JPH0561580B2 - - Google Patents
Info
- Publication number
- JPH0561580B2 JPH0561580B2 JP62293957A JP29395787A JPH0561580B2 JP H0561580 B2 JPH0561580 B2 JP H0561580B2 JP 62293957 A JP62293957 A JP 62293957A JP 29395787 A JP29395787 A JP 29395787A JP H0561580 B2 JPH0561580 B2 JP H0561580B2
- Authority
- JP
- Japan
- Prior art keywords
- reference electrode
- silver
- electrode
- insulating material
- conductive substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910021607 Silver chloride Inorganic materials 0.000 description 21
- HKZLPVFGJNLROG-UHFFFAOYSA-M silver monochloride Chemical compound [Cl-].[Ag+] HKZLPVFGJNLROG-UHFFFAOYSA-M 0.000 description 21
- 238000000034 method Methods 0.000 description 15
- 239000004809 Teflon Substances 0.000 description 9
- 229920006362 Teflon® Polymers 0.000 description 9
- 239000011810 insulating material Substances 0.000 description 9
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 8
- 239000010408 film Substances 0.000 description 8
- 238000001659 ion-beam spectroscopy Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 150000002500 ions Chemical class 0.000 description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 229910052786 argon Inorganic materials 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 238000010884 ion-beam technique Methods 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- ZOMNIUBKTOKEHS-UHFFFAOYSA-L dimercury dichloride Chemical class Cl[Hg][Hg]Cl ZOMNIUBKTOKEHS-UHFFFAOYSA-L 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000004925 denaturation Methods 0.000 description 1
- 230000036425 denaturation Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- GPRLSGONYQIRFK-UHFFFAOYSA-N hydron Chemical compound [H+] GPRLSGONYQIRFK-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000000075 oxide glass Substances 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- -1 polyparaxylylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000012047 saturated solution Substances 0.000 description 1
- 239000012085 test solution Substances 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Liquid Crystal (AREA)
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は基準電極、特に超微小で安定な銀/塩
化銀の基準電極及びその製造方法に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a reference electrode, particularly an ultrafine and stable silver/silver chloride reference electrode, and a method for manufacturing the same.
[従来の技術]
従来、基準電極としては内部液室にKCl飽和溶
液を含む銀/塩化銀電極があり、外部溶液との流
通が良好となる直径2〜3cmのガラス室の電極が
一般に用いられている。特に、この場合には内部
のAg+Cl-イオンと外部溶液が行き来できること
が必要である。従つて、内部液汚染や外部Cl-イ
オンが電極に影響を与えて電位が変化する等の問
題がある。[Prior art] Conventionally, the reference electrode is a silver/silver chloride electrode containing a KCl saturated solution in an internal liquid chamber, and an electrode in a glass chamber with a diameter of 2 to 3 cm is generally used to allow good communication with the external solution. ing. In particular, in this case it is necessary that the internal Ag + Cl - ions and the external solution can come and go. Therefore, there are problems such as internal liquid contamination and external Cl - ions affecting the electrodes and changing the potential.
このような問題点を解決するため、
(1) 内部のAgClができるだけ流出することを防
ぐこと、
(2) Ag/AgClの同相系の構成にすること、
(3) 被検液(Cl-含む)によらず、Cl-イオンの影
響を受けずに基準電位を示すことなどが要望さ
れている。 In order to solve these problems, (1) prevent the internal AgCl from flowing out as much as possible, (2) configure the in-phase system of Ag/AgCl, and (3) use the test solution (containing Cl - ), it is desired to be able to indicate a reference potential without being affected by Cl - ions.
[発明が解決しようとする問題点]
本発明の目的は、固体型(ハイブリツド型)で
AgClの流出がほとんど無く、超微小の安定した
基準電極を提供することにある。[Problems to be Solved by the Invention] The purpose of the present invention is to solve the problem in a solid type (hybrid type)
The purpose is to provide an ultra-small and stable reference electrode with almost no AgCl outflow.
[問題点を解決するための手段及び作用]
この問題点を解決するための一手段として、本
発明の基準電極は、導電性基体と、該導電性基体
の表面を被覆するイオンビームスパツタリング法
により作成される塩化銀を分散して含む絶縁材料
層とを備える。[Means and effects for solving the problem] As a means for solving the problem, the reference electrode of the present invention includes a conductive substrate and an ion beam sputtering method for coating the surface of the conductive substrate. and an insulating material layer containing silver chloride dispersed therein.
[実施例]
まず本実施例で使用するイオンビームスパツタ
法を説明する。イオンビームスパツタ法は、アル
ゴン等の不活性ガスを送り込み、電離プラズマで
イオン化させ、さらに強電界中で、このイオンを
加速させ、その加速エネルギーでターゲツトの原
子や分子を飛び出させて目的とする基板に堆積さ
せる。該方法の特徴は、アルゴンの運動エネルギ
ーをじかにターゲツトの原子や分子の運動エネル
ギーに変換する原理を利用するため、ターゲツト
が加熱を余り受けずに成膜できることである。特
に、膜組成の熱変性を受けないで成膜できるの
で、有機膜の成膜に適する方法である。[Example] First, the ion beam sputtering method used in this example will be explained. The ion beam sputtering method sends an inert gas such as argon, ionizes it with ionized plasma, accelerates the ions in a strong electric field, and uses the acceleration energy to eject target atoms and molecules. Deposit on substrate. The feature of this method is that it utilizes the principle of directly converting the kinetic energy of argon into the kinetic energy of the atoms or molecules of the target, so that it can form a film without much heating of the target. In particular, this method is suitable for forming organic films because the film can be formed without undergoing thermal denaturation of the film composition.
イオンビームスパツタ法の装置及びイオンガン
の概略図が第2図aに示されている。この場合の
実験条件は次の通りである。 A schematic diagram of an ion beam sputtering apparatus and an ion gun is shown in FIG. 2a. The experimental conditions in this case are as follows.
出力:10W(5KV、2mA)
真空度:3×10-5Torr以下
時間:任意設定条件
イオンビーム:アルゴン
成膜される塩化銀を分散して含む絶縁材料層
は、500Å〜100μm、好ましくは500〜1000Å厚
である。Output: 10W (5KV, 2mA) Vacuum level: 3 x 10 -5 Torr or less Time: Any setting conditions Ion beam: Argon The insulating material layer containing dispersed silver chloride to be formed has a thickness of 500 Å to 100 μm, preferably 500 μm. ~1000 Å thick.
絶縁材料としては、テトラフルオロエチレン
(テフロンデユボン社製)、ポリスチレン、フツ
素系有機化合物、芳香族系のポリパラキシリレン
などが用いられる。 As the insulating material, tetrafluoroethylene (manufactured by Teflon Dubon), polystyrene, fluorine-based organic compounds, aromatic polyparaxylylene, etc. are used.
実施例 1 第1図に本実施例の基準電極を示す。Example 1 FIG. 1 shows the reference electrode of this example.
第2図aのアルゴンイオンビームスパツタ装置
中で、インジウム錫酸化物ガラス(ITO)1の片
面に約2000Å厚を銀層2を蒸着法で作成したもの
を基板とし、第2図bに示すターゲツト(テフロ
ンデユボン社製パレツトに塩化銀を埋め込んだ
ターゲツト)を用いて、テフロン中に塩化銀を分
散させた約1000Å厚の絶縁材料層5を作成して、
下地が銀層2からなる銀/塩化銀混合膜で被覆さ
れた電極を作成した。なお、絶縁材料層5作成中
は電極はレジストによる保護し、リード線として
銅線3をリン青銅4(コンタクトで接続した。絶
縁材としてエポキシ樹脂6で周囲を覆つて十分に
囲つてからアセトンでレジストを剥離した。 In the argon ion beam sputtering apparatus shown in Fig. 2a, a silver layer 2 of about 2000 Å thick was formed on one side of an indium tin oxide glass (ITO) 1 by vapor deposition as a substrate, as shown in Fig. 2b. Using a target (a target made by embedding silver chloride in a pallet manufactured by Teflon Dubon), an insulating material layer 5 of approximately 1000 Å thick with silver chloride dispersed in Teflon was created.
An electrode was prepared in which the base was coated with a silver/silver chloride mixed film consisting of silver layer 2. Note that during the creation of the insulating material layer 5, the electrodes were protected by resist, and the copper wire 3 was connected as a lead wire with phosphor bronze 4 (contact).The periphery was sufficiently covered with epoxy resin 6 as an insulating material, and then acetone was applied. The resist was peeled off.
作成条件は、 出力:10W(5KV、2mA) 真空度:3×10-5Torr 時間:8時間 である。 The creation conditions were: Output: 10W (5KV, 2mA) Vacuum degree: 3×10 -5 Torr Time: 8 hours.
以上の電極を、アニーリング(120℃、10時間)
として膜の拡散及び安定化を図つた。 Annealing the above electrodes (120℃, 10 hours)
As a result, we attempted to diffuse and stabilize the membrane.
実験例 1
実施例1の方法で作製した電極を作用極、比較
局に飽和カロメル電極を用いてPH濃度をHCl−
KOHで調整し、但し、[Cl-]一定として、PH濃
度1〜10程度まで変化させたときの電極の電位を
測定した。Experimental Example 1 The electrode prepared by the method of Example 1 was used as a working electrode, and a saturated calomel electrode was used as a comparison station, and the PH concentration was adjusted to HCl−.
The potential of the electrode was measured when the PH concentration was varied from about 1 to about 10 while adjusting with KOH, but with [Cl - ] constant.
結果を第3図に示す。電位の変化は殆どみられ
ず、基準電極として使用できることが解つた。 The results are shown in Figure 3. Almost no change in potential was observed, indicating that it can be used as a reference electrode.
実験例 2
実施例1で作製した電極を作用極に用い、比較
極に飽和カロメル電極を用い、Cl-イオン濃度
(KCl濃度を10-2M/l〜10M/lで変化させた)
による影響を検討したところ、結果は第4図のよ
うになつた。Experimental Example 2 The electrode prepared in Example 1 was used as the working electrode, a saturated calomel electrode was used as the comparison electrode, and the Cl - ion concentration (KCl concentration was varied from 10 -2 M/l to 10 M/l).
When we examined the effects of this, the results were as shown in Figure 4.
このように、本実施例の電極はCl-イオン濃度
の影響を殆ど受けないことがわかり、Cl-イオン
下でも基準電極として使用できることが解つた。 In this way, it was found that the electrode of this example was hardly affected by the Cl - ion concentration, and that it could be used as a reference electrode even under Cl - ions.
以上のように本実施例の基準極は、
(1) テフロン(登録商標)(絶縁材料膜)で覆わ
れ、しかも、イオンビーム法を使用しているの
で、原子や分子状に設計されたテフロン(登録
商標)構造によりAgClが外部に流出し難い特
徴をもつ。 As described above, the reference electrode of this example is (1) covered with Teflon (registered trademark) (insulating material film), and since the ion beam method is used, Teflon, which is designed in an atomic or molecular shape, (Registered Trademark) structure makes it difficult for AgCl to leak out.
(2) しかも、テフロン(登録商標)膜は1000Å以
下、好ましくは、500Å〜1000Åの薄膜であり、
応答速度は迅速である。100μmをこえると、
応答速度が遅くなつたり、剥離が生じやすくな
る。(2) Moreover, the Teflon (registered trademark) film is a thin film of 1000 Å or less, preferably 500 Å to 1000 Å,
Response speed is quick. If it exceeds 100μm,
The response speed becomes slow and peeling tends to occur.
(3) AgClとAg(蒸着法)の状態でITOガラス表
面に被覆されており、Ag+イオンは絶えず基板
から供給される。又、AgClはテフロン(登録
商標)基材で囲まれた島状に存在する。以上の
ことから同相系の構成によりAgCl/Ag電極が
できる。(3) The ITO glass surface is coated with AgCl and Ag (vapor deposition method), and Ag + ions are constantly supplied from the substrate. Further, AgCl exists in an island shape surrounded by a Teflon (registered trademark) base material. From the above, an AgCl/Ag electrode can be created using an in-phase configuration.
(4) この様な方法(イオンビームスパツタ法)に
より、超微小の感応部にも該AgCl部位を容易
に被着できるため、ISFET(イオン選択性電界
効果トランジスタ)の基準電極にも利用でき、
その他の超微小センサもハイブリツド基準電極
としての広い利用が期待できる。(4) Using this method (ion beam sputtering method), the AgCl site can be easily deposited even on ultra-small sensitive parts, so it can also be used as a reference electrode for ISFETs (ion-selective field-effect transistors). I can,
Other ultra-small sensors can also be expected to find wide use as hybrid reference electrodes.
[発明の効果]
本発明により、固体型(ハイブリツド型)で
AgClの流出がほとんど無く、超微小の安定した
基準電極を提供できる。[Effect of the invention] According to the present invention, a solid type (hybrid type)
There is almost no outflow of AgCl, and an ultra-small and stable reference electrode can be provided.
より詳細には、
(1) テフロン(登録商標)(絶縁材料膜)で覆わ
れ、しかもイオンビーム法を使用しているの
で、原子や分子上に設計されたテフロン(登録
商標)構造によりAgClが外部に流出し難い特
徴をもつ。 In more detail, (1) Since it is covered with Teflon (registered trademark) (insulating material film) and uses the ion beam method, AgCl is It has a characteristic that it is difficult to leak outside.
(2) AgClとAg(蒸着法)の状態でITOガラス表
面に被覆されており、Ag+イオンは絶えず基板
から供給される。又、AgClはテフロン(登録
商標)基材で囲まれた島上に存在する。以上の
ことから同相系の構成によりAgCl/Ag電極が
できる。(2) The ITO glass surface is coated with AgCl and Ag (vapor deposition method), and Ag + ions are constantly supplied from the substrate. The AgCl is also present on islands surrounded by a Teflon matrix. From the above, an AgCl/Ag electrode can be created using an in-phase configuration.
(3) この様な方法(イオンビームスパツタ法)に
より、超微小の感応部にも該AgCl部位を容易
に被着できるため、ISFET(イオン選択性電解
効果トランジスタ)の基準電極にも利用でき、
その他の超微小センサのハイブリツド基準電極
としての広い利用が期待できる。(3) Using this method (ion beam sputtering method), the AgCl site can be easily deposited even on ultra-small sensitive parts, so it can also be used as a reference electrode for ISFETs (ion selective field effect transistors). I can,
It is expected that it will be widely used as a hybrid reference electrode for other ultra-small sensors.
第1図は本実施例の基準電極の構成を示す模式
図、第2図aは本実施例で使用したイオンビーム
スパツタ法の装置及びイオンガンの概略図、第2
図bは本実施例で使用したターゲツト例を示す
図、第3図は本実施例の基準電極の水素イオン濃
度に対する電位の変化を示す図、第4図は本実施
例の基準電極の塩素イオン濃度に対する電位の変
化を示す図である。
図中、1……ITO、2……銀層、3……銅線、
4……リン青銅、5……絶縁材料層、6……エポ
キシ樹脂である。
Fig. 1 is a schematic diagram showing the configuration of the reference electrode of this example, Fig. 2a is a schematic diagram of the ion beam sputtering apparatus and ion gun used in this example, and Fig.
Figure b is a diagram showing an example of the target used in this example, Figure 3 is a diagram showing changes in potential with respect to hydrogen ion concentration of the reference electrode of this example, and Figure 4 is a diagram showing chloride ions of the reference electrode of this example. FIG. 3 is a diagram showing changes in potential with respect to concentration. In the figure, 1...ITO, 2...silver layer, 3...copper wire,
4... Phosphor bronze, 5... Insulating material layer, 6... Epoxy resin.
Claims (1)
る塩化銀を分散して含む絶縁材料層とを備えるこ
とを特徴とする基準電極。 2 導電性基体は、絶縁体、半導体、導電体のい
ずれかから選ばれた材料を基体とし、該基体の片
面に銀又は銀を一部含む材料層と薄層が被着され
てなることを特徴とする特許請求の範囲第1項記
載の基準電極。 3 絶縁材料と塩化銀が共存するターゲツトに、
イオンビームを照射して、該ターゲツトをスパツ
タリングして、目的とする導電性基体上に塩化銀
を含む絶縁材料層を低温で形成することを特徴と
する基準電極の製造方法。 4 導電性基体は、絶縁体、半導体、導電体のい
ずれかから選ばれた材料を基体とし、該基体の片
面に銀又は銀を一部含む材料層の薄層が被着され
てなることを特徴とする特許請求の範囲第3項記
載の基準電極の製造方法。[Scope of Claims] 1. A reference electrode comprising an electrically conductive substrate and an insulating material layer containing dispersed silver chloride and covering the surface of the electrically conductive substrate. 2. The conductive substrate is made of a material selected from insulators, semiconductors, and conductors, and a thin layer of silver or a material partially containing silver is adhered to one side of the substrate. A reference electrode according to claim 1, characterized in that: 3 For targets where insulating material and silver chloride coexist,
A method for manufacturing a reference electrode, which comprises irradiating the target with an ion beam and sputtering the target to form an insulating material layer containing silver chloride on a desired conductive substrate at a low temperature. 4. The conductive substrate is made of a material selected from insulators, semiconductors, and conductors, and a thin layer of silver or a layer of material partially containing silver is adhered to one side of the substrate. A method for manufacturing a reference electrode according to claim 3, characterized in that:
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62293957A JPH01136060A (en) | 1987-11-24 | 1987-11-24 | Reference electrode and manufacture thereof |
PCT/JP1988/001188 WO1989004959A1 (en) | 1987-11-24 | 1988-11-24 | Reference electrode |
US07/490,636 US5200053A (en) | 1987-11-24 | 1988-11-24 | Reference electrode |
EP19880910119 EP0393188A4 (en) | 1987-11-24 | 1988-11-24 | Reference electrode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62293957A JPH01136060A (en) | 1987-11-24 | 1987-11-24 | Reference electrode and manufacture thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01136060A JPH01136060A (en) | 1989-05-29 |
JPH0561580B2 true JPH0561580B2 (en) | 1993-09-06 |
Family
ID=17801373
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62293957A Granted JPH01136060A (en) | 1987-11-24 | 1987-11-24 | Reference electrode and manufacture thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01136060A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070095661A1 (en) * | 2005-10-31 | 2007-05-03 | Yi Wang | Method of making, and, analyte sensor |
TWI502195B (en) | 2009-03-10 | 2015-10-01 | Senova Systems Inc | Multi-phase analyte insensitive electrode for use in an electrochemical sensing device for measuring an analyte in a sample , electrochemical sensing device comprising the electrode and method of measuring an analyte in a sample using the electrochemical |
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1987
- 1987-11-24 JP JP62293957A patent/JPH01136060A/en active Granted
Also Published As
Publication number | Publication date |
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JPH01136060A (en) | 1989-05-29 |
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