JPH06122566A - Joining method - Google Patents

Abstract

(57) [Summary] [Purpose] To prevent the formation of voids in the joint and to improve the joint strength. According to a joining method of joining a pair of objects to be joined each having a thin film formed on a joining surface of at least one object to be joined via glass, the joining is performed in a high temperature isotropically pressurized atmosphere. At this time, the thin film may be formed by a sputtering method, or the thin film may be in contact with glass.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a joining method for joining a pair of articles to be joined, each of which has a thin film formed on the joining surface of at least one article to be joined, by a sputtering method or the like through glass. In particular, the present invention relates to a bonding method for suppressing the generation of bubbles in the glass in contact with the thin film.

[0002]

2. Description of the Related Art In recent years, in the field of magnetic recording, high density recording has been demanded, and in order to meet this demand, a magnetic head having a narrow gap length of, for example, about 1 μm or less is required. The magnetic head is formed by joining a pair of magnetic cores made of a magnetic material such as ferrite with a magnetic gap through a non-magnetic material such as SiO ₂ or glass. The above-mentioned non-magnetic material is arranged in.

[0003] In such a form the magnetic head, a gap layer, such as first form the desired gap length in the abutting surfaces of the pair of magnetic cores to be joined with SiO _2, a non-magnetic material such as glass, sputtering It is formed by a method such as a method. After that, the pair of magnetic cores are butted against each other and thermocompression-bonded to be integrated. At this time, a magnetic gap in which a non-magnetic material is arranged is formed between the abutting surfaces of the magnetic core that is the joint. In the magnetic head as described above, reinforcing glass is generally filled and reinforced near the magnetic gap.

[0004]

However, there is a problem that voids are easily generated in the magnetic gap of the magnetic head formed by the above method and in the reinforcing glass filled in the vicinity of the magnetic gap. This is probably due to the following reasons. For example, when the gap film is configured to include at least glass, the magnetic core to be joined during thermocompression bonding is heated to a temperature equal to or higher than the softening point of the glass (hereinafter referred to as gap glass). However, at this time, the sputter gas mixed into the gap glass or the SiO ₂ film forming the gap film becomes bubbles in the gap glass film, which remain as voids in the magnetic gap even after cooling the gap glass. It seems to be because of it. Further, the glass filled in the vicinity of the magnetic gap (hereinafter referred to as “reinforced glass”) has the above-mentioned SiO ₂ , and the viscosity on the gap glass film lower than that of the glass (about 1/1).
000). Therefore, the sputter gas contained in the gap film is more remarkably generated as bubbles in the reinforcing glass to form voids.

As described above, the magnetic gap in the magnetic head is very small, and if the above-mentioned air gap is generated in the magnetic gap, it will occupy a relatively large portion of the magnetic gap, thus lowering the bonding strength of the magnetic gap. Not only will this cause the accuracy of the gap length of the magnetic gap, etc., to also decrease. Further, when the voids remain on the medium running surface, the magnetic powder peeled from the medium surface is clogged and causes a clog defect or the like. Further, this void also becomes a starting point of cracks, which causes deterioration of the quality of the obtained magnetic head. On the other hand, the voids in the reinforcing glass cause problems such as a decrease in the strength of the head chip and the above-mentioned clog failure. In order to reduce the generation of such voids, it is necessary to strictly control the sputtering conditions during film formation, the temperature conditions during bonding, and the time, resulting in extremely poor productivity.

Therefore, as a method for removing the air gap remaining in the magnetic gap of the magnetic head as described above, Japanese Patent Publication No.
As disclosed in JP-A-1-16752 and JP-A-63-170280, heat treatment is performed in a high temperature isotropically pressurized atmosphere after joining magnetic cores, that is, at a temperature above the softening point of glass in a high-pressure inert gas. There is proposed a method in which the bubbles forming the voids are crushed and eliminated by performing a heat treatment in (1). Further, in the former method, there is also proposed a method of melting the glass at the time of joining the magnetic cores and then introducing an inert gas to crush the generated bubbles.

However, if the air gap in the magnetic gap is to be removed by such a method, the internal pressure of the bubbles remaining in the gap glass is very high because of the high viscosity of the gap glass, and the high temperature isotropically pressurized atmosphere. A high pressure of 40.5 MPa or more is required to eliminate the bubbles by the heat treatment in the inside, and the productivity is not good. Further, according to the above method, it is necessary to perform the heat treatment at least twice, and from this point as well, the productivity is not good and the magnetic characteristics are often adversely affected. Furthermore, as the bubbles disappear, compressive stress is applied to the entire magnetic head, which tends to cause cracks. In the above method, bubbles are not surrounded by glass, for example, bubbles generated along the magnetic core butting surface. In this case, since the bubble is not a closed space, there is no effect of isotropic pressurization, and there is a disadvantage that the bubble cannot be eliminated even when high pressure is applied.

[0008] Therefore, an object of the present invention is to provide a joining method capable of performing joining with good joining strength without forming voids in the joining portion.

[0009]

A pair of objects to be joined, in which a thin film is formed on the joining surface of at least one object to be joined,
In the joining method of joining via glass, the joining is performed in a high temperature isotropically pressurized atmosphere.

Further, in the bonding method as described above, the thin film is formed by a sputtering method, or the thin film is in contact with glass.

[0011]

When the object to be bonded through the glass has a thin film formed by sputtering or the like on the bonding surface and is configured to contact and bond with the glass, when bonding,
Bubbles due to the sputtering gas contained in the thin film are likely to be generated in the glass when forming the thin film, and voids are likely to be generated after cooling.

According to the present invention, in a joining method of joining a pair of objects to be joined, each of which has a thin film formed on the joining surface of at least one of the objects to be joined, through glass, the joining is performed in a high temperature isotropically pressurized atmosphere. Therefore, bubbles due to the sputter gas contained in the thin film are not easily formed in the glass.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Specific embodiments to which the present invention is applied will be described below with reference to the drawings. Example 1 This example shows an example in which the magnetic cores of the magnetic head are bonded to each other and the magnetic gap is formed by a bonding method to which the present invention is applied.

In the magnetic head formed in this embodiment, as shown in FIG. 1, a pair of magnetic cores 1 and 2 made of a magnetic material has a magnetic gap g ₁ which is a front gap and a magnetic gap g ₂ which is a back gap. The magnetic cores 1 and 2 are abutted with each other and joined together, and the H-grooves 3 and 4 for controlling the track width of the magnetic head 8 and the glass fusion and coil winding of the magnetic cores 1 and 4 are provided on the magnetic cores 1 and 2. Revolving winding grooves 5 and 6 are formed, and a reinforcing glass 7 is filled between the winding grooves 5 and 6 to integrally join the magnetic cores 1 and 2. At this time, the magnetic cores 1 and 2 are joined and the magnetic gaps g ₁ and g ₂ are formed by the joining method of this embodiment.

A method of manufacturing the above magnetic head will be described below. First, as shown in FIG. 2, a plurality of H grooves 3 and 4 for restricting the track width of a magnetic head to be formed are formed in a block 9 made of a magnetic material such as ferrite, and glass bonding between magnetic cores is performed. The winding grooves 5 and 6 are formed. Next, this block 9 is divided by XX 'and Y-Y' in the figure,
Magnetic core blocks 10 and 11 forming a pair of magnetic cores
To get Then, as shown in FIG. 3 (the magnetic core block 10 is shown in FIG. 3), the SiO ₂ thin film 12 is formed on the magnetic gap forming surfaces 10 a, 11 a of the magnetic core blocks 10, 11 by sputtering, and then the glass transition is performed. Point T
A glass thin film 13 having g of 547 ° C. is formed, and these are used as a gap film. The total thickness of the SiO ₂ thin film 12 and the glass thin film 13 formed on one of the magnetic core blocks is 0.225 μm (however, the glass film 13 is adjusted so that the obtained magnetic head has a gap length of 0.45 μm). Thickness was set to 0.05 μm).

Next, the magnetic core blocks 10 and 11 obtained as described above are joined to form a magnetic head block. Then, at this time, the joining method of the present embodiment is applied. That is, as shown in FIG. 4, the H groove 3 and the winding groove 5 are formed, the magnetic core block 10 on which the SiO ₂ thin film 12 and the glass thin film 13 are formed, the H groove 4, and the winding groove 6 are formed. The magnetic core block 11 on which the SiO ₂ thin film 14 and the glass thin film 15 are formed is butted so that the glass thin films 13 and 15 are butted against each other so that the positions of the H grooves 3 and 4 and the winding grooves 5 and 6 are made to coincide with each other. Glass transition point 4 in line grooves 5 and 6
The reinforcing glass 7 having a temperature of 65 ° C. is arranged. Then, the magnetic core blocks 10 and 11 are held by a jig, and thermocompression bonding of the glass thin films 13 and 15 and melt filling of the reinforcing glass 7 are performed in a high temperature isotropically pressurized atmosphere. At this time, the magnetic core blocks 10 and 11 are joined, and the magnetic core blocks 10 and 1 are bonded by thermocompression bonding of the glass thin films 13 and 15.
A magnetic gap is formed between the two.

The high temperature isotropically pressurized atmosphere conditions at this time are shown in FIG. The high temperature isotropic pressure atmosphere condition at this time is as follows: As shown in FIG. 5, the temperature is raised from room temperature to 10.0 ° C./min in an atmosphere where the pressure of the inert gas is 30.4 MPa. Inert gas pressure 60.8 MPa, atmospheric temperature 75
Hold at 0 ° C. for 1 hour, then cool at a cooling rate of 5.0 ° C./min, and the atmospheric temperature indicated by A in FIG. 5 is 500 ° C.
The gas is recovered from the point when the temperature reaches, and it is cooled until the pressure of the inert gas becomes 0.1 MPa (atmospheric pressure) and the atmospheric temperature becomes room temperature. The pressure of the inert gas is 60.8M.
It is carried out under the conditions of Pa and an atmospheric temperature of 750 ° C. for 1 hour.

Then, after subjecting the magnetic head block to necessary polishing, chip cutting was carried out to obtain a magnetic head as shown in FIG. This magnetic head was used as a practical sample 1. The high temperature isotropic pressure atmosphere condition is that the high pressure atmosphere is maintained at least from the temperature rise to the glass transition point of the gap glass used during cooling.

Next, a sample for comparison was prepared. First, SiO ₂ was sputtered on a pair of magnetic core blocks in the same manner as the method of forming the practical sample 1.
A thin film is formed and a glass thin film having a glass transition point of 547 ° C. is formed thereon. In addition, the total thickness of the SiO ₂ thin film and the glass thin film was set to 0.2 in the same manner as in Working Example 1 so that the gap length of the obtained magnetic head was 0.45 μm.
It was set to 25 μm. Next, as in the case of the practical sample 1, a pair of magnetic core blocks are opposed to each other, a reinforcing glass is arranged in the winding groove, the heating conditions are the same as those of the practical sample 1, and the magnetic core blocks of the pair of magnetic core blocks are set under atmospheric pressure. Bonding was performed, and polishing processing and chip cutting were performed on this, and the obtained magnetic head was used as a comparative sample 1.

In order to remove the sputter gas contained in a pair of magnetic cores on which a SiO ₂ thin film was formed and a glass thin film having a glass transition point of 547 ° C. was formed on the SiO ₂ thin film, as in Comparative Sample 1. After the baking treatment was performed at the same temperature as the pressure bonding temperature, the pair of magnetic core blocks were joined under the same conditions as the comparative sample 1, and the magnetic head obtained by polishing and chip cutting was used as a comparative sample 2.
And These execution sample 1 and comparative sample 1,
Table 1 shows the results of an examination of the actual gap length of No. 2 and its variation (σ), and the presence / absence of voids in the magnetic gap and in the reinforcing glass.

[0021]

[Table 1]

As can be seen from the results shown in Table 1, in the practical sample 1 in which the magnetic core blocks were joined in a high temperature isotropically pressurized atmosphere, there was no void in the magnetic gap and the reinforced glass, and the accuracy was high. A good gap length was obtained.
This is because the bonding was performed in a high temperature isotropically pressurized atmosphere, so that the sputtered films (SiO ₂ 12, 14 and glass thin film 13,
It is considered that the sputter gas contained in 15) hardly forms bubbles. The bonding strength was also good.

On the other hand, in Comparative Samples 1 and 2 in which the magnetic core blocks were joined under atmospheric pressure, the magnetic gap was present in the reinforcing glass, and in Comparative Sample 1 in which no baking treatment was performed, the accuracy of the magnetic gap was high. Was not good either. In Comparative Sample 1, after the SiO ₂ thin film and the glass thin film were formed on the magnetic core block by sputtering, no treatment for discharging the sputter gas in these thin films was carried out. It is thought that this occurred and became voids, which caused the gap length to fluctuate. In Comparative Sample 2, although the sputter gas in the thin film was discharged to some extent by the baking treatment, it was not completely discharged, and therefore it is considered that air bubbles were slightly generated in the glass during bonding. Further, in Comparative Sample 2, since the heat treatment is performed twice, the thin film shrinks in the thickness direction, the gap length becomes thinner than the film formation thickness, and the thin film at the time of putting in and out of the heating furnace for the baking treatment. There is concern that dust may adhere to the surface.

If the magnetic gap of the magnetic head is subjected to thermocompression bonding and the reinforcing glass is melt-filled by the joining method of this embodiment, a magnetic gap having good accuracy can be formed without generating voids in the magnetic gap and the reinforcing glass. Therefore, the bonding can be performed with good bonding strength. Further, since the bake treatment is not required, the heat treatment only needs to be performed once, and the process efficiency can be improved and damage to the head core can be reduced.

In the above magnetic head, as shown in FIG. 6, the gap film is composed of the SiO ₂ thin films 12 and 14 and the glass thin films 13 and 15, and the magnetic cores are bonded to each other by heating the glass thin films 13 and 15. Crimping and tempered glass 7
However, the joining method of the present invention can be applied to the joining of magnetic cores or the formation of a magnetic gap in a magnetic head as described below in addition to the above-described magnetic head.

For example, a gap film as shown in FIG.
The present invention is also applicable to a magnetic head which is composed of the iO ₂ thin films 12 and 14 and whose magnetic cores are joined only by melting and filling the reinforcing glass 7. When the magnetic cores are joined by the joining method of the present invention, , S in the tempered glass 7
It is possible to prevent the generation of voids due to the sputtering gas contained in the iO ₂ thin films 12 and 14. In addition, FIG.
On the magnetic core blocks 10 and 11 whose magnetic cores are made of a magnetic material such as ferrite as shown in FIG.
17 are formed, and these metal magnetic films 16,
It is joined and integrated so that 17 is abutted,
It is also applicable to so-called MIG heads. 8 shows the gap film composed of the SiO ₂ thin films 12 and 14 and the glass thin films 13 and 15, and FIG. 9 shows the gap film formed of the SiO ₂ thin films 12 and 14.

Example 2 This example describes an example in which the guard material of the thin film magnetic head is joined by the joining method of the present invention. As shown in FIG. 10, the thin film magnetic head formed according to this embodiment has a thin film magnetic head chip 21 in which a magnetic circuit 24 is formed and a guard material 22 bonded by glass 23. The thin film magnetic head chip 21 is made of a magnetic material such as a plate-shaped ferrite, and has one main surface 21.
A magnetic circuit 24 made of a thin film is formed on a, and the medium sliding surface 21b is cylindrically polished. One guard material 2
Reference numeral 2 is made of a non-magnetic material such as a plate-shaped photoceram and has a groove 25 formed on one main surface 22a thereof, and a medium sliding surface 22b is cylindrically polished. The thin-film magnetic head chip 21 and the guard material 22 have one main surface 21a of the thin-film magnetic head chip 21 and one main surface 22a of the guard material 22 as opposite surfaces, and the guard material 22 covers the magnetic circuit 24 except the end portion. It is joined through the glass 23 in an arbitrary shape.

A method of manufacturing the above thin film magnetic head will be described below. First, as shown in FIG. 11, a magnetic circuit (not shown) is formed on a block 26 of ferrite or the like by sputtering or the like, and this is cut into chips, and a magnetic circuit 24 made of a thin film is formed on one main surface 21a as shown in FIG. The formed thin film magnetic head chip 21 is obtained. Next, as shown in FIG. 13, a plurality of groove portions 25 are formed in one main surface 27a of the substrate 27 made of photoceram or the like at a predetermined size and at intervals, and the one main surface 27a of the substrate 27 is not shown. After disposing a glass rod and heating it to pack the glass, polishing is performed so as to have a predetermined thickness, and the substrate 2 is formed as shown in FIG.
7 has a glass transition point Tg of 4 as a bonding material on one main surface 27a.
A glass 23 having a temperature of 02 ° C. is formed. Although the glass 23 is formed by the glass pack in this embodiment, it may be formed by a method such as sputtering.

After that, chip cutting is performed to obtain a guard material 22 having a groove 25 formed on one main surface and glass 23 as shown in FIG. Then, as shown in FIG. 16, the thin-film magnetic head chip 21 and the guard material 22 are opposed to each other, and are held by a jig 28 and subjected to a pressure and heat treatment to make the glass 23
These are joined by thermocompression bonding and the medium sliding surfaces 21b and 22b are cylindrically polished to obtain a thin film magnetic head as shown in FIG.

At this time, in this embodiment, the thin film magnetic head chip and the guard material are joined in a high temperature isotropically pressurized atmosphere. The high temperature isotropically pressurized atmosphere conditions at this time are shown in FIG. The high temperature isotropic pressure atmosphere condition at this time is as follows. As shown in FIG. 17, the temperature is increased from room temperature at a temperature increase rate of 5.0 ° C./min in an atmosphere where the pressure of the inert gas is 30.4 MPa.
Inert gas pressure 54.7 MPa, atmospheric temperature 585
Hold for 1 hour at 0 ° C, then cool at a cooling rate of 3.0 ° C / min, and recover the gas from the time when the ambient temperature shown by B in Fig. 17 reaches 340 ° C. Cool to about 0.1 MPa (atmospheric pressure) until the ambient temperature reaches room temperature. In addition, the pressure of the inert gas was 54.7.
It was carried out for 1 hour in MPa and an ambient temperature of 585 ° C. The thin film magnetic head obtained by joining the thin film magnetic head chip 21 and the guard material 22 by thermocompression bonding of the glass 23 in this manner is referred to as a practical sample 2.

For comparison, a thin film magnetic head chip was formed by the same method as that of the practical sample 2, and a glass thin film having a glass transition point Tg of 402 ° C. was formed on the guard material, and these were formed under atmospheric pressure. A thin film magnetic head was obtained by carrying out heating and pressure treatment under the conditions of 580 ° C. and 30 minutes (however, the temperature rising and cooling rate is the same as in Example 1) and thermocompression bonding of glass to obtain a thin film magnetic head. And Further, a thin film magnetic head chip was formed in the same manner as in Comparative Sample 3, and a baking treatment was applied to the thin film magnetic head chip at a temperature lower than the pressure bonding temperature. A thin film magnetic head was obtained by performing heating and pressure treatment in atmospheric pressure to perform bonding. The crimping condition at this time is 58
5 ℃, 1 hour comparison sample 4, 580 ℃, 30
The minute one was designated as Comparative Sample 5. (However, the heating / cooling rate is the same as that in Example 2.) The pressure bonding conditions for the comparative sample 5 were the minimum temperature and time for obtaining reliable bonding strength.

Then, the void defect rates of these practical sample 2 and comparative samples 3, 4 and 5 were investigated. The results are shown in Table 2. In the thin film magnetic head chip, it is desirable to bake above the pressure bonding temperature in order to obtain the effect of removing the sputter gas contained in the thin film formed by sputtering, but a magnetic circuit with a multilayer structure of thin films of different materials is used. Since it is configured, if the baking process is performed at 580 ° C. which is the same as the thermocompression bonding temperature, film peeling easily occurs. Therefore, here, it is decided to perform the baking treatment at 520 ° C., which is safe.

[0033]

[Table 2]

As can be seen from Table 2, in Comparative Example 3 in which the thin film magnetic head chip and the guard material were not particularly treated for degassing, the magnetic circuit formed on the thin film magnetic head chip was sputtered. Since the sputter gas (eg, argon gas) contained in the magnetic circuit is formed as bubbles in the glass during thermocompression bonding and remains as voids, the void defect rate is high.

If such voids are present on the medium running surface of the thin film magnetic head, the magnetic powder that has peeled off from the medium is clogged, which easily causes clog defects and the like, which leads to deterioration in quality and a decrease in manufacturing yield.

Further, in Comparative Samples 4 and 5 in which the thin film magnetic head chip was baked for degassing, the void defect rate can be lowered by lowering the pressure bonding temperature and shortening the pressure bonding time. Although it was confirmed, the void defect rate greatly changed depending on the crimping condition, and it was found that considerable accuracy was required for setting the crimping condition. That is, when joining the thin film magnetic head chip and the guard material, the glass needs to be deformed in accordance with the shape of the magnetic circuit of the thin film magnetic head chip, so that the pressure bonding condition requires a considerable degree of accuracy. Further, in the above Comparative Samples 4 and 5, since the baking treatment is performed at a temperature lower than the pressure bonding temperature, it is presumed that the sputter gas contained in the magnetic circuit is not sufficiently exhausted. Further, as described above, the pressure bonding condition of Sample 5 is the minimum temperature and time at which reliable bonding strength can be obtained, but still 20% of void defects occurred. That is, further reduction of void defects cannot be expected only by controlling the baking treatment and the pressure bonding conditions.

On the other hand, in the practical sample 2 in which the thin film magnetic head chip and the guard material were joined in a high temperature isotropically pressurized atmosphere, the void defect rate was 0% even without the baking treatment. This is because the gas (eg, argon gas) contained in the magnetic circuit when forming the magnetic circuit formed on the thin-film magnetic head chip by sputtering cannot form bubbles under high pressure during thermocompression bonding. It seems that there are no voids. Therefore, in the implementation sample 2, the dependency of the void defect rate on the pressure bonding condition is small and the pressure bonding condition does not require high precision, so that the productivity can be greatly improved. Further, in the practical sample 2, the bake treatment is not necessary and the heat treatment is only required once, and there are advantages that the efficiency of the process is improved, damage to the magnetic properties is reduced, and film peeling does not occur. The conditions of the high temperature isotropically pressurized atmosphere are not limited to the conditions described in the present embodiment, but may be any conditions that make it difficult to form bubbles of sputter gas near the pressure bonding temperature, depending on the type of glass. 30MP if the pressure bonding temperature is 580 ℃ or less
It is effective at about a. The initial pressure may be about 10 MPa or more. Further, in the thin film magnetic head thus obtained, a good quality thin film magnetic head could be obtained without generation of cracks, material changes, deterioration of characteristics, film peeling and the like. Especially in the case where a large number of different materials such as thin film magnetic heads are laminated and combined,
Multiple heat treatments are not preferred and this example appears to be suitable.

When the thin film magnetic head chip and the guard material are joined by the joining method of the present embodiment, it is possible to join without leaving a void in the joined portion, and a thin film magnetic head of good quality is obtained. be able to. Further, since good bonding can be performed without depending on the crimping condition, the permissible range of the crimping condition is wide and the productivity is also good.

[0039]

As is apparent from the above description, in the present invention, a pair of objects to be bonded, each of which has a thin film formed by the sputtering method on the bonding surface of at least one of the objects to be bonded, is made of glass. In the joining method of joining via, since the joining is performed in a high temperature isotropically pressurized atmosphere, it is difficult for bubbles to be formed by the sputter gas contained in the thin film,
Therefore, voids are unlikely to occur in the glass that is in contact with the thin film, and it is possible to perform bonding with good bonding strength.

Further, according to the present invention, it is not necessary to perform the heat treatment again for eliminating the bubbles generated by the film forming gas such as the stutter gas contained in the thin film of the object to be joined, and the object to be joined is not required. Moreover, it is not necessary to previously perform degassing treatment such as baking treatment, and good bonding can be performed without being affected by pressure bonding conditions. In addition, since it is not necessary to eliminate the bubbles generated in the joint by pressure as in the conventional case, it is possible to perform processing at a relatively low pressure, and the objects to be joined are not deformed or cracked as in the case of eliminating the bubbles. . Further, since it is not necessary to perform degassing treatment such as baking treatment in advance, it is possible to join objects to be joined having a structure in which a large number of different substances such as a thin film magnetic head are laminated and combined. Therefore, the present invention can be applied in various fields and its industrial value is very high.

[Brief description of drawings]

FIG. 1 is a perspective view showing an example of a magnetic head in which magnetic cores are joined together and a magnetic gap is formed by a joining method to which the present invention is applied.

FIG. 2 shows a manufacturing method for manufacturing a magnetic head using a joining method to which the present invention is applied, showing a step of forming an H groove and a winding groove in a block and dividing into a pair of magnetic core blocks. It is a perspective view shown.

FIG. 3 is a perspective view showing a process of forming a SiO ₂ thin film and a glass thin film on a magnetic core block.

FIG. 4 is a perspective view showing a step of joining a pair of magnetic core blocks.

FIG. 5 is a diagram showing a high temperature isotropically pressurized atmosphere condition when joining the magnetic core blocks.

6 is a schematic diagram showing a portion of the magnetic head of FIG. 1 in the vicinity of a surface facing a magnetic recording medium.

FIG. 7 is a schematic diagram showing a portion in the vicinity of a magnetic recording medium facing surface of another example of a magnetic head in which magnetic cores are joined and a magnetic gap is formed by a joining method to which the present invention is applied.

FIG. 8 is a schematic view showing a portion near a magnetic recording medium facing surface of still another example of a magnetic head in which magnetic cores are bonded to each other and a magnetic gap is formed by a bonding method to which the present invention is applied.

FIG. 9 is a schematic diagram showing a portion near a magnetic recording medium facing surface of still another example of a magnetic head in which magnetic cores are bonded to each other and a magnetic gap is formed by a bonding method to which the present invention is applied.

FIG. 10 is a perspective view showing a thin film magnetic head in which a guard material is joined by a joining method to which the present invention is applied.

FIG. 11 shows a manufacturing method for manufacturing a thin film magnetic head in which guard materials are bonded by a bonding method to which the invention is applied, in the order of steps, and is a perspective view showing a step of forming a magnetic circuit in a block.

FIG. 12 is a perspective view showing a process of cutting a block into chips to form a thin film magnetic head chip.

FIG. 13 is a perspective view showing a step of forming a groove on a substrate.

FIG. 14 is a side view showing a step of forming a glass film on a substrate.

FIG. 15 is a perspective view showing a step of cutting a substrate into chips to form a guard material.

FIG. 16 is a side view showing a step of joining a thin film magnetic head chip and a guard material.

FIG. 17 is a view showing a high temperature isotropically pressurized atmosphere condition when joining the thin film magnetic head chip and the guard material.

[Explanation of symbols]

1, 2, ... Magnetic cores 10, 11, ... Magnetic core blocks 10a, 11a .. Gap forming surface 12, 14 ... SiO ₂ thin film 13, 15 ... Glass thin film 21.・ ・ ・ ・ ・ ・ Thin film magnetic head chip 22 ・ ・ ・ ・ Guard material 23 ・ ・ ・ Glass 27 ・ ・ ・ Block

Claims (3)

[Claims] 1. A bonding method for bonding a pair of objects to be bonded, each having a thin film formed on the bonding surface of at least one object to be bonded, via glass, in a high temperature isotropically pressurized atmosphere. Joining method characterized by. 2. The bonding method according to claim 1, wherein the thin film is formed by a sputtering method. 3. The bonding method according to claim 2, wherein the thin film is in contact with glass.