JPH05312900A - Positioning device for test head - Google Patents
Positioning device for test headInfo
- Publication number
- JPH05312900A JPH05312900A JP3068844A JP6884491A JPH05312900A JP H05312900 A JPH05312900 A JP H05312900A JP 3068844 A JP3068844 A JP 3068844A JP 6884491 A JP6884491 A JP 6884491A JP H05312900 A JPH05312900 A JP H05312900A
- Authority
- JP
- Japan
- Prior art keywords
- test head
- positioning
- dut
- board
- dut board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 41
- 239000000523 sample Substances 0.000 claims abstract description 31
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 238000005259 measurement Methods 0.000 claims description 2
- 238000009423 ventilation Methods 0.000 description 9
- 238000005192 partition Methods 0.000 description 6
- 230000007246 mechanism Effects 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 230000003014 reinforcing effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 230000010485 coping Effects 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は半導体デバイス等のテス
トを行うためのテストシステムと被測定デバイス(DU
T)とのインターフェイスであるテストヘッドに対する
DUTボードの位置決め装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a test system and a device under test (DU) for testing semiconductor devices and the like.
The present invention relates to a positioning device for a DUT board with respect to a test head which is an interface with T).
【0002】[0002]
【従来の技術】テストヘッドには,コンタクトプローブ
を備えた多数のピンボードが実装され,このコンタクト
プローブによってDUTを搭載したDUTボードとの接
触がなされる。すなわち,コンタクトプローブの先端部
にDUTボードに形成した導電パッドを接触させること
によって,DUTとテストヘッドの接続を実現してお
り,この場合に,コンタクトプローブと導電パッドとの
位置決めが充分になされる必要がある。2. Description of the Related Art A large number of pin boards equipped with contact probes are mounted on a test head, and the contact probes make contact with a DUT board equipped with a DUT. That is, by connecting the conductive pad formed on the DUT board to the tip of the contact probe, the connection between the DUT and the test head is realized. In this case, the contact probe and the conductive pad are sufficiently positioned. There is a need.
【0003】従来のテストヘッドでは,図11に示すよ
うに,テストヘッド筐体20に固定された円筒形状のシ
リンダ21にピンボード22を固定し,また,筐体20
上面に取り付けられる上部カバー23に位置決めピン2
4を設けてある。一方,DUTボード10は,DUTボ
ードアダプタ25に装着されてテストヘッドに実装され
るわけであるが,DUTボードアダプタ25には孔25
aが形成され,位置決めピン24に嵌合するようにさ
れ,コンタクトプローブとDUTボードとの位置決めを
実現している。In a conventional test head, as shown in FIG. 11, a pinboard 22 is fixed to a cylindrical cylinder 21 fixed to a test head housing 20, and the housing 20 is fixed.
The positioning pin 2 is attached to the upper cover 23 attached to the upper surface.
4 is provided. On the other hand, the DUT board 10 is mounted on the DUT board adapter 25 and mounted on the test head.
a is formed and is fitted to the positioning pin 24, thereby realizing the positioning between the contact probe and the DUT board.
【0004】[0004]
【発明が解決しようとする課題】上記従来の構造におい
ては,コンタクトプローブ(通称,ポゴピン)先端部と
導電パッドとの位置精度は,上記各部品の設計寸法誤差
および組立て寸法誤差によって影響を受け,その寸法誤
差によって決定されることとなる。そのため,従来にお
いては,充分な位置精度が得られず,導電パッドの直径
を大きく取ることによって,これに対処していた。しか
し,近年のLSIの高密度化に伴なうコンタクトプロー
ブのピン数の増加によって,各コンタクトプローブのピ
ン間の距離が狭くなり,導電パッドの直径を小さく取る
必要が生じてきた。また一方,半導体デバイスのテスト
に当たっては,そのデバイスの用途に応じて,高い周波
数のアナログ信号を与えたりあるいはデジタル信号を与
えたりする必要があることから,ピンボードのプローブ
の配置や本数が異なり(単線用や同軸線用など),その
目的に応じてた仕様にプローブの種類をあらかじめ設定
するか,あるいは互換性を持たせるために必要以上の多
種のプローブをあらかじめ取り付け設置する必要があっ
た.In the above conventional structure, the positional accuracy of the contact probe (commonly known as pogo pin) tip and the conductive pad is affected by the design dimensional error and the assembly dimensional error of each of the above parts, It will be determined by the dimensional error. Therefore, in the past, sufficient positional accuracy could not be obtained, and this was dealt with by increasing the diameter of the conductive pad. However, due to the increase in the number of contact probe pins accompanying the recent increase in density of LSIs, the distance between the pins of each contact probe has become narrower, and it has become necessary to reduce the diameter of the conductive pad. On the other hand, when testing a semiconductor device, it is necessary to give a high-frequency analog signal or a digital signal depending on the application of the device, so that the pinboard probe arrangement and the number are different ( It was necessary to set the type of probe in advance according to the purpose according to its purpose (for single wire or coaxial wire, etc.), or to attach and install more than necessary various kinds of probes in advance in order to make them compatible.
【0005】本発明は,上記従来の課題を解決するため
になされたものであり,テストヘッドに対するDUTボ
ードの実装位置精度を高めて,コンタクトプローブの多
ピン化に対応できるテストヘッドを提供することを目的
としている。また本発明は,プローブの交換を簡単な構
造で容易にできるようにし,測定される半導体デバイス
の用途に応じた,適切なプローブの取り付けを容易にで
きるようにしたテストヘッドを提供することを目的とし
ている。The present invention has been made to solve the above-mentioned conventional problems, and provides a test head capable of increasing the mounting position accuracy of the DUT board with respect to the test head and coping with the increase in the pin count of the contact probe. It is an object. Another object of the present invention is to provide a test head that facilitates probe replacement with a simple structure and facilitates appropriate probe attachment depending on the intended use of the semiconductor device to be measured. I am trying.
【0006】[0006]
【課題を解決するための手段】上記目的を達成するため
本発明のテストヘッドにおける位置決め装置は,(イ)
テストヘッドのDUTボード装着部に,DUTボードを
受ける位置決め部材を固定し,(ロ)上記位置決め部材
は,ピンボードに接続した端子ブロックを嵌合して,そ
のコンタクトプローブをDUTボード装着面側へ突出さ
せるブロック受け部を有し,(ハ)上記位置決め部材
は,DUTボード装着面側に位置決めピンを突設し,
(ニ)DUTボード側の上記位置決めピンに対応する位
置に,該位置決めピンに嵌合する嵌合孔を形成すること
を特徴とする。In order to achieve the above object, a positioning device for a test head according to the present invention is (a)
A positioning member for receiving the DUT board is fixed to the DUT board mounting portion of the test head, and (b) the positioning member is fitted with the terminal block connected to the pin board, and the contact probe is attached to the DUT board mounting surface side. (C) The positioning member has a positioning pin protruding from the mounting surface side of the DUT board.
(D) It is characterized in that a fitting hole for fitting the positioning pin is formed at a position corresponding to the positioning pin on the DUT board side.
【0007】この場合において,(イ)端子ブロック
は,ブロック受け部への挿入方向に沿ってガイド突起を
有し,上記ブロック受け部は,該ガイド突起と係合する
ガイド溝を有し,(ロ)上記端子ブロックは,ブロック
受け部に対し弾発係合する係合片を有し,ブロック受け
部に対し着脱自在に係合されるようにしてもよい。In this case, (a) the terminal block has a guide protrusion along the insertion direction into the block receiving portion, and the block receiving portion has a guide groove that engages with the guide protrusion. (B) The terminal block may have an engaging piece that elastically engages with the block receiving portion, and may be detachably engaged with the block receiving portion.
【0008】[0008]
【実施例】以下,本発明の一実施例を図面に基づいて詳
細に説明する.図1ないしは図4は,本発明の一実施例
に係り,図1は本発明に係る位置決め装置を示す斜視
図,図2Aないし図2Cは位置決め部材の平面図,側面
図およびAーA線断面図,図3は位置決め部材と端子ブ
ロックの係合構造を示す要部拡大斜視図,図4はテスト
ヘッドの分解斜視図である.An embodiment of the present invention will be described in detail below with reference to the drawings. 1 to 4 relate to one embodiment of the present invention, FIG. 1 is a perspective view showing a positioning device according to the present invention, and FIGS. 2A to 2C are plan views, side views and cross-sections taken along the line AA of the positioning member. 3 and 4 are enlarged perspective views of the main parts showing the engagement structure of the positioning member and the terminal block, and FIG. 4 is an exploded perspective view of the test head.
【0009】上記各図に示すように本実施例においてテ
ストヘッド1のDUTボード装着部には,DUTボード
10に対応した大きさの方形枠状の位置決め部材2が設
けられる.この位置決め部材2は,テストヘッド1に実
装される多数のピンボード5を位置決め支持するために
設けられ,端子ブロック6を支承する多数のブロック受
け部3A,3Bを有する.この位置決め部材2によって
位置決めされた端子ブロック6は,その上面より多数の
プローブ7を突出状にする.プローブ7は,従来の構成
どおりばねによって出没自在に支持されている.DUT
ボード10はこの位置決め部材2上に着脱自在に搭載さ
れ,その裏面側のパッドをプローブ7に接触させて,D
UTの測定を可能とする.As shown in the above figures, in this embodiment, the DUT board mounting portion of the test head 1 is provided with a rectangular frame-shaped positioning member 2 having a size corresponding to the DUT board 10. The positioning member 2 is provided for positioning and supporting a large number of pin boards 5 mounted on the test head 1 and has a large number of block receiving portions 3A and 3B for supporting the terminal blocks 6. The terminal block 6 positioned by the positioning member 2 has a large number of probes 7 protruding from the upper surface thereof. The probe 7 is supported by a spring in a retractable manner as in the conventional configuration. DUT
The board 10 is removably mounted on the positioning member 2, and the pad on the back side thereof is brought into contact with the probe 7 to
Enables measurement of UT.
【0010】この位置決め部材2の四隅には円筒孔3が
形成され,ここにカム機構12が設けられる.図1に示
すように,上記カム機構は,タイミングベルト8aを介
して連結され,タイミングベルト8bを介して与えられ
るアクチュエータ9の動力によって同期して回動操作さ
れる.そして回動されたカム機構の係合部が,DUTボ
ード10と一体にされた補強板11の孔に係合して,D
UTボード10はテストヘッド1上に,押しつけられた
状態で固定される.Cylindrical holes 3 are formed at the four corners of the positioning member 2, and cam mechanisms 12 are provided therein. As shown in FIG. 1, the cam mechanism is connected via a timing belt 8a and is rotated in synchronization with the power of an actuator 9 provided via the timing belt 8b. Then, the engaged portion of the rotated cam mechanism engages with the hole of the reinforcing plate 11 integrated with the DUT board 10, and D
The UT board 10 is fixed on the test head 1 in a pressed state.
【0011】またテストヘッド1は,メインフレーム1
aの上部にDUTボード10の装着部を開口した上部カ
バー1bを設け,下部には下部カバー1cを設けて構成
される.多数のピンボード5は,図5および図6に示す
ように,区画壁1dによって9区画されたメインフレー
ム1a内に整列実装され,中央の区画に隣接する左右の
区画に収められたピンボード5は,端子ブロック6をD
UTボード10の装着部に突出させる.すなわち,これ
らのピンボード5はその一部を延長して端子ブロックの
取り付け部を形成し,この先端に多数のプローブ7を有
する端子ブロック6を実装してある.テストヘッド1の
通風構造について説明すると,多数のピンボード5はメ
インフレーム1aと区画壁1dにその両辺をガイドさ
れ,隣合うピンボード5間で適当な間隔を開けて保持さ
れる.メインフレーム1aおよび各区画壁1dには多数
の通風スリット1eが形成される.そして図5において
中央の区画およびその下方の区画(空間a)は空間とさ
れ,その屋外側には通風管13が連結される.通風管1
3を介してテストヘッド1内の空気が吸引され,各通風
スリット1eを介して外部から冷却用空気が供給され,
ピンボード5間を通って矢印bに沿って通風管13側に
排出される.このような通風径路は従来のような縦型通
風径路を取るものに比べて,通風効率を高めることがで
きるのみならず,テストヘッド1の全体の厚みを薄くで
きる点で有利であり,測定作業性の向上にもつながる
(図7ないしは図10)。また空間aにより,コネクタ
14の着脱作業が従来に比べ容易になる。The test head 1 is a main frame 1
An upper cover 1b having an opening for the mounting portion of the DUT board 10 is provided on the upper part of a, and a lower cover 1c is provided on the lower part. As shown in FIGS. 5 and 6, a large number of pinboards 5 are arranged and mounted in the main frame 1a which is divided into nine partitions by partition walls 1d, and the pinboards 5 are housed in the left and right partitions adjacent to the central partition. Is the terminal block 6
The UT board 10 is projected on the mounting part. That is, a part of each of these pinboards 5 is extended to form a terminal block mounting portion, and a terminal block 6 having a large number of probes 7 is mounted at the tip thereof. Explaining the ventilation structure of the test head 1, a large number of pinboards 5 are guided by the main frame 1a and the partition wall 1d on both sides thereof, and are held with an appropriate gap between adjacent pinboards 5. Many ventilation slits 1e are formed in the main frame 1a and each partition wall 1d. In FIG. 5, the central compartment and the compartment (space a) below it are made into a space, and the ventilation pipe 13 is connected to the outdoor side thereof. Ventilation tube 1
The air in the test head 1 is sucked in via 3 and the cooling air is supplied from the outside through each ventilation slit 1e,
It is discharged to the ventilation pipe 13 side along the arrow b through the pinboards 5. Such a ventilation path is advantageous not only in improving ventilation efficiency but also in reducing the overall thickness of the test head 1 as compared with the conventional vertical ventilation path. It also leads to improvement in sex (Figs. 7 to 10). Further, the space a makes it easier to attach and detach the connector 14 as compared with the conventional case.
【0012】次に本発明の要部である上記位置決め部材
2について詳細に説明する.位置決め部材2は,アルミ
ダイキャスト等により成形され,テストヘッド1のDU
Tボード10装着部に取り付けられるものであり,枠状
の本体の内周側に鍔部2aを形成して,ここをメインフ
レーム1aに対して8本のねじによってしっかりと固定
される。この位置決め部材2は,上述したようにその四
隅にカム機構12を有すると共に,そのほぼ全域にわた
って二種類のブロック受け部3A,3Bを有する.Next, the positioning member 2 which is an essential part of the present invention will be described in detail. The positioning member 2 is molded by aluminum die casting or the like, and the DU of the test head 1 is
It is attached to the mounting portion of the T-board 10, and a flange portion 2a is formed on the inner peripheral side of the frame-shaped main body, and this is firmly fixed to the main frame 1a by eight screws. As described above, the positioning member 2 has the cam mechanisms 12 at its four corners, and has two types of block receiving portions 3A and 3B over almost the entire area.
【0013】一方のブロック受け部3Aは,上方から下
方へ貫通する楕円孔により構成される.実施例において
は,位置決め部材2の対向する辺に各8つのブロック受
け部3Aが形成され,それぞれがテストヘッド1に実装
したピンボード5に対応させてある.このブロック受け
部3Aは,ピンボード5に取り付けた端子ブロック6を
嵌合するものであり,下側から端子ブロック6を受け入
れて,その上面側にプローブ7を突出状に保持する.他
方のブロック受け部3Bは,図3に示すように,上面側
および側面側を開口した溝により構成され,上記ブロッ
ク受け部3Aを形成した辺と隣合う辺に多数形成され
る.このブロック受け部3Bに嵌合される端子ブロック
15は,上記ブロック受け部3Aに嵌合される端子ブロ
ック6と異なり,ピンボード5とは分離して構成され,
ケーブル16を介してピンボード5に接続される.そし
て,数種類のピン配列(例えば,同軸線用や単線用)の
ものが用意される.The one block receiving portion 3A is composed of an elliptical hole penetrating from the upper side to the lower side. In the embodiment, eight block receiving portions 3A are formed on opposite sides of the positioning member 2, and each of them corresponds to the pin board 5 mounted on the test head 1. The block receiving portion 3A is for fitting the terminal block 6 attached to the pin board 5, receives the terminal block 6 from the lower side, and holds the probe 7 on the upper surface side in a protruding manner. As shown in FIG. 3, the other block receiving portion 3B is formed by a groove having an opening on the upper surface side and the side surface side, and is formed in a large number on the side adjacent to the side on which the block receiving portion 3A is formed. Unlike the terminal block 6 fitted in the block receiving portion 3A, the terminal block 15 fitted in the block receiving portion 3B is configured separately from the pin board 5.
It is connected to the pinboard 5 via the cable 16. Then, several types of pin arrangements (for coaxial line and single line, for example) are prepared.
【0014】この端子ブロック15は,ブロック受け部
3Bに対して側面方向より挿入されるが,その挿入方向
に沿ってガイド突起6bを有すると共に,先端側には前
方に延びる係合片6aが形成される.一方ブロック受け
部3Bには,上記ガイド突起6bを挿通するガイド溝3
1が形成されると共に,上記係合片6aを受ける係合縁
32を有する.したがって,端子ブロック15はブロッ
ク受け部3Bに対しその側壁およびガイド溝31にガイ
ドされながら挿入され,その前面を係合縁32に当接し
たところで,その係合片6aを係合縁32に弾発係合さ
せる.なお,係合縁32の厚さは,端子ブロック15の
前面から係合片6aの爪部分までの距離にほぼ等しくし
てあり,端子ブロック15の係合状態で挿入方向の位置
決めも確実になされる.このような構成により,端子ブ
ロック15は容易に着脱・交換が可能となる.なお,実
施例においては幅の異なる2種類のブロック受け部3B
が用意されており,また,端子ブロック15はフライス
成形により作成されている.The terminal block 15 is inserted into the block receiving portion 3B from the side, and has a guide projection 6b along the inserting direction and an engaging piece 6a extending forward at the tip side. Be done. On the other hand, the block receiving portion 3B has a guide groove 3 through which the guide protrusion 6b is inserted.
1 is formed and has an engaging edge 32 for receiving the engaging piece 6a. Therefore, the terminal block 15 is inserted into the block receiving portion 3B while being guided by the side wall and the guide groove 31, and when its front surface abuts on the engaging edge 32, the engaging piece 6a is elastically attached to the engaging edge 32. Engage. The thickness of the engaging edge 32 is substantially equal to the distance from the front surface of the terminal block 15 to the claw portion of the engaging piece 6a, and the positioning in the insertion direction is ensured in the engaged state of the terminal block 15. It. With such a configuration, the terminal block 15 can be easily attached / detached / replaced. In the embodiment, two types of block receiving portions 3B having different widths are used.
And the terminal block 15 is made by milling.
【0015】端子ブロック15は,測定されるDUTの
用途に応じて,同軸線用のもの,単線用のもの等を任意
に選択して,その必要数だけ設置される.上記位置決め
部材2には,さらに位置決めピン4がそのDUTボード
10の装着面側に突設される.実施例では,位置決め部
材2の対角側に二本設けられている.一方,DUTボー
ド10には,その強度を満たすため枠状の補強板11が
固定されている.そして,このDUTボード10側に
は,上記位置決めピン4を挿入・嵌合する嵌合孔10a
を穿設してある.この位置決めピン4と嵌合孔10aの
関係により,DUTボード10は位置決め部材2に対
し,位置決めされた状態で搭載されることとなる.そし
て,カム機構12を作動させてDUTボード10を固定
すれば,DUTボード10のパッド10bは,各端子ブ
ロック6,15のプローブ7に接触し,接続が完了す
る.The terminal block 15 is installed in the required number by arbitrarily selecting the one for the coaxial line, the one for the single line, etc. according to the application of the DUT to be measured. A positioning pin 4 is further provided on the positioning member 2 so as to project from the mounting surface side of the DUT board 10. In the embodiment, two pieces are provided on the diagonal side of the positioning member 2. On the other hand, a frame-shaped reinforcing plate 11 is fixed to the DUT board 10 in order to satisfy its strength. A fitting hole 10a for inserting and fitting the positioning pin 4 is provided on the DUT board 10 side.
Has been drilled. Due to the relationship between the positioning pin 4 and the fitting hole 10a, the DUT board 10 is mounted on the positioning member 2 in a positioned state. When the cam mechanism 12 is operated to fix the DUT board 10, the pads 10b of the DUT board 10 come into contact with the probes 7 of the terminal blocks 6 and 15, and the connection is completed.
【0016】なお,本実施例においては,方形枠状の位
置決め部材2を用いて本発明を説明したが,位置決め部
材2の形状としては,これに限定されず,円形そのた種
々の形状のものを用いることができる.In the present embodiment, the present invention has been described by using the positioning member 2 having a rectangular frame shape, but the shape of the positioning member 2 is not limited to this, and various shapes such as circular shapes can be used. Can be used.
【0017】[0017]
【発明の効果】以上の説明したように本発明によれば,
DUTボードの位置決め誤差は,テストヘッドの各構成
部品の設計誤差や組立て誤差に影響されず,位置決め部
材の精度のみに起因することとなり,テストヘッドに対
するDUTボードの実装位置精度を高めることができ
る.その結果,DUTボードのパッド面積を極小化でき
コンタクトプローブの多ピン化に対応できる.また本発
明は,プローブの交換を簡単な構造で容易にできるよう
にしたことから,測定される半導体デバイスの用途に応
じて,プローブをいつでも取り外し・交換あるいは追加
等することができ,単線用,同軸用,ディファレンシャ
ル用あるいはケルビン用等種々の仕様に対応が可能とな
る.As described above, according to the present invention,
The positioning error of the DUT board is not affected by the design error and assembly error of each component of the test head, and is due only to the accuracy of the positioning member, and the mounting position accuracy of the DUT board with respect to the test head can be improved. As a result, the pad area of the DUT board can be minimized and the number of pins of the contact probe can be increased. Further, according to the present invention, since the probe can be easily replaced with a simple structure, the probe can be removed / replaced or added at any time depending on the application of the semiconductor device to be measured. Various specifications such as coaxial, differential or Kelvin can be supported.
【図1】本発明の一実施例に係る位置決め装置を示す斜
視図である.FIG. 1 is a perspective view showing a positioning device according to an embodiment of the present invention.
【図2A】図1の位置決め部材の平面図である.2A is a plan view of the positioning member of FIG. 1. FIG.
【図2B】図1の位置決め部材の側面図である.2B is a side view of the positioning member of FIG. 1. FIG.
【図2C】図2AのAーA線断面図である.FIG. 2C is a sectional view taken along line AA of FIG. 2A.
【図3】位置決め部材と端子ブロックの係合構造を示す
要部拡大斜視図である.FIG. 3 is an enlarged perspective view of an essential part showing an engaging structure of a positioning member and a terminal block.
【図4】テストヘッドの分解斜視図である.FIG. 4 is an exploded perspective view of a test head.
【図5】テストヘッドの冷却構造を示す概略平面図であ
る.FIG. 5 is a schematic plan view showing a cooling structure of a test head.
【図6】図5の概略側面図である.6 is a schematic side view of FIG.
【図7】テストヘッドの使用状態図である.FIG. 7 is a diagram showing a usage state of the test head.
【図8】従来のテストヘッドの使用状態図である.FIG. 8 is a diagram showing a conventional test head in use.
【図9】従来のテストヘッドの冷却構造を示す概略平面
図である.FIG. 9 is a schematic plan view showing a cooling structure of a conventional test head.
【図10】図9の概略側面図である.10 is a schematic side view of FIG.
【図11】従来のテストヘッドの斜視図である.FIG. 11 is a perspective view of a conventional test head.
1 :テストヘッド 2 :位置決め部材 3 :ブロック受け部 31:ガイド溝 32:係合縁 4 :位置決めピン 5 :ピンボード 6 :端子ブロック 6a:係合片 6b:ガイド突起 7 :プローブ 10:DUTボード 10a:嵌合孔 10b:パッド 11:補強板 1: Test head 2: Positioning member 3: Block receiving portion 31: Guide groove 32: Engagement edge 4: Positioning pin 5: Pin board 6: Terminal block 6a: Engaging piece 6b: Guide protrusion 7: Probe 10: DUT board 10a: Fitting hole 10b: Pad 11: Reinforcing plate
Claims (2)
端子ブロックに接続された多数のピンボードを実装し
て,搭載するDUTボードのパッドと該コンタクトプロ
ーブとを接触せしめてDUTの測定を可能ならしめるテ
ストヘッドにおける,以下の構成からなることを特徴と
する位置決め装置。 (イ)テストヘッドのDUTボード装着部に,DUTボ
ードを受ける位置決め部材を固定する。 (ロ)上記位置決め部材は,ピンボードに接続した端子
ブロックを嵌合して,そのコンタクトプローブをDUT
ボード装着面側へ突出させるブロック受け部を有する。 (ハ)上記位置決め部材は,DUTボード装着面側に位
置決めピンを突設する。 (ニ)DUTボード側の上記位置決めピンに対応する位
置に,該位置決めピンに嵌合する嵌合孔を形成する。1. A large number of pin boards connected to a terminal block supporting a contact probe in a retractable manner are mounted, and pads of a DUT board to be mounted are brought into contact with the contact probe to enable DUT measurement. Positioning device for the test head, which has the following configuration. (A) Fix the positioning member that receives the DUT board to the DUT board mounting part of the test head. (B) The positioning member is fitted with the terminal block connected to the pin board and the contact probe is attached to the DUT.
It has a block receiving portion that projects toward the board mounting surface side. (C) In the positioning member, positioning pins are provided so as to project on the DUT board mounting surface side. (D) A fitting hole for fitting the positioning pin is formed at a position corresponding to the positioning pin on the DUT board side.
項1記載のテストヘッドの位置決め装置。 (イ)端子ブロックは,ブロック受け部への挿入方向に
沿ってガイド突起を有し,上記ブロック受け部は,該ガ
イド突起と係合するガイド溝を有する。 (ロ)上記端子ブロックは,ブロック受け部に対し弾発
係合する係合片を有し,ブロック受け部に対し着脱自在
に係合される。2. The test head positioning device according to claim 1, which has the following configuration. (A) The terminal block has a guide protrusion along the insertion direction into the block receiving portion, and the block receiving portion has a guide groove that engages with the guide protrusion. (B) The terminal block has an engaging piece that elastically engages with the block receiving portion, and is detachably engaged with the block receiving portion.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3068844A JPH05312900A (en) | 1991-03-08 | 1991-03-08 | Positioning device for test head |
| DE19924207002 DE4207002A1 (en) | 1991-03-08 | 1992-03-05 | Positioning system for test object carrier plate, e.g. for semiconductor devices - has carrier plate mounted on positioning device carrying connector block mounting sections and having positioning pins matching carrier plate holes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3068844A JPH05312900A (en) | 1991-03-08 | 1991-03-08 | Positioning device for test head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05312900A true JPH05312900A (en) | 1993-11-26 |
Family
ID=13385405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3068844A Pending JPH05312900A (en) | 1991-03-08 | 1991-03-08 | Positioning device for test head |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH05312900A (en) |
| DE (1) | DE4207002A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008014730A (en) * | 2006-07-04 | 2008-01-24 | Nec Electronics Corp | Semiconductor inspection device |
| JP2008224591A (en) * | 2007-03-15 | 2008-09-25 | Advantest Corp | Testing device and connecting device |
| JP2008261715A (en) * | 2007-04-12 | 2008-10-30 | Yokogawa Electric Corp | LSI tester positioning mechanism |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3062268B2 (en) * | 1991-03-11 | 2000-07-10 | アジレント・テクノロジー株式会社 | DUT board attachment / detachment mechanism for test head |
| CN105445647B (en) * | 2015-12-18 | 2019-08-06 | 苏州华兴源创科技股份有限公司 | A kind of pneumatic positioning mechanism for being positioned in testing to bga chip |
-
1991
- 1991-03-08 JP JP3068844A patent/JPH05312900A/en active Pending
-
1992
- 1992-03-05 DE DE19924207002 patent/DE4207002A1/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008014730A (en) * | 2006-07-04 | 2008-01-24 | Nec Electronics Corp | Semiconductor inspection device |
| JP2008224591A (en) * | 2007-03-15 | 2008-09-25 | Advantest Corp | Testing device and connecting device |
| JP2008261715A (en) * | 2007-04-12 | 2008-10-30 | Yokogawa Electric Corp | LSI tester positioning mechanism |
Also Published As
| Publication number | Publication date |
|---|---|
| DE4207002A1 (en) | 1992-09-17 |
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