB (Tape Automated Bonus).
ding) The present invention relates to a semiconductor device in which a tape is used for resin sealing and a manufacturing method.

In recent years, with the miniaturization and thinning of electronic devices, tape carrier packages (TCP; Tape Carrier Pac
Kage) is frequently used, and there is a demand for improved performance and reliability and cost reduction. Therefore, a new structure of TAB tape is required.

[0003]

2. Description of the Related Art FIGS. 2A and 2B are explanatory views of a conventional TAB tape. 2 (B) is a plan view of the TAB tape, and FIG. 2 (A) is a sectional view of a portion indicated by an arrow in FIG. 2 (B).

In the figure, 1 is a TAB tape (polyimide film or the like), 1A is a support ring for holding the lead of the TAB tape, 1B is a support bar for holding the support ring, and 1C is a test formed on the TAB tape. Pad, 2 inner lead, 3 outer lead, 4 epoxy adhesive to attach lead to TAB tape, 5 semiconductor chip,
6 is a sealing resin, and 7 is a solder resist.

The inner leads 2 are bonded to the bonding bumps formed on the semiconductor chip 5 by inner lead bonding.
(ILB) and outer lead 3 is TAB tape
It is connected to the test pad 1C provided on the upper part of the 1 and after the test is performed using this test pad, the outer lead
3 is mounted by outer lead bonding (0LB) just outside the support ring, and leads are cut outside the bonding part to remove the TAB tape unnecessary part around the chip.

[0006]

The shrinkage of the polyimide film due to the heat at the time of ILB causes the inner leads to be misaligned or warped, resulting in defective bonding with the bumps.
The polyimide film shrinks due to heat at 0LB, and the package itself warps due to shrinkage that accompanies resin curing during resin encapsulation.

Further, the tape carrier package has a drawback in that it has a high heat resistance because the heat radiation area of the leads and the like is small. Furthermore, the cost was high when the TAB tape was multi-layered.

According to the present invention, in a semiconductor device using a tape carrier package, the effects of heat generated at the time of bonding the leads and the effects caused by shrinkage when the sealing resin is cured are reduced, the thermal resistance is reduced, and the TAB tape is made low. The purpose is to enable multiple layers at cost.

[0009]

[Means for Solving the Problems] 1)
A tape having a frame-shaped support ring around a semiconductor chip and having a plurality of leads attached to and extending from the inside and outside of the support ring is used, and the leads extending inside the support ring are used. Is a semiconductor device connected to the semiconductor chip, the semiconductor chip being resin-sealed, wherein a frame-shaped substrate having a through-hole conductor is mounted on the support ring of the tape,
Or 2) whether the substrate of the semiconductor device according to claim 1 is mounted by using an adhesive, or whether a hole is formed in the tape at a position corresponding to the through-hole conductor and the through-hole conductor and the lead are joined. , Or a method of manufacturing a semiconductor device in which both are used in combination.

[0010]

In the present invention, by providing a frame-shaped substrate having through-hole conductors on the support ring of the TAB tape, the heat generated in the semiconductor chip is released to this substrate to lower the thermal resistance of the semiconductor device, and As the support ring is reinforced by the substrate, a tape carrier package with no warping was obtained. In addition, the frame-shaped substrate is also partially bonded onto the support bar that holds the support ring, so the support bar is also reinforced. Furthermore, by forming a circuit pattern on the substrate, electrical characteristics can be added to the semiconductor device, and the performance equivalent to that of a multilayer TAB tape can be provided at low cost.

[0011]

Embodiments FIGS. 1 (A) to 1 (C) show a TAB according to an embodiment of the present invention.
It is explanatory drawing of a tape. FIG. 1 (C) is a plan view of the TAB tape, FIG. 1 (A) is a sectional view of a portion indicated by an arrow in FIG. 1 (C), and FIG. 1 (B) is an enlarged sectional view.

In the figure, 1 is a TAB tape (polyimide film, etc.), 1A is a support ring that holds the lead of the TAB tape, 1B is a support bar that holds the support ring, and 1C is a test formed on the TAB tape. Pad, 2 inner lead, 3 outer lead, 4 epoxy adhesive to attach lead to TAB tape, 5 semiconductor chip,
6 is a sealing resin, 8 is a substrate of the present invention, for example, a substrate made of glass epoxy or metal base, 8A is a through-hole conductor (VIA), and 8B is a circuit pattern.

The method of attaching the frame-shaped substrate to the support ring is as follows. (1) Laser welding the through-hole conductor of the frame-shaped substrate and the lead on the tape. (2) Adhere the frame-shaped substrate to the support ring with an epoxy adhesive.

A frame-shaped substrate is provided on the support ring by using either one or both of these methods. The board can be mounted either before or after the ILB.

As described above, by providing the frame-shaped substrate on the support ring, the positional deviation of the inner leads and the bonding failure with the bumps caused by the contraction of the polyimide due to the heat at the time of ILO are eliminated. In addition, it was possible to suppress warpage of the package itself due to shrinkage of polyimide during OLB and shrinkage of resin curing during resin encapsulation.

Further, the circuit pattern of the substrate makes it possible to increase the heat dissipation area, improve heat dissipation, and improve the electrical characteristics. Furthermore, by making the circuit pattern formed on the substrate multi-layered, a tape carrier package with the same performance as the multi-layer TAB tape was obtained at low cost.

[0017]

According to the present invention, in a semiconductor device using a tape carrier package, the influence of heat generated during bonding of leads and the contraction caused when the sealing resin is cured are alleviated, and the thermal resistance of the semiconductor device is reduced. Lower, and TA
B tape can now be multi-layered at low cost.

[Brief description of drawings]

FIG. 1 is an explanatory view of a TAB tape according to an embodiment of the present invention.

[Fig. 2] Illustration of a conventional TAB tape

[Explanation of symbols]

1 TAB tape (polyimide film, etc.) 1A Support ring for holding the lead of TAB tape 1B Support bar holding the support ring 1C Test pad formed on TAB tape 2 Inner lead 3 Outer lead 4 Lead to TAB tape Epoxy adhesive to be bonded 5 Semiconductor chip 6 Encapsulation resin 8 Frame substrate of the present invention 8A Through hole conductor (VIA) 8B Circuit pattern

Claims (2)

[Claims] 1. A tape having a frame-shaped support ring around a semiconductor chip, and a plurality of leads attached to extend inside and outside the support ring are attached to the tape.
A semiconductor device in which the lead extending inside the support ring is connected to the semiconductor chip, and the semiconductor chip is resin-sealed, and has a frame-like shape having a through-hole conductor on the support ring of the tape. A semiconductor device having a substrate attached thereto. 2. The semiconductor device according to claim 1, wherein the substrate is mounted by using an adhesive, or a hole is formed in the tape at a position corresponding to the through-hole conductor, and the through-hole conductor and the lead are joined. A method of manufacturing a semiconductor device, characterized in that both are performed or both are performed in combination.