JPH056869A - Semiconductor device - Google Patents

Abstract

(57) [Summary] [Structure] A semiconductor element is resin-encapsulated using a resin composition containing the following components (A) to (C). (A) A maleimide compound having two or more maleimide groups in one molecule. (B) An allylated phenol resin having the following general formula (1) as a repeating unit. [Chemical 1] [In the general formula (1), n and m are integers, and m
/(N+m)=0.3 or more and n + m = 1 to 20. ] (C) Curing catalyst. [Effect] Excellent in moisture resistance, heat resistance, and mechanical strength.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device having excellent reliability.

[0002]

2. Description of the Related Art Semiconductor elements such as transistors, ICs, and LSIs are usually sealed by a ceramic package or a plastic package to form a semiconductor device. In the above ceramic package, the constituent material itself has heat resistance and also has excellent moisture permeation resistance.
It is highly resistant to humidity, and because it is a hollow package, it has high mechanical strength and enables highly reliable sealing. However, since the constituent materials are relatively expensive and the mass productivity is inferior, recently, resin sealing using the plastic package has become mainstream. An epoxy resin composition has been conventionally used for this type of resin encapsulation, and has achieved good results. However, due to technological innovations in the semiconductor field, the size of the device has been increased, the size of the device has been increased, and the wiring has been miniaturized.
There is a tendency to make the device thinner, and accordingly, further improvement in reliability (such as internal stress, humidity resistance reliability, and heat resistance reliability of the obtained semiconductor device) of the sealing material is demanded.

In recent years, a maleimide resin, which is superior in heat resistance to epoxy resin (glass transition temperature of 100 to 200 ° C.), is used as a sealing resin for semiconductor elements in order to obtain such high reliability, particularly high heat resistance. (Glass transition temperature 200
Various systems using (~ 300 ° C) have been studied.

[0004]

However, the maleimide resin has a drawback that it is hard and brittle because the cured product thereof has a higher elastic modulus and a lower energy absorption capacity than the epoxy resin. Further, when a maleimide resin is used as a sealing resin, there is a problem that the moisture resistance reliability is insufficient.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a semiconductor device having high reliability with excellent humidity resistance reliability, heat resistance reliability, and mechanical strength.

[0006]

In order to achieve the above object, the semiconductor device of the present invention has a semiconductor element encapsulated with a resin composition containing the following components (A) to (C). Semiconductor device. (A) A maleimide compound having two or more maleimide groups in one molecule. (B) An allylated phenol resin having the following general formula (1) as a repeating unit.

[Chemical 3] [In the general formula (1), n and m are integers, and m
/(N+m)=0.3 or more and n + m = 1 to 20. ] (C) Curing catalyst.

[0007]

FUNCTIONS That is, the present inventors have conducted a series of studies in order to obtain a highly reliable sealing resin. As a result, they have found that high reliability can be obtained by using a maleimide resin and a special phenol resin containing a phenolic OH group and an allyl group capable of reacting with it, and arrived at the present invention.

Next, the present invention will be described in detail.

The resin composition used in the present invention is obtained by using a specific maleimide compound (component A), a special phenol resin (component B), and a curing catalyst (component C). , Powdery or tablet-shaped tablets.

The above specific maleimide compound (component A)
Is a compound having two or more maleimide groups in one molecule, and is, for example, a maleimide compound represented by the following general formula (2) or a maleimide compound containing a repeating unit represented by the general formula (3) as a main component. And those obtained by using the maleimide compound represented by the general formula (4).

[0011]

[Chemical 4]

[0012]

[Chemical 5]

[0013]

[Chemical 6]

These maleimide compounds may be used alone or in combination. The maleimide compound (component A)
Special allylated phenolic resin (B
The component) is obtained by reacting an aralkyl ether with a phenol (for example, Mitsui Toatsu Chemical Co., Ltd., Zyrock XL-225), and after adding allyl chloride by a conventional method, the Claisen rearrangement is performed. It is obtained by Such a special allylated phenol resin (component B) is represented by the following general formula (1). In the following general formula (1), the form of the component represented by the number of repetitions n and the component represented by the number of repetitions m is block, alternating, or random.

[0015]

[Chemical 7]

In the allylated phenol resin represented by the above general formula (1), m / (n + m), that is, the allylation rate must be 0.3 or more. That is, when the allylation ratio is less than 0.3, heat resistance and moisture resistance deteriorate. Further, m + n must be in the range of 1-20. Particularly preferably, m + n is 2 to 15. That is, when m + n exceeds 20, the viscosity becomes high and a problem occurs in sealing workability.

The amount of the special allylated phenolic resin (component B) is the weight ratio of the maleimide compound (A).
It is preferable to set it in the range of 0.3 to 1.5 with respect to component 1). That is, if it is out of the above range, heat resistance, moisture resistance and workability tend to deteriorate.

The curing catalyst (component C) used together with the maleimide compound (component A) and the special allylated phenolic resin (component B) is a radical initiator such as an organic peroxide or an azo compound, or a tertiary amine. , Imidazoles, quaternary ammonium salts, organic phosphine compounds,
Examples thereof include Lewis acid and Lewis acid complex. These may be used alone or in combination. The blending amount of the above-mentioned curing catalyst (component C) is appropriately determined in accordance with the curing conditions used during production.

In the resin composition used in the present invention, in addition to the above-mentioned components A to C, if necessary, a powdery reinforcing agent, filler, colorant, release agent, flame retardant, coupling agent, A curing catalyst or the like can be added as appropriate.

Examples of the powdery reinforcing agent or filler include aluminum oxide, magnesium oxide, aluminum hydroxide, aluminum carbonate, calcium carbonate, magnesium carbonate, diatomaceous earth, calcium silicate, calcined clay, powdered silica, graphite, Examples include asbestos, ammotin trioxide, glass fiber, rock wool, carbon fiber, etc. The amount of the reinforcing agent and the filler used is preferably 500 parts or less with respect to 100 parts by weight of the resin component (hereinafter abbreviated as “part”), although it depends on the application.

Examples of the colorant include titanium dioxide, yellow lead carbon black, iron black, molybdenum red, ultramarine blue, dark blue, cadmium yellow, cadmium red and the like.

Examples of the releasing agent include higher aliphatic paraffins, higher aliphatic esters, natural waxes and synthetic waxes, and examples of the releasing agent include antimony trioxide and phosphorus compounds.

Examples of the coupling agent include silane-based, titanate-based, aluminum-based coupling agents and the like.

The resin composition used in the present invention can be manufactured, for example, as follows. That is,
The maleimide compound (component A), special allylated phenol resin (component B) and curing catalyst (component C), and other additives such as the above-mentioned fillers, colorants, release agents, flame retardants and coupling agents, if necessary. The agent is blended appropriately. Next, the desired resin composition can be produced by a series of steps in which the composition is heated, mixed and kneaded, cooled to room temperature, pulverized, and tableted if necessary.

The encapsulation of the semiconductor element using such a resin composition is not particularly limited and can be performed by a known molding method such as ordinary transfer molding.

The semiconductor device thus obtained is excellent in low stress, heat resistance, and moisture resistance and has high reliability.

[0027]

As described above, the semiconductor device of the present invention is resin-sealed with the special resin composition containing the special allylated phenol resin (component B).
Since the sealing plastic package is different from that of the conventional epoxy resin composition or maleimide resin composition, it has high moisture resistance reliability and also excellent heat resistance reliability. Therefore, reliability is further enhanced under severe usage conditions.

Next, examples will be described together with comparative examples.

First, using the following general formula (1) as a repeating unit, six kinds of allylated phenol resins A to F having the allylation ratio and (n + m) number shown in the following Table 1 and the following general formula ( A phenol novolak resin having 5) as a repeating unit was prepared.

[0030]

[Chemical 8]

[0031]

[Chemical 9]

[0032]

[Table 1]

[0033]

Examples 1 to 6 Allylated phenol resins A to C,
F and each component shown in Table 2 below were blended in the proportions shown in the same table, and melt-kneaded. Then, the mixture was cooled and solidified, and then pulverized to obtain a desired powdery resin composition.

[0034]

[Table 2]

[0035]

Comparative Examples 1 to 3 The above allylated phenol resins D and E and the phenol novolak resin were used, and the respective components shown in Table 3 below were blended in the proportions shown in the same table and melt kneaded. Then, the mixture was cooled and solidified, and then pulverized to obtain a desired powdery resin composition.

[0036]

[Table 3]

Using the powdery resin compositions obtained in Examples and Comparative Examples as described above, a cured product was molded by transfer molding. Then, the flexural modulus, flexural strength and moisture absorption rate of the cured product are measured according to JIS K.
6911 and the results are shown in Tables 4 and 5 below. In the measurement of the moisture absorption rate, 85 ° C. × 8
It was carried out under the condition of 5% RH.

[0038]

[Table 4]

[0039]

[Table 5]

From the results shown in Tables 4 and 5, the comparative products have low strength at high temperature and high moisture absorption. On the other hand, the example products have high high-temperature strength and low hygroscopicity. From this, it is understood that the cured product of the example product is excellent in moisture resistance and mechanical strength particularly at high temperature.
Then, a semiconductor device was produced using the resin composition of this example. These semiconductor devices were excellent in moisture resistance reliability and mechanical strength.

Claims (2)

[Claims] 1. A semiconductor device obtained by encapsulating a semiconductor element with a resin composition containing the following components (A) to (C). (A) A maleimide compound having two or more maleimide groups in one molecule. (B) An allylated phenol resin having the following general formula (1) as a repeating unit. [Chemical 1] [In the general formula (1), n and m are integers, and m
/(N+m)=0.3 or more and n + m = 1 to 20. ] (C) Curing catalyst. 2. A semiconductor encapsulating resin composition containing the following components (A) to (C). (A) A maleimide compound having two or more maleimide groups in one molecule. (B) An allylated phenol resin having the following general formula (1) as a repeating unit. [Chemical 2] [In the general formula (1), n and m are integers, and m
/(N+m)=0.3 or more and n + m = 1 to 20. ] (C) Curing catalyst.