JPH0581499A - Memory package - Google Patents

Abstract

PURPOSE:To improve performance such as an access time by providing an integrated circuit, and a memory card where storage elements are mounted on both sides, and plural different-height connectors which connect the memory card and a substrate to the back of a substrate where the integrated circuit is mounted. CONSTITUTION:A memory card 3 which has plural storage element 4 mounted on both its surfaces is controlled by the integrated circuit 1 and a substrate 5 and memory card 3 are connected through plural kind of connectors 2 which are mounted on the substrate 5 and differ in height. Consequently, the space is effectively used to increase the package density. Further, the pattern length from the integrated circuit to the storage elements 4 becomes short, so the skew or delay of the medium is reducible. Namely, the memory card mounted with the storage elements 4 is mounted on the back of the substrate where the integrated circuit is mounted to improve the performance such as the access time and a cycle time.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION This invention relates to memory packages.

[0002]

2. Description of the Related Art Conventionally, a memory package of this type has a structure in which an integrated circuit 1 and a SIM 6 having a plurality of storage elements 4 are mounted on a substrate as shown in FIG.
As shown in (b), the integrated circuit 1 and the memory element 4 are mounted on the front surface of the substrate, and the memory element is mounted on the back surface of the substrate using a space other than the back surface on which the integrated circuit is mounted. There is.

[0003]

In the conventional memory package, as the number of memory elements mounted on the substrate increases, the distance between the integrated circuit and the memory elements increases, which results in an increase in access time,
There is a drawback that the cycle time becomes large.

[0004]

A memory package according to the present invention comprises an integrated circuit, a memory card having storage elements mounted on both sides, and the memory card and the substrate on the back of the substrate on which the integrated circuit is mounted. And a plurality of types of connectors having different heights for connecting with each other.

[0005]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings. 1 (a) and 1 (b) are a sectional view and a rear view of an embodiment of the present invention. The memory card 3 having a plurality of memory elements 4 mounted on both sides of the card is controlled by the integrated circuit 1, and the substrate 5 and the memory card 3 are mounted on the substrate 5 through the connectors 2 having different heights. By connecting, the space can be effectively used and the packaging density can be increased, and since the pattern length of the integrated circuit 1 to the memory element 4 is shortened, the skew or delay of the medium can be reduced.

[0006]

As described above, according to the present invention, a memory card having a plurality of storage elements mounted thereon is mounted on the back side of a substrate on which the integrated circuit is mounted. The pattern length can be shortened and the signal delay and skew can be reduced. Therefore, there is an effect that the performance such as access time and cycle time can be improved.

[Brief description of drawings]

1A and 1B are a sectional view and a rear view showing an embodiment of the present invention.

FIG. 2 is a perspective view showing a first conventional example.

3A and 3B are a top view and a back view showing a second conventional example.

[Explanation of symbols]

 1 integrated circuit 2 connector 3 memory card 4 storage element 5 substrate

Claims (1)

[Claims] 1. A package having an integrated circuit mounted on the surface, a memory card having a plurality of storage elements mounted thereon, and a plurality of types having different heights for connecting the memory card and the package to the back of the package of the integrated circuit. A memory package characterized by including a connector.