JPH06164117A - Manufacture of wiring board with connector attached - Google Patents
Manufacture of wiring board with connector attachedInfo
- Publication number
- JPH06164117A JPH06164117A JP4333498A JP33349892A JPH06164117A JP H06164117 A JPH06164117 A JP H06164117A JP 4333498 A JP4333498 A JP 4333498A JP 33349892 A JP33349892 A JP 33349892A JP H06164117 A JPH06164117 A JP H06164117A
- Authority
- JP
- Japan
- Prior art keywords
- connector
- wiring board
- lead
- board
- positioning notch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】
【目的】 コネクタ６付き配線基板１の有効面積の減少
を伴うことなくコネクタ６のリード９と、配線基板１の
リード接続電極８との半田による接続時において生じる
位置ずれを防止する。
【構成】 配線基板１の捨て基板部４にコネクタ６の嵌
合部７が嵌合する位置決め切欠５を設け、該位置決め切
欠５にコネクタ６の嵌合部７を嵌合することにより位置
決めした状態でリード９の電極８への半田による接続を
し、その後、捨て基板部４を除去する。
(57) [Abstract] [Purpose] A positional deviation caused when soldering the lead 9 of the connector 6 and the lead connecting electrode 8 of the wiring board 1 without reducing the effective area of the wiring board 1 with the connector 6 is performed. To prevent. A configuration in which a positioning cutout 5 into which a fitting portion 7 of a connector 6 is fitted is provided in a waste board portion 4 of a wiring board 1 and the fitting portion 7 of a connector 6 is fitted into the positioning cutout 5 to perform positioning. Then, the lead 9 is connected to the electrode 8 by soldering, and then the discarded substrate portion 4 is removed.
Description
【０００１】[0001]
【産業上の利用分野】本発明は、コネクタ付き配線基板
の製造方法、例えばメモリＩＣ等の電子部品が搭載され
るカード状の配線基板であって製造段階では捨て基板部
と本体部が一体に形成され、電子部品及びコネクタの搭
載、接続後に捨て基板部を分離するコネクタ付き配線基
板の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a wiring board with a connector, for example, a card-shaped wiring board on which electronic components such as a memory IC are mounted, and the waste board portion and the main body portion are integrated in the manufacturing stage. The present invention relates to a method of manufacturing a wiring board with a connector, which is formed and mounts an electronic component and a connector and separates a discarded board portion after connection.
【０００２】[0002]
【従来の技術】ＩＣメモリカードは、本体部とメモリＩ
Ｃ等の電子部品が搭載されて複数な電子回路を構成する
本体部とそれを囲繞する捨て基板部とを破壊容易な微小
な複数の連接部を介して一体に形成した配線基板を母体
として製造される。2. Description of the Related Art An IC memory card has a main body and a memory I.
Manufactured using a wiring board as a base body, in which a main body portion having electronic components such as C mounted thereon and constituting a plurality of electronic circuits and a discarding board portion surrounding the main body portion are integrally formed through a plurality of minute connection portions that are easy to break. To be done.
【０００３】具体的には、配線基板本体部の配線膜への
クリーム半田印刷を行い、メモリＩＣのマウントを行
い、半田リフローによりメモリＩＣを配線基板本体部に
搭載し、その後、メモリコントローラを成すベアのＩＣ
をダイボンディング、ワイヤボンディング及び樹脂コー
ティング（ポッティング）により配線基板本体部に搭載
し、メモリコントローラを成すＩＣについて電気的測定
をし、更に裏面に対しても電子部品のマウントを行い、
電気的測定をし、しかる後、コネクタの接続を行う。そ
して、コネクタ接続後、上記連接部を切断することによ
り捨て基板部を本体部から分離して廃棄する。Specifically, cream solder printing is performed on the wiring film of the wiring board body, the memory IC is mounted, the memory IC is mounted on the wiring board body by solder reflow, and then a memory controller is formed. Bear IC
Is mounted on the main body of the wiring board by die bonding, wire bonding and resin coating (potting), electrical measurement is performed on the IC that constitutes the memory controller, and electronic components are mounted on the back surface.
Make electrical measurements and then connect the connectors. After connecting the connector, the connecting portion is cut to separate the discarded substrate portion from the main body portion and discard it.
【０００４】[0004]
【発明が解決しようとする課題】ところで、コネクタの
接続、具体的にはコネクタのリードと配線基板本体部の
リード接続電極との半田接続は自動実装方式により行う
ことが難しかった。というのは、コネクタの各リードが
配線基板本体部のクリーム半田が印刷された各リード接
続電極上に位置するようにコネクタを位置合せした後リ
フローすると、リフロー途中で半田が溶けることによっ
てコネクタの位置がずれ、ショートしたり、リードが本
来接続されるべきリード接続電極と隣りのリード接続電
極に接続されるという不良が発生したからである。By the way, it has been difficult to carry out the connection of the connector, more specifically, the solder connection between the lead of the connector and the lead connection electrode of the wiring board body by the automatic mounting method. This is because when reflowing after aligning the connector so that each lead of the connector is positioned on each lead connection electrode on which the cream solder of the wiring board body is printed, the solder melts during reflow and the position of the connector This is because there is a problem that the lead is misaligned, short-circuited, or the lead is connected to the lead connecting electrode adjacent to the lead connecting electrode that should be originally connected.
【０００５】そこで、配線基板本体部に位置決め切欠を
設け、コネクタに該位置決め切欠と嵌合する嵌合部を設
け、コネクタの嵌合部を配線基板本体部の位置決め切欠
に嵌合すると自ずと位置合せされるようにすることが考
えられた。このようにすれば、位置決めした状態でリフ
ローすることができ、延いてはリフロー時における位置
ずれを防止することができるからである。しかし、配線
基板本体部に位置決め切欠を設けると位置決め切欠のた
めに配線基板本体部の限られた面積を割かなければなら
ず、ＩＣカードの有効面積が減少するという問題に直面
し、得策ではない。Therefore, a positioning notch is provided on the wiring board main body, a fitting portion for fitting with the positioning notch is provided on the connector, and when the fitting portion of the connector is fitted into the positioning notch of the wiring board main body, it is automatically aligned. It was thought to be done. By doing so, it is possible to perform reflow in a positioned state, and it is possible to prevent positional deviation during reflow. However, if a positioning notch is provided in the wiring board main body, a limited area of the wiring board main body must be divided due to the positioning notch, which faces a problem that the effective area of the IC card decreases, which is not a good idea. .
【０００６】本発明はこのような問題点を解決すべく為
されたものであり、コネクタ付き配線基板の有効面積の
減少を伴うことなくコネクタのリードと配線基板のリー
ド接続電極との接続時に生じる位置ずれを防止すること
を目的とする。The present invention has been made to solve such a problem, and occurs at the time of connecting the lead of the connector and the lead connecting electrode of the wiring board without reducing the effective area of the wiring board with the connector. The purpose is to prevent misalignment.
【０００７】[0007]
【課題を解決するための手段】本発明コネクタ付き配線
基板の製造方法は、配線基板の捨て基板部にコネクタの
嵌合部が嵌合する位置決め切欠を設け、該位置決め切欠
にコネクタの嵌合部を嵌合することにより位置決めした
状態でコネクタの配線基板への接続をし、その後、捨て
基板部を除去することを特徴とする。According to the method of manufacturing a wiring board with a connector of the present invention, a positioning notch for fitting a fitting portion of the connector is provided in a waste board portion of the wiring board, and the fitting portion of the connector is provided in the positioning notch. It is characterized in that the connector is connected to the wiring board in a positioned state by fitting, and then the discarded board portion is removed.
【０００８】[0008]
【作用】本発明コネクタ付き配線基板の製造方法によれ
ば、捨て基板部の位置決め切欠にコネクタの嵌合部を嵌
合させることにより位置決めした状態で半田付けするの
で、半田が溶融してもコネクタの位置がずれない。従っ
て、コネクタのリードと配線基板のリード接続電極との
位置ずれを防止することができる。そして、配線基板側
の位置決め切欠を捨て基板部に形成するので、位置決め
切欠を設けることによって配線基板の実効面積が減少す
ることはない。依って、コネクタ付き配線基板の有効面
積の減少を伴うことなくコネクタのリードと配線基板の
リード接続電極との接続時における位置ずれを防止する
ことができる。According to the method of manufacturing a wiring board with a connector of the present invention, the connector is soldered in a positioned state by fitting the fitting portion of the connector into the positioning notch of the discarding board portion, so that the connector is melted even if the solder melts. The position of does not shift. Therefore, it is possible to prevent the positional deviation between the lead of the connector and the lead connecting electrode of the wiring board. Since the positioning notch on the side of the wiring board is formed in the discarded board portion, the effective area of the wiring board is not reduced by providing the positioning notch. Therefore, it is possible to prevent the displacement of the lead of the connector and the lead connecting electrode of the wiring board during the connection without reducing the effective area of the wiring board with the connector.
【０００９】[0009]
【実施例】以下、本発明コネクタ付き配線基板の製造方
法を図示実施例に従って詳細に説明する。図１（Ａ）乃
至（Ｃ）は本発明コネクタ付き配線基板の製造方法の一
つの実施例を工程順に示す断面図である。（Ａ）先ず、
図１（Ａ）に示すように配線基板１として本体部２と連
接部３、３、…を介して一体に形成された捨て基板部４
に位置決め切欠５が形成されたものを用意し、コネクタ
６として嵌合部７が形成されたものを用意する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method of manufacturing a wiring board with a connector according to the present invention will be described below in detail with reference to the illustrated embodiments. 1A to 1C are cross-sectional views showing one embodiment of a method for manufacturing a wiring board with a connector according to the present invention in the order of steps. (A) First,
As shown in FIG. 1 (A), as a wiring substrate 1, a waste substrate portion 4 integrally formed with the main body portion 2 through the connecting portions 3, 3, ....
The one having the positioning notch 5 formed therein is prepared, and the one having the fitting portion 7 formed as the connector 6 is prepared.
【００１０】尚、８、８、…は配線基板１本体部２に形
成されたリード接続電極、９、９、…はコネクタ６のリ
ードであり、１０、１０は嵌合部７の下側に形成された
テーパーで、嵌合部７が位置決め切欠５にスムーズに案
内されるようにする役割を果す。１１、１１はコネクタ
６の上下位置出し片であり、嵌合部７が位置決め切欠５
に嵌合されたとき配線基板１の表面と当ってコネクタ６
の配線基板１に対する上下方向における位置を規定す
る。.. are lead connection electrodes formed on the main body 2 of the wiring board 1, 9, 9, ... Are leads of the connector 6, and 10 and 10 are below the fitting portion 7. The formed taper serves to allow the fitting portion 7 to be smoothly guided to the positioning notch 5. Reference numerals 11 and 11 denote vertical positioning pieces of the connector 6, and the fitting portion 7 has the positioning notch 5
The connector 6 by hitting the surface of the wiring board 1 when fitted to the connector 6
The position in the vertical direction with respect to the wiring board 1 is defined.
【００１１】（Ｂ）そして、図示を省略した電子部品を
配線基板１の捨て基板部４に搭載した後、図１（Ｂ）に
示すように配線基板１の位置決め切欠５にコネクタ６の
嵌合部７を嵌合することによりコネクタ６の各リード
９、９、…を配線基板１の本体部２のリード接続電極
８、８、…上に位置させる。図２はこの状態における配
線基板１及びコネクタ６の側面図である。そして、位置
決めされたこの状態で加熱炉に通してリード接続電極
８、８、…上に既に塗布されているクリーム半田のリフ
ローを行う。(B) Then, after mounting an electronic component (not shown) on the waste board portion 4 of the wiring board 1, the connector 6 is fitted into the positioning notch 5 of the wiring board 1 as shown in FIG. 1 (B). By fitting the parts 7, the leads 9, 9, ... Of the connector 6 are positioned on the lead connection electrodes 8, 8, ... Of the main body part 2 of the wiring board 1. FIG. 2 is a side view of the wiring board 1 and the connector 6 in this state. Then, in this positioned state, it is passed through a heating furnace to reflow the cream solder already applied on the lead connection electrodes 8, 8, ....
【００１２】すると、リード接続電極８、８、…上のク
リーム半田を介して該リード接続電極８、８、…にコネ
クタ６の各リード９、９、…が接続された状態になる。
そして、リフロー中コネクタ６は嵌合部７と位置決め切
欠５との嵌合により配線基板１に対して位置決めされた
状態を保つので、コネクタ６のリード９、９、…と配線
基板１本体部２のリード接続電極８、８、…との間に位
置ずれが生じる虞れがない。尚、図２はリフロー時の状
態を示す側面図である。Then, the leads 9, 9, ... Of the connector 6 are connected to the lead connection electrodes 8, 8, ... Via the cream solder on the lead connection electrodes 8, 8 ,.
During the reflow, the connector 6 is kept positioned with respect to the wiring board 1 by fitting the fitting portion 7 and the positioning notch 5, so that the leads 9, 9, ... There is no risk of misalignment between the lead connection electrodes 8, 8 ,. Incidentally, FIG. 2 is a side view showing a state at the time of reflow.
【００１３】（Ｃ）その後、連接部３、３、…を切断す
ることにより本体部２から捨て基板部４を分離した後捨
て基板部４を廃棄する。図１（Ｃ）は捨て基板部４廃棄
後の状態を示す。このようなコネクタ付き配線基板の製
造方法によれば、コネクタ６のリード９と配線基板１の
リード接続電極８との位置ずれを防止することができる
と共に、配線基板１側の位置決め切欠５を捨て基板部４
に形成するので、位置決め切欠５を設けることによって
配線基板の実効面積が減少することはない。依って、コ
ネクタ付き配線基板１の有効面積の減少を伴うことなく
コネクタ６のリード９、９、…と配線基板１とリード接
続電極８、８、…との接続時における位置ずれを防止す
ることができるのである。また、コネクタ付き配線基板
１の製造の自動化が容易となる。(C) After that, the connecting substrate parts 3, 3, ... Are cut to separate the discarding substrate part 4 from the main body part 2, and then the discarding substrate part 4 is discarded. FIG. 1C shows a state after discarding the discarded substrate unit 4. According to such a method for manufacturing a wiring board with a connector, it is possible to prevent the lead 9 of the connector 6 and the lead connection electrode 8 of the wiring board 1 from being displaced, and to discard the positioning notch 5 on the wiring board 1 side. Board part 4
Therefore, the effective area of the wiring board is not reduced by providing the positioning notch 5. Therefore, it is possible to prevent the displacement of the leads 9, 9, ... Of the connector 6 and the wiring substrate 1 and the lead connection electrodes 8, 8, .. Can be done. Moreover, the automation of the manufacture of the wiring board 1 with a connector is facilitated.
【００１４】尚、配線基板１の位置決め切欠５に対する
コネクタ６の嵌合部７の嵌合構造は図１に示した実施例
の場合、図３（Ａ）に示すようになっていたが、図３
（Ｂ）に示すようにしても良い。即ち、図３（Ｂ）の場
合、テーパー部の上に凹部１２が形成され、基板１の捨
て基板部４が嵌り込んで上下方向におけるガタツキがな
くなるようにすことができるようにしており、より完璧
に位置ずれの防止ができる。The fitting structure of the fitting portion 7 of the connector 6 into the positioning notch 5 of the wiring board 1 is as shown in FIG. 3A in the case of the embodiment shown in FIG. Three
You may make it show in (B). That is, in the case of FIG. 3B, the recessed portion 12 is formed on the taper portion, and the discarding substrate portion 4 of the substrate 1 is fitted so that rattling in the vertical direction can be eliminated. It is possible to prevent misalignment perfectly.
【００１５】[0015]
【発明の効果】本発明コネクタ付き配線基板の製造方法
は、配線基板の捨て基板部にコネクタの嵌合部が嵌合す
る位置決め切欠を設け、該位置決め切欠に嵌合部を嵌合
することにより位置決めした状態で接続し、その後、捨
て基板部を除去するものである。従って、本発明コネク
タ付き配線基板の製造方法によれは、捨て基板部の位置
決め切欠にコネクタの嵌合部を嵌合させることにより位
置決めした状態で半田付けするので、半田が溶融しても
コネクタの位置がずれない。従って、コネクタのリード
と配線基板のリード接続電極との位置ずれを防止するこ
とができる。According to the method of manufacturing a wiring board with a connector of the present invention, a positioning notch for fitting the fitting portion of the connector is provided in the waste board portion of the wiring board, and the fitting portion is fitted in the positioning notch. The connection is made in a positioned state, and then the discarded substrate portion is removed. Therefore, according to the method for manufacturing a wiring board with a connector of the present invention, soldering is performed in a state in which the connector is fitted in the positioning notch of the discarding board so that the connector is soldered even if the solder melts. The position does not shift. Therefore, it is possible to prevent the positional deviation between the lead of the connector and the lead connecting electrode of the wiring board.
【００１６】そして、配線基板側の位置決め切欠を捨て
基板部に形成するので、位置決め切欠を設けることによ
って配線基板の実効面積が減少することはない。依っ
て、コネクタ付き配線基板の有効面積の減少を伴うこと
なくコネクタのリードと配線基板とリード接続電極との
接続時における位置ずれを防止することができる。Since the positioning notch on the side of the wiring board is formed in the discarded board portion, the effective area of the wiring board is not reduced by providing the positioning notch. Therefore, it is possible to prevent the displacement of the connector lead, the wiring board, and the lead connection electrode during the connection without reducing the effective area of the wiring board with the connector.
【図１】（Ａ）乃至（Ｃ）は本発明コネクタ付き配線基
板の製造方法の一つの実施例を工程順に示す斜視図であ
る。1A to 1C are perspective views showing an embodiment of a method of manufacturing a wiring board with a connector according to the present invention in the order of steps.
【図２】コネクタの嵌合部を配線基板の位置決め切欠に
嵌合した状態を示す側面図である。FIG. 2 is a side view showing a state where the fitting portion of the connector is fitted in the positioning notch of the wiring board.
【図３】（Ａ）、（Ｂ）はコネクタの捨て基板部への嵌
合構造の各別の例を示す断面図である。3 (A) and 3 (B) are cross-sectional views showing another example of the fitting structure of the connector to the waste board portion.
１ 配線基板 ２ 本体部 ３ 連接部 ４ 捨て基板部 ５ 位置決め切欠 ６ コネクタ ７ 嵌合部 ８ リード接続電極 ９ リード 1 Wiring board 2 Main body section 3 Connecting section 4 Discarding board section 5 Positioning notch 6 Connector 7 Fitting section 8 Lead connection electrode 9 Lead
Claims (1)
部と捨て基板部からなる配線基板として該捨て基板部に
上記コネクタを位置決めする位置決め切欠を有するもの
を用意し、 コネクタとして上記位置決め切欠に嵌合して該コネクタ
の配線基板本体部に対する位置を決める嵌合部を有する
ものを用意し、 上記コネクタの嵌合部を上記配線基板の捨て基板部の位
置決め切欠に嵌合することにより該コネクタを配線基板
に位置合せした状態で該コネクタのリードと配線基板本
体部のリード接続電極との接続をし、 その後、配線基板本体部から捨て基板部を分離すること
を特徴とするコネクタ付き配線基板の製造方法1. A wiring board comprising a body portion to which electronic components and a connector are connected and a waste board portion having a positioning notch for positioning the connector on the waste board portion is prepared, and the connector is fitted into the positioning notch. A connector having a fitting portion for determining the position of the connector with respect to the wiring board main body is prepared, and the connector is fitted by fitting the fitting portion of the connector into the positioning notch of the waste board portion of the wiring board. A wiring board with a connector characterized in that the leads of the connector are connected to the lead connection electrodes of the wiring board main body in a state of being aligned with the wiring board, and then the discarded board portion is separated from the wiring board main body. Production method
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4333498A JPH06164117A (en) | 1992-11-19 | 1992-11-19 | Manufacture of wiring board with connector attached |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4333498A JPH06164117A (en) | 1992-11-19 | 1992-11-19 | Manufacture of wiring board with connector attached |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06164117A true JPH06164117A (en) | 1994-06-10 |
Family
ID=18266732
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4333498A Pending JPH06164117A (en) | 1992-11-19 | 1992-11-19 | Manufacture of wiring board with connector attached |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06164117A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997017823A1 (en) * | 1995-11-08 | 1997-05-15 | Minnesota Mining And Manufacturing Company | Connector break-off locator tab |
| JP2002151825A (en) * | 2000-11-09 | 2002-05-24 | Matsushita Electric Ind Co Ltd | Connector mounting method |
| JP2012099441A (en) * | 2010-11-05 | 2012-05-24 | Tyco Electronics Japan Kk | Circuit board assembly, connector, soldering method |
-
1992
- 1992-11-19 JP JP4333498A patent/JPH06164117A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997017823A1 (en) * | 1995-11-08 | 1997-05-15 | Minnesota Mining And Manufacturing Company | Connector break-off locator tab |
| GB2321557A (en) * | 1995-11-08 | 1998-07-29 | Minnesota Mining & Mfg | Connector break-off locator tab |
| JP2002151825A (en) * | 2000-11-09 | 2002-05-24 | Matsushita Electric Ind Co Ltd | Connector mounting method |
| JP2012099441A (en) * | 2010-11-05 | 2012-05-24 | Tyco Electronics Japan Kk | Circuit board assembly, connector, soldering method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6259608B1 (en) | Conductor pattern for surface mount devices and method therefor | |
| US6396001B1 (en) | Printed circuit board and method of making the same | |
| EP0889512A2 (en) | Method for controlling solder bump shape and stand-off height | |
| JP3130784B2 (en) | Terminal structure of electronic components | |
| JPH06164117A (en) | Manufacture of wiring board with connector attached | |
| JPH10256421A (en) | Semiconductor device and mounting method thereof | |
| JP3384121B2 (en) | Electronic circuit module | |
| JPH08340164A (en) | Surface mounting structure of BGA type package | |
| JPH09181208A (en) | Hybrid integrated circuit device | |
| JPS58102597A (en) | Electronic circuit board | |
| JP2595881B2 (en) | Method for fixing lead terminals of surface mount type integrated circuit package | |
| JPH0677620A (en) | Electronic component mounting structure | |
| JP2001298264A (en) | Solder tip | |
| EP4021153A1 (en) | Electronic circuit device and manufacturing method of same | |
| JPH0446381Y2 (en) | ||
| JPH07263848A (en) | Printed wiring board | |
| JPH09326545A (en) | Printed wiring board mounted with surface mount components, printed wiring board and chip type surface mount components | |
| JPH0562067U (en) | Circuit board | |
| JP2512218Y2 (en) | Hybrid integrated circuit device | |
| JPH0536302Y2 (en) | ||
| JPH0440283Y2 (en) | ||
| JPH0631170U (en) | Printed circuit board connection structure | |
| JPH06310844A (en) | Mounting method of electronic parts on wiring board | |
| JPH10294339A (en) | Printed circuit board for mounting BGA mounted components | |
| JP2001257454A (en) | Electronic component mounting structure on printed circuit board |