JPH0517593A - Heat-conductive molded article - Google Patents
Heat-conductive molded articleInfo
- Publication number
- JPH0517593A JPH0517593A JP3171052A JP17105291A JPH0517593A JP H0517593 A JPH0517593 A JP H0517593A JP 3171052 A JP3171052 A JP 3171052A JP 17105291 A JP17105291 A JP 17105291A JP H0517593 A JPH0517593 A JP H0517593A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- heat
- graphite powder
- molded article
- thermal conductivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims abstract description 35
- 239000011347 resin Substances 0.000 claims abstract description 35
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 30
- 229920000049 Carbon (fiber) Polymers 0.000 claims abstract description 28
- 239000004917 carbon fiber Substances 0.000 claims abstract description 28
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 11
- 239000002245 particle Substances 0.000 claims abstract description 9
- 239000012778 molding material Substances 0.000 claims abstract description 5
- 239000003822 epoxy resin Substances 0.000 abstract description 13
- 229920000647 polyepoxide Polymers 0.000 abstract description 13
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 abstract description 11
- 238000000034 method Methods 0.000 description 11
- 238000000465 moulding Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 10
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 238000001723 curing Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 239000012530 fluid Substances 0.000 description 4
- 229910002804 graphite Inorganic materials 0.000 description 4
- 239000010439 graphite Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 150000008065 acid anhydrides Chemical class 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000000748 compression moulding Methods 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- 229920002545 silicone oil Polymers 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920002239 polyacrylonitrile Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 229910015900 BF3 Inorganic materials 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000004984 aromatic diamines Chemical class 0.000 description 1
- 229910021383 artificial graphite Inorganic materials 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 1
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001493 electron microscopy Methods 0.000 description 1
- 238000009730 filament winding Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910021382 natural graphite Inorganic materials 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000002964 rayon Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- JIYNFFGKZCOPKN-UHFFFAOYSA-N sbb061129 Chemical compound O=C1OC(=O)C2C1C1C=C(C)C2C1 JIYNFFGKZCOPKN-UHFFFAOYSA-N 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
Landscapes
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、熱伝導性の成形品に関
する。さらに詳しくは、成形性、熱伝導度及び機械的強
度にすぐれた熱交換器用の伝熱管等の成形品に関するも
のである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat conductive molded article. More specifically, the present invention relates to a molded product such as a heat transfer tube for a heat exchanger, which is excellent in moldability, thermal conductivity and mechanical strength.
【0002】[0002]
【従来の技術】従来、塩酸、硫酸のような流体を加熱す
る耐蝕性熱交換器等の伝熱管として、ステンレス鋼、チ
タン合金等が一般に用いられている。しかし、これらの
素材は加工が難しく仕上げ表面の平滑性が悪く、そのた
め流体の圧損が大きく、またスケールの付着や伝熱境膜
が生じやすく、熱交換効率に欠点があった。2. Description of the Related Art Conventionally, stainless steel, titanium alloy or the like has been generally used as a heat transfer tube for a corrosion resistant heat exchanger for heating a fluid such as hydrochloric acid or sulfuric acid. However, these materials are difficult to process and have poor smoothness on the finished surface. Therefore, pressure loss of the fluid is large, scale adhesion and heat transfer film are likely to occur, and heat exchange efficiency is disadvantageous.
【0003】そのため、最近では、耐蝕性の良い熱可塑
性樹脂及び熱硬化性樹脂を素材として、射出成形や圧縮
成形によって伝熱管を成形する試みがなされている。一
般に、熱交換器の熱交換効率を高めるには、平滑性を高
め伝熱面積をできる限り大きくとり、伝熱部の膜厚を薄
くし、かつ熱交換部の熱伝導度を高め、さらに熱交換部
がスケール等で汚れないようにする必要がある。Therefore, recently, attempts have been made to mold a heat transfer tube by injection molding or compression molding using a thermoplastic resin and a thermosetting resin having good corrosion resistance as raw materials. Generally, in order to improve the heat exchange efficiency of the heat exchanger, the smoothness is increased and the heat transfer area is made as large as possible, the film thickness of the heat transfer section is made thin, and the heat conductivity of the heat exchange section is increased to further improve the heat transfer efficiency. It is necessary to prevent the replacement part from getting dirty with scales.
【0004】上記のような樹脂素材を用いると平滑性が
良いことから、流体の流動効率が高い利点があるが、熱
伝導度が小さいため大きな伝熱面積が必要となるので、
これを改善するために熱伝導性が良好な黒鉛粉末や炭素
繊維を短く切断したものを樹脂に混合し、熱伝導度を高
める技術が開示されている。しかしながら、黒鉛粉末の
場合は該樹脂に混入する量を多くするほど機械的強度が
著しく損なわれる。これは黒鉛粉末の粒子形態から何ら
補強効果を持たないためと思われる。The use of the resin material as described above has good smoothness and thus has an advantage of high fluid flow efficiency. However, since the thermal conductivity is small, a large heat transfer area is required.
In order to improve this, there is disclosed a technique in which a graphite powder or a carbon fiber having a good thermal conductivity and a short cut one are mixed with a resin to enhance the thermal conductivity. However, in the case of graphite powder, the mechanical strength is significantly impaired as the amount of the graphite powder mixed in the resin is increased. This seems to be because the graphite powder has no reinforcing effect due to the particle morphology.
【0005】このため黒鉛粉末の添加量を低く制限する
必要があり、熱伝導度を充分に高めることはできなかっ
た。しかも、使用中の破損の危険性から膜厚の薄い成形
品は使用することができなかった。一方、炭素繊維を短
く切断して樹脂と混合し、熱伝導度を高める試みは、成
形する際に、成形品中での炭素繊維の分散が不均一にな
り機械的強度の低下を招くのみならず熱伝導度を充分に
高めることはできなかった。Therefore, the amount of graphite powder added must be limited to a low level, and the thermal conductivity could not be sufficiently increased. Moreover, a molded product having a thin film thickness could not be used because of the risk of breakage during use. On the other hand, an attempt to increase the thermal conductivity by cutting the carbon fibers into short pieces and mixing them with a resin is not enough if the dispersion of the carbon fibers in the molded product becomes uneven and the mechanical strength is reduced. Therefore, the thermal conductivity could not be sufficiently increased.
【0006】また、黒鉛粉末と短く切断した炭素を樹脂
と混合して熱伝導率を高める試みもなされているが(特
開昭63−194195号公報、特開平2−16313
7号公報)、成形時の流動性が悪く、均一な薄膜状の成
形が困難であると共に、機械的強度を充分に高めること
ができない。すなわち、上記の方法では、機械的強度を
保ったまま熱伝導度を有効に上げることが難しいこと、
および黒鉛粉末や炭素繊維使用における成形性の低下
や、熱伝導度を上げても機械的強度の低下のために流体
の流速を上げられず、汚れ成分が沈着し、熱交換率を低
下させるものであった。Attempts have also been made to increase the thermal conductivity by mixing graphite powder and short cut carbon with a resin (Japanese Patent Laid-Open Nos. 63-194195 and 2-16313).
No. 7), the fluidity during molding is poor, it is difficult to mold a uniform thin film, and the mechanical strength cannot be sufficiently increased. That is, in the above method, it is difficult to effectively increase the thermal conductivity while maintaining the mechanical strength,
In addition, the flowability of the fluid cannot be increased due to the deterioration of the moldability when using graphite powder or carbon fiber and the decrease of the mechanical strength even if the thermal conductivity is increased, and the dirt components are deposited and the heat exchange rate is decreased. Met.
【0007】最近、一方向に引揃えた炭素繊維に熱硬化
性樹脂を含浸させプリプレグとした後、多層積層し硬化
成形した炭素繊維強加樹脂成形体は、釣竿、ゴルフシャ
フト等のスポーツレジャー用及び航空機用等の部材とし
て、機械的強度、弾性率及びすぐれた成形性等の面から
利用されつつある。しかし、熱交換器用等の伝熱管のよ
うな熱伝導性の成形品としては、熱伝導度が充分でなか
った。Recently, a carbon fiber-reinforced resin molded product obtained by impregnating unidirectionally aligned carbon fibers with a thermosetting resin to form a prepreg, and then laminating and molding the same in multiple layers is used for sports leisure such as fishing rods and golf shafts. It is being used as a member for aircrafts in terms of mechanical strength, elastic modulus and excellent formability. However, the heat conductivity was not sufficient as a heat conductive molded product such as a heat transfer tube for a heat exchanger.
【0008】[0008]
【発明が解決しようとする課題】本発明は、成形性にす
ぐれると共に、熱伝導度と機械的強度を同時に満足する
熱伝導性の成形品を提供することを目的とする。SUMMARY OF THE INVENTION It is an object of the present invention to provide a heat conductive molded product which has excellent moldability and simultaneously satisfies both thermal conductivity and mechanical strength.
【0009】[0009]
【課題を解決するための手段】本発明者らは、上記問題
点を解決するために、鋭意検討した結果、一方向に引揃
えた炭素繊維に黒鉛粉末が配合された熱硬化性樹脂が含
浸されている成形材料からなる成形品とすることによっ
て本発明に到達した。すなわち、本発明は、一方向に引
揃えた炭素繊維に黒鉛粉末を含む熱硬化性樹脂が含浸さ
れている成形材料からなることを特徴とする熱伝導性成
形品、である。Means for Solving the Problems As a result of intensive studies to solve the above problems, the present inventors have found that carbon fibers aligned in one direction are impregnated with a thermosetting resin containing graphite powder. The present invention has been achieved by forming a molded article made of the above-mentioned molding material. That is, the present invention is a heat conductive molded article, which is made of a molding material in which carbon fibers aligned in one direction are impregnated with a thermosetting resin containing graphite powder.
【0010】本発明の熱伝導性成形品は、熱硬化性樹脂
と黒鉛粉末を均一に混合した配合樹脂を、一方向に引揃
えた炭素繊維に含浸させることにより、又は、ストラン
ドプリプレグ、テープ状プリプレグ、シート状プリプレ
グ、織編物プリプレグ等の成形材料を経由して、フィラ
メントワインディング成形、ロール成形、圧縮成形、引
抜き成形等によって伝熱管等として成形され熱硬化され
ることによって得られる。The heat conductive molded article of the present invention is obtained by impregnating carbon fibers aligned in one direction with a compounded resin in which a thermosetting resin and graphite powder are uniformly mixed, or a strand prepreg or a tape shape. It can be obtained by molding as a heat transfer tube or the like by filament winding molding, roll molding, compression molding, pultrusion molding, etc. via a molding material such as a prepreg, a sheet-shaped prepreg, or a woven or knitted material prepreg, and heat curing.
【0011】そのため、本発明の成形品では、一方向引
揃えの炭素繊維と黒鉛粉末とが併用されていることが不
可欠である。両者の使用割合については、使用する黒鉛
粉末の粒径、成形品の要求特性等により異なり、一義的
に定めることは困難である。しかし、一般的には炭素繊
維と黒鉛粉末との比率が25:75〜95:5(重量
比)であり、好ましくは30:70〜90:10(重量
比)の範囲で選定する。Therefore, in the molded article of the present invention, it is essential that the unidirectionally aligned carbon fibers and graphite powder are used together. It is difficult to unambiguously determine the usage ratio of both, because it depends on the particle size of the graphite powder used, the required characteristics of the molded product, and the like. However, generally, the ratio of carbon fiber to graphite powder is 25:75 to 95: 5 (weight ratio), and preferably selected in the range of 30:70 to 90:10 (weight ratio).
【0012】本発明に用いる炭素繊維は、黒鉛繊維を包
含し、具体的には、ポリアクリロニトリル(PAN)
系、ピッチ系(石油系、石炭系)、レーヨン系炭素繊維
等が挙げられ、成形品の熱伝導度を高めるには、繊維弾
性率の高い炭素繊維が好ましいが、繊維弾性率が高くな
ると機械的強度低下を伴なうため、目的とする熱伝導率
と機械的強度によって使いわけられる。The carbon fibers used in the present invention include graphite fibers, specifically, polyacrylonitrile (PAN).
Carbon fiber, pitch-based (petroleum-based, coal-based), rayon-based carbon fiber, and the like. In order to increase the thermal conductivity of the molded product, carbon fiber having a high fiber elastic modulus is preferable, but when the fiber elastic modulus becomes high, Since it is accompanied by a decrease in mechanical strength, it can be used depending on the desired thermal conductivity and mechanical strength.
【0013】本発明に使用する黒鉛粉末は、天然黒鉛、
人造黒鉛で、純度75%以上のものであり、その粒度は
電顕法の平均粒子径で40μm以下、好ましくは10μ
m以下のものであり、この中から選ばれた1種又は2種
以上を用いて実施してもよい。また、黒鉛粉末に替え
て、シリカ、アルミナ、酸化マグネシウム、窒化ホウ
素、酸化ベリリウム等の無機粉末も特定条件下で使用す
ることができる。The graphite powder used in the present invention is natural graphite,
Artificial graphite with a purity of 75% or more, and its particle size is 40 μm or less, preferably 10 μm in average particle diameter by electron microscopy.
m or less, and one or two or more selected from these may be used. Further, instead of graphite powder, inorganic powder such as silica, alumina, magnesium oxide, boron nitride, beryllium oxide, etc. can be used under specific conditions.
【0014】本発明に用いる熱硬化性樹脂(以下樹脂基
材)は、炭素繊維に含浸し、また、黒鉛粉末を混合でき
るものならば、どの様な熱硬化性樹脂も使用できる。例
えば、フェノール樹脂、尿素樹脂、不飽和ポリエステル
樹脂、ビニルエステル樹脂、シリコン樹脂、ウレタン樹
脂、エポキシ樹脂、ビスマレイミド樹脂、ポリアミド樹
脂、ポリイミド樹脂等を用いることができ、目的に応じ
て使用することができる。As the thermosetting resin (hereinafter referred to as resin base material) used in the present invention, any thermosetting resin can be used as long as carbon fibers can be impregnated and graphite powder can be mixed. For example, a phenol resin, a urea resin, an unsaturated polyester resin, a vinyl ester resin, a silicone resin, a urethane resin, an epoxy resin, a bismaleimide resin, a polyamide resin, a polyimide resin, or the like can be used and can be used depending on the purpose. it can.
【0015】これら樹脂基材のうち、機械的特性、耐薬
品性、耐熱性、成形性等に優れ、上記特性のバランスが
とれたエポキシ樹脂を主体としたものが最も好ましい。
エポキシ樹脂としては、ビスフェノールA型エポキシ樹
脂、フェノールノボラック型エポキシ樹脂、クレゾール
ノボラック型エポキシ樹脂、ビスフェノールF型エポキ
シ樹脂、グリシジルアミン型エポキシ樹脂あるいは熱可
塑性樹脂等を混合して使用してもよいがこれに限定され
るものではない。耐熱性の点からは、ビスフェノールA
型エポキシ樹脂に、フェノールノボラック樹脂、あるい
はグリシジルアミン型樹脂を混合して用いるのが好まし
い。Of these resin base materials, those based on an epoxy resin which is excellent in mechanical properties, chemical resistance, heat resistance, moldability and has a good balance of the above properties are most preferable.
As the epoxy resin, bisphenol A type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, bisphenol F type epoxy resin, glycidyl amine type epoxy resin or thermoplastic resin may be mixed and used. It is not limited to. From the point of heat resistance, bisphenol A
It is preferable to use a phenol novolac resin or a glycidyl amine type resin mixed with the type epoxy resin.
【0016】エポキシ樹脂の硬化剤は一般的に何でもよ
く酸無水物、ジシアンジアミド、芳香族ジアミン、フェ
ノール樹脂等があるが、目的とする特性によって使い分
けられ、耐酸性用途においては、酸無水物が好ましい。
これら硬化剤は、一般的には硬化促進剤と併用して用い
られ、イミダゾール誘導体、尿素誘導体、弗化ホウ素錯
塩類、3級アミン等が例示でき、これらに限定するもの
ではない。Generally, any curing agent for epoxy resin may be used, such as acid anhydride, dicyandiamide, aromatic diamine, phenol resin, etc., but the acid anhydride is preferable for acid resistant use. .
These curing agents are generally used in combination with a curing accelerator, and examples thereof include imidazole derivatives, urea derivatives, boron fluoride complex salts, tertiary amines, etc., but are not limited thereto.
【0017】本発明の成形品中の樹脂基材の配合割合
は、20〜80重量%、好ましくは、30〜70重量%
である。樹脂基材が20重量%未満では、成形時の流動
性が不足し、品位の低い成形品となり、機械的強度が低
い。また、80重量%を越えると、熱伝導度の低下を招
くと共に、充分な機械的強度が得られない。The compounding ratio of the resin base material in the molded article of the present invention is 20 to 80% by weight, preferably 30 to 70% by weight.
Is. If the resin base material is less than 20% by weight, the fluidity at the time of molding becomes insufficient, resulting in a low-quality molded product and low mechanical strength. On the other hand, when it exceeds 80% by weight, the thermal conductivity is lowered and sufficient mechanical strength cannot be obtained.
【0018】本発明において、成形品の特性を阻害しな
い範囲内で各種の添加剤を配合することができる。例え
ば、熱可塑性樹脂、流動調整剤、可塑剤、安定剤、滑
剤、金属を含む無機充填剤等が挙げられる。本発明の成
形品の製造において、樹脂基材と黒鉛粉末及び各種の添
加剤の混練は、プラネタリーミキサー、ニーダー、ロー
ル混練機等で行なわれる。また、必要に応じて、塩化メ
チレン、メチルエチルケトン、メチルセルソルブ、アセ
トン、メタノール等の溶剤から選ばれた1種又は2種以
上の溶剤を用いて粘度調整され、配合樹脂が製造され
る。In the present invention, various additives can be added within a range that does not impair the characteristics of the molded product. For example, thermoplastic resins, flow control agents, plasticizers, stabilizers, lubricants, inorganic fillers containing metals, etc. may be mentioned. In the production of the molded product of the present invention, the resin base material, the graphite powder and various additives are kneaded with a planetary mixer, a kneader, a roll kneader or the like. Further, if necessary, the viscosity is adjusted using one or more solvents selected from solvents such as methylene chloride, methyl ethyl ketone, methyl cellosolve, acetone, methanol, etc. to prepare a compounded resin.
【0019】成形工程は前述した方法等で実施するが、
配合樹脂に溶剤を用いた場合は、炭素繊維に配合樹脂が
含浸された後、除去される。本発明の熱伝導性成形品は
前記のような成形方法を採用することができるので、炭
素繊維と黒鉛粉末の分散を均一にすることができ、1m
m以下の薄膜のものが可能となった。The molding step is carried out by the above-mentioned method, etc.
When a solvent is used as the compounded resin, it is removed after the carbon fiber is impregnated with the compounded resin. Since the heat conductive molded article of the present invention can adopt the above-described molding method, the carbon fiber and the graphite powder can be uniformly dispersed, and 1 m
Thin films of m or less are now possible.
【0020】また、一方向引揃えの炭素繊維を任意の方
向に配列させる構造によって、炭素繊維が持っている機
械的強度特性を充分に活用でき、すぐれた機械的強度を
得ることができる。さらに、本発明の成形品はすぐれた
熱伝導度を持つ炭素繊維が連続して並んだ層間に、黒鉛
粒子で層間距離を縮める又は黒鉛粒子で結ぶことによ
り、大巾に熱伝導度を向上させることが可能となった。Further, due to the structure in which the unidirectionally aligned carbon fibers are arranged in an arbitrary direction, the mechanical strength characteristics of the carbon fibers can be fully utilized and excellent mechanical strength can be obtained. Furthermore, the molded article of the present invention greatly improves the thermal conductivity by shortening the interlayer distance with graphite particles or by tying with graphite particles between the layers of carbon fibers having excellent thermal conductivity. It has become possible.
【0021】[0021]
【実施例】以下実施例によって本発明を更に詳細に説明
する。なお、実施例に示す物性は次の測定法による。ま
た、部は重量部を示す。
(1)熱伝導度
各実施例の平板(厚み約2mm)よりサンプリングし、
熱定数測定装置TC−2000(真空理工社製)を用
い、比熱容量Cp(Joule/gK)と熱拡散率α
(cm2 /sec)をフラッシュ法で直接測定し、別に
測定した密度ρ(g/cm3 )から、熱伝導度λ(W/
cmK)をλ=α・Cp・ρで求め換算してKcal/
m2 ・hr・℃)で示した。TC−2000による熱拡
散率の測定は非接触式で行ない、比熱は接触式で測定し
た。また、密度は密度勾配管法で測定した。
(2)引張り強度
JIS K7073に準拠し、恒温槽160℃雰囲気中
に15分間保持した後、測定した。
(3)耐圧強度
シリコンオイルを充填した中空パイプを160℃のシリ
コンオイル槽中に10分間保持後、シリコンオイルを加
圧して耐圧強度を測定した。The present invention will be described in more detail with reference to the following examples. The physical properties shown in the examples are based on the following measuring methods. Moreover, a part shows a weight part. (1) Thermal Conductivity Sampled from the flat plate (thickness: about 2 mm) of each example,
Using a thermal constant measuring device TC-2000 (manufactured by Vacuum Riko Co., Ltd.), the specific heat capacity Cp (Jouule / gK) and the thermal diffusivity α
(Cm 2 / sec) was directly measured by the flash method, and from the density ρ (g / cm 3 ) separately measured, the thermal conductivity λ (W / W /
cmK) is calculated by λ = α · Cp · ρ and converted to Kcal /
m 2 · hr · ° C). The thermal diffusivity was measured by TC-2000 by a non-contact method, and the specific heat was measured by a contact method. The density was measured by the density gradient tube method. (2) Tensile strength Based on JIS K7073, the tensile strength was measured after holding in an atmosphere of a constant temperature bath of 160 ° C for 15 minutes. (3) Compressive strength After holding a hollow pipe filled with silicone oil in a silicone oil tank at 160 ° C for 10 minutes, the silicone oil was pressurized to measure the compressive strength.
【0022】[0022]
【実施例1〜8、比較例1〜6】ビスフェノールA型エ
ポキシ樹脂(AER331、旭化成工業(株)製)10
0部、テトラグリシジルアミン型エポキシ樹脂(TET
RAD−X、三菱ガス化学工業(株)製)100部、無
水メチルナジック酸(無水メチルハイミック酸、日立化
成工業(株)製)220部、イミダゾール(1B2E
Z、四国化成工業(株)製)2部を加熱ニーダーで樹脂
基材を混練した。Examples 1 to 8 and Comparative Examples 1 to 6 Bisphenol A type epoxy resin (AER331, manufactured by Asahi Chemical Industry Co., Ltd.) 10
0 parts, tetraglycidyl amine type epoxy resin (TET
RAD-X, Mitsubishi Gas Chemical Industry Co., Ltd. 100 parts, methyl nadic acid anhydride (methyl hymic acid anhydride, Hitachi Chemical Co., Ltd.) 220 parts, imidazole (1B2E)
2 parts of Z, manufactured by Shikoku Kasei Kogyo Co., Ltd. was kneaded with the resin base material with a heating kneader.
【0023】次いで、粒径が0.4μm、2μm、10
μm、45μm、60μmの黒鉛粉を表1に示す配合重
量比で添加しさらに混練した。このとき必要に応じて、
メチルセルソルブ又は塩化メチレンを加え混練した。さ
らにロールミル上で混練し、均一な配合樹脂を得た。次
に、配合樹脂を離型紙上にコーティングしてフィルムを
得た。このフィルム上に、表1に示す配合重量比になる
様に弾性率24TON/mm2 の高強度炭素繊維(H
T)及び弾性率40TON/mm2 の高弾性炭素繊維
(HM)を引き揃えた後、その上に離型紙を載せ、ホッ
トロールで圧縮し、含浸させて一方向プリプレグを得
た。Next, the particle size is 0.4 μm, 2 μm, 10
Graphite powders of μm, 45 μm, and 60 μm were added at the compounding weight ratio shown in Table 1 and further kneaded. At this time, if necessary,
Methyl cellosolve or methylene chloride was added and kneaded. Further, the mixture was kneaded on a roll mill to obtain a uniform blended resin. Next, the compounded resin was coated on release paper to obtain a film. On this film, high-strength carbon fiber having an elastic modulus of 24 TON / mm 2 (H
T) and high-elasticity carbon fibers (HM) having an elastic modulus of 40 TON / mm 2 were aligned, and a release paper was placed thereon, followed by compression with a hot roll and impregnation to obtain a unidirectional prepreg.
【0024】作成したプリプレグを30cm四方に切
り、面対称になるように±45°で積層し、オートクレ
ーブで80℃1時間、150℃2時間、180℃3時間
硬化して、厚み2mmの平板を得た。また、外径7mm
の丸鋼にプリプレグをシートローリング成形機で±45
°に積層し、ポリエステルテープでテーピング後、オー
トクレーブ成形と同様の硬化を行ない、外径8.0m
m、内径7.0mmの中空パイプを成形した。The prepared prepreg is cut into 30 cm squares, laminated at ± 45 ° so as to be plane symmetrical, and cured in an autoclave at 80 ° C. for 1 hour, 150 ° C. for 2 hours, 180 ° C. for 3 hours to form a flat plate having a thickness of 2 mm. Obtained. Also, the outer diameter is 7 mm
Round prepregs on round steel with a sheet rolling molding machine ± 45
After laminating at 0 ° and taping with polyester tape, the same curing as in autoclave molding is performed and the outer diameter is 8.0 m.
A hollow pipe having an inner diameter of 7.0 mm and an inner diameter of 7.0 mm was formed.
【0025】得られた平板より熱伝導度及び引張り強度
を測定し、中空パイプで耐圧強度を測定した。これらの
結果を表2に示す。The thermal conductivity and the tensile strength of the obtained flat plate were measured, and the pressure resistance of the hollow pipe was measured. The results are shown in Table 2.
【0026】[0026]
【比較例7】実施例1〜8及び比較例1〜6と同様の樹
脂基材及び方法で表1に示す配合樹脂を作製した。この
配合樹脂を60〜70℃で真空脱泡した後クロムメッキ
した25cm四方、厚み2mmのスペーサーを持つ金型
に流し込み、80℃1時間、150℃2時間、180℃
3時間の圧縮成形を行ない、平板を得た。COMPARATIVE EXAMPLE 7 Compounded resins shown in Table 1 were prepared by the same resin base material and method as in Examples 1 to 8 and Comparative Examples 1 to 6. This compounded resin is vacuum degassed at 60 to 70 ° C and then poured into a metal mold having a chrome-plated 25 cm square and a thickness of 2 mm, 80 ° C for 1 hour, 150 ° C for 2 hours, 180 ° C.
Compression molding was carried out for 3 hours to obtain a flat plate.
【0027】得られた平板より熱伝導度及び引張り強度
を測定した。なお、中空パイプの成形は実施できなかっ
た。これらの測定結果を表2に示す。本発明の熱伝導性
成形品は、熱交換器用パネル、フィン、伝熱管、放熱用
電気部品(冷蔵庫の放熱パネル、スピーカーコイルの冷
却等)、摺動部材、エレクトロニス基板、車輌用ラジエ
ーターパネル等の熱伝導性で機械強度の必要とされる用
途に有用である。The thermal conductivity and tensile strength of the flat plate thus obtained were measured. The hollow pipe could not be molded. The results of these measurements are shown in Table 2. The heat conductive molded article of the present invention includes a heat exchanger panel, fins, heat transfer tubes, heat radiating electric parts (heat radiating panel of refrigerator, cooling of speaker coil, etc.), sliding member, electron varnish substrate, radiator panel for vehicle, etc. It is useful for applications requiring thermal conductivity and mechanical strength.
【0028】[0028]
【表1】 [Table 1]
【0029】[0029]
【表2】 [Table 2]
【0030】[0030]
【発明の効果】本発明の熱伝導性成形品は従来のものに
比べ成形性にすぐれ、熱伝導度が大で、かつ、耐熱性が
高いものである。また、平滑性にすぐれると共に機械的
強度も大きいので管内流速を大きくすることができ、ス
ケール等の沈着を抑制することが必要な用途に有用であ
る。EFFECTS OF THE INVENTION The heat conductive molded product of the present invention has excellent moldability, high thermal conductivity and high heat resistance as compared with the conventional products. Further, since it has excellent smoothness and high mechanical strength, it is possible to increase the flow velocity in the pipe, which is useful for applications where it is necessary to suppress the deposition of scale and the like.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 // C08L 101:00 7167−4J ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location // C08L 101: 00 7167-4J
Claims (2)
含む熱硬化性樹脂が含浸されている成形材料からなるこ
とを特徴とする熱伝導性成形品。1. A thermally conductive molded article, which comprises a molding material in which unidirectionally aligned carbon fibers are impregnated with a thermosetting resin containing graphite powder.
に引揃えた炭素繊維と粒径40μm以下の黒鉛粉末との
合計が20−80重量%であり、かつ、炭素繊維と黒鉛
粉末との割合が25:75〜95:5(重量比)である
ことを特徴とする熱伝導性成形品。2. The thermosetting resin is 20-80% by weight, the total amount of unidirectionally aligned carbon fibers and graphite powder having a particle size of 40 μm or less is 20-80% by weight, and the carbon fibers and the graphite powder. And the ratio is 25:75 to 95: 5 (weight ratio).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3171052A JPH0517593A (en) | 1991-07-11 | 1991-07-11 | Heat-conductive molded article |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3171052A JPH0517593A (en) | 1991-07-11 | 1991-07-11 | Heat-conductive molded article |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0517593A true JPH0517593A (en) | 1993-01-26 |
Family
ID=15916189
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3171052A Pending JPH0517593A (en) | 1991-07-11 | 1991-07-11 | Heat-conductive molded article |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0517593A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10193380A (en) * | 1997-01-14 | 1998-07-28 | Asahi Chem Ind Co Ltd | Heat-generating molding of thermoplastic resin |
| US6730731B2 (en) | 2000-09-12 | 2004-05-04 | Polymatech Co., Ltd | Thermally conductive polymer composition and thermally conductive molded article |
| US6794035B2 (en) | 2001-10-02 | 2004-09-21 | Polymatech Co., Ltd. | Graphitized carbon fiber powder and thermally conductive composition |
| JP2006113126A (en) * | 2004-10-12 | 2006-04-27 | Sony Corp | Liquid crystal display panel frame and liquid crystal display device |
| US7264869B2 (en) | 2001-06-06 | 2007-09-04 | Polymatech Co., Ltd. | Thermally conductive molded article and method of making the same |
| WO2007126133A1 (en) | 2006-04-27 | 2007-11-08 | Teijin Limited | Composite carbon fiber sheet |
| JP2020133048A (en) * | 2019-02-19 | 2020-08-31 | 阿波製紙株式会社 | Carbon fiber sheet material, compact, method for producing carbon fiber sheet material and method for producing compact |
| CN113402205A (en) * | 2021-06-21 | 2021-09-17 | 贵州兰鑫石墨机电设备制造有限公司 | Carbon fiber reinforced compression type graphite tube and preparation method thereof |
-
1991
- 1991-07-11 JP JP3171052A patent/JPH0517593A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10193380A (en) * | 1997-01-14 | 1998-07-28 | Asahi Chem Ind Co Ltd | Heat-generating molding of thermoplastic resin |
| US6730731B2 (en) | 2000-09-12 | 2004-05-04 | Polymatech Co., Ltd | Thermally conductive polymer composition and thermally conductive molded article |
| US7264869B2 (en) | 2001-06-06 | 2007-09-04 | Polymatech Co., Ltd. | Thermally conductive molded article and method of making the same |
| US6794035B2 (en) | 2001-10-02 | 2004-09-21 | Polymatech Co., Ltd. | Graphitized carbon fiber powder and thermally conductive composition |
| JP2006113126A (en) * | 2004-10-12 | 2006-04-27 | Sony Corp | Liquid crystal display panel frame and liquid crystal display device |
| WO2007126133A1 (en) | 2006-04-27 | 2007-11-08 | Teijin Limited | Composite carbon fiber sheet |
| EP2025704A4 (en) * | 2006-04-27 | 2010-11-24 | Teijin Ltd | Composite carbon fiber sheet |
| US7947362B2 (en) | 2006-04-27 | 2011-05-24 | Teijin Limited | Carbon fiber composite sheet |
| JP2020133048A (en) * | 2019-02-19 | 2020-08-31 | 阿波製紙株式会社 | Carbon fiber sheet material, compact, method for producing carbon fiber sheet material and method for producing compact |
| CN113402205A (en) * | 2021-06-21 | 2021-09-17 | 贵州兰鑫石墨机电设备制造有限公司 | Carbon fiber reinforced compression type graphite tube and preparation method thereof |
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