JPH06166434A - Parts feeder - Google Patents

Abstract

(57) [Summary] [Objective] The present invention relates to a component supply device, and more specifically, to a device for taking out components stored in a stick from a stick by horizontal conveyance, which is a more compact device than before. [Structure] A rotating frame 1 having a rotating shaft 2 horizontally,
It comprises a rotating mechanism for rotating the rotating frame 1 and a plurality of sets of component supplying mechanism symmetrically arranged with respect to the rotating shaft 2. The component supplying mechanism includes the sticks 3a, 3b accommodating the parts 4 and the sticks 3a, 3b. The component supply device includes stick fixing portions 5a, 5b for fixing the rotating frame 1 to the rotating frame 1 and push-out mechanisms 6a, 7a, 6b, 7b for pushing out the components 4 in the sticks 3a, 3b in the rotation axis direction. The component 4 is an IC package.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component supply device, and more particularly to a device for taking out an IC package housed in a stick from a stick by horizontal conveyance.

As a mechanism for taking out the IC package contained in the stick, a method of tilting the stick to drop it by its own weight is generally used. Bending, mechanical damage inside the IC, etc. become a problem. Further, a drop in the electrical characteristics inside the IC may occur due to the drop.

Therefore, it is necessary to forcibly push out the IC package in the stick while keeping the stick horizontal.

[0004]

2. Description of the Related Art FIG. 3 is a top view showing a conventional horizontal transfer mechanism. 3 is an IC storage stick, 4 is an IC package, 6 is an IC pushing mechanism, and 8 is a buffer rail. Set the IC package 4 in the IC storage stick 3 to I
It is extruded by the C extrusion mechanism 6 and supplied to, for example, an inspection device.

After pushing all the IC packages 4 out of the stick, the empty IC storage stick 3 is
It takes some time to replace the next IC storage stick filled with the C package.

In order to shorten the stick replacement time as much as possible and operate the device supplied with the IC package without interruption, the buffer rail 8 for stocking the IC packages for the replacement time is required. . That is, while the IC package is on the buffer rail 8, the empty IC storage stick 3 is replaced with the next IC storage stick filled with the IC package.

Therefore, in the case of making a device using the forced horizontal transfer mechanism, there is an inconvenience that the buffer rail lengthens the total length of the device and requires a large space.

[0008]

SUMMARY OF THE INVENTION In view of the above problems, it is an object of the present invention to provide a component supply device which has a forced horizontal transfer mechanism, does not require a buffer rail, and has a compact transfer mechanism.

[0009]

FIG. 1 is a conceptual view of a component supply apparatus of the present invention, (a) is a side view and (b) is a front view. The above-mentioned problems include a rotating frame 1 having a rotating shaft 2 horizontally,
It comprises a rotating mechanism for rotating the rotating frame 1 and a plurality of sets of component supplying mechanism symmetrically arranged with respect to the rotating shaft 2. The component supplying mechanism comprises a stick 3a containing a component 4,
3b, stick fixing portions 5a, 5b for fixing the sticks 3a, 3b to the rotary frame 1, and push-out mechanisms 6a, 7a, 6b, for pushing out the parts 4 in the sticks 3a, 3b in the rotation axis direction.
Solved by a component feeder with 7b.

Further, the component 4 is solved by the component supply device which is an IC package.

[0011]

FIG. 1 is a conceptual diagram of the component supply apparatus of the present invention, (a)
Is a side view, (b) is a front view, 1 is a rotating frame, 2
Is a rotating shaft, 3a and 3b are sticks, 4 is a component, for example, an IC package, 5a and 5b are stick fixing parts, 6a and 7a
6b and 7b represent the extrusion mechanism.

In the present invention, while the IC package 4 in the stick 3a is being pushed out of the stick 3a by the pushing mechanisms 6a and 7a, the stick 3b filled with the IC package is fixed to the rotary frame 1 by the stick fixing portion 5b. To do. Then, when all the IC packages 4 housed in the stick 3a are pushed out, the rotary frame 1 is rotated by 180 ° around the rotary shaft 2. Then, the stick 3b filled with the IC package becomes empty stick 3a
Then, the extrusion of the IC package 4 can be started immediately by the extrusion mechanisms 6b and 7b. That is, while pushing out the IC package in one stick,
By filling the IC package in the other stick, the time required for exchanging the empty stick and the filled stick is only the time for the rotating frame 1 to rotate 180 °. The buffer rail for stocking the IC package extruded from is unnecessary, and the processing operation of the device to which the parts are supplied can be operated without interruption.

[0013]

2A and 2B are a top view and a side view showing a component supply device of an embodiment, FIG. 2A is a top view and FIG. 2B is a side view. The reference numerals in the figure are the same as those in FIG. 1, and 2a is a rotary drive pulley,
Reference numerals 5a and 5b are stick fixing mechanisms and stick clamp mechanisms, 6a and 6b are pushing mechanisms and IC pushing cylinders, and 7a and 7b are pushing guide rods. An embodiment will be described below with reference to FIG.

The rotary frame 1 rotates about a horizontal rotary shaft 2 by rotating the rotary drive pulley 2a. 3
Reference numerals a and 3b are sticks for accommodating the IC package 4, and the sticks 3a and 3b are fixed to the rotary frame 1 by stick clamp mechanisms 5a and 5b, respectively. The IC packages in the sticks 3a, 3b are pushed out of the sticks by the IC pushing cylinders 6a, 6b moving along the pushing guide rods 7a, 7b.

The sticks 3a and 3b exchange their positions by rotating the rotary frame 1 about the rotary shaft 2 by 180 °. The IC package 4 in the stick 3b is filled while the IC package 4 in the stick 3a is being pushed out. As soon as all the IC packages 4 inside the stick 3a are pushed out, the rotating frame 1
Is rotated about the rotation axis 2 by 180 °, and then the IC package 4 in the stick 3b is pushed out. In this way, the processing operation of the device to which the IC package is supplied can be operated without interruption.

In the above embodiment, two sets of the sticks 3a, 3b are arranged on the rotary frame 1, but three or four sets are arranged so as to be three-fold symmetrical or four-fold symmetrical with respect to the rotary shaft 2. It can also be taken.

Further, although the present invention has a great effect as a device for supplying an IC package, it can be applied to a device for supplying other electronic components. According to the present invention, the forced horizontal transport mechanism can be downsized.

[0018]

As described above, according to the present invention,
Even though it is a forced horizontal transfer mechanism, it does not require a buffer rail as in the past. Since the IC package push-out mechanism is arranged in several sets on the rotary frame, the apparatus becomes compact.

The present invention contributes to downsizing of the component supply device.

[Brief description of drawings]

FIG. 1 is a conceptual view of a component supply device of the present invention, (a) is a side view, and (b) is a front view.

2A and 2B are a top view and a side view showing a component supply device of an embodiment, FIG. 2A is a top view and FIG. 2B is a side view.

FIG. 3 is a top view showing a conventional horizontal transport mechanism.

[Explanation of symbols]

1 is a rotary frame 2 is a rotary shaft 2a is a rotary drive pulley 3 is an IC storage stick 3a, 3b is a stick, an IC storage stick is an IC storage stick 4 is a component, and the IC packages 5a, 5b are The stick clamp part 6 is the stick clamp mechanism 6, the IC pushing mechanism 6a, 6b is the pushing mechanism, and the IC pushing mechanism is the I pushing mechanism.
C The extrusion cylinders 7a and 7b are the extrusion mechanism, and the extrusion guide bar 8 is the buffer rail.

Claims (2)

[Claims] 1. A rotating frame having a horizontal rotating shaft (2).
(1), a rotating mechanism for rotating the rotating frame (1), and a plurality of sets of component supplying mechanisms symmetrically arranged with respect to the rotating shaft (2). ) Is stored in the stick (3a, 3b), a stick fixing part (5a, 5b) for fixing the stick (3a, 3b) to the rotating frame (1), and parts (3a, 3b) inside the stick (3a, 3b). 4) A parts supply device characterized by comprising an extruding mechanism (6a, 7a, 6b, 7b) for extruding 4) in the direction of the rotation axis. 2. The component supply device according to claim 1, wherein the component (4) is an IC package.