JPH054874A - Fire resisting mortar composition - Google Patents
Fire resisting mortar compositionInfo
- Publication number
- JPH054874A JPH054874A JP3061972A JP6197291A JPH054874A JP H054874 A JPH054874 A JP H054874A JP 3061972 A JP3061972 A JP 3061972A JP 6197291 A JP6197291 A JP 6197291A JP H054874 A JPH054874 A JP H054874A
- Authority
- JP
- Japan
- Prior art keywords
- composition
- present
- refractory material
- conductive metal
- amount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 68
- 239000004570 mortar (masonry) Substances 0.000 title claims description 39
- 229910052751 metal Inorganic materials 0.000 claims abstract description 28
- 239000002184 metal Substances 0.000 claims abstract description 28
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 19
- 239000010949 copper Substances 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims abstract description 12
- 229910052802 copper Inorganic materials 0.000 claims abstract description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910019142 PO4 Inorganic materials 0.000 claims abstract description 6
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 5
- 239000010452 phosphate Substances 0.000 claims abstract description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 3
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 3
- 239000000956 alloy Substances 0.000 claims abstract description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims abstract description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims abstract description 3
- 229910052709 silver Inorganic materials 0.000 claims abstract description 3
- 239000004332 silver Substances 0.000 claims abstract description 3
- 239000011819 refractory material Substances 0.000 claims description 19
- 239000011230 binding agent Substances 0.000 claims description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 13
- 239000002245 particle Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 10
- 239000004014 plasticizer Substances 0.000 claims description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 6
- ILRRQNADMUWWFW-UHFFFAOYSA-K aluminium phosphate Chemical compound O1[Al]2OP1(=O)O2 ILRRQNADMUWWFW-UHFFFAOYSA-K 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- 229920000609 methyl cellulose Polymers 0.000 claims description 5
- 239000001923 methylcellulose Substances 0.000 claims description 5
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 4
- 229920005551 calcium lignosulfonate Polymers 0.000 claims description 4
- 239000000945 filler Substances 0.000 claims description 4
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 3
- 229910000570 Cupronickel Inorganic materials 0.000 claims description 3
- RYAGRZNBULDMBW-UHFFFAOYSA-L calcium;3-(2-hydroxy-3-methoxyphenyl)-2-[2-methoxy-4-(3-sulfonatopropyl)phenoxy]propane-1-sulfonate Chemical compound [Ca+2].COC1=CC=CC(CC(CS([O-])(=O)=O)OC=2C(=CC(CCCS([O-])(=O)=O)=CC=2)OC)=C1O RYAGRZNBULDMBW-UHFFFAOYSA-L 0.000 claims description 3
- 239000004927 clay Substances 0.000 claims description 3
- LNAZSHAWQACDHT-XIYTZBAFSA-N (2r,3r,4s,5r,6s)-4,5-dimethoxy-2-(methoxymethyl)-3-[(2s,3r,4s,5r,6r)-3,4,5-trimethoxy-6-(methoxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6r)-4,5,6-trimethoxy-2-(methoxymethyl)oxan-3-yl]oxyoxane Chemical group CO[C@@H]1[C@@H](OC)[C@H](OC)[C@@H](COC)O[C@H]1O[C@H]1[C@H](OC)[C@@H](OC)[C@H](O[C@H]2[C@@H]([C@@H](OC)[C@H](OC)O[C@@H]2COC)OC)O[C@@H]1COC LNAZSHAWQACDHT-XIYTZBAFSA-N 0.000 claims description 2
- 229910000906 Bronze Inorganic materials 0.000 claims description 2
- 229920001353 Dextrin Polymers 0.000 claims description 2
- 239000004375 Dextrin Substances 0.000 claims description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 2
- 229910000792 Monel Inorganic materials 0.000 claims description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 2
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 2
- 239000010974 bronze Substances 0.000 claims description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 2
- 235000019425 dextrin Nutrition 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 239000011733 molybdenum Substances 0.000 claims description 2
- 229910052758 niobium Inorganic materials 0.000 claims description 2
- 239000010955 niobium Substances 0.000 claims description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 2
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 claims description 2
- 229920000058 polyacrylate Polymers 0.000 claims description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 2
- 239000011734 sodium Substances 0.000 claims description 2
- 229910052708 sodium Inorganic materials 0.000 claims description 2
- 229920005552 sodium lignosulfonate Polymers 0.000 claims description 2
- 229910052715 tantalum Inorganic materials 0.000 claims description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 claims description 2
- 239000010937 tungsten Substances 0.000 claims description 2
- 235000010981 methylcellulose Nutrition 0.000 claims 2
- 229910052570 clay Inorganic materials 0.000 claims 1
- 229910001092 metal group alloy Inorganic materials 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 15
- 239000007788 liquid Substances 0.000 abstract description 8
- 230000009970 fire resistant effect Effects 0.000 abstract description 4
- 230000001459 mortal effect Effects 0.000 abstract 2
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 239000011363 dried mixture Substances 0.000 abstract 1
- 230000001747 exhibiting effect Effects 0.000 abstract 1
- 239000004615 ingredient Substances 0.000 description 7
- XFWJKVMFIVXPKK-UHFFFAOYSA-N calcium;oxido(oxo)alumane Chemical compound [Ca+2].[O-][Al]=O.[O-][Al]=O XFWJKVMFIVXPKK-UHFFFAOYSA-N 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 235000021317 phosphate Nutrition 0.000 description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 239000004115 Sodium Silicate Substances 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 239000010427 ball clay Substances 0.000 description 2
- 239000004568 cement Substances 0.000 description 2
- 239000008240 homogeneous mixture Substances 0.000 description 2
- 239000002694 phosphate binding agent Substances 0.000 description 2
- 229910052911 sodium silicate Inorganic materials 0.000 description 2
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229920001732 Lignosulfonate Polymers 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical group [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 239000004111 Potassium silicate Substances 0.000 description 1
- 235000004443 Ricinus communis Nutrition 0.000 description 1
- 240000000528 Ricinus communis Species 0.000 description 1
- 229910018540 Si C Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910000318 alkali metal phosphate Inorganic materials 0.000 description 1
- 229910000316 alkaline earth metal phosphate Inorganic materials 0.000 description 1
- ANBBXQWFNXMHLD-UHFFFAOYSA-N aluminum;sodium;oxygen(2-) Chemical group [O-2].[O-2].[Na+].[Al+3] ANBBXQWFNXMHLD-UHFFFAOYSA-N 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- -1 if any Substances 0.000 description 1
- 229910001026 inconel Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 239000013528 metallic particle Substances 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical group 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 229910052913 potassium silicate Inorganic materials 0.000 description 1
- NNHHDJVEYQHLHG-UHFFFAOYSA-N potassium silicate Chemical compound [K+].[K+].[O-][Si]([O-])=O NNHHDJVEYQHLHG-UHFFFAOYSA-N 0.000 description 1
- 235000019353 potassium silicate Nutrition 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 235000019980 sodium acid phosphate Nutrition 0.000 description 1
- 229910001388 sodium aluminate Inorganic materials 0.000 description 1
- AJPJDKMHJJGVTQ-UHFFFAOYSA-M sodium dihydrogen phosphate Chemical compound [Na+].OP(O)([O-])=O AJPJDKMHJJGVTQ-UHFFFAOYSA-M 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- 229910000162 sodium phosphate Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 230000003245 working effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B28/00—Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements
- C04B28/34—Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements containing cold phosphate binders
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
- C04B2111/20—Resistance against chemical, physical or biological attack
- C04B2111/28—Fire resistance, i.e. materials resistant to accidental fires or high temperatures
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
- C04B2111/90—Electrical properties
- C04B2111/94—Electrically conducting materials
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Ceramic Products (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
Abstract
Description
【0001】技術分野
本発明は、熱伝導性金属を含有してなる、耐火物を基礎
材料とするモルタル組成物に関する。この組成物は高い
熱伝導率を示す。[0001] Technical Field The present invention contains the thermally conductive metal, relates mortar composition to a refractory based material. This composition exhibits high thermal conductivity.
【0002】発明の背景
管のブロックやシールドのような耐火物構造体はしばし
ば、熱風ダクト、温水管、スチーム管を含めた種々の構
造体を熱損失から守るために使用される。ボイラーの熱
風管、スチーム管及び水管も、ボイラーで燃焼された物
質の副生物により引き起こされる腐食を防ぐため、その
ような管のブロックやシールドで保護される。シールド
や管のブロックは、焼却炉や商業用発電所のボイラーに
見られるような高温のボイラーで特に有用である。[0002] refractory structures such as block and shielding BACKGROUND tube invention are often used to protect the hot air ducts, hot water pipe, a variety of structures, including the steam tube from heat loss. Boiler hot air tubes, steam tubes and water tubes are also protected by blocks or shields of such tubes to prevent corrosion caused by by-products of the materials combusted in the boiler. Shields and tube blocks are particularly useful in high temperature boilers such as those found in incinerators and commercial power plant boilers.
【0003】そのようなボイラー管を保護するために用
いられる管ブロックやシールドは、一般に実際の使用時
には約 700℃より高い温度にはさらされないながらも、
炭化ケイ素材料が極めて高い温度(最高1000℃まで)に
耐えることができるため、一般に炭化ケイ素で製作され
る。更に、SiCを基礎材料とする耐火性の管ブロック
やシールドは、ボイラー管の伝熱を結果として良好なも
のにする比較的高い熱伝導率を有する。ボイラー管の中
には標準的に、例えばスチームにスチームタービンを通
過させて発電を行うために使用される、過熱スチームが
入るので、これは重要である。このように、良好な伝熱
は高効率のボイラーの運転を行うために必要とされる。The tube blocks and shields used to protect such boiler tubes are generally not exposed to temperatures above about 700 ° C. in actual use, yet
It is generally made of silicon carbide because silicon carbide materials can withstand extremely high temperatures (up to 1000 ° C). Furthermore, SiC-based refractory tube blocks and shields have a relatively high thermal conductivity which results in good heat transfer in the boiler tube. This is important because some boiler tubes typically contain superheated steam, which is used, for example, to pass steam through a steam turbine to generate electricity. Thus, good heat transfer is required to operate a highly efficient boiler.
【0004】そのような管ブロックやシールドは熱伝導
率が比較的高いとは言え、管ブロック間又はシールド間
の良好な熱の流れは、組み立てられた金属管の壁の製造
上の変動が所望される最高の取付けのために必要とされ
る厳しい公差で耐火性の管ブロック又はシールドを製作
することを許さないので、しばしば得られない。このよ
うに、ブロック又はシールドと金属管との間の熱の流れ
を不十分にする空隙を結果として生じかねない。この不
十分な熱の流れはしばしば、管ブロックや熱シールドの
性能を低下させることになることが分っている。Although such tube blocks and shields have relatively high thermal conductivity, good heat flow between tube blocks or shields is desired due to manufacturing variations in the walls of the assembled metal tubes. It is often not available because it does not allow to make a fire resistant tube block or shield with the tight tolerances required for the best possible installation. As such, voids can result that result in insufficient heat flow between the block or shield and the metal tube. This inadequate heat flow has often been found to reduce the performance of tube blocks and heat shields.
【0005】この問題に対する一つの解決は、耐火物を
基礎材料とするモルタルで空隙を充填することである。
しかしながら、SiCを基礎材料とする従来技術のモル
タルは、最適なものからは程遠い熱の流れに結果として
至る比較的低い熱伝導率を有する。One solution to this problem is to fill the voids with a refractory-based mortar.
However, prior art mortars based on SiC have a relatively low thermal conductivity which results in a heat flow far from optimal.
【0006】例えば、米国特許第 4682568号明細書は、
窒化物結合炭化ケイ素から構成される過熱器管シールド
を開示する。この管シールドと管との間には耐火性のモ
ルタルが配置される。このモルタルは、シールドがボイ
ラー管と接触するのを保つのに役立つ。このモルタル
は、未焼結(green) の炭化ケイ素、アルミン酸カルシウ
ム及び水を含んでなる。米国特許第 4776790号明細書
は、同じ耐火性モルタルの助けでボイラー管に取付けら
れる管シールドを開示する。For example, US Pat. No. 4,682,568 is:
Disclosed is a superheater tube shield composed of nitride bonded silicon carbide. A refractory mortar is placed between the tube shield and the tube. This mortar helps keep the shield in contact with the boiler tube. The mortar comprises green silicon carbide, calcium aluminate and water. U.S. Pat. No. 4,767,790 discloses a tube shield attached to a boiler tube with the aid of the same refractory mortar.
【0007】米国特許第 4561958号明細書は、5〜10%
の水と、75〜85%の炭化ケイ素及び15〜25%の結合剤を
含む約90〜95%の混合物とを含んでなる別のモルタル組
成物を開示し、結合剤はアルミン酸ナトリウム、ケイ酸
ナトリウム及びリン酸ナトリウムでよい。US Pat. No. 4,562,958 is 5-10%
Of water and about 90-95% mixture containing 75-85% silicon carbide and 15-25% binder, wherein the binder is sodium aluminate, silica. Sodium acid and sodium phosphate may be used.
【0008】米国特許第 3470004号明細書は、クロム鉱
石及びマグネシアを含む78〜92%の融解鋳造耐火物粒
子、水溶性ケイ酸ナトリウム可塑剤並びに有機湿潤剤を
含んでなる耐火性モルタルを開示する。US Pat. No. 3470004 discloses a refractory mortar comprising 78-92% fused cast refractory particles containing chromium ore and magnesia, a water soluble sodium silicate plasticizer and an organic wetting agent. .
【0009】これらの従来技術の耐火物を基礎材料とす
るモルタル組成物のおのおのは、どれも伝導性金属粒子
又はモルタルの熱流特性を実質的に上昇させる他の成分
を少しも含有しないという点で本発明の組成物と異な
る。Each of these prior art refractory-based mortar compositions is in that each does not contain any conductive metal particles or other components that substantially enhance the heat flow properties of the mortar. Different from the composition of the present invention.
【0010】発明の概要
本発明は、従来技術のモルタルに付随することが分って
いる熱伝導性が不十分であるという問題を、モルタル組
成物の全体にわたって伝導性金属材料を取入れることに
よって解決する。ここで用いられる「伝導性」という語
は、熱伝導性を意味する。SUMMARY OF THE INVENTION The present invention addresses the problem of poor thermal conductivity known to be associated with prior art mortars by incorporating a conductive metallic material throughout the mortar composition. Solve. As used herein, the term "conductive" means thermally conductive.
【0011】このモルタル組成物は、炭化ケイ素のよう
な耐火性材料と、銅のような伝導性金属と、そして結合
剤とを含んでなる。伝導性金属の存在することが、モル
タルの熱伝導率を約60〜2,000BTU・in/hr・ft2 ・°F
(740〜24,800kcal・cm/hr・m2 ・℃)に上昇させる。
伝導性金属を含まない同様の耐火性組成物の熱伝導率
は、一般に約33BTU ・in/hr・ft2 ・°F(410kcal・cm
/hr・m2 ・℃)に過ぎない。最良の結果は、伝導性材
料がモルタル組成物の全体にわたって均一に分散される
場合に得られる。この組成物は、ボイラー管のシールド
やブロックのような耐火性構造体をボイラー管集成体へ
結合させるのに特に有効である。The mortar composition comprises a refractory material such as silicon carbide, a conductive metal such as copper, and a binder. The presence of a conductive metal causes the thermal conductivity of mortar to be about 60 to 2,000 BTU · in / hr · ft 2 · ° F.
(740 to 24,800 kcal · cm / hr · m 2 · ° C).
The thermal conductivity of similar refractory compositions that do not contain conductive metals is generally about 33 BTU · in / hr · ft 2 · ° F (410 kcal · cm
/ Hr · m 2 · ° C). Best results are obtained when the conductive material is uniformly dispersed throughout the mortar composition. The composition is particularly effective for bonding refractory structures such as boiler tube shields and blocks to boiler tube assemblies.
【0012】好ましい態様の説明
本発明の組成物は一般に、耐火性材料、伝導性金属及び
結合剤を含んでなる。この組成物はまた、有機可塑剤及
び充填剤を含有してもよい。 Description of the Preferred Embodiments The compositions of the present invention generally comprise a refractory material, a conductive metal and a binder. The composition may also contain organic plasticizers and fillers.
【0013】ここで有用な耐火性材料には、炭化ケイ
素、窒化ケイ素及び窒化アルミニウムが含められる。と
は言うものの、経費の考慮から、また炭化ケイ素(Si
C)モルタル組成物は炭化ケイ素の耐火性管ブロック又
はシールドを金属のボイラー管集成体に結合させるのに
特に効果的であるため、現在のところは炭化ケイ素(S
iC)が好ましい。モルタルの耐火性材料成分は、管ブ
ロック又はシールドのために用いられる耐火性材料と同
じであるか、又は少なくとも匹敵できることが最も望ま
しい。これは、モルタルが実際のボイラーや炉の運転中
に高温にさらされる際に何らかの有意量の液体物質が生
成するのを防ぐのに役立つ。耐火性材料は一般に、乾燥
モルタル組成物の総重量を基準にして、約5〜90%の量
で、より好ましくは約40〜75%の量で、最も好ましくは
約50〜65%の量で使用される。Refractory materials useful herein include silicon carbide, silicon nitride and aluminum nitride. However, due to cost considerations, silicon carbide (Si
C) Mortar compositions are currently particularly effective at bonding silicon carbide refractory tube blocks or shields to metallic boiler tube assemblies and, as such, are currently available.
iC) is preferred. Most preferably, the refractory material component of the mortar is the same as, or at least comparable to, the refractory material used for the tube block or shield. This helps to prevent the formation of any significant amount of liquid material when the mortar is exposed to high temperatures during actual boiler or furnace operation. The refractory material is generally in an amount of about 5-90%, more preferably about 40-75%, most preferably about 50-65%, based on the total weight of the dry mortar composition. used.
【0014】伝導性金属は、好ましくは、銅又は銅合
金、例えばキュプロニッケル(およそCu 65〜80%、N
i 35〜20%) 、リン青銅、及びモネル (およそNi 70
%、Cu30%) の如きものであるが、そうは言っても他
の伝導性金属、例えば銀、金、ニッケル、インコネル、
ニクロム、モリブデン、タングステン、ニオブ及びタン
タル、又はそれらの合金もしくは混合物のようなものを
使用してもよい。伝導性金属は一般に、粒度約 300μm
未満の金属粒子又はフレークの形で存在する。伝導性金
属は、乾燥モルタル組成物の総重量の約5〜90%の量
で、より好ましくは約10〜60%の量で、最も好ましくは
約20〜40%の量で存在する。The conductive metal is preferably copper or a copper alloy such as cupronickel (approximately Cu 65-80%, N 2.
i 35-20%), phosphor bronze, and monel (approximately Ni 70
%, Cu30%), but with that said other conductive metals such as silver, gold, nickel, inconel,
Materials such as nichrome, molybdenum, tungsten, niobium and tantalum, or alloys or mixtures thereof may be used. Conductive metals generally have a particle size of about 300 μm
Present in the form of less than metallic particles or flakes. The conductive metal is present in an amount of about 5 to 90% of the total weight of the dry mortar composition, more preferably about 10 to 60%, most preferably about 20 to 40%.
【0015】使用される結合剤は、好ましくはリン酸モ
ノアルミニウム、オルトリン酸アルミニウム、リン酸、
アルカリ金属リン酸塩、又はアルカリ土類金属リン酸塩
のような可溶性リン酸塩である。ここで有用なそのほか
の適当な結合剤には、ケイ酸ナトリウム、ケイ酸カリウ
ム及びアルミン酸カルシウムセメントが含められる。結
合剤がリン酸塩である場合、それは一般的には、乾燥モ
ルタル組成物の総重量の約1〜10%の量で、より好まし
くは約2〜8%の量で、最も好ましくは約3〜7%の量
で存在する。結合剤がケイ酸塩である場合、それは一般
的には、約1〜5%の量で存在する。結合剤がアルミン
酸カルシウムセメントである場合、それは一般的には、
約2〜30%の量で存在する。乾燥粉末の代りに液体のリ
ン酸塩結合剤を利用する場合には、それは一般に、水を
加える前の全混合物の重量で表して約1〜6%、好まし
くは約2〜4%のP2O5含有量になるべきである。The binder used is preferably monoaluminum phosphate, aluminum orthophosphate, phosphoric acid,
Soluble phosphates such as alkali metal phosphates or alkaline earth metal phosphates. Other suitable binders useful herein include sodium silicate, potassium silicate and calcium aluminate cement. When the binder is a phosphate, it is generally in an amount of about 1-10%, more preferably about 2-8%, most preferably about 3% by total weight of the dry mortar composition. Present in an amount of ~ 7%. When the binder is a silicate, it is generally present in an amount of about 1-5%. If the binder is calcium aluminate cement, it generally
It is present in an amount of about 2-30%. When a liquid phosphate binder is utilized instead of a dry powder, it is generally about 1-6%, preferably about 2-4% P 2 by weight of the total mixture prior to the addition of water. It should have an O 5 content.
【0016】組成物に加えてもよいそのほかの材料に
は、微細なシリカ、ベントナイトやボールクレーのよう
な粘土、及び微細なアルミナが含められる。「微細な」
とは、粒子が平均粒度で約44μmよりも一般に小さいこ
とを意味する。これらの材料は一般に、最高で約10%ま
で、より好ましくは最高で約8%までの量で存在する。
シリカ及びアルミナは、モルタルの使用中に経験される
高温で発現する実際の結合の一部になる。粘土は可塑性
を高めるが、モルタル組成物中に存在しているいずれの
自由なアルミナ、シリカ又はリン酸塩とも反応し、かく
して耐火性結合の一部になることもできる。このよう
に、これらの添加剤は全て、モルタルが操作に供されそ
して高温すなわち最高約 700℃までの温度にさらされる
と結合の発現を強めるのに役立つ。Other materials that may be added to the composition include finely divided silica, clays such as bentonite and ball clay, and finely divided alumina. "Fine"
By means that the particles are generally smaller than about 44 μm in average particle size. These materials are generally present in amounts up to about 10%, more preferably up to about 8%.
Silica and alumina become part of the actual bond developed at the elevated temperatures experienced during mortar use. While clay enhances plasticity, it can also react with any free alumina, silica or phosphate present in the mortar composition and thus become part of the refractory bond. Thus, all of these additives serve to enhance the bond development when the mortar is subjected to operation and exposed to elevated temperatures, ie up to about 700 ° C.
【0017】有機の可塑剤も、モルタルの付着性はもち
ろんこて塗り適性をも増大させるために組成物中に存在
することができる。適当な有機可塑剤には、例えば、メ
チルセルロース、リグノスルホン酸ナトリウム又はカル
シウム、デキストリン、及びポリアクリレートが含めら
れ、現在のところメチルセルロース及びリグノスルホン
酸塩が好ましい。有機可塑剤は一般には、乾燥モルタル
組成物の約5%までの量で、より好ましくは約1〜3重
量%の量で存在する。Organic plasticizers may also be present in the composition to increase trowel suitability as well as mortar adhesion. Suitable organic plasticizers include, for example, methylcellulose, sodium or calcium lignosulfonates, dextrins, and polyacrylates, with methylcellulose and lignosulfonates being presently preferred. The organic plasticizer is generally present in an amount up to about 5% of the dry mortar composition, more preferably about 1 to 3% by weight.
【0018】モルタル組成物は、初めに乾燥した成分を
適当な混合装置で混ぜ合わせて均一混合物を作り、それ
からいずれかの液体成分を加え、そして次にこの混合物
へ水を加えて調製される。乾燥した成分は、任意の適当
なドライブレンダー、例えばホバートランドキャスター
(Hobart Landcaster) ブレンダー、マラー(Muller)ブレ
ンダー、エリッチ(Erich) ブレンダーや、他の同様のも
ので混合することができる。この乾燥混合物は、後に、
もしもあるならば液体成分と、そして水を加えるために
貯蔵することができる。液体成分、例えば液体リン酸塩
結合剤源を使用する場合には、それは乾燥した成分を初
めに混合する時にこれらの乾燥した成分に加えることが
でき、そしてこの混合物は、後に水を加えそして実際に
使用するに至るまでシールされた防湿性の容器に貯蔵さ
れる。あるいはまた、液体成分は実際に使用する時点で
水と一緒に加えることができる。これを行う場合、モル
タルの作業特性を向上させる可溶性成分の完全な混合及
び溶解を確実にするため、好ましくは混合物を約15〜60
分間放置してから、実際に使用する前に再び混合する。
やはり別法として、液体成分は水と同時に加え、均質混
合物が作られるまで混合する(一般に約5〜10分) こと
ができ、結果として得られた使用する用意のできた耐火
性モルタル混合物を実際に使用するまでシールされた防
湿性容器に貯蔵することができる。水は、それを加える
時点では一般に約60°F(15.6℃) より高い温度、好ま
しくは約70〜90°F(21.1〜32.2℃) の温度であるべき
である。使用すべき水の量は、モルタルの所望される特
定の物理的コンシステンシーに主としてよるとは言うも
のの、一般には、乾燥したモルタルの重量の約5〜20
%、好ましくは約8〜10%の範囲であろう。The mortar composition is prepared by first mixing the dry ingredients in a suitable mixing device to form a homogeneous mixture, then adding any liquid ingredients and then adding water to the mixture. Dried ingredients may be dried in any suitable dry blender, such as Hobartland Castors.
(Hobart Landcaster) Blender, Muller blender, Erich blender, and the like can be mixed. This dry mixture is later
It can be stored with liquid ingredients, if any, and water. If a liquid ingredient, such as a liquid phosphate binder source, is used, it can be added to these dry ingredients when first mixing the dry ingredients, and this mixture is later added with water and It is stored in a sealed moisture-proof container until use. Alternatively, the liquid component can be added with water at the point of actual use. If this is done, the mixture is preferably about 15-60 to ensure complete mixing and dissolution of the soluble components, which improves the working properties of the mortar.
Let stand for a minute and then mix again before actually using.
Alternatively, the liquid components can be added simultaneously with the water and mixed until a homogeneous mixture is formed (generally about 5-10 minutes), and the resulting ready-to-use refractory mortar mixture is actually used. It can be stored in a sealed moisture-proof container until use. The water should generally be at a temperature above about 60 ° F (15.6 ° C), preferably about 70-90 ° F (21.1-32.2 ° C) at the time it is added. Although the amount of water to be used depends primarily on the particular physical consistency desired of the mortar, it is generally about 5-20% by weight of the dried mortar.
%, Preferably in the range of about 8-10%.
【0019】次に、具体的な例に関して本発明を説明す
る。これらの例において、部数及び百分率は、別段の明
示がない限りは重量によるものである。The present invention will now be described with respect to specific examples. In these examples, parts and percentages are by weight unless otherwise stated.
【0020】例1
57部の炭化ケイ素粒子(300μm未満) 、30部の銅粒子(2
00μm未満) 、5部のボールクレー粒子、5部の乾燥リ
ン酸モノアルミニウム、0.15部のアルミナ粒子(45μm
未満) 、0.85部のシリカ粒子 (10μm未満) 、1.5部の
リグノスルホン酸カルシウム及び0.5部のメチルセルロ
ースの乾燥混合物を、均一になるまでミキサーでドライ
ブレンドする。室温で9部の水を加えて10分間混合す
る。このモルタルを30分間放置し、そして使用する直前
に再び混合する。 Example 1 57 parts of silicon carbide particles (less than 300 μm), 30 parts of copper particles (2
(Less than 00 μm), 5 parts ball clay particles, 5 parts dry monoaluminum phosphate, 0.15 parts alumina particles (45 μm
Dry blend of 0.85 parts of silica particles (less than 10 μm), 1.5 parts of calcium lignosulfonate and 0.5 parts of methylcellulose in a mixer until uniform. Add 9 parts of water at room temperature and mix for 10 minutes. The mortar is left for 30 minutes and mixed again just before use.
【0021】結果として得られた耐火性モルタルは、乾
燥させて固体にした後に3.00g/ccの密度を有する。熱
伝導率は270BTU・in/hr・ft2 ・°F (3350kcal・cm/
hr・m2 ・℃)である。The resulting refractory mortar has a density of 3.00 g / cc after drying to a solid. Thermal conductivity is 270 BTU ・ in / hr ・ ft 2・ ° F (3350 kcal ・ cm /
hr · m 2 · ° C).
【0022】比較例A
銅粒子を省略し、そして同等の量の追加の炭化ケイ素粒
子と取り替えることを除いて、例1の手順を繰返す。結
果として得られた耐火性モルタルは、 33BTU・in/hr・
ft2 ・°F(410kcal・cm/hr・m2 ・℃)の熱伝導率を
示す。 Comparative Example A The procedure of Example 1 is repeated except that the copper particles are omitted and replaced with an equivalent amount of additional silicon carbide particles. The resulting refractory mortar is 33 BTU · in / hr ·
It shows the thermal conductivity of ft 2 · ° F (410kcal · cm / hr · m 2 · ° C).
【0023】例2
例1の手順を繰返して本発明の別の耐火性モルタル組成
物を製造する。これらの組成は次に示すとおりである。 Example 2 The procedure of Example 1 is repeated to produce another refractory mortar composition of the present invention. Their compositions are as shown below.
【0024】[0024]
【表1】 [Table 1]
【0025】組成物Aの密度は2.77g/cc、熱伝導率は
92BTU・in/hr・ft2 ・°F (1140kcal・cm/hr・m2
・℃)である。組成物Bの密度は2.65g/cc、熱伝導率
は60BTU ・in/hr・ft2 ・°F(740kcal・cm/hr・m2
・℃)である。Composition A has a density of 2.77 g / cc and a thermal conductivity of
92 BTU ・ in / hr ・ ft 2・ ° F (1140kcal ・ cm / hr ・ m 2
・ C). Composition B has a density of 2.65 g / cc and a thermal conductivity of 60 BTU-in / hr-ft 2- ° F (740 kcal-cm / hr-m 2
・ C).
─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成3年6月11日[Submission date] June 11, 1991
【手続補正1】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】請求項16[Name of item to be corrected] Claim 16
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【手続補正2】[Procedure Amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】請求項17[Name of item to be corrected] Claim 17
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【手続補正3】[Procedure 3]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】請求項18[Name of item to be corrected] Claim 18
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 C04B 35/66 T 7305−4G (72)発明者 ドナルド ケー.ジヨンソン アメリカ合衆国,マサチユーセツツ 01520,ホールデン,ドイル ロード 193─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Internal reference number FI Technical indication location C04B 35/66 T 7305-4G (72) Inventor Donald K. Ji Young Son USA, Masachi Youtsutsu 01520, Holden, Doyle Road 193
Claims (20)
んでなる組成物。1. A composition comprising a refractory material, a conductive metal and a binder.
たって均一に分散されている、請求項1記載の組成物。2. The composition of claim 1, wherein the conductive metal is uniformly dispersed throughout the composition.
ル、モリブデン、タングステン、ニオブ及びタンタル、
並びにそれらの合金及び混合物からなる群より選択され
る、請求項1記載の組成物。3. The conductive metal is copper, silver, gold, nickel, molybdenum, tungsten, niobium and tantalum,
And the composition of claim 1 selected from the group consisting of and alloys and mixtures thereof.
Cu 及び35〜20%のNi を含有してなるキュプロニッケ
ル、リン青銅、並びに約70%のNi 及び30%のCu を含
有してなるモネル(Monel、商標) からなる群より選択さ
れる銅合金である、請求項1記載の組成物。4. The conductive metal is copper or cupronickel containing about 65-80% Cu and 35-20% Ni, phosphor bronze, and about 70% Ni and 30% Cu. The composition of claim 1 which is a copper alloy selected from the group consisting of: Monel (TM).
を有する粒子の形で存在している、請求項1記載の組成
物。5. The composition of claim 1, wherein the conductive metal is present in the form of particles having a particle size of less than about 300 μm.
素及び窒化アルミニウムからなる群から選ばれる、請求
項1記載の組成物。6. The composition of claim 1, wherein the refractory material is selected from the group consisting of silicon carbide, silicon nitride and aluminum nitride.
求項1記載の組成物。7. The composition of claim 1, wherein the refractory material is silicon carbide.
請求項1記載の組成物。8. The binder is a phosphate-based material,
The composition of claim 1.
ウム、オルトリン酸アルミニウム及びリン酸からなる群
より選ばれる、請求項8記載の組成物。9. The composition of claim 8 wherein said phosphate material is selected from the group consisting of monoaluminum phosphate, aluminum orthophosphate and phosphoric acid.
の組成物。10. The composition of claim 1, further comprising a filler.
びそれらの混合物からなる群より選択される、請求項10
記載の組成物。11. The filler is selected from the group consisting of alumina, silica, clay and mixtures thereof.
The composition as described.
存在している、請求項10記載の組成物。12. The composition of claim 10, wherein the filler is present in an amount up to about 10% by weight.
記載の組成物。13. The method of claim 1, further comprising an organic plasticizer.
The composition as described.
グノスルホン酸ナトリウム又はカルシウム、デキストリ
ン、ポリアクリレート重合体及びそれらの混合物からな
る群より選ばれる、請求項13記載の組成物。14. The composition of claim 13, wherein the organic plasticizer is selected from the group consisting of methyl cellulose, sodium or calcium lignosulfonate, dextrin, polyacrylate polymers and mixtures thereof.
存在している、請求項13記載の組成物。15. The composition of claim 13, wherein the organic plasticizer is present in an amount of about 1-5% by weight.
総重量を基準にして約5〜90重量%の量で存在し、前記
伝導性金属が耐火性材料及び金属の総重量を基準にして
約5〜90重量%の量で存在し、そして前記結合剤が当該
組成物を耐火性モルタルにするのに十分な量で存在して
いる、請求項1記載の組成物。16. The refractory material is present in an amount of about 5 to 90% by weight, based on the total weight of the refractory material and the metal, and the conductive metal is based on the total weight of the refractory material and the metal. The composition of claim 1 wherein said binder is present in an amount of about 5-90% by weight and said binder is present in an amount sufficient to render said composition a refractory mortar.
総重量を基準にして約40〜75重量%の量で存在し、前記
伝導性金属が耐火性材料及び金属の総重量を基準にして
約10〜60重量%の量で存在し、そして前記結合剤が当該
組成物を耐火性モルタルにするのに十分な量で存在して
いる、請求項1記載の組成物。17. The refractory material is present in an amount of about 40-75 wt% based on the total weight of the refractory material and the metal, and the conductive metal is based on the total weight of the refractory material and the metal. The composition of claim 1 wherein the binder is present in an amount of about 10 to 60% by weight and the binder is present in an amount sufficient to render the composition a refractory mortar.
総重量を基準にして約50〜65重量%の量で存在し、前記
伝導性金属が耐火性材料及び金属の総重量を基準にして
約20〜40重量%の量で存在し、そして前記結合剤が当該
組成物を耐火性モルタルにするのに十分な量で存在して
いる、請求項1記載の組成物。18. The refractory material is present in an amount of about 50-65% by weight, based on the total weight of the refractory material and the metal, and the conductive metal is based on the total weight of the refractory material and the metal. The composition of claim 1 wherein the binder is present in an amount of about 20-40% by weight and the binder is present in an amount sufficient to render the composition a refractory mortar.
る金属合金であり、且つ前記耐火性材料が炭化ケイ素で
ある、請求項1記載の組成物。19. The composition according to claim 1, wherein the conductive metal is copper or a metal alloy containing copper, and the refractory material is silicon carbide.
合金、約5部のリン酸モノアルミニウム、約0.15部の微
細なアルミナ、約0.85部の微細なシリカ、約5部の粘
土、約1.5部のリグノスルホン酸カルシウム、及び約0.
5部のメチルセルロースを含んでなる組成物。20. About 57 parts silicon carbide, about 30 parts copper or copper alloy, about 5 parts monoaluminum phosphate, about 0.15 parts fine alumina, about 0.85 parts fine silica, about 5 parts. Clay, about 1.5 parts calcium lignosulfonate, and about 0.
A composition comprising 5 parts of methyl cellulose.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US49850690A | 1990-03-26 | 1990-03-26 | |
| US498506 | 1990-03-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH054874A true JPH054874A (en) | 1993-01-14 |
Family
ID=23981374
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3061972A Pending JPH054874A (en) | 1990-03-26 | 1991-03-26 | Fire resisting mortar composition |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH054874A (en) |
| DE (1) | DE4109916A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006306629A (en) * | 2005-04-26 | 2006-11-09 | Kurosaki Harima Corp | Granulated slag production equipment |
| JP2013527827A (en) * | 2010-03-23 | 2013-07-04 | ステラ マテリアルズ インコーポレイテッド | Refractory composition and method of forming an article therefrom |
| KR102613467B1 (en) * | 2022-11-09 | 2023-12-14 | 우리기술 주식회사 | Warning system for heating pavement |
| KR20240170261A (en) * | 2023-05-26 | 2024-12-03 | 우리기술 주식회사 | Warning system for heating pavement using thermal imaging camera |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2721601B1 (en) * | 1994-06-24 | 1996-08-14 | Rhone Poulenc Chimie | Cements comprising polysaccharides, vegetable proteins and its method of preparation. |
| DE102012014225B4 (en) * | 2012-07-10 | 2014-12-18 | Sepp Zeug GmbH & Co. KG | Adhesive for highly porous ceramics |
| EP2981513B1 (en) * | 2013-04-03 | 2019-03-06 | Dinex A/S | Honey comb assembly |
| CN109369090B (en) * | 2018-12-07 | 2022-04-29 | 江苏博拓新型建筑材料有限公司 | Assembled concrete member prepared from nickel slag ceramsite |
| DE102019001214A1 (en) * | 2019-02-20 | 2020-08-20 | Intocast Ag | Refractory compounds and binders therefor, processes for their production and use |
| WO2020169772A2 (en) | 2019-02-20 | 2020-08-27 | Intocast Ag | Refractory compound and binder therefor, method for the production and use thereof |
-
1991
- 1991-03-26 JP JP3061972A patent/JPH054874A/en active Pending
- 1991-03-26 DE DE19914109916 patent/DE4109916A1/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006306629A (en) * | 2005-04-26 | 2006-11-09 | Kurosaki Harima Corp | Granulated slag production equipment |
| JP2013527827A (en) * | 2010-03-23 | 2013-07-04 | ステラ マテリアルズ インコーポレイテッド | Refractory composition and method of forming an article therefrom |
| KR102613467B1 (en) * | 2022-11-09 | 2023-12-14 | 우리기술 주식회사 | Warning system for heating pavement |
| KR20240170261A (en) * | 2023-05-26 | 2024-12-03 | 우리기술 주식회사 | Warning system for heating pavement using thermal imaging camera |
Also Published As
| Publication number | Publication date |
|---|---|
| DE4109916A1 (en) | 1991-10-02 |
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