JPH0530352Y2 - - Google Patents
Info
- Publication number
- JPH0530352Y2 JPH0530352Y2 JP1985183933U JP18393385U JPH0530352Y2 JP H0530352 Y2 JPH0530352 Y2 JP H0530352Y2 JP 1985183933 U JP1985183933 U JP 1985183933U JP 18393385 U JP18393385 U JP 18393385U JP H0530352 Y2 JPH0530352 Y2 JP H0530352Y2
- Authority
- JP
- Japan
- Prior art keywords
- reaction tube
- manifold
- ring
- open door
- reaction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Crystals, And After-Treatments Of Crystals (AREA)
Description
【考案の詳細な説明】
〔概要〕
Metal Organic Chemical Vapor Deposition
(以下、MOCVD法と略称する)装置に用いる反
応管の試料取り出し口の開放扉の構造であつて、
反応管の周囲を囲み、円筒状で且つ反応管が挿入
される箇所は開口状態となつているマニホールド
と称する治具にOリングを介して対向配置されて
いる開放扉に、前記マニホールドの開口部に挿入
されるようなリング状の突出部を設け、この突出
部でOリングに成長後の反応生成物が付着するの
を防止した気相成長装置。[Detailed explanation of the invention] [Summary] Metal Organic Chemical Vapor Deposition
(hereinafter abbreviated as MOCVD method) The structure of the open door of the sample outlet of the reaction tube used in the device,
The opening of the manifold is placed in an open door that is placed opposite to a jig called a manifold, which surrounds the reaction tube and is cylindrical and open at the point where the reaction tube is inserted, via an O-ring. A vapor phase growth apparatus in which a ring-shaped protrusion that is inserted into the O-ring is provided, and this protrusion prevents reaction products after growth from adhering to the O-ring.
〔産業上の利用分野〕
本考案はMOCVD法を用いた気相装置に係り、
特に気相成長装置に用いる反応管の試料挿入口に
設置されているマニホールドに対向して設けられ
ている開放扉の構造に関する。[Industrial Application Field] This invention relates to a gas phase device using the MOCVD method.
In particular, the present invention relates to the structure of an open door provided opposite to a manifold installed at a sample insertion port of a reaction tube used in a vapor phase growth apparatus.
ガリウム砒素(GaAs)等の化合物半導体基板
を製造する場合、ガリウム(Ga)の有機化合物
であるトリメチルガリウムを担持した水素ガス
と、砒素の水素化合物であるアルシン(AsH3)
ガスとをGaAs基板が設置されている反応管内に
導入し、基板を加熱することで、基板と反応管内
に導入された反応ガスとの間に気相化学反応を生
じさせ、アルシンガスより分解した砒素の成分
と、トリメチルガリウムより分解したガリウムの
成分を基板上に付着させてGaAs基板上にGaAs
のエピタキシヤル層を形成するMOCVD法は周
知である。 When manufacturing compound semiconductor substrates such as gallium arsenide (GaAs), hydrogen gas carrying trimethylgallium, which is an organic compound of gallium (Ga), and arsine (AsH 3 ), which is a hydrogen compound of arsenic, are used.
By introducing the gas into the reaction tube in which the GaAs substrate is installed and heating the substrate, a gas phase chemical reaction occurs between the substrate and the reaction gas introduced into the reaction tube, and the arsenic gas is decomposed from the arsine gas. The components of GaAs and the components of gallium decomposed from trimethyl gallium are deposited on the substrate to form GaAs on the GaAs substrate.
MOCVD methods for forming epitaxial layers are well known.
このようなMOCVD法に用いる反応管の試料
取り出し口には、反応管内に導入される反応ガス
が外部に漏洩しないように気密に封止されること
が要望されている。 The sample outlet of the reaction tube used in such MOCVD method is required to be hermetically sealed so that the reaction gas introduced into the reaction tube does not leak to the outside.
第2図は従来のMOCVD装置の要部を示す説
明図で、図示するように一端Aが開放状態で、他
端Bが管状に絞られた石英ガラスよりなる反応管
1の開放端部Aには、円筒状で反応管1が挿入さ
れる箇所が開口状態となつているステンレス製の
マニホールド2が取りつけられている。
FIG. 2 is an explanatory diagram showing the main parts of a conventional MOCVD apparatus. As shown in the figure, one end A is in an open state, and the other end B is connected to the open end A of a reaction tube 1 made of quartz glass squeezed into a tubular shape. A manifold 2 made of stainless steel is attached to the manifold 2, which is cylindrical and has an open position where the reaction tube 1 is inserted.
このマニホールド2には、反応終了後の反応ガ
スが外部へ排出される排出管3が設けられ、反応
管1の開放端部Aと接触する側と反対側には、こ
の反応管1内を気密に保つためのOリング4が嵌
挿されるような溝5が設けられ、その溝5内に前
記したOリング4が設置されている。 This manifold 2 is provided with a discharge pipe 3 through which the reaction gas is discharged to the outside after the reaction is completed, and on the side opposite to the side that contacts the open end A of the reaction tube 1, the inside of this reaction tube 1 is kept airtight. A groove 5 is provided into which an O-ring 4 for maintaining the temperature is inserted, and the above-mentioned O-ring 4 is installed within the groove 5.
更に反応管1の開放端部Aと対向するように円
板状のステンレス製の開放扉6が設置され、この
開放扉6は空気圧等を用いてOリング4を介して
反応管1を押圧するように設置されている。 Furthermore, a disc-shaped open door 6 made of stainless steel is installed to face the open end A of the reaction tube 1, and this open door 6 presses the reaction tube 1 through the O-ring 4 using air pressure or the like. It is set up like this.
更に開放扉6の中央部には磁気シールドを用い
て外部に反応管1内部の反応ガスが漏洩しない状
態を保ちながら、支持棒7が挿入され、その先端
にはカーボンよりなり、GaAs基板8を設置する
ための設置台9が設けられている。 Further, a support rod 7 is inserted into the center of the open door 6 using a magnetic shield to prevent the reaction gas inside the reaction tube 1 from leaking to the outside, and its tip is made of carbon and supports the GaAs substrate 8. An installation stand 9 for installation is provided.
また反応管1の周囲には、基板8を加熱するた
めの高周波誘導コイル10が設置されている。 Further, a high frequency induction coil 10 for heating the substrate 8 is installed around the reaction tube 1.
このような気相成長装置を用いてGaAs基板8
上にGaAsのエピタキシヤル層を気相成長する場
合について述べる。 GaAs substrate 8 is grown using such a vapor phase growth apparatus.
The case where a GaAs epitaxial layer is grown in a vapor phase will be described.
まず開放扉6を開いた状態で、開放扉に支持棒
7を挿通し、支持棒の先端部の設置台9上に
GaAs基板8を設置した状態で、空気圧を用いて
開放扉6を反応管1の開放端部Aに押圧する。 First, with the open door 6 open, insert the support rod 7 into the open door and place it on the installation stand 9 at the tip of the support rod.
With the GaAs substrate 8 installed, the open door 6 is pressed against the open end A of the reaction tube 1 using air pressure.
この状態で、反応管1のガス導入管11より水
素ガスを反応管1に導入し、反応管1内を水素ガ
スによつて充分置換した後、ガス導入管11より
トリメチルガリウムを担持した水素ガスとアルシ
ンガスとを導入し、高周波誘導コイル10に高周
波電流を通電することで基板の温度を650〜750℃
に上昇させる。この状態で所定時間経過した後、
反応管1への反応ガスの導入を停止し、高周波コ
イル10の通電を停止した後、装置が冷却した段
階で、開放扉6を開いてGaAsがエピタキシヤル
成長したGaAs基板8を取り出すようにしてい
る。 In this state, hydrogen gas is introduced into the reaction tube 1 from the gas introduction tube 11 of the reaction tube 1, and after the inside of the reaction tube 1 is sufficiently replaced with hydrogen gas, hydrogen gas carrying trimethyl gallium is introduced from the gas introduction tube 11. and arsine gas, and by passing a high frequency current through the high frequency induction coil 10, the temperature of the substrate is raised to 650 to 750°C.
to rise to. After a predetermined period of time in this state,
After stopping the introduction of the reaction gas into the reaction tube 1 and stopping the energization of the high-frequency coil 10, when the apparatus has cooled down, the open door 6 is opened to take out the GaAs substrate 8 on which GaAs has epitaxially grown. There is.
然し、開放扉6を開いて基板8を取り出す段階
で、開放扉6の反応管1側に於ける面やマニホー
ルド2の内壁に付着したGaAsの如き反応生成物
が剥離してOリング4に付着する問題が生ずる。
However, at the stage of opening the open door 6 and taking out the substrate 8, reaction products such as GaAs attached to the surface of the open door 6 on the side of the reaction tube 1 and the inner wall of the manifold 2 are peeled off and attached to the O-ring 4. A problem arises.
このようにOリング4に反応生成物が付着する
と、開放扉6を反応管1に対して気密に封止する
ことができず、そのため反応管1内部の有毒ガス
が外部に排出される等問題が多い。そのためOリ
ング4に付着した反応生成物を清浄な布等を用い
て拭きとつて除去していたが、このような除去作
業は煩雑である。 If the reaction product adheres to the O-ring 4 in this way, the open door 6 cannot be airtightly sealed against the reaction tube 1, causing problems such as toxic gas inside the reaction tube 1 being discharged to the outside. There are many. Therefore, the reaction product adhering to the O-ring 4 has been removed by wiping it off using a clean cloth, but such removal work is complicated.
本考案は上記した問題点を除去し、Oリング4
に反応生成物が付着しないようにした開放扉を有
する気相成長装置の提供を目的とする。 The present invention eliminates the above-mentioned problems and
An object of the present invention is to provide a vapor phase growth apparatus having an open door that prevents reaction products from adhering to the vapor phase growth apparatus.
本考案の気相成長装置は、一端に反応ガスが導
入されるガス導入管を有し、他端が開放状態の反
応管の開放端部に設けられ、前記反応管の内径に
対応する開口部を有し、端部にOリングが挿入さ
れる溝を有するマニホールドと、前記溝に挿入さ
れたOリングを介して前記マニホールドに対向配
置される平板状の開放扉とを備え、前記開放扉の
前記反応管内部に露出する平面に、前記マニホー
ルドの開口部の内面に沿うように設けられたリン
グ状の突出部を有することを特徴とする。
The vapor phase growth apparatus of the present invention has a gas introduction tube into which a reaction gas is introduced at one end, and is provided at an open end of a reaction tube with the other end open, and has an opening corresponding to the inner diameter of the reaction tube. a manifold having a groove at the end into which an O-ring is inserted, and a flat open door disposed opposite to the manifold with the O-ring inserted in the groove, A ring-shaped protrusion is provided on a plane exposed inside the reaction tube along the inner surface of the opening of the manifold.
本考案の気相成長装置は、マニホールド2に対
向配置して設置される平板状の開放扉6のマニホ
ールド2に対向する平面21に、前記マニホール
ド2の開口部22内に挿入されるような、例えば
ステンレス製のリング状の突出部23を設ける。
The vapor phase growth apparatus of the present invention has a flat open door 6 installed facing the manifold 2, which is inserted into the opening 22 of the manifold 2 on the flat surface 21 facing the manifold 2. For example, a ring-shaped protrusion 23 made of stainless steel is provided.
このようにして開閉扉6のマニホールド側の面
21や、マニホールド2の内壁に付着した反応生
成物がOリング4に付着しないようにして、マニ
ホールド2に開放扉6を装着した時、反応管1内
部が気密状態に保たれるようにする。 In this way, reaction products adhering to the manifold side surface 21 of the opening/closing door 6 or the inner wall of the manifold 2 are prevented from adhering to the O-ring 4, and when the opening door 6 is attached to the manifold 2, the reaction tube 1 Make sure the inside is kept airtight.
以下図面を用いて本考案の一実施例につき詳細
に説明する。
An embodiment of the present invention will be described in detail below with reference to the drawings.
第1図は本考案の気相成長装置の説明図であ
る。ここで第1図に於いて、前記した第2図と同
等な部分には同一の符号を付す。 FIG. 1 is an explanatory diagram of the vapor phase growth apparatus of the present invention. Here, in FIG. 1, parts equivalent to those in FIG. 2 described above are given the same reference numerals.
図示するように本考案の気相成長装置が、従来
の装置と異なる点は、開放扉6のマニホールド2
と対向する側の面21に、前記マニホールド2の
開口部22に挿入されるような、例えばステンレ
ス製のリング状の突出部23を、開放扉6に設け
た点に有る。 As shown in the figure, the vapor phase growth apparatus of the present invention differs from conventional apparatuses in that the manifold 2 of the open door 6
The opening door 6 is provided with a ring-shaped protrusion 23 made of, for example, stainless steel and inserted into the opening 22 of the manifold 2 on the side 21 facing the opening door 6.
このようにすれば、成長後の基板8を取り出す
時に開放扉6を開いた際に、開放扉6のマニホー
ルド2と対向する側の面21に付着した反応生成
物が、Oリング4の方向に移動するのが、前記し
た突出物23に遮られて移動しなくなり、Oリン
グ4に反応生成物が付着する不都合が防止でき
る。 In this manner, when the open door 6 is opened to remove the grown substrate 8, the reaction products adhering to the surface 21 of the open door 6 facing the manifold 2 do not move in the direction of the O-ring 4 because they are blocked by the protrusion 23, thereby preventing the reaction products from adhering to the O-ring 4.
そのため、Oリング4を介して開放扉6をマニ
ホールド2に締め付けた時、Oリングが清浄に保
たれているので、反応管が気密状態に保たれる。 Therefore, when the open door 6 is fastened to the manifold 2 via the O-ring 4, the reaction tube is kept in an airtight state because the O-ring is kept clean.
尚、このリング状の突出物23はステンレス製
に限らず、例えば400℃程度の温度に耐え、かつ
化学的に侵されがたい金属を使用しても良い。 Note that this ring-shaped protrusion 23 is not limited to stainless steel, and may be made of a metal that can withstand temperatures of about 400° C. and is chemically resistant to attack.
以上述べたように、本考案の気相成長装置によ
れば、マニホールド、或いは開放扉に付着した反
応生成物がOリングの方向に移動することがなく
なり、Oリングが清浄な状態に保たれるので、マ
ニホールドと開放扉間がリークのない状態で締結
でき、反応管内の有毒ガスが外部に漏れるような
事故が防止できる効果がある。
As described above, according to the vapor phase growth apparatus of the present invention, reaction products attached to the manifold or the open door do not move toward the O-ring, and the O-ring is kept in a clean state. Therefore, the manifold and the open door can be connected without leakage, which has the effect of preventing accidents such as leakage of toxic gas inside the reaction tube to the outside.
第1図は本考案の気相成長装置の説明図、第2
図は従来の気相成長装置の説明図である。
図に於いて、1は反応管、2はマニホールド、
4はOリング、5は溝、6は開放扉、11はガス
導入管、21は開放扉の面、22は開口部、23
は突出部を示す。
Figure 1 is an explanatory diagram of the vapor phase growth apparatus of the present invention, Figure 2
The figure is an explanatory diagram of a conventional vapor phase growth apparatus. In the figure, 1 is a reaction tube, 2 is a manifold,
4 is an O-ring, 5 is a groove, 6 is an open door, 11 is a gas introduction pipe, 21 is a surface of the open door, 22 is an opening, 23
indicates a protrusion.
Claims (1)
有し、他端が開放状態の反応管1の開放端部に設
けられ、前記反応管1の内径に対応する開口部2
2を有し、端部にOリング4が挿入される溝5を
有するマニホールド2と、 前記溝5に挿入されたOリング4を介して前記
マニホールド2に対向配置される平板状の開放扉
6とを備え、 前記開放扉6の前記反応管1内部に露出する平
面21に、前記マニホールド2の開口部22の内
面に沿うように設けられたリング状の突出部23
を有することを特徴とする気相成長装置。[Claims for Utility Model Registration] It has a gas introduction pipe 11 at one end into which a reaction gas is introduced, and the other end is provided at the open end of the reaction tube 1 and corresponds to the inner diameter of the reaction tube 1. Opening 2
2, and a manifold 2 having a groove 5 at the end into which an O-ring 4 is inserted; and a flat open door 6 disposed opposite to the manifold 2 with the O-ring 4 inserted into the groove 5. a ring-shaped protrusion 23 provided on the flat surface 21 of the open door 6 exposed inside the reaction tube 1 along the inner surface of the opening 22 of the manifold 2;
A vapor phase growth apparatus characterized by having:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985183933U JPH0530352Y2 (en) | 1985-11-28 | 1985-11-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985183933U JPH0530352Y2 (en) | 1985-11-28 | 1985-11-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6291433U JPS6291433U (en) | 1987-06-11 |
| JPH0530352Y2 true JPH0530352Y2 (en) | 1993-08-03 |
Family
ID=31131125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985183933U Expired - Lifetime JPH0530352Y2 (en) | 1985-11-28 | 1985-11-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0530352Y2 (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4459104A (en) * | 1983-06-01 | 1984-07-10 | Quartz Engineering & Materials, Inc. | Cantilever diffusion tube apparatus and method |
| JPS6031000U (en) * | 1983-08-09 | 1985-03-02 | ウシオ電機株式会社 | light irradiation furnace |
-
1985
- 1985-11-28 JP JP1985183933U patent/JPH0530352Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6291433U (en) | 1987-06-11 |
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