JPH06164290A - Piezoelectric oscillator - Google Patents
Piezoelectric oscillatorInfo
- Publication number
- JPH06164290A JPH06164290A JP31223292A JP31223292A JPH06164290A JP H06164290 A JPH06164290 A JP H06164290A JP 31223292 A JP31223292 A JP 31223292A JP 31223292 A JP31223292 A JP 31223292A JP H06164290 A JPH06164290 A JP H06164290A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- base substrate
- oscillator
- ceramic element
- piezoelectric ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 70
- 239000000919 ceramic Substances 0.000 claims abstract description 35
- 239000011347 resin Substances 0.000 claims abstract description 14
- 229920005989 resin Polymers 0.000 claims abstract description 14
- 230000010355 oscillation Effects 0.000 abstract description 12
- 239000004593 Epoxy Substances 0.000 abstract description 11
- 239000011521 glass Substances 0.000 abstract description 11
- 239000000853 adhesive Substances 0.000 abstract description 5
- 230000001070 adhesive effect Effects 0.000 abstract description 5
- 230000008602 contraction Effects 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、圧電セラミック素子を
備えた圧電発振子に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a piezoelectric oscillator provided with a piezoelectric ceramic element.
【０００２】[0002]
【従来の技術】圧電発振子として、例えば面実装型セラ
ミック発振子は、アルミナ等からなるベース基板（セラ
ミック基板）と、ベース基板の両側に形成された外部電
極と、ベース基板上にて外部電極にそれぞれ導電性接着
剤を介して固着された圧電セラミック素子と、ベース基
板上に取付けられ、圧電セラミック素子を防護するキャ
ップとを備える。このように、従来の発振子では、一般
にベース基板としてアルミナ等からなるセラミック基板
が使用されている。2. Description of the Related Art As a piezoelectric oscillator, for example, a surface mount ceramic oscillator is a base substrate (ceramic substrate) made of alumina or the like, external electrodes formed on both sides of the base substrate, and external electrodes on the base substrate. And a piezoelectric ceramic element fixed to each other via a conductive adhesive, and a cap mounted on the base substrate to protect the piezoelectric ceramic element. Thus, in the conventional oscillator, a ceramic substrate made of alumina or the like is generally used as the base substrate.
【０００３】[0003]
【発明が解決しようとする課題】ところで、圧電セラミ
ック素子をベース基板に固着すると、固着しない単体の
場合に比べて、環境温度の変化に伴ってベース基板の熱
膨張係数により発振周波数（振動数）が変化し、温度変
化に対する周波数特性の変動が大きくなる。例えば、環
境温度が高温になるほど、圧電セラミック素子の発振周
波数が高くなり、その変動が著しくなる。その上、セラ
ミック基板はアルミナ等からなるため高価であり、延い
ては発振子のコストが高くなる。By the way, when the piezoelectric ceramic element is fixed to the base substrate, the oscillation frequency (frequency) depends on the coefficient of thermal expansion of the base substrate as the ambient temperature changes, as compared with the case where the piezoelectric ceramic element is not fixed. Changes, and the fluctuation of the frequency characteristic with respect to the temperature change increases. For example, the higher the ambient temperature, the higher the oscillation frequency of the piezoelectric ceramic element, and the more significant the fluctuation. Moreover, since the ceramic substrate is made of alumina or the like, it is expensive, which in turn increases the cost of the oscillator.
【０００４】従って、本発明の目的は、温度変化に対す
る発振周波数特性の向上、及び低コストを実現する圧電
発振子を提供することにある。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a piezoelectric oscillator which improves the oscillation frequency characteristic with respect to temperature changes and realizes low cost.
【０００５】[0005]
【課題を解決するための手段及び作用】前記目的を達成
するために、本発明の圧電発振子は、従来の圧電発振子
において、ベース基板を樹脂製の基板としたことを特徴
とする。一般に樹脂製の基板は、セラミック基板に比べ
て熱膨張係数が大きく、温度変化の影響を受け易い。従
って、セラミック基板よりも温度変化に対して膨張・収
縮し易い樹脂製の基板をベース基板として用いることに
より、圧電セラミック素子の振動数が環境温度の変化に
よって変わったとしても、樹脂製の基板の膨張や収縮に
よって、振動数の変化が発振子全体としては相殺され、
結果的に振動数の変化が大幅に抑制される。In order to achieve the above object, the piezoelectric oscillator of the present invention is characterized in that, in the conventional piezoelectric oscillator, the base substrate is a resin substrate. Generally, a resin substrate has a larger coefficient of thermal expansion than a ceramic substrate and is easily affected by temperature changes. Therefore, even if the frequency of the piezoelectric ceramic element changes due to the change in the ambient temperature, the resin substrate, which is more easily expanded and contracted with respect to the temperature change than the ceramic substrate, is used as the base substrate. Due to expansion and contraction, the change in frequency is canceled out for the entire oscillator,
As a result, the change in frequency is greatly suppressed.
【０００６】なお、本発明において、樹脂製の基板は、
セラミック基板の熱膨張係数よりも大きいものであれば
特定されない。例えば、ガラス・エポキシ基板、紙・フ
ェノール基板を使用すればよい。因みに、ガラス・エポ
キシ基板及び紙・フェノール基板の熱膨張係数は共に１
０-5〜１０-4／℃程度であるのに対し、セラミック基板
の熱膨張係数は１０-7〜１０-6／℃程度であり、これら
樹脂製の基板の方が温度変化の影響を受け易く、膨張又
は収縮し易い。In the present invention, the resin substrate is
It is not specified as long as it is larger than the coefficient of thermal expansion of the ceramic substrate. For example, a glass / epoxy substrate or a paper / phenolic substrate may be used. By the way, the coefficient of thermal expansion of glass / epoxy substrate and paper / phenolic substrate are both 1
The coefficient of thermal expansion of the ceramic substrate is about 10 -7 to 10 -6 / ° C, while that of 0 -5 to 10 -4 / ° C, and these resin substrates are more affected by temperature changes. Easy to expand and contract.
【０００７】なお、ガラス・エポキシ基板の熱膨張係数
は方向性があるため、圧電セラミック素子と方向性を揃
え、圧電セラミック素子の発振周波数の変化が、基板の
膨張や収縮によって相殺されるように注意する必要があ
る。Since the coefficient of thermal expansion of the glass / epoxy substrate is directional, it is aligned with that of the piezoelectric ceramic element so that changes in the oscillation frequency of the piezoelectric ceramic element are canceled by expansion and contraction of the substrate. You need to be careful.
【０００８】[0008]
【実施例】以下、本発明の圧電発振子を実施例に基づい
て説明する。その一実施例に係る発振子の平面図を図１
に、側面図を図２に、底面図を図３に示す。この発振子
は、コンデンサを内蔵する面実装型のセラミック発振子
であり、樹脂製の基板であるガラス・エポキシ基板（ベ
ース基板）１の両側と中央に外部電極２，３，４が形成
され、ベース基板１上にて外部電極２，３にそれぞれ導
電性接着剤５，６を介して圧電セラミック素子７が固着
され、ベース基板１上に圧電セラミック素子７を防護す
るキャップ（図示せず）が取付けられたものである。な
お、コンデンサは図には特に示していないが、外部電極
４がコンデンサ用の電極となる。EXAMPLES The piezoelectric oscillator of the present invention will be described below based on examples. FIG. 1 is a plan view of the oscillator according to the embodiment.
2 is a side view and FIG. 3 is a bottom view. This oscillator is a surface-mounted ceramic oscillator with a built-in capacitor, and external electrodes 2, 3 and 4 are formed on both sides and center of a glass / epoxy substrate (base substrate) 1 which is a resin substrate. A piezoelectric ceramic element 7 is fixed to the external electrodes 2 and 3 on the base substrate 1 via conductive adhesives 5 and 6, respectively, and a cap (not shown) for protecting the piezoelectric ceramic element 7 is provided on the base substrate 1. It is installed. Although the capacitor is not shown in the figure, the external electrode 4 serves as an electrode for the capacitor.
【０００９】この実施例では、ベース基板１の相対側面
に各々３つの切欠部８，９が形成されており、外部電極
２，３，４は、この切欠部８，９を通って、ベース基板
１の裏面にも形成され、全体としてベース基板１の横断
方向に周設されている。このような圧電発振子の製造例
を簡潔に述べると、まず所定厚さの大サイズのガラス・
エポキシ基板に、発振子のサイズに応じた個々のユニッ
ト（ベース基板）の側面に相当する部分に図１のような
形状の切欠部（即ちスルーホール）を打ち抜く。次い
で、各ベース基板の両側と中央に電極材を塗布・焼成し
て、表面と裏面に外部電極を設け、両側の外部電極上に
圧電セラミック素子を導電性接着剤で固着した後、ベー
ス基板上にキャップを接合する。その後、切欠部を形成
した部分を例えばスクライブによりカッティングし、こ
のカッティング面（側面）にて切欠部に電極材を塗布・
焼成し、側面にも外部電極を形成する。そして、更にカ
ッティングして、ベース基板を個々に分離し、発振子を
得る。In this embodiment, three notches 8 and 9 are formed on the relative side surfaces of the base substrate 1, and the external electrodes 2, 3 and 4 pass through the notches 8 and 9 and the base substrate 1 passes. It is also formed on the back surface of the base substrate 1, and is provided around the base substrate 1 in the transverse direction as a whole. To briefly describe an example of manufacturing such a piezoelectric oscillator, first, a large-sized glass
A notch (that is, a through hole) having a shape as shown in FIG. 1 is punched in a portion of the epoxy substrate corresponding to the side surface of each unit (base substrate) corresponding to the size of the oscillator. Next, electrode materials are applied and baked on both sides and the center of each base substrate, external electrodes are provided on the front and back surfaces, and piezoelectric ceramic elements are fixed on the external electrodes on both sides with a conductive adhesive. Join the cap to. After that, the portion where the notch is formed is cut by, for example, scribing, and the electrode material is applied to the notch on the cutting surface (side surface).
Baking is performed to form external electrodes also on the side surfaces. Then, further cutting is performed to separate the base substrate into individual pieces to obtain an oscillator.
【００１０】この発振子では、ベース基板が樹脂製の基
板（ガラス・エポキシ基板）であり、ガラス・エポキシ
基板は、前記したようにその熱膨張係数が１０-5〜１０
-4／℃程度であって、セラミック基板の熱膨張係数（１
０-7〜１０-6／℃程度）に比較して大きいため、セラミ
ック基板よりも温度変化によって膨張・収縮し易い。こ
のため、圧電セラミック素子７の発振周波数が環境温度
の変化によって変わっても、ガラス・エポキシ基板自身
の膨張又は収縮によって発振周波数の変化が相殺され、
結果的に発振子全体としてみた場合に発振周波数の変化
が抑制されたことになる。In this oscillator, the base substrate is a resin substrate (glass / epoxy substrate), and the glass / epoxy substrate has a coefficient of thermal expansion of 10 −5 to 10 as described above.
-4 / ℃, the thermal expansion coefficient of the ceramic substrate (1
0 For -7 large compared to to 10 -6 / ° C. approximately), easily expands or contracts due to temperature changes than the ceramic substrate. Therefore, even if the oscillation frequency of the piezoelectric ceramic element 7 changes due to a change in environmental temperature, the expansion or contraction of the glass / epoxy substrate itself cancels the change in the oscillation frequency.
As a result, the change of the oscillation frequency is suppressed when viewed as the whole oscillator.
【００１１】例えば、環境温度が高温になると、圧電セ
ラミック素子の発振周波数は高くなるが、ガラス・エポ
キシ基板自身も高温により膨張する。すると、発振周波
数は圧電セラミック素子を支える基板によって発振子全
体としては低くなり、発振周波数の変化が抑えられる。
この効果をより明確にするために、図４に実施例と従来
例の発振子における温度と周波数変化率との関係をグラ
フで示す。但し、実施例ではガラス・エポキシ基板を、
従来例ではセラミック基板を用い、発振子のサイズや試
験環境等のその他の条件は全て同じとする。このグラフ
によると、実施例の方が従来例よりも全ての温度変化に
おいて周波数変化率が小さくなっており、特に４０℃以
上の高温にて周波数変化率が著しく小さくなっている。
このように、本発明の発振子では、温度変化に対する周
波数特性が大幅に向上していることが分かる。For example, when the environmental temperature becomes high, the oscillation frequency of the piezoelectric ceramic element becomes high, but the glass / epoxy substrate itself also expands due to the high temperature. Then, the oscillation frequency is lowered as the whole oscillator by the substrate supporting the piezoelectric ceramic element, and the variation of the oscillation frequency is suppressed.
In order to make this effect clearer, FIG. 4 is a graph showing the relationship between the temperature and the frequency change rate in the oscillators of the example and the conventional example. However, in the embodiment, a glass / epoxy substrate is used.
In the conventional example, a ceramic substrate is used, and all other conditions such as the size of the oscillator and the test environment are the same. According to this graph, the frequency change rate of the example is smaller than that of the conventional example at all temperature changes, and particularly at a high temperature of 40 ° C. or higher, the frequency change rate is significantly reduced.
Thus, it can be seen that the oscillator of the present invention has a significantly improved frequency characteristic with respect to temperature changes.
【００１２】[0012]
【発明の効果】本発明の圧電発振子は、以上説明したよ
うにベース基板を樹脂製の基板としたため、下記の効果
を有する。 （１）樹脂製の基板の熱膨張係数がセラミック基板のそ
れよりも大きいため、圧電セラミック素子の発振周波数
の温度変化による変化が、樹脂製の基板自身の温度変化
による変化（膨張・収縮）によって相殺され、結果的に
周波数変化が抑制され、温度変化に対する周波数特性が
向上する。 （２）樹脂製の基板は、セラミック基板に比べて安価で
あるばかりか、外部電極の形成が容易であり、低コスト
化が実現される。As described above, the piezoelectric oscillator of the present invention has the following effects because the base substrate is the resin substrate. (1) Since the thermal expansion coefficient of the resin substrate is larger than that of the ceramic substrate, the change in the oscillation frequency of the piezoelectric ceramic element due to the temperature change is due to the change (expansion / contraction) due to the temperature change of the resin substrate itself. These are offset, and as a result, frequency changes are suppressed and the frequency characteristics with respect to temperature changes are improved. (2) The resin substrate is not only less expensive than the ceramic substrate, but also the external electrodes are easily formed, and the cost is reduced.
【図１】本発明の一実施例に係る発振子の平面図であ
る。FIG. 1 is a plan view of an oscillator according to an embodiment of the present invention.
【図２】図１に示す発振子の側面図である。FIG. 2 is a side view of the oscillator shown in FIG.
【図３】図１に示す発振子の底面図である。FIG. 3 is a bottom view of the oscillator shown in FIG.
【図４】実施例と従来例の発振子における温度と周波数
変化率との関係を示すグラフである。FIG. 4 is a graph showing the relationship between the temperature and the frequency change rate in the oscillator of the example and the conventional example.
１ ベース基板（樹脂製の基板） ２，３，４ 外部電極 ５，６ 導電性接着剤 ７ 圧電セラミック素子 ８，９ 切欠部 1 Base Substrate (Resin Substrate) 2, 3, 4 External Electrodes 5, 6 Conductive Adhesive 7 Piezoelectric Ceramic Element 8, 9 Notch
Claims (1)
複数の外部電極と、所定の外部電極に電気的に接続され
た圧電セラミック素子と、ベース基板上に取付けられ、
圧電セラミック素子を防護するキャップとを備える圧電
発振子において、 前記ベース基板は樹脂製の基板であることを特徴とする
圧電発振子。1. A base substrate, a plurality of external electrodes provided on the base substrate, a piezoelectric ceramic element electrically connected to predetermined external electrodes, and mounted on the base substrate,
A piezoelectric oscillator including a cap that protects a piezoelectric ceramic element, wherein the base substrate is a resin substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31223292A JPH06164290A (en) | 1992-11-20 | 1992-11-20 | Piezoelectric oscillator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31223292A JPH06164290A (en) | 1992-11-20 | 1992-11-20 | Piezoelectric oscillator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06164290A true JPH06164290A (en) | 1994-06-10 |
Family
ID=18026770
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31223292A Pending JPH06164290A (en) | 1992-11-20 | 1992-11-20 | Piezoelectric oscillator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06164290A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108476015A (en) * | 2016-01-23 | 2018-08-31 | 京瓷株式会社 | Piezoelectric part |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3090123B2 (en) * | 1998-06-22 | 2000-09-18 | ヤマハ株式会社 | Waveform generation method |
-
1992
- 1992-11-20 JP JP31223292A patent/JPH06164290A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3090123B2 (en) * | 1998-06-22 | 2000-09-18 | ヤマハ株式会社 | Waveform generation method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108476015A (en) * | 2016-01-23 | 2018-08-31 | 京瓷株式会社 | Piezoelectric part |
| CN108476015B (en) * | 2016-01-23 | 2021-10-26 | 京瓷株式会社 | Piezoelectric component |
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