[go: up one dir, main page]

JPH06126256A - Processing apparatus and processing method using supercritical fluid - Google Patents

Processing apparatus and processing method using supercritical fluid

Info

Publication number
JPH06126256A
JPH06126256A JP27850392A JP27850392A JPH06126256A JP H06126256 A JPH06126256 A JP H06126256A JP 27850392 A JP27850392 A JP 27850392A JP 27850392 A JP27850392 A JP 27850392A JP H06126256 A JPH06126256 A JP H06126256A
Authority
JP
Japan
Prior art keywords
supercritical fluid
processing
processing apparatus
treated
processed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP27850392A
Other languages
Japanese (ja)
Inventor
Shingo Shimada
真吾 島田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Corp
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Corp, Omron Tateisi Electronics Co filed Critical Omron Corp
Priority to JP27850392A priority Critical patent/JPH06126256A/en
Publication of JPH06126256A publication Critical patent/JPH06126256A/en
Pending legal-status Critical Current

Links

Landscapes

  • Manufacture Of Switches (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

(57)【要約】 【目的】 処理工程が少なく、被処理物である樹脂成形
品に塑性変形が生じない超臨界流体による処理装置およ
び処理方法を提供することにある。 【構成】 超臨界流体からなる処理液で処理槽5内に配
した被処理物4を洗浄処理等を行なう処理装置である。
(57) [Abstract] [PROBLEMS] To provide a processing apparatus and a processing method using a supercritical fluid that has a small number of processing steps and that does not cause plastic deformation of a resin molded product as an object to be processed. [Structure] A processing apparatus for performing a cleaning process or the like on an object to be processed 4 placed in a processing tank 5 with a processing liquid composed of a supercritical fluid.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は超臨界流体でリレー,ス
イッチなどの電子機器,精密機器およびこれらの構成部
品を洗浄処理等する処理装置および処理方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing apparatus and a processing method for cleaning electronic devices such as relays and switches, precision devices and their components with a supercritical fluid.

【0002】[0002]

【従来の技術と発明が解決しようとする課題】従来、リ
レー,スイッチなどの電子機器,精密機器等の製造工程
においては、構成部品に付着した油,塵埃を除去するた
め、例えば、洗浄槽内の液化フレオン(商品名)中にリ
レー等の半製品である被処理物を浸漬し、超音波で洗浄
していた。
2. Description of the Related Art Conventionally, in the manufacturing process of electronic equipment such as relays and switches, precision equipment, etc., in order to remove oil and dust adhering to component parts, for example, in a cleaning tank. A semi-finished product to be processed such as a relay was dipped in the liquefied Freon (trade name) and cleaned with ultrasonic waves.

【0003】しかしながら、この洗浄方法では、液化フ
レオンの温度が極めて低いので、洗浄槽から取り出した
直後の被処理物の温度も極めて低い。このため、空気中
の水分が被処理物の表面に付着して水滴が生じるので、
前記被処理物をドライヤで乾燥しなければならず、製造
工程が多く、生産性が低い。
However, in this cleaning method, since the temperature of the liquefied freon is extremely low, the temperature of the object to be treated immediately after being taken out from the cleaning tank is also extremely low. For this reason, water in the air adheres to the surface of the object to be processed, causing water droplets.
Since the object to be treated must be dried with a dryer, there are many manufacturing steps and the productivity is low.

【0004】また、リレー等の電子機器においては樹脂
成形部品から発生する有機ガスが接点を腐食させて接触
不良を生じさせるおそれがあるため、組立完成後のリレ
ー等の電子機器あるいはこれらの樹脂成形部品を真空加
熱し、前記有機ガスを除去していた。
In an electronic device such as a relay, the organic gas generated from the resin-molded parts may corrode the contacts to cause a contact failure. The parts were vacuum heated to remove the organic gas.

【0005】しかしながら、前述のガス抜き工程では真
空加熱の際に生じる熱応力により、構成部品が塑性変形
して寸法精度にバラツキが生じたり、動作特性が変化す
るという問題点がある。
However, in the above-mentioned degassing step, there is a problem that thermal stress generated during vacuum heating causes plastic deformation of the component parts, resulting in variation in dimensional accuracy and change in operating characteristics.

【0006】本発明は、前記問題点に鑑み、処理工程が
少なく、被処理物である樹脂成形品に変形が生じない超
臨界流体による処理装置および処理方法を提供すること
を目的とする。
In view of the above problems, it is an object of the present invention to provide a processing apparatus and a processing method using a supercritical fluid which has a small number of processing steps and which does not cause deformation of a resin molded product which is an object to be processed.

【0007】[0007]

【問題を解決するための手段】本発明にかかる超臨界流
体による処理装置は、前記目的を達成するため、処理槽
内に配した被処理物を処理液で洗浄処理等を行なう処理
装置において、前記処理液を超臨界流体とした構成とし
てある。なお、前記超臨界流体は液化した二酸化炭素か
らなるものであってもよい。また、本発明にかかる超臨
界流体による処理方法は、処理槽内に配した被処理物の
汚れを超臨界流体で洗浄処理する方法である。さらに、
本発明にかかる超臨界流体による処理方法は、処理槽内
に配した合成樹脂材からなる被処理物の内部から発生す
る有機ガスを超臨界流体に溶出させてガス抜き処理する
方法であってもよい。
In order to achieve the above-mentioned object, a processing apparatus using a supercritical fluid according to the present invention is a processing apparatus for cleaning an object to be processed placed in a processing tank with a processing liquid. The treatment liquid is a supercritical fluid. The supercritical fluid may be liquefied carbon dioxide. Further, the method for treating with a supercritical fluid according to the present invention is a method for cleaning stains on an object to be treated placed in a treatment tank with a supercritical fluid. further,
The treatment method with the supercritical fluid according to the present invention is a method of degassing the organic gas generated from the inside of the object to be treated made of the synthetic resin material placed in the treatment tank by eluting it into the supercritical fluid. Good.

【0008】[0008]

【作用】したがって、本発明にかかる処理装置および処
理方法によれば、超臨界流体で被処理物を洗浄処理等す
ることになる。特に、被処理物が合成樹脂材からなるも
のであれば、その内部から発生する有機ガスが超臨界流
体に溶出して除去されることになる。
Therefore, according to the processing apparatus and the processing method of the present invention, the object to be processed is washed with the supercritical fluid. In particular, if the object to be processed is made of a synthetic resin material, the organic gas generated from the inside will be eluted into the supercritical fluid and removed.

【0009】[0009]

【実施例】次に、本発明にかかる一実施例を図1ないし
図3の添付図面に従って説明する。本実施例にかかる超
臨界流体による処理装置は、図1に示すように、超臨界
流体となるガスを供給するガス供給部1と、供給された
ガスを圧縮して液化する高圧ポンプなどからなるガス圧
縮部2と、圧縮されて液化したガスを加熱し、所定の温
度に調整して超臨界流体を生成する温度調整部3と、収
納した被処理物4を超臨界流体に接触させて汚染物質等
を除去する処理槽5と、被処理物4から除去した汚染物
質等を超臨界流体から取り除くトラップ部6と、超臨界
流体を通常のガスにもどす圧力調整部7とからなるもの
である。なお、処理槽5の上流側と下流側とには開閉弁
8,9が設けられているとともに、処理槽5には超臨界
流体状態を維持するための温度調整手段10が設けられ
ている。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the accompanying drawings of FIGS. As shown in FIG. 1, the processing apparatus using a supercritical fluid according to the present embodiment includes a gas supply unit 1 that supplies a gas that becomes a supercritical fluid, a high-pressure pump that compresses the supplied gas and liquefies it, and the like. The gas compressing section 2, the temperature adjusting section 3 that heats the compressed and liquefied gas and adjusts it to a predetermined temperature to generate a supercritical fluid, and the stored object 4 to be contacted with the supercritical fluid to contaminate It comprises a processing tank 5 for removing substances and the like, a trap section 6 for removing contaminants and the like removed from the object to be treated 4 from the supercritical fluid, and a pressure adjusting section 7 for returning the supercritical fluid to a normal gas. . It should be noted that on-off valves 8 and 9 are provided on the upstream side and the downstream side of the processing tank 5, and the processing tank 5 is provided with temperature adjusting means 10 for maintaining a supercritical fluid state.

【0010】したがって、ガス供給部1から供給された
ガスはガス圧縮部2で圧縮されて液化し、温度調整部3
で所定の温度に加熱されて超臨界流体となる。ついで、
この超臨界流体3は処理槽5の上流側から下流側に流
れ、処理槽5内に配された被処理物4に接触し、その表
面に付着した汚染物質やその内部から発生する有機ガス
を被処理物4から除去する。そして、超臨界流体は、ト
ラップ部6に流入して前記汚染物質等を分離,除去され
た後、圧力調整器7によって気化した後、再び、前記ガ
ス圧縮部2に送られ、前述と同様に循環する。
Therefore, the gas supplied from the gas supply unit 1 is compressed and liquefied by the gas compression unit 2, and the temperature adjustment unit 3
Is heated to a predetermined temperature and becomes a supercritical fluid. Then,
The supercritical fluid 3 flows from the upstream side to the downstream side of the treatment tank 5, contacts the object 4 to be treated arranged in the treatment tank 5, and removes contaminants adhering to the surface thereof and organic gas generated from the inside thereof. It is removed from the object to be processed 4. Then, the supercritical fluid flows into the trap section 6 to separate and remove the contaminants and the like, and after being vaporized by the pressure regulator 7, is sent to the gas compressing section 2 again, and is the same as the above. Circulate.

【0011】本実施例において使用される超臨界流体と
なるガスとしては、例えば、二酸化炭素(CO2)の他、
窒素、ネオン、アルゴン等の不活性ガスが挙げられ、特
に限定するものではない。
Examples of the gas used as the supercritical fluid used in this embodiment include carbon dioxide (CO 2 ),
Examples of the inert gas include nitrogen, neon, and argon, but are not particularly limited.

【0012】これらのガスから生成される超臨界流体と
は、臨界点以上の温度、圧力領域における流体をいい、
例えば、二酸化炭素の場合は、図2のハッチングで示し
た超臨界流体領域における流体をいう。
The supercritical fluid produced from these gases means a fluid in a temperature and pressure range above the critical point,
For example, in the case of carbon dioxide, it means a fluid in the supercritical fluid region shown by hatching in FIG.

【0013】この超臨界流体は一般に密度が気体よりも
液体に極めて近いので、物質への溶解度が液体に近似し
ている。しかも、拡散係数が液体よりも極めて大きく、
物質の移動速度、平衡速度が大きいので、洗浄能力,脱
ガス能力が大きい。特に、本実施例においては、一定流
量の超臨界流体でガス抜き処理した場合、処理時間が長
いほど合成樹脂材から発生する有機ガスが少なくなるた
め(図3)、脱ガス効果が大きいという特性がある。さら
に、超臨界流体は常圧でも容易に気化するという特性が
ある。なお、二酸化炭素からなる超臨界流体は気化して
も無害であるうえに、常温付近(約30〜50℃)で洗
浄処理等に使用できるので、超臨界流体から取り出した
被処理物を空気中に放置しても、空気中の水分が被処理
物の表面に付着せず、水滴が生じない。
Since the density of this supercritical fluid is generally much closer to that of liquid than that of gas, its solubility in substances is similar to that of liquid. Moreover, the diffusion coefficient is much larger than that of liquids,
Since the moving speed and equilibrium speed of substances are high, the cleaning ability and degassing ability are high. In particular, in the present embodiment, when degassing is performed with a constant flow rate of supercritical fluid, the longer the processing time is, the less organic gas is generated from the synthetic resin material (FIG. 3), so that the degassing effect is large. There is. Further, the supercritical fluid has a characteristic that it is easily vaporized even at normal pressure. In addition, since the supercritical fluid consisting of carbon dioxide is harmless even when vaporized and can be used for cleaning treatment at around room temperature (about 30 to 50 ° C.), the object to be treated taken out from the supercritical fluid is in air. Even if left to stand, moisture in the air does not adhere to the surface of the object to be treated, and water drops do not occur.

【0014】本実施例によれば、超臨界流体が処理槽5
内を一方向に流れ、被処理物4には常に新しい超臨界流
体が接触するので、洗浄,ガス抜き効率が高いという利
点がある。
According to this embodiment, the supercritical fluid is the processing tank 5
Since the new supercritical fluid constantly contacts the object 4 to be processed, it has the advantage of high cleaning and degassing efficiency.

【0015】本実施例にかかる被処理物はリレー,スイ
ッチ等の電子機器に限らず、他の精密機器であってもよ
い。さらに、被処理物は組立られた製品や半製品に限ら
ず、例えば、構成部品単独や成形前の合成樹脂材であっ
てもよい。また、必ずしも洗浄処理,ガス抜き処理を同
時に行なう場合に適用する必要はなく、洗浄処理あるい
はガス抜き処理だけを行なう場合に適用してもよい。
The object to be processed according to the present embodiment is not limited to electronic equipment such as relays and switches, but may be other precision equipment. Further, the object to be processed is not limited to the assembled product or the semi-finished product, and may be, for example, a component alone or a synthetic resin material before molding. Further, it is not always necessary to apply the cleaning treatment and the degassing treatment at the same time, and may be applied when only the cleaning treatment or the degassing treatment is performed.

【0016】[0016]

【発明の効果】以上の説明から明らかなように、本発明
にかかる超臨界流体による処理装置によれば、処理液で
ある超臨界流体は常圧で容易に気化するので、処理槽内
から被処理物を取り出せば、超臨界流体は気化して消失
する。しかも、超臨界流体は常温付近で洗浄処理等に使
用されるので、従来例のように被処理物の表面に水滴が
生じるということもない。このため、従来例のような乾
燥工程が不要となり、製造工程が減少し、生産性が向上
する。特に、超臨界流体が液化した二酸化炭素からなる
ものであれば、気化しても人体に無害である。しかも、
超臨界流体によれば、洗浄すると同時に、合成樹脂材か
らなる被処理物の内部から発生する有機ガスをも抽出,
除去できるので、別途、脱ガス工程を設ける必要がな
く、製造工程が減少し、生産性がより一層向上する。さ
らに、一般に、超臨界流体は常温付近で洗浄処理等に使
用されるので、被処理物を超臨界流体で処理しても、被
処理物に大きな熱応力が発生せず、被処理物に塑性変形
が生じない。このため、寸法精度にバラツキが生ぜず、
動作特性が変化しないという効果がある。
As is apparent from the above description, according to the supercritical fluid processing apparatus of the present invention, the supercritical fluid, which is the processing liquid, is easily vaporized under normal pressure, so that the supercritical fluid from the inside of the processing tank is covered. When the processed product is taken out, the supercritical fluid vaporizes and disappears. Moreover, since the supercritical fluid is used for cleaning treatment or the like at around room temperature, water droplets do not occur on the surface of the object to be treated as in the conventional example. Therefore, the drying process as in the conventional example is unnecessary, the number of manufacturing processes is reduced, and the productivity is improved. In particular, if the supercritical fluid is composed of liquefied carbon dioxide, it is harmless to the human body even when vaporized. Moreover,
With the supercritical fluid, at the same time as cleaning, the organic gas generated from the inside of the object to be treated made of synthetic resin material is also extracted.
Since it can be removed, it is not necessary to separately provide a degassing step, the number of manufacturing steps is reduced, and the productivity is further improved. Further, since the supercritical fluid is generally used for cleaning treatment at around room temperature, even if the object to be treated is treated with the supercritical fluid, a large thermal stress does not occur in the object to be treated, and the object to be treated is plastic. No deformation occurs. Therefore, the dimensional accuracy does not vary,
The effect is that the operating characteristics do not change.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明にかかる超臨界流体による処理装置の
概略図である。
FIG. 1 is a schematic view of a processing apparatus using a supercritical fluid according to the present invention.

【図2】 本発明にかかる超臨界流体となる二酸化炭素
の状態図である。
FIG. 2 is a state diagram of carbon dioxide as a supercritical fluid according to the present invention.

【図3】 本発明にかかる超臨界流体による脱ガス効果
を示すグラフ図である。
FIG. 3 is a graph showing the degassing effect of the supercritical fluid according to the present invention.

【符号の説明】[Explanation of symbols]

1…ガス供給部、2…ガス圧縮部、3…温度調整部、4
…被処理物、5…処理槽。
DESCRIPTION OF SYMBOLS 1 ... Gas supply part, 2 ... Gas compression part, 3 ... Temperature adjustment part, 4
... processing object, 5 ... processing tank.

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 処理槽内に配した被処理物を処理液で洗
浄処理等を行なう処理装置において、 前記処理液を超臨界流体としたことを特徴とする超臨界
流体による処理装置。
1. A processing apparatus for cleaning an object to be processed placed in a processing tank with a processing liquid, wherein the processing liquid is a supercritical fluid.
【請求項2】 前記超臨界流体が液化した二酸化炭素か
らなることを特徴とする請求項1に記載の超臨界流体に
よる処理装置。
2. The processing apparatus according to claim 1, wherein the supercritical fluid is liquefied carbon dioxide.
【請求項3】 処理槽内に配した被処理物の汚れを超臨
界流体で洗浄処理することを特徴とする超臨界流体によ
る処理方法。
3. A method of treating with a supercritical fluid, which comprises cleaning a stain on an object to be treated placed in a treatment tank with a supercritical fluid.
【請求項4】 処理槽内に配した合成樹脂材からなる被
処理物の内部から発生する有機ガスを超臨界流体に溶出
させてガス抜き処理することを特徴とする超臨界流体に
よる処理方法。
4. A treatment method using a supercritical fluid, wherein an organic gas generated from the inside of an object to be treated made of a synthetic resin material placed in a treatment tank is eluted into a supercritical fluid to perform degassing treatment.
JP27850392A 1992-10-16 1992-10-16 Processing apparatus and processing method using supercritical fluid Pending JPH06126256A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27850392A JPH06126256A (en) 1992-10-16 1992-10-16 Processing apparatus and processing method using supercritical fluid

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27850392A JPH06126256A (en) 1992-10-16 1992-10-16 Processing apparatus and processing method using supercritical fluid

Publications (1)

Publication Number Publication Date
JPH06126256A true JPH06126256A (en) 1994-05-10

Family

ID=17598223

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27850392A Pending JPH06126256A (en) 1992-10-16 1992-10-16 Processing apparatus and processing method using supercritical fluid

Country Status (1)

Country Link
JP (1) JPH06126256A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6880560B2 (en) 2002-11-18 2005-04-19 Techsonic Substrate processing apparatus for processing substrates using dense phase gas and sonic waves

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6880560B2 (en) 2002-11-18 2005-04-19 Techsonic Substrate processing apparatus for processing substrates using dense phase gas and sonic waves

Similar Documents

Publication Publication Date Title
US5045117A (en) System for removing flux residues from printed wiring assemblies
KR101122377B1 (en) Method and apparatus for cleaning semiconductor wafers using compressed and/or pressurized foam, bubbles, and/or liquids
US5964958A (en) Methods for drying and cleaning objects using aerosols
US20090084405A1 (en) Substrate treating apparatus and substrate treating method
JPH06126256A (en) Processing apparatus and processing method using supercritical fluid
JPH0832289B2 (en) Controlled release system and method for liquid compositions having volatile components
FR2486287A1 (en) METHOD FOR MANUFACTURING DISCS CONTAINING HIGH DENSITY INFORMATION
JP2003080187A (en) Part washing and drying method and part washing and drying apparatus
JP4252295B2 (en) Metal mask cleaning method and apparatus
JPH0417333A (en) Substrate cleaning method and cleaning system using supercritical gas
JP2015073947A (en) Method for removing metal impurities from fluororesin
JP3955924B2 (en) Method and apparatus for drying and cleaning articles using aerosols
US20050288485A1 (en) Method and apparatus for pretreatment of polymeric materials utilized in carbon dioxide purification, delivery and storage systems
JP2784159B2 (en) Method and apparatus for cleaning object to be cleaned
JP3289336B2 (en) Method for cleaning porous article containing rust-causing substance and cleaning apparatus used for the method
JP7658641B1 (en) Method for cleaning objects
JP3182136B2 (en) Cleaning equipment
JPH0718478A (en) Cleaning method for small parts such as electrical contacts and vacuum dryer
JP3169080B2 (en) Method and apparatus for drying object to be cleaned
JP3439243B2 (en) Cleaning method and cleaning device
WO1991008583A1 (en) Washing system
JP3326845B2 (en) Washing / drying method and washing / drying apparatus
JPH0642862A (en) Washing and drying method
JP2001241843A (en) Method and apparatus for drying object to be cleaned
JPS63194787A (en) Washing method and device