JPH06163676A - Wafer boat - Google Patents
Wafer boatInfo
- Publication number
- JPH06163676A JPH06163676A JP33384992A JP33384992A JPH06163676A JP H06163676 A JPH06163676 A JP H06163676A JP 33384992 A JP33384992 A JP 33384992A JP 33384992 A JP33384992 A JP 33384992A JP H06163676 A JPH06163676 A JP H06163676A
- Authority
- JP
- Japan
- Prior art keywords
- wafer boat
- strength
- cross
- section
- supporting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 235000012431 wafers Nutrition 0.000 claims abstract description 56
- 239000004065 semiconductor Substances 0.000 claims abstract description 5
- 238000005452 bending Methods 0.000 abstract description 6
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 238000009792 diffusion process Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】この発明は、多数の半導体ウエハ
を支持するための支持部材を備えたウエハボートに関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer boat provided with a support member for supporting a large number of semiconductor wafers.
【0002】[0002]
【従来の技術】半導体ウエハ製造工程における酸化や拡
散等の熱処理工程は、通常拡散炉を用いて行われる。ウ
エハはウエハボートに積載されて拡散炉に出し入れされ
る。拡散炉には横型の拡散炉と縦型の拡散炉があり、こ
れに合せて横型のウエハボートと縦型のウエハボートが
用いられる。ウエハボートの仕様は拡散炉に合せて決定
される。2. Description of the Related Art A heat treatment process such as oxidation and diffusion in a semiconductor wafer manufacturing process is usually performed using a diffusion furnace. The wafers are loaded on the wafer boat and loaded into and unloaded from the diffusion furnace. There are a horizontal diffusion furnace and a vertical diffusion furnace in the diffusion furnace, and a horizontal wafer boat and a vertical wafer boat are used in accordance with this. The specifications of the wafer boat are determined according to the diffusion furnace.
【0003】ウエハボートは一般に、平行に配置された
数本の棒状支持部材を有している。各支持部材には多数
の溝が設けてあり、これらの溝内にウエハを積載する構
成になっている。横型ボートの場合には支持部材が水平
方向に配置され、ウエハは水平方向に一列に並んで積載
される。縦型ボートの場合には支持部材が垂直方向に配
置され、ウエハは垂直方向に一列に並んで積載される。
いずれの場合にもウエハは支持部材によって支持される
構成になっている。Wafer boats generally have several rod-shaped support members arranged in parallel. Each supporting member is provided with a large number of grooves, and wafers are loaded in these grooves. In the case of a horizontal boat, the supporting members are arranged in the horizontal direction, and the wafers are loaded in a line in the horizontal direction. In the case of a vertical boat, the supporting members are arranged in the vertical direction, and the wafers are loaded in a line in the vertical direction.
In either case, the wafer is supported by the supporting member.
【0004】近年、ウエハの大口径化が進み、また一度
に大量のウエハを処理するために拡散炉も大型化する傾
向にある。それに伴ってウエハボートも大型で耐用寿命
の長いものが要求されるようになってきた。In recent years, the diameter of wafers has increased, and the diffusion furnace tends to increase in size in order to process a large number of wafers at once. Along with this, wafer boats are also required to be large and have a long service life.
【0005】[0005]
【発明が解決しようとする課題】大型のウエハは重量も
大きく、ウエハボートはそれだけ大きな荷重を支持しな
ければならない。Large wafers are heavy and the wafer boat must support such a large load.
【0006】横型ボートの場合には、ウエハの重量は主
に支持部材が撓み変形するように作用する。一方、縦型
ボートにおいては、ウエハの重量は主に支持部材が座屈
変形するように作用する。In the case of a horizontal boat, the weight of the wafer mainly acts so that the supporting member is bent and deformed. On the other hand, in the vertical boat, the weight of the wafer mainly acts so that the supporting member is buckled and deformed.
【0007】いずれのボートの場合にも、支持部材の強
度がボートの寿命を左右することになる。従来、ウエハ
ボートの支持部材としては断面円形や矩形の棒材が用い
られていた。丸棒材の支持部材の強度を上げようとすれ
ば、径を大きくしなければならない。しかし、その場合
にはボート自体が重くなって取り扱いが不便になり、し
かも、ボートの熱容量も大きくなって熱効率の面でもマ
イナスである。このように、丸棒の支持部材を用いたウ
エハボートにおいては耐用寿命をある程度以上には伸ば
すことができなかった。In any boat, the strength of the support member affects the life of the boat. Conventionally, a bar member having a circular or rectangular cross section has been used as a supporting member for a wafer boat. In order to increase the strength of the round bar supporting member, the diameter must be increased. However, in that case, the boat itself becomes heavy and inconvenient to handle, and the heat capacity of the boat is large, which is also a negative factor in terms of thermal efficiency. As described above, in the wafer boat using the support member of the round bar, the service life cannot be extended beyond a certain extent.
【0008】以上のような従来技術の問題点に鑑み、本
発明は重量が同等の従来のウエハボートに較べて強度的
に優れ耐用寿命が長いウエハボートを提供することを目
的としている。In view of the above problems of the prior art, it is an object of the present invention to provide a wafer boat which is superior in strength and has a long service life as compared with the conventional wafer boat having the same weight.
【0009】[0009]
【課題を解決するための手段】この発明は、多数の半導
体ウエハを支持するための支持部材を備えたウエハボー
トにおいて、支持部材の断面形状が実質的に三角形であ
ることを特徴とするウエハボートを要旨としている。SUMMARY OF THE INVENTION The present invention is a wafer boat provided with a support member for supporting a large number of semiconductor wafers, wherein the support member has a substantially triangular cross-sectional shape. Is the gist.
【0010】[0010]
【実施例】以下、図面を参照して本発明の実施例を説明
する。Embodiments of the present invention will be described below with reference to the drawings.
【0011】図1は本発明による縦型のウエハボートを
示す斜視図である。ウエハボート10は縦長であって、
例えば8インチSiウエハを125枚収容可能な構成に
なっている。ウエハボート10は高純度のSiCやSi
含侵SiCを材料として形成することができる。FIG. 1 is a perspective view showing a vertical wafer boat according to the present invention. The wafer boat 10 is vertically long,
For example, it is configured to accommodate 125 8-inch Si wafers. The wafer boat 10 is made of high-purity SiC or Si.
Impregnated SiC can be formed as a material.
【0012】ウエハボート10は棒状の支持部材13を
4本備えている。支持部材13は縦(垂直)方向に平行
に配置され、その上下端部が上板11と下板12によっ
て強固に結合されている。上板11と下板12は馬蹄形
をした板である。The wafer boat 10 has four rod-shaped support members 13. The support member 13 is arranged in parallel in the vertical (vertical) direction, and its upper and lower ends are firmly coupled by the upper plate 11 and the lower plate 12. The upper plate 11 and the lower plate 12 are horseshoe-shaped plates.
【0013】図2に示すように支持部材13は断面正三
角形である。各棒状部材には多数の溝14が形成され、
溝14はウエハボートの内側に向くように配置されてい
る。溝14はウエハを収容するためのものであり、各支
持部材13の1つの頂部に等間隔で形成されている。こ
の三角形の断面二次モーメントは後述するように同じ面
積の円の断面二次モーメントの約1.2倍になってい
る。なお、図2には支持部材の寸法の一例を記載した。As shown in FIG. 2, the support member 13 has an equilateral cross section. A large number of grooves 14 are formed in each rod-shaped member,
The groove 14 is arranged so as to face the inside of the wafer boat. The grooves 14 are for accommodating wafers, and are formed at equal intervals on one top of each support member 13. The moment of inertia of area of this triangle is about 1.2 times the moment of inertia of area of a circle of the same area, as will be described later. Note that FIG. 2 shows an example of the dimensions of the support member.
【0014】図3に示す支持部材は断面矩形状の従来例
1である。矩形断面の支持部材23の場合にも、1つの
頂部がウエハボートの内側に向くように配置され、その
頂部にウエハ設定用の溝24が形成される。後述するよ
うにこの矩形の断面二次モーメントは同じ面積の円の断
面二次モーメントの約1.1倍になっている。図3にも
支持部材の寸法の一例を記載した。The supporting member shown in FIG. 3 is a conventional example 1 having a rectangular cross section. Also in the case of the support member 23 having a rectangular cross section, one top is arranged so as to face the inside of the wafer boat, and the groove 24 for wafer setting is formed on the top. As will be described later, the geometrical moment of inertia of this rectangle is about 1.1 times the geometrical moment of inertia of a circle of the same area. FIG. 3 also shows an example of the dimensions of the support member.
【0015】次に、横型のウエハボートについて簡単に
説明する。横型のウエハボート(図示せず)も前述した
縦型のウエハボートと同様にして構成できる。横型ウエ
ハボートの場合には、棒状部材を横向き(水平方向)に
配置し、その両端を脚付のフレームで結合するのであ
る。そして、必要に応じて棒状部材の中間部分にも脚付
フレームを配置する。Next, the horizontal wafer boat will be briefly described. A horizontal wafer boat (not shown) can be configured in the same manner as the vertical wafer boat described above. In the case of a horizontal wafer boat, the rod-shaped members are arranged horizontally (horizontally), and both ends thereof are joined by a frame with legs. Then, if necessary, the legged frame is also arranged in the intermediate portion of the rod-shaped member.
【0016】次に、本発明の横型及び縦型のウエハボー
トの強度を考える。まず、横型のウエハボートの強度を
検討するため、図5に示すように単純化したモデルを用
いて強度計算を行った。実施例1は断面が正三角形の梁
に関する計算例であって、これは図2に示した寸法を有
する断面正三角形の支持部材を持つ横型ウエハボートの
モデルである。従来例1は同様に図3に示した寸法を有
する断面矩形の支持部材に対応するモデルである。従来
例2は図4に示した断面円形の支持部材のモデルであ
る。なお、各梁(支持部材)には深さ5mmの溝が形成
されていて、溝以外の部分の断面積はほぼ同じになって
いる。Next, the strength of the horizontal and vertical wafer boats of the present invention will be considered. First, in order to study the strength of a horizontal wafer boat, strength calculation was performed using a simplified model as shown in FIG. Example 1 is a calculation example regarding a beam having an equilateral triangular cross section, which is a model of a horizontal wafer boat having a support member having an equilateral triangular cross section having the dimensions shown in FIG. Conventional Example 1 is also a model corresponding to a support member having a rectangular cross section having the dimensions shown in FIG. Conventional Example 2 is a model of a supporting member having a circular cross section shown in FIG. A groove having a depth of 5 mm is formed in each beam (support member), and the cross-sectional areas of the portions other than the groove are substantially the same.
【0017】計算条件を以下に示す。The calculation conditions are shown below.
【0018】L(梁全体):85.7cm I(断面二次モーメント)従来例2:0.125cm4 実施例1:0.153cm4 従来例1:0.139cm4 Z(断面係数)従来例2:0.201cm3 実施例1:0.319cm3 従来例1:0.232cm3 E(縦弾性係数):7.78×105 kg/cm2 上記条件をもとに最大撓み量(cm)、最大曲げモーメ
ント(kg・cm)、最大曲げ応力(kg/cm2 )、
安全率の比を計算して結果を表1に示した。L (entire beam): 85.7 cm I (second moment of area) Conventional example 2: 0.125 cm 4 Example 1: 0.153 cm 4 Conventional example 1: 0.139 cm 4 Z (section coefficient) Conventional example 2: 0.201 cm 3 Example 1: 0.319 cm 3 Conventional example 1: 0.232 cm 3 E (modulus of elasticity): 7.78 × 10 5 kg / cm 2 Maximum deflection (cm) based on the above conditions. ), Maximum bending moment (kg · cm), maximum bending stress (kg / cm 2 ),
The safety factor ratios were calculated and the results are shown in Table 1.
【0019】[0019]
【表1】 また、従来例2を基準にして撓み量の比及び安全率の比
を計算して結果を表2に示した。[Table 1] Further, the ratio of the amount of bending and the ratio of the safety factor were calculated based on Conventional Example 2 and the results are shown in Table 2.
【0020】[0020]
【表2】 以上の結果を見ると、梁の撓み量は実施例1(断面三角
形)が従来例2(断面円形)に較べて約20%減、従来
例1(断面矩形)が約10%減であることがわかる。ま
た、梁の曲げ強さは実施例1(正三角形)が従来例2
(円形)の約1.6倍の強さを有することが判明した。[Table 2] Looking at the above results, the amount of deflection of the beam in Example 1 (triangular cross section) was reduced by about 20% compared to Conventional Example 2 (circular cross section), and that in Conventional Example 1 (rectangular cross section) was reduced by about 10%. I understand. In addition, the bending strength of the beam is that of Example 1 (regular triangle) and that of Conventional Example 2
It was found to be about 1.6 times stronger than the (circular) shape.
【0021】次に、縦型のウエハボートの強度を検討す
るため、図6に示すように単純化したモデルを用いて強
度計算を行った。実施例2は断面が正三角形の梁に関す
る計算例であって、これは図2に示した寸法を有する断
面正三角形の支持部材を持つ縦型ウエハボートのモデル
である。従来例3は同様に図3に示した寸法を有する断
面矩形の支持部材のモデルである。従来例4は図4に示
した断面円形の支持部材のモデルである。各梁には深さ
5mmの溝が形成されていて、溝以外の部分の断面積は
ほぼ同じである。計算条件を以下に示す。Next, in order to study the strength of the vertical wafer boat, strength calculation was performed using a simplified model as shown in FIG. Example 2 is a calculation example regarding a beam having an equilateral triangular section, which is a model of a vertical wafer boat having a support member having an equilateral triangular section having the dimensions shown in FIG. Conventional Example 3 is also a model of a support member having a rectangular cross section, which similarly has the dimensions shown in FIG. Conventional Example 4 is a model of a supporting member having a circular cross section shown in FIG. A groove having a depth of 5 mm is formed in each beam, and the cross-sectional areas of the portions other than the groove are substantially the same. The calculation conditions are shown below.
【0022】L(梁全体):85.7cm I(断面二次モーメント)従来例4:0.125cm4 実施例2:0.153cm4 従来例3:0.139cm4 E(縦弾性係数):7.78×105 kg/cm2 C(端末条件係数):0.25 上記条件をもとにEulerの式を用いて座屈荷重(k
g)を計算し、また従来例4を基準にした場合の座屈荷
重の比も求めて表3に示した。L (entire beam): 85.7 cm I (second moment of area) Conventional example 4: 0.125 cm 4 Example 2: 0.153 cm 4 Conventional example 3: 0.139 cm 4 E (longitudinal elastic modulus): 7.78 × 10 5 kg / cm 2 C (end condition coefficient): 0.25 Based on the above conditions, the buckling load (k
g) was calculated, and the buckling load ratios based on Conventional Example 4 were also found and shown in Table 3.
【0023】[0023]
【表3】 この結果を見ると、梁の座屈荷重は実施例2(断面三角
形)が従来例4(断面円形)に較べて約1.2倍、従来
例3(断面矩形)が約1.1倍の強さを有することが判
明した。[Table 3] Looking at these results, the buckling load of the beam is about 1.2 times in Example 2 (triangular cross section) and 1.1 times in Conventional Example 3 (rectangular cross section) compared to Conventional Example 4 (circular cross section). It has been found to have strength.
【0024】[0024]
【発明の効果】本発明のウエハボートは、支持部材の断
面形状が実質的に三角形であるので、重量が同等の従来
のウエハボートに較べて、横型ボートの場合には撓み量
が減少し、縦型ボートの場合には座屈荷重が増大する。
従って、横型及び縦型いずれのボートにおいても耐用寿
命が長くなる。In the wafer boat of the present invention, since the supporting member has a substantially triangular cross-sectional shape, the bending amount is reduced in the case of the horizontal boat as compared with the conventional wafer boat having the same weight. The buckling load increases in the case of a vertical boat.
Therefore, the useful life is extended in both horizontal and vertical boats.
【0025】なお、断面形状は前記実施例の正三角形の
断面形状のものに限定されない。例えば正三角形以外の
三角形(とくに二等辺三角形が好ましい)であってもよ
い。また、三角形の角部は多少面取りされていてもよ
い。全体的に丸みをおびた「おむすび」形の三角形でも
よい。The cross-sectional shape is not limited to the equilateral triangular cross-sectional shape of the above embodiment. For example, a triangle other than an equilateral triangle (especially an isosceles triangle is preferable) may be used. The corners of the triangle may be chamfered to some extent. It may be a rounded "Omusubi" shaped triangle.
【図1】本発明のウエハボートを示す斜視図。FIG. 1 is a perspective view showing a wafer boat of the present invention.
【図2】図1の支持部材の断面図。2 is a cross-sectional view of the support member of FIG.
【図3】従来例を示す断面図。FIG. 3 is a cross-sectional view showing a conventional example.
【図4】従来のウエハボートにおける支持部材を示す断
面図。FIG. 4 is a cross-sectional view showing a supporting member in a conventional wafer boat.
【図5】横型ウエハボートにおける支持部材の強度計算
想定モデルを示す図。FIG. 5 is a view showing an assumed model for strength calculation of a support member in a horizontal wafer boat.
【図6】縦型ウエハボートにおける支持部材の座屈荷重
計算モデルを示す図。FIG. 6 is a diagram showing a buckling load calculation model of a supporting member in a vertical wafer boat.
10 ウエハボート 11 上板 12 下板 13 支持部材 14 溝 ◆ 10 Wafer Boat 11 Upper Plate 12 Lower Plate 13 Supporting Member 14 Groove ◆
Claims (1)
持部材を備えたウエハボートにおいて、支持部材の断面
形状が実質的に三角形であることを特徴とするウエハボ
ート。1. A wafer boat provided with a supporting member for supporting a large number of semiconductor wafers, wherein the supporting member has a substantially triangular cross-sectional shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33384992A JPH06163676A (en) | 1992-11-20 | 1992-11-20 | Wafer boat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33384992A JPH06163676A (en) | 1992-11-20 | 1992-11-20 | Wafer boat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06163676A true JPH06163676A (en) | 1994-06-10 |
Family
ID=18270636
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33384992A Pending JPH06163676A (en) | 1992-11-20 | 1992-11-20 | Wafer boat |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06163676A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6110285A (en) * | 1997-04-15 | 2000-08-29 | Toshiba Ceramics Co., Ltd. | Vertical wafer boat |
| WO2005091341A1 (en) * | 2004-03-18 | 2005-09-29 | Poco Graphite, Inc. | Improved rails for semiconductor wafer carriers |
| JP2009170938A (en) * | 1999-04-15 | 2009-07-30 | Integrated Materials Inc | Silicon fixture for wafer processing and method of manufacturing the same |
-
1992
- 1992-11-20 JP JP33384992A patent/JPH06163676A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6110285A (en) * | 1997-04-15 | 2000-08-29 | Toshiba Ceramics Co., Ltd. | Vertical wafer boat |
| JP2009170938A (en) * | 1999-04-15 | 2009-07-30 | Integrated Materials Inc | Silicon fixture for wafer processing and method of manufacturing the same |
| WO2005091341A1 (en) * | 2004-03-18 | 2005-09-29 | Poco Graphite, Inc. | Improved rails for semiconductor wafer carriers |
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