JPH0543994B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a magnetoelectric transducer using a Hall chip, a magnetoresistive chip, or the like using a semiconductor material.

[Prior Art] Recently, there has been a growing trend to use Hall elements to control the rotation of DC motors. This type of DD motor uses two to three Hall elements mounted on a substrate in a predetermined positional relationship.

Conventionally, a method has been used in which Hall elements are mounted one by one on a board having printed wiring, and the lead wires of the Hall elements are soldered to the printed wiring.

[Problems to be Solved by the Invention] However, with this method, firstly, there is a drawback that the Hall element cannot be installed in a narrow place where printed wiring is routed due to the restriction of lead wires, and two to three Considerable effort is required for mutual positioning when using individual Hall elements.

Secondly, the mounting error between the plurality of Hall elements becomes an error in detecting the magnetic pole position of the magnet rotor, which greatly affects the performance of the DD motor. Therefore, conventional methods cannot provide satisfactory performance.

The present invention has been made in view of the above points, and provides a magnetoelectric conversion device in which a magnetoelectric conversion chip is directly connected to printed wiring without using lead wires or the like.

[Means for Solving the Problems] The present invention is configured as follows. That is, a through hole is formed in an insulating substrate that passes through the substrate, a printed wiring is formed on the substrate, and a joint is formed by extending the printed wiring to protrude into the through hole. A through hole is formed in the part, a magnetoelectric conversion chip formed on a substrate is inserted into the through hole, and the electrode of this chip is directly connected to the joint part.

[Function] A through hole corresponding to the size of the chip is bored in the insulating substrate at a position where a magnetoelectric conversion chip such as a Hall chip or a magnetoresistive chip is to be inserted. For example, copper foil is bonded onto the insulating substrate provided with the through holes and etched into a predetermined wiring pattern to form printed wiring. In this case, a printed wiring whose tip protrudes into the through hole is provided, and the portion that protrudes into the through hole becomes a joint.

When the magnetoelectric conversion chip is inserted into the through hole, its electrodes and joints are directly connected by means such as bonding, and lead wires or the like are not used to connect the magnetoelectric conversion chip and the printed wiring.

[Example] Hereinafter, an example of the apparatus of the present invention will be described in detail. FIG. 1 is a plan view of a magnetoelectric transducer, showing an example in which two Hall chips are used. Insulating substrate, such as epoxy resin or phenol resin, thickness 0.5 to 3
Through-holes 2 and 3 are punched out at predetermined positions on the substrate 1, each having a diameter of approximately 1.0 mm, into which hole chips are inserted. In this case, a through hole 4 for fixing the board 1 to a motor (not shown),
5 is similarly formed by punching, and these through holes 4, 5
The positions of the through holes 2 and 3 are precisely positioned with reference to . Copper foil having a thickness of approximately 35 to 100 μm is adhered to the substrate 1 provided with the through holes 2 and 3 and the through holes 4 and 5 with an adhesive, for example, an epoxy adhesive, and the wiring portion 6 is formed using a known photoetching technique. ,7,8,9,
10, 11, 12 and terminal parts 6a, 7a, 8a, 9
a, 10a, 11a, 12a and joint parts 6b, 7b, 8b, 9b, 10 protruding into the through holes 2, 3
b, 11b, and 12b are formed. In this case, since the adhesive is applied to the substrate 1, the bonding parts 6b to 12
No adhesive adheres to the part b, allowing smooth bonding to the electrodes of the hole chip.

In addition, in the drawing, the terminal portions 6a to 6a are connected from the through holes 2 and 3.
Although only the wiring up to 12a is shown, wiring can be provided to attach resistors, capacitors, transistors, ICs, etc. to the substrate 1.

Figure 2 shows an enlarged view of the through holes 2 and 3 in Figure 1.
Insert 3. Hall chip 13 is made of InSb on a substrate made of ferrite or glass.
A Hall element that has a magnetically sensitive part made of a semiconductor such as InAs, and does not have lead wires or lead frames. The hole chip 13 is inserted from the side of the substrate 1 that does not have the printed wirings 6 to 12 with the semiconductor portion of the hole chip 13 facing into the through holes 2 and 3, and electrodes, that is, current electrodes 14 on which a metal such as In is vapor-deposited, 1
5 and hole electrodes 16 and 17 with printed wiring 6 to 9
The bonding portions 6b to 9b are brought into contact with each of the electrodes 14 to 17 by sequentially bonding from above the bonding portions. The hole chip 13 is fixed to the substrate 1 by this bonding, but if necessary, the through holes 2 and 3 are molded with epoxy resin or the like from the viewpoint of improving reliability. Heat shield holes 6c, 7c, 8c, and 9c are provided at the joints 6b to 9b of the printed wirings 6 to 9. A portion of this through hole overlaps with a through hole 2 provided in the substrate 1. That is, the bonding portions 6b to 9b are connected to the printed wiring 6.
Two branch pieces 61b, 62b, 7 from the end of ~9
1b, 72b, 81b, 82b, 91b, 92b
extends into the through hole 2, and between each pair of branch pieces 61b and 62b, 71b and 72b, 81b and 82b, 91
b and 92b have joint pieces 63b, 73b, 83b,
93b.

With this configuration, the hole chip 13 can be connected to the joint portion 6b.
When bonding the bonding pieces 63b to 93b of ~9b, the amount of heat transferred in the direction of the printed wirings 6 to 9 is limited by the branch pieces 61b to 92b, so that the heat balance during bonding is improved. Moreover, since excess molten metal, such as solder material, during bonding is accommodated in the through holes 6c to 9c, there is no risk of the solder material overflowing into the magnetically sensitive portion 18 and degrading the performance of the hole chip 13.

Although the above example uses two hole chips, the same applies to the case of one hole chip or the case of three to four hole chips.

In addition, in the case of a low magnetic field, a magnetic piece is pasted from above the tip to the magnetic sensing part 18 of the hole chip in order to increase the output sensitivity.

In the above embodiment, a hole chip was described, but a similar configuration can be made using a magnetoresistive chip. In this case, the wiring and the bonding portion are formed to match the element.

[Effects of the Invention] Since the present invention is configured as described above, it has the following effects.

(1) Magnetoelectric conversion chips do not require lead wires or lead frames at all, and are connected directly to printed wiring and continuous joints, which not only significantly reduces the work required to attach magnetoelectric conversion chips to the board; Since the occurrence of defects due to soldering work is significantly reduced, yields are improved and
Since there is no need for lead wires, an inexpensive device can be obtained.
It also improves productivity.

(2) Since the through hole is provided at the joint part that protrudes into the through hole of the board, the heat during bonding is difficult to escape to the printed wiring, and bonding can be performed well.

[Brief explanation of the drawing]

FIG. 1 is a plan view of the magnetoelectric transducer of the present invention, and FIG. 2 is an enlarged view of the through-hole portion of FIG. 1. In the figure, 1 is the board, 6 to 12 are printed wiring, 6
b to 12b are joint parts, 13 is a hole chip, 2,
3 is a through hole.

Claims (1)

[Claims] 1 forming a through hole penetrating the insulating substrate,
Forming printed wiring on the substrate,
A printed wiring is extended to provide a joint portion protruding into the through hole, a through hole is formed in the joint portion, and a magnetoelectric conversion chip formed on a substrate is inserted into the through hole. . A magnetoelectric transducer characterized in that the electrode of the chip is directly connected to the joint.