JPH0616528B2 - Adhesive sheet processing device - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a pressure-sensitive adhesive sheet processing apparatus for irradiating a sheet assembly coated with a UV-sensitive pressure-sensitive adhesive with ultraviolet rays for processing.

[Prior art and its problems]

In the integrated circuit (IC) manufacturing process, there is a dicing process for cutting a semiconductor wafer into chips. In this dicing process, as a method of holding the semiconductor wafer, the semiconductor wafer is arranged at the center of the supporting frame, and the lower surface of these is adhered by a sheet coated with an adhesive to form an integrated sheet assembly. Only the semiconductor wafer is cut while the frame is fixed and the sheet is left with a cutter. This method has an advantage that chips can be prevented from chipping or scattering, but the adhesive strength of the pressure-sensitive adhesive must be large in order to withstand the impact force at the time of cutting. On the other hand, on the other hand, the chip must be easily peeled from the sheet after cutting, but there is a problem that the large adhesive force of the sheet hinders peeling.

By the way, recently, a UV-sensitive adhesive having a property that its adhesive strength is reduced by irradiating with ultraviolet rays has been developed, and a sheet coated with this adhesive adheres a semiconductor wafer to UV rays after cutting. Irradiation can solve the above problems.

For this reason, a device for irradiating the sheet assembly coated with the UV-sensitive adhesive with ultraviolet rays is required. However, this device has a simple structure and is uniformly irradiated with ultraviolet rays. It is required that the assembly is not affected by heat during processing.

[Object of the Invention]

Accordingly, the present invention provides an apparatus for processing a sheet assembly in which a wafer for semiconductors or the like is adhered to a sheet coated with an ultraviolet sensitive adhesive, and a novel adhesive sheet processing apparatus that can satisfy the above requirements. The purpose is to do.

[Structure of Invention]

The pressure-sensitive adhesive sheet processing apparatus of the present invention has a holding plate having a through hole formed in the center thereof in front of a light irradiator having a built-in lamp that emits light in the range of short-wavelength visible light to ultraviolet light. A sheet assembly made of a material that transmits light and coated with an ultraviolet-sensitive adhesive is used to form a sheet assembly in which a supporting frame and a wafer arranged at the center of the frame are adhered from below and integrated. It is placed on the holding plate by the positioning mechanism so as to cover the through hole, and the outlet and the inlet of the cooling air for cooling the seat assembly are provided in the vicinity of the seat assembly so as to face each other. Light illuminates the ultraviolet sensitive adhesive.

〔Example〕

The present invention will be specifically described below based on the embodiments shown in the drawings.

As shown in FIGS. 1 and 2, a light irradiator 2 is disposed below the inside of the device box 1. A high-pressure mercury lamp having an emission length of 150 mm is arranged in the light irradiator 2 as a lamp 3 that emits light in a range from short-wavelength visible light to ultraviolet light. This high-pressure mercury lamp has a rating of 1.2 kW, has a main wavelength of 365 nm, and is 254 nm, 303 nm, 405 nm, 43 nm.
Emit light of wavelengths such as 6 nm efficiently. A mirror 31 is arranged behind the lamp 3, and the light of the above-mentioned wavelength range of the lamp 3 is emitted upward.

A holding plate 4 is provided on the upper part of the device box 1. At the center of the holding plate 4, as shown in FIG.
1 is provided. A step portion 42 is formed at the rim of the through hole 41, and the auxiliary ring 5 is locked by the step portion 42 and fitted into the through hole 41. Inner hole 5 of auxiliary ring 5
Several sizes of 1 are prepared, and the auxiliary ring 5 having the inner hole 51 corresponding to the size of the wafer to be processed is selected.

In the seat assembly 10, as shown in FIG. 3, a wafer 12 is arranged in the center of an annular support frame 11, and the support frame 11 and the wafer 12 are seated together in a sheet 13.
It is adhered with and is united. This sheet 13 is a thin plastic sheet that transmits light, and its surface is coated with an adhesive. This adhesive is an ultraviolet-sensitive type that has the property of decreasing its adhesive strength when irradiated with ultraviolet rays. is there. A plurality of notches 11a are formed on the outer edge of the support frame 11, while a corresponding locking piece 5a is provided on the upper surface of the auxiliary ring 5 so that the seat assembly 10 can be positioned. It is placed on the auxiliary ring 5. At this time, the rim of the inner hole 51 is located in the middle of the support frame 11 and the wafer 12, and the support frame 11 is masked by the auxiliary ring 5 and the wafer 12
Only the part of the is irradiated with ultraviolet rays.

A shutter 6 is arranged immediately below the holding plate 4, and this is driven by a motor 61 in a horizontal plane to open and close the through hole 41. In the drive surface of the shutter 6, an outlet 71 for cooling air and an inlet 72 for forcibly sucking air are provided so as to face each other to form an air curtain. When the shutter 6 is closed, the shutter 6 is used. The seat assembly 10 is adapted to cool when the is open. However, the shutter 6 and the seat assembly 10 may be cooled only by the air outlet 71 without using the air curtain.

A light guide 8 is connected to the irradiation opening of the light irradiator 3, and the tip of the light guide 8 reaches directly below the shutter 6. When the distance between the sheet assembly 10 and the lamp 3 is increased so as not to be affected by the heat of the lamp 3, the light guide 8 prevents diffusion of light, and the inner surface of the inner cylinder 81 is mirror-finished. As a result, the seat assembly 10 is efficiently irradiated. The light guide 8 has a double cylinder structure, and the heat dissipation from the inner cylinder 81 is blocked by the outer cylinder 82 so that the inside of the device box 1 does not become hot. Further, when the double cylinder structure is adopted, the inner cylinder 81
By configuring the cold mirror that transmits infrared rays, there is an advantage that the amount of heat received by the seat assembly 10 can be reduced. Furthermore, in order to completely shut out the heat effect on the seat assembly 10, the light irradiator 2 and the holding plate 4 are provided.
A cold filter that transmits light in the range from short-wavelength visible light to ultraviolet light and reflects or absorbs medium-wavelength visible light is preferably arranged between the two. Then, it is preferable to provide a cooling mechanism for cooling the cold filter.

Then, in order to perform processing with the apparatus having the above-described configuration, first, the shutter 6 is closed and the lamp 3 is turned on. Then, the upper lid 1a is opened and the seat assembly 1 that has completed the dicing process
0 is set at a predetermined position of the auxiliary ring 5 by the positioning mechanism. Next, when the shutter 6 is opened for a predetermined time and the sheet assembly 10 is irradiated with ultraviolet rays, the adhesive force of the ultraviolet-sensitive adhesive that adheres the sheet 13 and the wafer 12 is drastically reduced. Therefore, in the sheet assembly 10 taken out of this apparatus, the chip-shaped wafer 12 is easily separated from the sheet 13 in the next step.

〔The invention's effect〕

As described above, the adhesive sheet processing apparatus of the present invention,
First, since the structure is simple and the sheet assembly is placed on the holding plate by the positioning mechanism, the position of the wafer with respect to the light source lamp is accurate and the sheet assembly can be reliably and uniformly irradiated with ultraviolet rays. . Further, since the apparatus for cooling the sheet assembly is provided, the adhesive sheet processing apparatus can completely satisfy the required characteristics without giving a heat effect to the sheet assembly.

[Brief description of drawings]

FIG. 1 is a front sectional view of an embodiment of the present invention, FIG. 2 is a side sectional view of the same, and FIG. 3 is an exploded perspective view of essential parts. 1 ... Device box, 2 ... Light irradiator, 3 ... Lamp, 31 ...
Mirror, 4 ... Holding plate, 41 ... Through hole, 42 ... Step, 5 ...
… Auxiliary ring, 6… Shutter, 71… Air outlet, 72…
… Suction port, 8 …… Light guide, 10 …… Seat assembly,
11 …… Support frame, 12 …… Wafer, 13 …… Sheet

Claims (9)

[Claims] 1. A holding plate having a through hole in the center thereof is arranged in front of a light irradiator having a built-in lamp that emits light in the range from short-wavelength visible light to ultraviolet light. In the sheet made of a material that transmits the ultraviolet ray-sensitive adhesive, the supporting frame and the wafer arranged at the center of the frame are adhered from below to form an integrated sheet assembly by the positioning mechanism. It is placed on the holding plate so as to cover the through hole, and an outlet and an inlet for cooling air for cooling the seat assembly are provided in the vicinity of the seat assembly so as to face each other.
A pressure-sensitive adhesive sheet processing apparatus, wherein the light from the light irradiator irradiates the ultraviolet-sensitive adhesive. 2. An auxiliary ring is fitted in a step or the like formed on the rim of the through hole, and at least the support frame is masked by the auxiliary ring. Adhesive sheet processing equipment. 3. The pressure-sensitive adhesive sheet processing apparatus according to claim 1, further comprising a light guide provided between the light irradiator and the holding plate. 4. The pressure-sensitive adhesive sheet processing apparatus according to claim 3, wherein the light guide has a double cylinder structure, and the inner surface of the inner cylinder is mirror-finished. 5. The pressure-sensitive adhesive sheet processing apparatus according to claim 3, wherein the light guide has a double cylinder structure, and the inner cylinder is a cold mirror that transmits infrared rays. 6. The adhesive sheet processing apparatus according to claim 1, wherein a mirror is arranged behind the lamp in the light irradiator. 7. The pressure-sensitive adhesive sheet processing apparatus according to claim 6, wherein the mirror is a cold mirror that transmits infrared rays. 8. A cold filter is provided between the light irradiator and the holding plate, the cold filter transmitting light in the range from short-wavelength visible light to ultraviolet light and reflecting or absorbing medium-wavelength visible light. The pressure-sensitive adhesive sheet processing apparatus according to claim 1, which is characterized in that. 9. The pressure-sensitive adhesive sheet processing apparatus according to claim 8, further comprising a cooling mechanism for cooling the cold filter.