JPH06168968A - Equipment for supplying preheat to resin tablet - Google Patents

Abstract

PURPOSE:To rapidly supply preheated resin tablets in a molding machine to a pot part of a molding equipment, by preheating the resin tablets which are retained by a retaining mechanism. CONSTITUTION:When a resin tablet 35 is taken out from a magazine by a taking-out equipment 34, an arm 22 of a transferring equipment 21 is horizontally turned as far as a position above the taking-out equipment 34. A retaining mechanism 30 descends while opening a chuck pawl 29, and the resin tablet 35 on the taking-out equipment 34 is retained by closing the retaining mechanism 30. Then the retaining mechanism 30 is made to ascend by the arm 22, and is horizontally turned and transferred as far as a position above the heating coil 61 of a preheating equipment 62. By turning the chuck pawl 29, the resin tablet 35 is put in the coil 61 while the resin tablet 35 is retained by the chuck pawl 29. The resin tablet 35 is preheated at 70-85 deg.C. The preheated resin tablet 35 is transferred as far as a position above a supply equipment 38 by horizontally turning the arm 22, and dropped by opening a shutter 33.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin tablet preheat supply device for a mold which supplies a preheated resin tablet of a molding machine to a pot portion of the molding device.

[0002]

2. Description of the Related Art Conventionally, for encapsulating a semiconductor element with a resin, for example, a transfer mold apparatus disclosed in JP-A-58-21344 has been used.

FIG. 6 shows the structure of this conventional transfer molding apparatus, in which a lower mold having a heater 3 built-in is mounted on a lower die plate 2 provided so as to be vertically moved by a lowermost cylinder 1. Mold 4 is installed.
On the other hand, below the upper die plate 5, the heater 6
An upper mold 7 having a built-in is installed. The upper mold 7 is provided with a required number of pot portions 8 corresponding to the cavities (not shown) of the lower mold 4. Corresponding to the pot portion 8, the upper die plate 5,
Further, the same number of plungers 9 and cylinders 10 for moving the plungers 9 up and down are provided.

With this structure, a lead frame 11 having a semiconductor element fixed thereto is supplied onto the cavity of the lower mold 4, and while the lead frame 11 is heated by the heater 3, the lower mold 4 and the lower die plate 2 together. It is raised by the cylinder 1 and fastened to the upper mold 7. Next, the resin tablet 12 of the molding machine is supplied to the pot portion 8 of the upper molding die 7, and the tablet 12
Is heated by the heater 6 to be melted. Then, the plunger 9 is lowered by the cylinder 10, the melt molding machine in the pot portion 8 is press-fitted into the cavity of the lower molding die 4, and the resin encapsulation molding of the semiconductor element is performed.

Then, the pot portion 8 of the mold 7 is
Regarding the supply of the tablet 12 of the molding machine to the above, a hopper 13 for accommodating a large number of the resin tablets 12 is provided on the upper side of the upper molding die 7 and the popper 1
3 is moved up and down by the cylinder 14 to align and insert the resin tablet 12 into the chute pipe 15.

The resin tablets 12 inserted into the chute pipe 15 are put into the holes 17 of the disc 16 which is rotated intermittently, one by one, and in the opposite direction from the holes 17 of the disc 16 to one of the holes 19 of the supply block 18. Are transferred one by one.

The resin tablet 12 transferred to the hole 19 of the supply block 18 is transferred to the pot part 8 of the upper mold 7 by moving the supply block 18 onto the pot part 8 of the upper mold 7. Thus, the resin tablet 12 of the molding machine is supplied to the pot portion 8 of the upper molding die 7.

[0008]

By the way, in recent years, as the size of semiconductor devices such as memory has become larger, the size of the encapsulation package has increased, so that the resin tablet of a molding machine has a conventional size (diameter 17 (mm) or less). The larger one (diameter 17 (mm) or more) has been used. Unlike a resin tablet of a general size, the resin tablet of this large molding machine cannot be melted only by heating by the mold die performed by the heater 6 of the upper mold die 7, so that 75 ~ 85 before feeding to pot
It is necessary to preheat to (° C). However, as described above, in the pre-heated molding machine, the heating temperature decreases with the passage of time, and temperature variations do not occur, so the flow characteristics of the molding machine change and the gold wire connecting the semiconductor element and the lead frame is changed. (Generally, the thickness is 5 μm to 1
Due to quality problems such as falling down (0 μm), it is necessary to supply to the mold pot as soon as possible (within 10 seconds from the flow characteristics).

The present invention has been made in view of the above circumstances, and an object thereof is to provide an excellent mold for rapidly supplying a preheated resin tablet of a molding machine to a pot portion of a molding machine. It is to provide a preheating supply device for resin tablets.

[0010]

In order to achieve the above object, in a device for supplying a molding resin tablet according to the present invention, the pot part of a molding device for performing a predetermined molding by a molding machine supplied from the pot part. In the one for supplying the preheated tablet of the molding machine, the preheating is performed while the resin tablet is held by the holding mechanism, and the resin tablet is supplied from the holding mechanism to the pot section. It is characterized by having done.

[0011]

According to the above means, since the resin tablet is preheated while being held by the holding mechanism, the resin tablet can be quickly supplied to the pot portion of the molding apparatus after preheating.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described below with reference to FIGS.
Will be described with reference to.

First, FIG. 1 shows a resin tablet transfer device 21 at the center, and an arm 22 can be moved back and forth by a motor 23 and a ball screw 24. Further, the motor 25 and the ball screw 26 are provided so as to be able to move to the left and right, to be horizontally pivotable by the vertical surface device 27, and to be vertically movable by the vertically movable cylinder 28. At the tip of the arm 22, a holding mechanism 30 including a pair of chuck claws 29, and a chuck cylinder 3 for opening and closing the holding mechanism 30.
1. Swivel cylinder 3 that swivels the holding mechanism 30 vertically
2 and a shutter 33 that opens and closes an opening at one end which is a lower part of the holding mechanism 30 in a vertical state.

On the other hand, a resin tablet take-out device 34 is provided below the tip of the arm 22 of the resin tablet transfer device 21 at the horizontal turning position on the right side in the figure,
The tablet take-out device 34 takes out a required number of resin tablets 35 of the molding machine from a magazine (not shown) to the same position.

Further, a coil 61 of a preheating device is provided below the tip of the arm 22 of the resin tablet transfer device 21 at the vertical turning position in the center of the drawing, and the arm 22 is lowered by the cylinder 28 to lower the resin. The tablet holding mechanism 30 enters the coil 61 of the preheating device 62,
The resin tablet 35 is heated to 70 to 85 (° C.) by a high frequency heating method or an induction heating method.

Then, below the tip of the arm 22 of the resin tablet transfer device 21 at the leftward horizontal turning position in the drawing,
A resin tablet supply device 38 is provided. The resin tablet supply device 38 has a holding mechanism 43 including holding claws 39 and 40 and opening / closing cylinders 41 and 42.
In addition, in the resin tablet supply device 38 portion, as shown in FIG.
The lead frame supply device 54 shown in FIG.

The lead frame supply device 54 also has a holding mechanism composed of a plurality of pairs of holding claws 56 for holding the lead frames (to which semiconductor elements are fixed) 55 taken out by a required number from a stocker (not shown). 57, and the device 53 as a whole is reciprocally moved between the resin tablet supply device 38 and the mold 59 by the drive device 58.

The mold 59 has a cavity (not shown) on which the lead frame 55 is placed,
Pot part 60 for storing the resin tablet 35 of the molding machine
And form.

Next, the operation of the above structure will be described.
At the time of supply, the resin tablets 35 of the molding machine are first taken out from the magazine (not shown) by the resin tablet take-out device 34 in a required number.

When the resin tablet 35 of the molding machine is taken out, the arm 22 of the resin tablet transfer device 21 is horizontally swiveled to the position on the resin tablet take-out device 34, and the chuck claw 29 of the holding mechanism 30 is opened and lowered. By closing the mechanism 30, the resin tablet 35 on the resin tablet extracting device 34 is held. At this time, the chuck claws 29 of the holding mechanism 30 have the resin tablets 3
It is closed by 0.3 to 0.6 mm larger than the diameter of No. 5, and the resin tablet 35 is free to move between the chuck claws 29.

Holding mechanism 3 holding resin tablet 35
0 is the arm 22 of the resin tablet transfer device 21 after that.
Is moved up to the position on the heating coil 61 of the preheating device 62, and the chuck claw 29 is rotated at the same position to move the resin tablet 35 into the coil 61 at the same position by the chuck claw 29. The resin tablet 35 is put in while holding it, and the preheating device 62 preheats the resin tablet 35 to 70 ° C. to 85 ° C. The resin tablet 35 of the pre-heated molding machine is rotated by the arm 22 of the resin tablet transfer device 21 to be horizontally rotated.
Is transferred to a position on the tablet supply device 38, and is dropped by opening the shutter 33 after the transfer.

Further, the lead frames 55 taken out from the stocker (not shown) are held by the holding claws 56 of the holding mechanism 57 at the lead frame supply device 54. Therefore, after this, the holding mechanism 57 of the lead frame supply device 54 holding the lead frame 55,
Holding mechanism 43 holding the resin tablet 35 of the molding machine
And 5 are simultaneously moved by the drive device 58 and
Then, the lead frame 55 and the resin tablet 35 are simultaneously supplied to the mold 59. As described above, according to the present configuration, the preheated resin tablet 35 can be promptly supplied after preheating.

As another embodiment, as shown in FIG.
The coil 61 is embedded in the chuck claw 29, the electrode 63 of the coil is provided in the lower part, and the electrode 64 of the preheating device 62 is provided. The electrode 63 and the electrode 64 are brought into contact with each other by the resin tablet transfer device 21 to preheat the resin tablet 35. .

As shown in FIG. 5, the coil 61 is put in a state where a plurality of resin tablets 35 are put in the holes of the supply block 18.
The supply block 18 is put in the container and the preheating device 62 preheats the plurality of resin tablets 35.

[0025]

As described above, according to the present construction, since the resin tablet is preheated while being held by the holding mechanism, it can be quickly supplied to the pot section of the molding apparatus after preheating. .

[Brief description of drawings]

FIG. 1 is an overall perspective view of a resin tablet supply device portion showing an embodiment of the present invention,

[Fig. 2] Detailed view of the resin tablet preheating part,

FIG. 3 is a cutaway perspective view from a resin tablet supply device to a lead frame supply device and a mold part,

FIG. 4 is a view corresponding to FIG. 2 showing another embodiment,

FIG. 5 is a view corresponding to FIG. 2 showing another embodiment,

FIG. 6 is an overall perspective view of a conventional one.

[Explanation of symbols]

8 ... Pot part, 18 ... Supply block, 21 ... Tablet transfer device, 29 ... Chuck claw, 30 ... Holding mechanism, 34, 35
… Resin tablets, 39, 40… Holding claws,
61 ... Coil, 62 ... Preheating device,
63, 64 ... Electrodes.

Claims (3)

[Claims] 1. A method of supplying a preheated resin tablet of the molding machine to the pot section of a molding apparatus for performing a predetermined molding by the molding machine supplied from the pot section, the resin being supplied to the molding machine. A preheating supply device for a resin tablet, comprising a tablet holding mechanism and a preheating device, wherein the resin tablet is preheated by the preheating device while the resin tablet is held by the holding mechanism. 2. A coil is embedded in a chuck claw of a holding mechanism, an electrode of the coil is arranged in the lower part, an electrode is arranged in a preheating device, and both electrodes are brought into contact with each other by a resin tablet transfer device to preheat the resin tablet. The preheating supply device for a resin tablet according to claim 1. 3. Inserting the supply block into the coil with a plurality of resin tablets in the holes of the supply block,
The preheating supply device for resin tablets according to claim 1, wherein a plurality of resin tablets are preheated by the preheating device.