JPH06174439A - Bonding wire inspection device - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a bonding wire inspection apparatus capable of performing both inspection by image processing and visual observation on a bonding wire and performing highly accurate inspection. [Structure] An image pickup device 5 for picking up an image of a bonding state between a semiconductor chip 3 and a lead frame 2 to obtain an image.
And a processing device 9 that performs an inspection based on the image obtained by the image pickup device 5, and a stereoscopic microscope 1 that is an observation device provided near the image pickup device 5. After imaging by the imaging device 5, the transport mechanism 4 transports a specific semiconductor chip to the observation area of the stereomicroscope 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding wire inspection device for connecting a semiconductor chip and a lead frame.

[0002]

2. Description of the Related Art FIG. 3 shows an example of the configuration of a conventional bonding wire inspection apparatus. Reference numeral 2 is a lead frame after bonding, 3 is a semiconductor chip fixed on the lead frame (hereinafter referred to as IC), 4 is a carrying section for carrying and fixing the lead frame, and 5 is an external image of a bonding wire. An image pickup device for capturing the light is shown, and 8 is an illuminating device for illuminating the lead frame in accordance with the image pickup situation.

A lead frame 2 placed on the carrying section 4.
Is an IC to be inspected in the imaging area of the imaging device 5.
3 is conveyed and fixed to a position where it is fixed. Next, the image of the IC required by the imaging device 5 is taken in, and the next IC is sequentially conveyed to perform the visual inspection.

[0004]

However, in the above-mentioned conventional example, as shown in FIG. 3, the image pickup device 5 and the illumination device 8 are constructed so as to cover the upper portion of the IC 3 under inspection, so that there are the following problems. It was

(1) Since a high-magnification camera is generally used as the image pickup apparatus, when a defective portion is found, it is difficult to recognize the location in the entire IC, and it is difficult to compare visual inspections.

(2) Since monochromatic light is generally used for the illuminating device, even if a defect such as pattern omission or discoloration is required to be used in combination with visual inspection, the same device is used in the same device. The treatment was not possible.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a bonding wire inspection apparatus capable of performing both image pickup and visual observation of a bonding wire and highly accurate inspection.

[0008]

A bonding wire inspection apparatus of the present invention which solves the above-mentioned problems is based on an image pickup means for picking up an image of a bonding state between a semiconductor chip and a lead frame, and an image obtained by the image pickup means. It is characterized in that it has a processing means for carrying out an inspection and an observing means provided in the vicinity of the imaging means.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a drawing which best represents the features of the embodiment of the present invention. In the figure, 1 is a stereoscopic microscope which is an observation device for observing an object to be inspected, 2 is a lead frame which is an object to be inspected, 3 is an IC wire-bonded on the lead frame, and 4 is a lead frame. A transport unit for transporting, 5 is an image pickup device for capturing an image of an object to be inspected, 6 is a stage for scanning the image pickup device 5 on the lead frame 2 or the IC 3, and 7 is the stereomicroscope 1 with respect to the lead frame 2. And 9 is a processing control device for performing image processing and controlling the entire system.

The lead frame 2 and the IC 3 are carried by the carrying section 4 to a predetermined position of the image pickup device 5, an appearance inspection is performed by image processing, and the inspection results are sequentially output.

If abnormalities are found in the bonding as a result of image processing during or after the inspection, a coordinate point on the IC corresponding to this is designated by the controller 9 and a movement command to the stereoscopic microscope 1 side is issued. Give out. Then, the above coordinates are immediately fed back to the transport unit 4 and the stereoscopic microscope side stage 7, and the abnormal IC on the lead frame 2 is transported to the visual field area of the stereoscopic microscope 1 and fixed. At the same time, the stage 7 moves and the stereomicroscope 1 moves to a position where a designated point on the IC is projected in the center of the visual field. In this way, the inspection method is switched from image processing to visual inspection.

When a human is visually inspected using this stereoscopic microscope, the automatic visual inspection by image processing is suspended. After the completion of the visual inspection, by inputting a restart command to the control device 9, the lead frame 2 is automatically conveyed and fixed to its original position, and the visual inspection by image processing is started.

In the above embodiment, the stereoscopic microscope moves its position by a dedicated stage, but as shown in FIG. 2, the stage 6 provided for the image pickup device is used.
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In the above embodiment, the specific point on the IC is moved to the center of the visual field of the stereoscopic microscope. However, a movable chart function may be added to the stereoscopic microscope by using a means such as a transmission type liquid crystal. Alternatively, a specific point on the IC can be limited by moving the cross chart within the visual field.

Further, in the above embodiment, the visual inspection is performed after the inspection by the image processing. However, the position of the point on the IC specified at the time of the visual inspection is fed back to the control device, and the image is re-imaged at the point. Inspection by processing can also be performed.

According to the embodiment described above, it becomes possible to compare the image processing of a specific point on the lead frame and the IC and the visual inspection by both visual means on the same coordinate plane, and the image pickup device and the lighting device. It is possible to change to the observation means without changing the complicated conditions of. That is, it is possible to compare the visual inspection device with the inspection device by image processing without replacing the object, and the coordinate position on the object is uniquely managed. The area coordinates do not need to be converted even when switching between image processing and visual inspection.

[0017]

According to the present invention, both the image pickup and the visual observation can be performed on the bonding wire, and highly accurate inspection can be performed.

[Brief description of drawings]

FIG. 1 is a configuration diagram of an embodiment of a bonding wire inspection apparatus embodying the present invention.

FIG. 2 is a modification of FIG.

FIG. 3 is an example of a conventional device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Stereomicroscope 2 Lead frame 3 Semiconductor chip (IC) 4 Transfer part 5 Imaging device 6 Stage 7 Stage 9 Control device

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Masato Nagura, 53 Imaiue-cho, Nakahara-ku, Kawasaki-shi, Kanagawa, Canon Inc., Kosugi Plant (72) Inventor, Minokichi, 53, Imaiue-cho, Nakahara-ku, Kawasaki, Kanagawa Non-Kosugi Office

Claims (2)

[Claims] 1. An image pickup means for picking up an image of a bonding state between a semiconductor chip and a lead frame, a processing means for inspecting based on an image obtained by the image pickup means, and an observation means provided in the vicinity of the image pickup means. A bonding wire inspection apparatus comprising: 2. The apparatus according to claim 1, further comprising a carrying device for carrying a specific semiconductor chip to an observation area of the observing means after the image pickup by the image pickup means.