JPH05173166A - Liquid crystal display - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a liquid crystal display device capable of supporting high definition. [Structure] A terminal of a liquid crystal panel 21 is connected to flexible substrates 23a and 23b made of a tape carrier on which an integrated circuit chip 22 for driving the liquid crystal panel 21 is mounted.
It is connected to a printed circuit board 24 on which circuit wiring to the integrated circuit chip 22 is formed. The outer shapes of the flexible boards 23a and 23b on which the driving integrated circuit chip 22 is mounted are different between the adjacent flexible boards 23a and 23b, and when mounted, they may be stacked and overlapped with the adjacent flexible boards 23a and 23b. Absent. The flexible boards 23a and 23b are also shaped so that the ends on the terminal side expand. The end portions where the terminals are arranged are alternately arranged so that the adjacent flexible boards 23a and 23b are located at different positions in the width direction of the printed board 24. The terminals of the terminals 23b on the side of the terminals 25 are arranged so as to overlap each other.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device provided with a plurality of flexible substrates.

[0002]

2. Description of the Related Art In recent years, with the progress of the information society, the emergence of a flat display capable of color display with a large display capacity has been demanded. By adding, it is possible to obtain a full-color display relatively easily. In addition, since the driving voltage is relatively low, about 20 V at the maximum, liquid crystal display devices for liquid crystal televisions, vehicle-mounted devices, personal computers, and word processors are rapidly becoming popular.

In general, wire bonding, tape automatic bonding, flip chip bonding and the like are used for assembling the liquid crystal display device. In all of these, a bare integrated circuit chip is used as an integrated circuit chip for driving, and it can be said that this is a mounting technology of an integrated circuit chip aiming at downsizing rather than putting it in a flat package.

Of these, tape automatic bonding (TAB) is superior in mass productivity as compared with wire bonding, is superior in stress reliability as compared with flip chip bonding, and is a passive component such as a resistor, a capacitor or an inductor. And can be mixed easily. Therefore, it has been widely adopted as a mounting technique for an integrated circuit chip of a liquid crystal display device.

Conventionally, as shown in FIGS. 4 and 5, a large number of terminals (not shown) provided in the peripheral portion of the liquid crystal panel 11 and a bare driving integrated circuit chip for driving the liquid crystal panel 11 are used. It is connected to a tape carrier 13 on which 12 is mounted, and is connected to a printed board 14 based on a glass epoxy laminated plate on which circuit wiring to the integrated circuit chip 12 is formed.

When connecting the integrated circuit chip 12 and the tape carrier 13, gold (Au) bumps are formed on the terminals of the integrated circuit chip 12 and the copper (C) of the tape carrier 13 is formed.
u) The leads are tin (Sn) plated. Further, after the connection positions of the integrated circuit chip 12 and the tape carrier 13 are aligned, they are heated and pressed to perform gold / tin eutectic and are integrally bonded. Furthermore, integrated circuit chips
The output terminals of the tape carrier 13 connected to 12 are matched with the pitch and the number of terminal groups of the liquid crystal panel 11. Then, after the liquid crystal panel 11 and the tape carrier 13 are opposed to each other, the anisotropic conductive film is interposed and the anisotropic conductive film is heated and pressed to be connected. The anisotropic conductive film is a band-shaped thin film in which conductive particles are scattered on an organic material, and the resin is softened and crushed by heating and pressing, and the conductive particles correspond to the corresponding liquid crystal panel 11 and tape. The carrier 13 is electrically connected while being sandwiched between the terminals.

[0007]

However, in recent years,
The demand for light, thin, short and small LCDs, high image quality, and high definition, that is, miniaturization of pixels is increasing more and more, and the pixel pitch of the liquid crystal panel display unit is further narrowed.

As a result of this narrowing of the pitch, the pitch of the terminals of the liquid crystal panel 11 becomes narrower.
The display area driven by 12 is narrowed, and the pitch of the terminals on the input side of the tape carrier 13 on which the driving integrated circuit chip 12 is mounted is also narrowed.

However, when the liquid crystal panel 11 and the plurality of tape carriers 13 are connected to each other, an alignment error occurs with respect to each terminal of the liquid crystal panel 11 and the plurality of tape carriers 13. There is a problem that it is difficult to connect the input side terminal and the printed circuit board 14.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a liquid crystal display device capable of coping with high definition.

[0011]

A liquid crystal display device according to claim 1, wherein a liquid crystal panel and a driving integrated circuit chip for driving the liquid crystal panel are mounted, and a plurality of flexible substrates are arranged adjacent to each other. In a liquid crystal display device including
The flexible boards have different outer shapes between the adjacent flexible boards, and when mounted on the liquid crystal panel, the adjacent flexible boards do not overlap each other.

A liquid crystal display device according to a second aspect is the first aspect.
In the liquid crystal display device described above, the flexible substrates having different outer shapes are processed and formed by changing only the outer shape from a long flexible substrate sheet in which the same pattern is continuously formed.

[0013]

According to the liquid crystal display device of the present invention, when a flexible substrate on which a driving integrated circuit chip for driving the liquid crystal panel is mounted has different outer shapes between adjacent flexible substrates and is mounted on the liquid crystal panel. In addition, since the adjacent flexible boards do not overlap each other, the pitch between the terminals can be widened, and the terminals of the flexible board on which the integrated circuit chip for driving is mounted can be connected to the terminals of the circuit. Can be done easily.

In the liquid crystal display device according to the second aspect, several types of flexible substrates having different outer shapes are formed by processing the long flexible substrate sheet in which the same pattern is continuously formed by changing only the outer shape. It is possible to easily manufacture the flexible substrate without the need for designing and manufacturing the pattern.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the liquid crystal display device of the present invention will be described below with reference to the drawings.

As shown in FIGS. 1 and 2, a liquid crystal panel
In 21, a flexible substrate consisting of a number of lead terminals (not shown) provided in the peripheral portion for driving each pixel and a tape carrier on which a bare driving integrated circuit chip 22 for driving the liquid crystal panel 21 is mounted. 23a and 23b are connected,
It is connected to a printed circuit board (24) based on a glass epoxy laminated plate on which circuit wiring to the integrated circuit chip (22) is formed. The terminals of the liquid crystal panel 21 are divided into a plurality of groups according to the number of outputs of the driving integrated circuit chip 22 for driving each pixel.

Further, as shown in FIG. 1, the outer shapes of the flexible boards 23a and 23b on which the driving integrated circuit chip 22 is mounted are different between the adjacent flexible boards 23a and 23b. Boards 23a, 23
b does not overlap with each other in the stacking direction, and the pitch of the terminals 25 on the input side of the flexible boards 23a and 23b shown in FIG. The shape is such that the side end part expands. Further, the end portions on which the terminals 25 are arranged are alternately arranged on the adjacent flexible boards 23a and 23b so as to be at different positions in the width direction of the printed board 24, and in the longitudinal direction of the printed board 24. Flexible board
23a and 23b are also arranged so that the ends on the terminal 25 side overlap. Therefore, the terminals of the flexible boards 23a and 23b can be formed without increasing the length of the printed board 24 in the longitudinal direction.
The pitch of 25 can be widened.

As shown in FIG. 3, the flexible boards 23a and 23b on which the driving integrated circuit chip 22 is mounted are formed from a long flexible board sheet 27 in which the same pattern 26 is continuously formed. It is designed so that only the shape needs to be changed to form the work.

As described above, the flexible substrates 23a and 23b having different outer shapes are formed by processing the long flexible substrate sheet 27 in which the same pattern 26 is continuously formed by changing only the outer shape. Since it is possible to design and manufacture the patterns of the flexible substrates 23a and 23b in one, the mass production effect and the cost reduction due to the reduction of component types can be achieved.

When connecting the integrated circuit chip 22 and the flexible substrates 23a and 23b, the integrated circuit chip 22
Gold (Au) bumps are formed on the terminals of 22, and tin (Sn) plating is applied to the copper (Cu) leads of the flexible substrates 23a and 23b. Further, after matching the connection positions of the integrated circuit chip 22 and the integrated circuit chip 22, heating and pressurization is performed to perform gold / tin eutectic and bond them together. Also integrated circuit chip
The output terminals of the flexible boards 23a and 23b connected to the 22 are matched with the pitch and the number of terminals of the liquid crystal panel 21.

After the liquid crystal panel 21 and the flexible substrates 23a and 23b are opposed to each other, the anisotropic conductive film is interposed and the anisotropic conductive film is heated and pressed to be connected. Note that the anisotropic conductive film is a band-shaped thin film in which conductive particles are scattered in an organic material, the resin is softened by heating and pressing, and is crushed, and the conductive particles are associated with the corresponding liquid crystal panel 21. The flexible boards 23a and 23b are electrically connected while being sandwiched between the terminals.

The terminals of the liquid crystal panel 21 are divided into a plurality of groups and the intervals are widened according to the number of outputs of the driving integrated circuit chip 22 for driving each pixel. Therefore, for example, one flexible substrate 23a, 23b is formed. Even if it becomes defective, it can be easily repaired.

[0023]

According to the liquid crystal display device of the first aspect,
When a flexible board mounted with an integrated circuit chip for driving a liquid crystal panel is made to have different outer shapes between adjacent flexible boards and mounted on the liquid crystal panel,
By adopting an external shape that does not overlap adjacent flexible boards, it is possible to widen the pitch between terminals, and
The connection with the terminal of the circuit to be connected with the terminal of the flexible substrate on which the driving integrated circuit chip is mounted can be facilitated.

According to the liquid crystal display device of the second aspect, the flexible substrates having different outer shapes are processed and formed by changing only the outer shape from a long flexible substrate sheet in which the same pattern is continuously formed. Therefore, the need for designing and manufacturing a pattern of several types of flexible boards is eliminated, and it is possible to easily manufacture.

[Brief description of drawings]

FIG. 1 is a plan view showing an embodiment of a liquid crystal display device of the present invention.

FIG. 2 is a side view of the liquid crystal display device shown in FIG. 1 above.

FIG. 3 is a cross-sectional view showing the above flexible substrate sheet.

FIG. 4 is a plan view showing a conventional liquid crystal display device.

5 is a side view of the liquid crystal display device shown in FIG. 4 above.

[Explanation of symbols]

 21 LCD panel 22 Integrated circuit chips 23a, 23b Flexible board 26 patterns

Claims (2)

[Claims] 1. A liquid crystal display device comprising: a liquid crystal panel; and a flexible substrate on which a plurality of driving integrated circuit chips for driving the liquid crystal panel are mounted, and a plurality of adjacent flexible substrates are provided. A liquid crystal display device, wherein outer shapes of the adjacent flexible substrates are different from each other, and when mounted on the liquid crystal panel, the adjacent flexible substrates do not overlap each other. 2. A flexible substrate having a different outer shape is formed by processing a long flexible substrate sheet in which the same pattern is continuously formed by changing only the outer shape. Liquid crystal display device.