JPH0615427Y2 - Surface mount connector - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial field of application) The present invention relates to a surface mount connector mounted on a pad on the surface of a substrate on which an electric circuit is formed and soldered to the pad by reflow soldering. It is a thing.

(Prior Art) As shown in FIG. 3, a conventional surface mount connector has a gull wing type lead F bent in an L shape.
Are attached to both side surfaces E in the longitudinal direction of the horizontal rectangular connector body D so as to project laterally. This connector is mounted on the board A by mounting the soldering piece G of the lead F on the pad B of the board A and then soldering the soldering piece G to the pad B by reflow soldering.

However, in the lead F, the soldering pieces G project laterally from the both side surfaces E in the longitudinal direction of the connector body D, so that the soldering pieces G easily bend or twist as shown in FIG. Such deformation makes it difficult for the soldering piece G to closely adhere to the pad B, so that there is a problem that soldering to the pad B becomes insufficient.

Further, since the soldering piece G has a space corresponding to the lateral protrusion, when the soldering piece G is mounted on the board A as shown in FIG.
There is also a problem that it is not possible to perform high-density mounting because it is necessary to set a large gap between adjacent components.

Therefore, conventionally, as shown in FIG. 6, a press-fitting piece H is press-fitted and fixed in a fitting groove K provided on a side surface J of a connector body D, above a lead F bent in a substantially U-shape. The soldering piece G below the lead F is exposed on the bottom surface L of the main body D,
A connector has been developed in which the soldering piece G is placed on the pad B of the board A and soldered.

Further, as shown in FIG. 7, a press-fitting piece H on one side surface of the lead F bent in a substantially letter shape is press-fitted and fixed in a fitting groove M provided on the bottom surface L of the connector body D, and a soldering piece. G
Has been developed so that the soldering piece G is exposed to the bottom surface L and soldered to the pad B on the substrate A in a close contact state.

In these connectors, since the soldering piece G is in close contact with the connector body D, the lead F is unlikely to be deformed like the soldering piece in FIG. 3, and the entire lead F is in close contact with the connector body D. Since there is no protruding portion to the side of the connector body D, there is an advantage that the space between adjacent components can be narrowed when mounted on the board A, and high-density mounting can be performed.

(Problems to be solved by the invention) However, the surface mount connectors shown in FIGS. 6 and 7 have the following problems.

． Insert the press-fitting piece H of the lead F into the fitting groove K of the connector body D,
Since the connector D is press-fitted into M, the size of the connector D must be increased by the amount of the provision of the fitting grooves K and M, which makes it difficult to miniaturize the connector D.

． Since the soldering piece G is hidden by the bottom surface of the connector body D and the surface area of the exposed portion N of the lead F exposed on the side surface of the connector body D is small, heat absorption of the lead F during reflow soldering is performed. Is lower than that of the soldering piece shown in FIG. Therefore, the soldering is not sufficiently performed in a short time, and it takes time to surely perform the soldering, and when the time is taken, heat is transferred to other electronic components through the substrate A, which adversely affects the same. There was also.

． Since the lead F of FIG. 7 is not axisymmetric, there is a problem that the lead F has directionality when it is press-fitted into the connector body D, and the assembly to the body D is troublesome.

(Purpose of the Invention) The purpose of the present invention is small and suitable for high-density mounting. The soldering piece of the lead is not easily deformed, it easily adheres to the pad, the heat absorption of the lead is good, and the soldering can be done reliably in a short time. Another object of the present invention is to provide a surface mount connector in which leads can be easily assembled to the connector body.

(Means for Solving the Problems) In the surface mount connector of the present invention, as shown in FIG. 1, a contact is internally provided in a connector housing 20, and a terminal 21 of the contact is a terminal on an outer peripheral surface of the connector housing 20. The lead 1 is attached to the connector main body 5 which is projected outward from the projecting surface 7, the lead 1 is mounted on the pad B provided on the upper surface of the substrate A, and the lead 1 is reflowed by the reflow soldering. In the surface mount connector which is fixed to the pad B, the lead 1 has the upper holding portion 2 for holding the upper surface 6 of the connector housing 20 and the side holding portion 3 for holding the terminal projecting surface 7 of the housing 20 and the housing 20. Lower clamping unit 4 for clamping the bottom surface 8 of the
The lead 1 has an upper holding portion 2 on the upper surface of the connector housing 20, and a side holding portion 3
Is fitted to the connector housing 20 from the terminal projecting surface 7 of the connector housing 20 so that the lower holding portion 4 is exposed on the bottom surface 8 of the housing 20 and does not contact the terminal 21 on the side surface of the housing 20. Is.

(Operation) In the surface mount connector of the present invention, the lead 1
Since the lower holding portion 4 of the above is exposed on the bottom surface 8 of the connector body 5, if the lower holding portion 4 is mounted on the pad B of the board A and then reflow soldered, the lead 1 is soldered to the pad B. .

Further, since the side-face sandwiching portion 3 and the upper sandwiching portion 2 of the lead 1 are exposed on the outer surface of the connector housing 20, the heat absorption of the lead 1 at the time of reflow soldering is good, and the solder is securely attached to the pad B in a short time. Can be attached.

Further, since the lead 1 is fitted to the connector housing 20 from the terminal projecting surface 7 of the connector housing 20, the lead 1 does not project to the lateral surface 15 of the connector housing 20 in the lead insertion direction. Therefore, when two or more connector main bodies 5 are arranged side by side on the lateral surface 15 in the lead insertion direction, the interval between both connector main bodies 5 can be narrowed and high-density mounting can be realized.

(Embodiment) FIG. 1 shows an embodiment of the surface mount connector of the present invention. This is made by fitting and mounting the lead 1 on the connector body 5.

In the connector body 5, a large number of contacts are incorporated in the connector housing 20, and the terminals 2 of the contacts are
1 projects outward from one side surface (terminal projecting surface) 7 of the outer peripheral surface of the connector housing 20.

The connector housing 20 has an upper surface 6 on which an upper surface fitting groove 1 is formed.
2, the bottom surface fitting groove 13 on the bottom surface 8 and the terminal protruding surface 7
Side fitting grooves 14 are provided in each of them, and the respective fitting grooves 12, 13, 14 are continuous in a U-shape.

The lead 1 is formed by punching a thin plate substrate 10 into a substantially U-shape to form an upper holding portion 2, a side holding portion 3, and a lower holding portion 4.

The lead 1 is fitted into the connector housing 20 from the terminal projecting surface 7 side of the connector housing 20 toward the opposite side surface thereof, and the upper holding portion 2 is fitted into the upper fitting groove 12 described above.
Then, the side holding portion 3 is fitted into the side fitting groove 14 and the lower holding portion 4 is fitted in the bottom fitting groove 13, respectively, and the connector housing 2
0 is sandwiched in a U-shape from three sides, and each sandwiching portion 2,
3 and 4 are exposed to the outside.

Then, of the leads 1 fitted and mounted in the connector housing 20, the lower sandwiching portion 4 is placed on the pad B of the substrate A and mounted on the substrate A by reflow soldering.

The lead 1 of FIG. 1 is formed by punching out a narrow plate material, but the lead 1 of the present invention can also be formed by bending a wide thin plate material into a U-shape.

(Effect of the Invention) The surface mount connector of the present invention has the following effects.

． The lead 1 is fitted onto the connector housing 20 from the terminal projecting surface 7 of the connector housing 20 to form the lead 1
Is the lateral surface 15 of the connector housing 20 in the lead insertion direction.
Since two or more connector main bodies 5 are arranged side by side on the lateral surface 15 in the lead insertion direction, the distance between both connector main bodies 5 can be narrowed and high-density mounting can be achieved. It will be possible.

． The lower holding portion 4 of the lead 1 is the bottom surface 8 of the connector body 5.
Since it is exposed to the bottom, the lower holding part 4 can be mounted on the pad B of the substrate A and the lead 1 can be soldered to the pad B.

． Since the side sandwiching portion 3 and the upper sandwiching portion 2 of the lead 1 are exposed to the outer surface of the connector housing 20, the heat absorption of the lead 1 during reflow soldering is good, the solder is easily melted, and the soldering is easy. Therefore, the lower holding portion 4 of the lead 1 can be soldered to the pad B reliably in a short time.

． Since the lead 1 sandwiches the connector housing 20 from the bottom surface 8, the terminal projecting surface 7 and the top surface, the lead 1
Is less likely to be displaced or deformed, and the dimensional accuracy of the lead 1 is easily maintained. Therefore, it is suitable for use as a connector for automatic mounting on the board A where dimensional accuracy of the connector is required.

． Like the connector of FIGS. 6 and 7, it is necessary to provide a space for forming a fitting groove M for press-fitting a lead into the connector body and a space for housing a press-fitting piece H inserted from the fitting groove M. Since it does not have a connector, the connector can be miniaturized and mounting with higher density can be achieved.

． The upper clamping portion 2 and the lower clamping portion 4 connect the connector body 5 to each other.
Since the lead 1 is sandwiched between the lead 1 and the connector 1, the lead 1 has a U-shaped line-symmetrical shape, and there is no directivity when the lead 1 is attached to the connector body 5. Easy fitting and mounting.

[Brief description of drawings]

FIG. 1 is a perspective view showing a different embodiment of the surface mount connector of the present invention, FIG. 2 is an explanatory view of mounting the surface mount connector of the present invention, and FIG. 3 is a perspective view of a conventional surface mount connector. 4 and 5 are explanatory views when the surface mount connector of FIG. 3 is mounted, and FIGS. 6 and 7 are perspective views of different conventional surface mount connectors. 1 is a lead 2 is an upper clamping part 3 is a side surface part 4 is a lower clamping part 5 is a connector body 6 is an upper surface of a connector housing 7 is a terminal projecting surface 8 is a bottom surface of a connector housing 20 is a connector housing 21 is a terminal B is a pad

Claims (1)

[Scope of utility model registration request] 1. A lead is mounted on a connector body 5 in which a contact is internally housed in a connector housing 20, and a terminal 21 of the contact is projected outward from a terminal projecting surface 7 on an outer peripheral surface of the connector housing 20. In the surface mount connector in which the lead 1 is mounted on the pad B provided on the upper surface of the substrate A and the lead 1 is fixed to the pad B by reflow soldering, the lead 1 is mounted on the connector housing 20. The upper holding portion 2 holding the upper surface 6, the side holding portion 3 holding the terminal projecting surface 7 of the housing 20, and the lower holding portion 4 holding the bottom surface 8 of the housing 20 are formed into a substantially U shape. The lead 1 has an upper holding part 2 on the upper surface of the connector housing 20, and a side holding part 3 on the same housing. On the side surface of the connector housing 20, the lower holding portion 4 is fitted to the connector housing 20 from the terminal projecting surface 7 of the connector housing 20 so as to be exposed on the bottom surface 8 of the housing 20 and not to contact the terminal 21. Surface mount connector.