JPH05167228A - Washing device - Google Patents

Abstract

PURPOSE:To enable a cleaning fluid to be sucked-in passing a through hole in a printed wiring board thereby enabling the through hole to be satisfactorily cleaned up without fail by a method wherein a suction nozzle is provided in a position opposite to a printed wiring board to be carried while the slit type aperture parts are either dispersedly or obliquely arrayed. CONSTITUTION:Within the suction nozzle 3 shown in figure (1), multiple slit type aperture parts F dispersedly and linearly arrayed at respective intervals in the carrier direction Y and the lateral width direction X rectangular to the former on a printed wiring board P are formed attaining the length to cover the lateral width of said board P as a whole. On the other hand, within the suction nozzle 3 shown in figure (2), a bit obliquely arrayed slit type aperture part F is formed in the carrier direction and the lateral direction X rectangular to the former on the printed wiring board P attaining the length to cover the lateral width of said board P. Through these procedures, a cleaning fluid can be sucked from the slit type aperture parts F of the suction nozzle 3 to pass the through holes F in the printed wiring board P thereby enabling the through holes T to be cleaned up satisfactorily.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to a cleaning device. That is, it is used in the manufacturing process of printed wiring boards,
The present invention relates to a cleaning device for cleaning through holes on a printed wiring board.

[0002]

2. Description of the Related Art A printed wiring board is often formed with a large number of through holes, which are through holes having a small diameter, by a drill for electrical connection of circuits on both front and back surfaces or for mounting parts.
In the process of manufacturing the printed wiring board, such cleaning of through holes is frequently performed. Conventionally, as such a cleaning device, a high pressure cleaning system has been used. That is, this conventional cleaning apparatus is of a type in which a cleaning liquid is jetted toward a printed wiring board by a nozzle at a pressure of 50 kg / cm ² or more in the air and the cleaning liquid is allowed to pass therethrough to clean through holes.

By the way, the following problems have been pointed out in the conventional high-pressure cleaning type through-hole cleaning device. That is, as for the through hole of the printed wiring board, first, due to the recent miniaturization and densification of the circuit, it is overwhelming that the hole diameter is extremely small from 0.2 mm to 0.5 mm. 2, one printed wiring board, for example 1
An extremely large number of about 000 are formed, and thirdly, they are scattered and distributed in an unspecified and irregular manner. Fourth, on the other hand, the thickness of the printed wiring board is, for example, about 1.6 mm, which is several times to 10 times as large as the diameter of the through hole (that is, the shape of the through hole is extremely elongated). Since the cleaning liquid sprayed from the nozzle also hits the printed wiring board surface other than the through hole, the pressure for passing through the through hole is weakened. These first, second, third, fourth
According to the fifth and the like, it has recently become particularly difficult to sufficiently and surely clean a long and slender through hole having a very small diameter and irregularly scattered. Therefore, in this conventional high-pressure cleaning type cleaning device, drill burr, cutting waste,
Cutting chips, and further, resist deposits, oxidation spots, copper foil stains, other foreign substances adhering to the inner wall, etc., remain without being removed by washing, and therefore after-hole through-hole plating and soldering for component mounting It was a cause of such defects.

In view of such circumstances, the inventor recently newly developed the following through-hole cleaning device. That is, in this recently developed cleaning device, the printed wiring board is conveyed by the roller conveyor group while being immersed in the cleaning liquid in the liquid tank. Then, in the cleaning liquid of the liquid tank, a suction nozzle facing the printed wiring board to be conveyed is provided,
The cleaning liquid is sucked through the through holes of the printed wiring board. The slit-shaped openings of the suction nozzle were arranged linearly along the widthwise direction perpendicular to the direction of conveyance of the printed wiring board. By the way, according to this recently developed cleaning device, even if it is an extremely small diameter, many irregularly scattered and long and slender through-holes, the suction nozzle linearly sucks and strong suction pressure acts, so
Ensure that the cleaning fluid passes through all through holes.
Therefore, the inside of the through-hole is thoroughly and surely cleaned, and the through-hole is completely free of flash, cutting chips, chips, resist deposits, oxidation spots, copper foil stains, and other foreign substances attached to the inner wall. Will be washed away,
The above-mentioned problems of the conventional high pressure cleaning type cleaning device are solved.

[0005]

However, in spite of such advantages, the recently developed cleaning device has the following disadvantages.
The following problems were pointed out. That is, FIG. 3 shows such a recently developed conventional suction nozzle, etc., FIG. 1 (1) is a plan view of a main part thereof, and FIG. 2 (2) is a front explanatory view of the main part. As shown in the figure, when the printed wiring board P is transported in the liquid tank and reaches the suction nozzle 3, the slit shape of the suction nozzle 3 linearly arranged along the lateral width direction X perpendicular to the transport direction Y. The suction pressure from the opening E causes the front end of the printed wiring board P to be sucked intensively at one time. The suction pressure acts as a strong resistance, and the thin and flexible printed wiring board P is damaged or prevented from being conveyed, is sucked and stopped, and is bent from the front end to be on the roller conveyor 2. There is a problem that various defects are likely to occur, such as overlapping, transport and cleaning being impossible, and the like. 4A and 4B show a top member M used in such a conventional example, FIG. 1A is a front view, and FIG. 4B is a side view. It was arranged on the slit-shaped opening E of the suction nozzle 3 so as to be rotatable in the direction Y, and was opened and closed as appropriate.

The present invention has been made as a result of earnest research efforts by the inventor in order to solve the problems of the recently developed conventional example in view of the above-mentioned circumstances, and is carried into the cleaning liquid in the liquid tank. A suction nozzle facing the printed wiring board is provided, and the slit-shaped openings are arranged in a predetermined distribution in claim 1, inclined in a predetermined manner in claim 2, and further in claim 3, Firstly, the cleaning liquid can be sucked through the through-holes of the printed wiring board, and the inside of the through-holes can be sufficiently and surely cleaned.
An object of the present invention is to propose a cleaning device in which the suction pressure is dispersed and the printed wiring board is smoothly transported.

[0007]

The technical means of the present invention for achieving this object are as follows. That is, this cleaning device is used in a manufacturing process of a printed wiring board, and cleans a large number of small-sized through holes provided on both sides of the printed wiring board. A liquid tank of a cleaning liquid in which the printed wiring board is dipped, a group of upper and lower roller conveyors which are arranged in the cleaning liquid of the liquid tank and send by sandwiching the printed wiring board, and the roller conveyor in the cleaning liquid of the liquid tank. It has a suction nozzle arranged between the groups, and a suction mechanism connected to the suction nozzle. The suction nozzle is located opposite to the printed wiring board being conveyed, and can suck the cleaning liquid in the liquid tank through the through hole of the printed wiring board based on the suction pressure of the suction mechanism.

According to another aspect of the cleaning apparatus of the present invention, the suction nozzles have a plurality of slit-shaped openings arranged at intervals in the conveying direction of the printed wiring board and in the lateral width direction perpendicular thereto. Parts are formed to cover the lateral width of the printed wiring board as a whole. or,
3. The cleaning device according to claim 2, wherein the suction nozzle is provided with slit-shaped openings arranged obliquely with respect to a lateral width direction perpendicular to the conveying direction of the printed wiring board to cover the lateral width of the printed wiring board. is doing. Furthermore, in the cleaning apparatus of claim 3, such claim 1 or claim 2
In addition to the configuration described above, in the slit-shaped opening, an assembly of top members is arranged facing each other along the arrangement direction thereof, and the top member is attached to a shaft and rotatable along the transport direction. , All of which normally closes the slit-shaped openings, while on the other hand, while the printed wiring board is conveyed through the corresponding slit-shaped openings, it is displaced by the corresponding slit-shaped openings. It is designed to open the opening.

[0009]

Since the present invention comprises such means, it operates as follows. In this cleaning device, the printed wiring board is conveyed by the roller conveyor group while being immersed in the cleaning liquid in the liquid tank. Then, it passes through the slit-shaped openings of the suction nozzles facing each other over its entire width, and the slit-shaped openings of the suction nozzles suck the cleaning liquid through the through holes of the printed wiring board based on the suction pressure of the suction mechanism. Therefore, firstly, although the through holes are extremely small in diameter, many are irregularly scattered, and the shape is also elongated, in this way, the suction pressure is directly exerted by the slit-shaped opening of the suction nozzle, and thus a strong suction pressure acts. , The cleaning liquid will pass through all through holes. Therefore, even if the hole is extremely thin, the inside of the through hole can be sufficiently and reliably cleaned, and the flash, cutting chips, chips, resist deposits, oxidation spots, copper foil stains, and other substances adhering to the inner wall can be removed from the through hole. Foreign substances, etc. are completely washed away.

Secondly, the slit-shaped openings of the suction nozzle are arranged in a distributed manner in the carrying direction and the lateral width direction, and in the second aspect, they are arranged obliquely with respect to the lateral width direction. Therefore, the suction pressure to the printed wiring board is dispersed in the carrying direction and the lateral width direction, so that the printed wiring board is smoothly carried without being damaged or bent. Thirdly, in claim 3, a method of arranging each top member in a slit-shaped opening and opening / closing it is adopted. That is, while the top member is being pushed up by the printed wiring board and displaced, the corresponding slit-shaped openings are opened and the through holes are sucked, and the printed wiring board is sucked at a predetermined suction pressure. To be washed.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below based on the embodiments shown in the drawings. FIG. 5 is an overall front view of a cleaning device to which the present invention is applied, and FIG. 6 is a side view of the same. FIG. 7 is an enlarged front sectional view of the printed wiring board. First, the whole will be described with reference to these drawings.

This cleaning device is used in the manufacturing process of the printed wiring board P and cleans a large number of small-diameter through holes T provided between both surfaces of the printed wiring board P. First, the printed wiring board P will be described. The printed wiring board P has a wide variety depending on the application, such as a double-sided board for OA, a multi-layer board for a computer, a flexible board for a computer, and the like. Through holes T are formed as shown in FIG. The through holes T are for electrical connection / conduction of circuits on both front and back surfaces of the printed wiring board P,
Alternatively, it is used for component insertion, that is, for attachment around the legs of semiconductor components mounted on the printed wiring board P.
It is formed as a through hole by a drilling machine or the like. The through hole T has an extremely small hole diameter of about 0.2 mm to 0.5 mm with the recent miniaturization and miniaturization of circuits, and one printed wiring board P has, for example, An extremely large number of around 1000 are formed, and moreover, unspecified
Randomly scattered and distributed, and printed wiring board P
Considering that the wall thickness is about 1.6 mm, for example, the length, that is, the depth is several to ten times as large as the hole diameter, and the hole has a long and deep hole shape.

A printed wiring board P having such through holes T is manufactured, for example, as follows. That is, this printed wiring board P is
It is manufactured by following processes such as drilling, polishing / electrolytic treatment, through-hole T plating, polishing / electrolytic treatment, resist application, exposure, development, etching, resist stripping, and so on. First, a double-sided copper-clad laminate, in which copper foil is laminated on both sides of an insulating material, is cut into a work-size short material, and then subjected to perforation processing for through holes T, followed by double-side polishing for cleaning and surface treatment. Alternatively, through the electrolytic treatment, the through-hole T plating using the plating solution is performed. That is,
The inner wall of the through hole T is plated so as to connect the electric circuit on the front surface with the electric circuit on the back surface. After that, after double-side polishing or electrolytic treatment is performed again as cleaning and surface treatment, a process of attaching a photosensitive resist in a film form is performed,
Then, a circuit photograph, which is a negative film of the circuit, is exposed to light, and after that, the resist leaves the exposed and cured circuit portion, and the other portion is dissolved and removed by spraying a developing solution. Then, in the etching machine, the copper foil in the circuit portion where the resist is hardened in this way is left, and the copper foil in the portion where the resist is dissolved and removed as described above is dissolved and removed by the jetting of the corrosive liquid. After that, the remaining resist of the above-mentioned cured circuit portion is dissolved and removed by spraying the stripping solution, and thus the printed wiring board P on which a predetermined electric circuit is formed is manufactured. Then, during the manufacturing process of such a printed wiring board P, cleaning the through holes T and the like with a cleaning device is performed before the above-described through hole T plating, after the resist is dissolved and removed, and the final product finishing stage and the like. , Is repeated in each step.

Now, as shown in FIGS. 5 and 6, this cleaning apparatus used for such cleaning has the following liquid tank 1, roller conveyor 2 group, suction nozzle 3, suction mechanism 4
And so on. To describe these, first, the liquid tank 1
Is the one in which the printed wiring board P is dipped, and comprises a bath of a cleaning liquid H consisting of washing water or a solution of acid, alkali, etc., and is disposed in the processing chamber of the apparatus main body 5. The roller conveyor 2 group is arranged in the cleaning liquid H in the liquid tank 1,
A large number of printed wiring boards P are arranged side by side so as to sandwich and feed the printed wiring board P. Further, outside the liquid tank 1, they are appropriately provided only on the lower side. 6 is a motor for driving such a group of roller conveyors 2, 7 is a transmission section between the motor 6 and the group of roller conveyors 2,
Consists of a pulley etc.

Two suction nozzles 3 are arranged in the cleaning liquid H in the liquid tank 1 as described above between the two groups of roller conveyors. The suction nozzle 3 is located opposite to one surface of the conveyed printed wiring board P, and can suck the cleaning liquid H in the liquid tank 1 through the through hole T of the printed wiring board P based on the suction pressure of the suction mechanism 4. Is becoming The suction nozzle 3 is positioned so as to face the one surface of the printed wiring board P to be conveyed with a very small gap of about 0.5 mm, for example, so that it can be appropriately abutted. Regardless of this, the opposing positioning may be performed so as to always abut, or the opposing positioning may be performed in a gap that does not always abut. The suction nozzles 3 in the illustrated example are arranged under the printed wiring board P, that is, between the lower roller conveyors 2 groups, but are arranged above the printed wiring board P, that is, between the upper roller conveyors 2 group. You may. The details of the suction nozzle 3 will be described later.

Next, the suction mechanism 4 is arranged outside the liquid tank 1 and is connected to the suction nozzle 3 in the liquid tank 1. That is, 8 is a motor of the suction mechanism 4, and this motor 8
Are connected to two piston pumps 10 via both crank portions 9. 11 is a tank, and this tank 11
The two suction nozzles 3 are connected at their base ends via pipes 12, and at the same time are connected to the front and rear ends of the liquid tank 1 via pipes 13, respectively. The pipe 13 is provided with a check valve 14, the piston pump 10, the check valve 15, a filter 16 and the like in this order from the tank 11 side. Therefore, in the suction mechanism 4, both piston pumps 10 reciprocate through the crank portion 9 by the drive of the motor 8, and the suction movement causes
Suction pressure acts on the suction nozzle 3 via the tank 11 and the check valve 14, and the vacuum pressure thereof causes the cleaning liquid H in the liquid tank 1 to flow.
Is sucked. Further, the cleaning liquid H thus sucked by the discharge movement of the piston pump 10 is circulated from the piston pump 10 to the liquid tank 1 through the check valve 15 and the filter 16, at which time the cleaning liquid H is filtered by the filter 16. Dirt is purified and reduced. In the figure, 17 is a mount.

In the illustrated example, two such piston pumps 10 are provided. When one of the piston pumps 10 performs a suction movement, the other is set to perform a discharge movement. Therefore, the interaction causes the flow of the cleaning liquid H. The strength is reduced, that is, the wave of the suction pulse of the cleaning liquid H is reduced. Further, in such a suction mechanism 4, for example, the tank 11 or the pipes 12, 1
A pressure reducing valve (not shown) is attached to 3 and the like, and the suction pressure acting on the suction nozzle 3 is adjusted. That is, a large number of through holes T formed on the printed wiring board P as described above are scattered in an unspecified or irregular manner.
Since they are distributed, the suction pressure for sucking the cleaning liquid H through the through holes T, that is, the vacuum pressure, by the suction nozzles 3 does not greatly change depending on the size, number, presence or absence of the through holes T to be sucked. The pressure reducing valve opens and closes appropriately,
The cleaning liquid H is allowed to escape to another pipe (not shown) and is circulated again. In addition, the pressure reducing valve for controlling the suction pressure, that is, the vacuum pressure to be constant as described above may be directly attached to the suction nozzle 3.

Next, the suction nozzle 3 will be described in detail. FIG. 1 is a plan view of an essential part of an embodiment of the present invention, FIG. 1 (1) shows one example thereof, and FIG. 2 (2) shows another example. FIG. 2 shows the top member N and the like, FIG. 1 (1) is a front view, and FIG. 2 (2) is a plan view. First, the suction nozzles 3 shown in FIG. 1 (1) are linearly arrayed at intervals in the transport direction Y of the printed wiring board P and the lateral width direction X perpendicular to the transport direction Y, A plurality of slit-shaped openings F are formed, and the slit-shaped openings F have a length that covers the lateral width of the printed wiring board P as a whole. The slit-shaped openings F in this illustrated example are arranged in two rows along the lateral width direction X, and the other is arranged in the interval portion of one row, but not according to such an illustrated example. It may be arranged in multiple rows such as three rows, and the spacing can be set in various other ways. On the other hand, in the suction nozzle 3 shown in FIG. 1 (2), slit-shaped openings F are formed which are arranged slightly inclined with respect to the lateral width direction X which is perpendicular to the transport direction Y of the printed wiring board P, Such a slit-shaped opening F has a length that covers the lateral width of the printed wiring board P. The slit-shaped openings F in the illustrated example are linearly arranged in a slanting arrangement, but, regardless of such an illustrated example, the slanted openings are arranged in multiple rows and are spaced apart and discontinuous. It may be arranged as a target.

Next, the top member N of FIG. 2 will be described. As shown in FIG. 2, the slit-shaped openings F are arranged so as to face each other along the arrangement direction of the aggregate of the top members N.
Each top member N is attached to a shaft or shaft 18, respectively, and is rotatable along the transport direction Y. At all times, all of the top members N descend to seal or close the slit-shaped opening F at their ends. On the other hand, while the printed wiring board P is being transported on the corresponding slit-shaped opening F, the ends thereof are separated due to, for example, being lifted and displaced thereby, so that the corresponding slit-shaped opening F is formed. Is open. The top member N shown in FIG. 2 is arranged on the slit-shaped opening F in FIG. 1 (1), and a set of top members N closely contacting each other on each slit-shaped opening F. The body is arranged, and the top member N of each block is pivotally attached to one shaft 18 arranged in the lateral width direction X. Therefore, as shown in the drawing, the top row member N in the transport direction Y is
The length along the transport direction Y is formed to be short.

First, when the top member N is arranged on the slit-shaped opening F in FIG. 1 (2), the top member N
As a matter of course, the printed wiring boards P are linearly inclined and arranged in a predetermined manner, and when the printed wiring board P is conveyed, the printed wiring boards P are sequentially opened from the front side and are sequentially closed from the front side. Secondly, each top member N also serves as an adjusting mechanism for adjusting the overall lengths of both ends of the slit-shaped opening F in correspondence with the printed wiring board P having various widths. Only the slit-shaped openings F that function and pass the width of the printed wiring board P passing through are opened, and the slit-shaped openings F outside the width are left closed. Thirdly, since the suction member 3 and the slit-shaped opening F are provided on the lower side of the printed wiring board P to be conveyed, the top member N of FIG. There is. However, irrespective of such an illustrated example, when the suction nozzle 3 and the slit-shaped opening F are provided on the upper side of the printed wiring board P to be conveyed, the top member N opposes this against the lower side. Will be distributed. In the latter case, when the printed wiring board P is transported under the slit-shaped opening F, the top member N is
With this, it is pivotally displaced, and its slit-shaped opening F
It comes to separate from the bottom.

The present invention is constructed as described above. Then it becomes as follows. In this cleaning apparatus, the printed wiring board P is conveyed while being immersed in the cleaning liquid H in the liquid tank 1 while being sandwiched between the upper and lower roller conveyors 2. The printed wiring board P conveyed in this way is arranged between the two groups of roller conveyors 2 and passes through the slit-shaped openings F of the suction nozzles 3 facing each other over the entire width thereof, so that the slit-shaped openings of the suction nozzles 3 are formed. Based on the suction pressure of the suction mechanism 4, F sucks the cleaning liquid H in the liquid tank 1 through the through hole T of the printed wiring board P. That is, by driving the motor 8 of the suction mechanism 4, the two piston pumps 10 alternately perform the suction motion and the discharge motion, and the liquid tank 1
The cleaning liquid H in the liquid again passes through the through hole T, the slit-shaped opening F of the suction nozzle 3, the pipe 12, the tank 11, the pipe 13, the check valve 14, the piston pump 10, the check valve 15, the filter 16 and the like, and is again liquid. Circulate to tank 1.

Then, first, the through holes T of the printed wiring board P have an extremely small diameter, and many are irregularly scattered and have a long and slender shape. However, the through holes T are conveyed in the cleaning liquid H in the liquid tank 1 in this way. At the same time, it is directly sucked by the slit-shaped opening F of the suction nozzle 3 facing the one surface side, so that the suction pressure, that is, the vacuum pressure is strongly applied to all the through holes T. Therefore, due to such suction pressure, the cleaning liquid H passes through all the through holes T and is not repelled by the surface of the printed wiring board P even when the holes are extremely thin, and the slit-shaped opening of the suction nozzle 3 is provided. F is sucked. In this way, all of the through holes T are thoroughly and surely cleaned, and from the through holes T, the burrs, cutting chips, and chips of the drill generated in the previous process, as well as the resist deposits, oxidation points, and copper foil stains. , Other foreign substances attached to the inner wall are completely cleaned and removed.

Along with this, secondly, the slit-shaped openings F of the suction nozzles 3 in FIG. 1 (1) are distributed and arrayed in the carrying direction Y and the lateral width direction X, respectively.
In the case of (2), the slanting arrangement is performed from the lateral width direction X to the transport direction Y. Therefore, the printed wiring board P passing through
The suction pressure with respect to is distributed in the transport direction Y and the lateral width direction X, so that the leading end of the printed wiring board P is not concentrated and sucked at one time and receives a large resistance. It is gradually sucked, and receives a resistance that does not hinder its transportation little by little. For example, in the case of FIG. 1 (1), the conventional resistance is divided into about 2 parts to operate. Therefore, although the printed wiring board P is thin and flexible, it is smoothly transported without being damaged or bent. Thirdly, as shown in FIG. 2, the suction of the printed wiring board P by the suction nozzle 3 is performed by arranging each top member N on the slit-shaped opening F and opening and closing it. Is being done. In other words, while a certain group of top members N is being pushed up by the printed wiring board P that is being conveyed and passed, only the corresponding slit-shaped opening F is opened, so that the through hole T of the printed wiring board P is always at a predetermined value. Suction pressure is used for cleaning.

[0024]

As described above, the cleaning apparatus according to the present invention is provided with the suction nozzle opposed to the printed wiring board conveyed in the cleaning liquid in the liquid tank, and the cleaning liquid can be sucked through the through hole of the printed wiring board. In addition, the slit-shaped openings are distributed in a predetermined manner in Claim 1, are inclined in a predetermined manner in Claim 2, and the top members are arranged in a predetermined manner in Claim 3. The following effects are exhibited.

That is, first, the inside of the through hole of the printed wiring board is sufficiently and surely cleaned. In other words, from through holes, drill burrs, cutting waste, chips,
Completely cleans and removes resist deposits, oxidization spots, stains on copper foil, other foreign substances adhering to the inner wall, etc., so that after-hole through-hole plating and soldering for component mounting can be achieved without any defects. To be done. Secondly, the suction pressure is dispersed and the printed wiring board is smoothly transported. In other words, the printed wiring board will not be damaged, will not be interrupted by conveyance and will not be stopped by suction, and will not be bent and overlapped from the tip, so that conveyance and cleaning will be performed smoothly and various defects will occur. Avoided.
As a result, high density, small size, light weight, high number of layers are advanced, and the quality and stability of a printed wiring board in which circuits are becoming finer and finer are significantly improved. As described above, the effects of the present invention are remarkably large, such as the problems existing in this type of conventional example are eliminated.

[Brief description of drawings]

1A and 1B are plan views of a main part of an embodiment of a cleaning apparatus according to the present invention, wherein FIG. 1A shows a claim 1 and FIG. 2B shows a claim 2;

FIG. 2 shows the top member and the like, (1) is a front view,
(2) The figure is a plan view.

3A and 3B show a suction nozzle and the like of this type of conventional example, FIG. 1A is a plan view of an essential part thereof, and FIG. 3B is a front explanatory view of the essential part thereof.

FIG. 4 shows a top member and the like of this type of conventional example, FIG. 1 (1) is a front view, and FIG. 4 (2) is a side view.

FIG. 5 is an overall front view of this type of cleaning device.

FIG. 6 is an explanatory view of the same side.

FIG. 7 is an enlarged front sectional view of a printed wiring board.

[Explanation of symbols]

 1 Liquid Tank 2 Roller Conveyor 3 Suction Nozzle 4 Suction Mechanism 5 Device Main Body 6 Motor 7 Transmission Section 8 Motor 9 Crank Section 10 Piston Pump 11 Tank 12 Piping 13 Piping 14 Check Valve 15 Check Valve 16 Filter 17 Frame 18 Shaft E Slit -Shaped opening (conventional example) F slit-shaped opening (present invention) H cleaning liquid M coma member (conventional example) N coma member (present invention) P printed wiring board T through hole Y transport direction X lateral width direction

Claims (3)

[Claims] 1. A cleaning device used in a manufacturing process of a printed wiring board, for cleaning a large number of small-sized through holes provided on both sides of the printed wiring board, the cleaning liquid being a liquid for immersing the printed wiring board. Tank, upper and lower roller conveyor groups arranged in the cleaning liquid of the liquid tank and sandwiching and sending the printed wiring board, suction nozzles arranged between the roller conveyor groups in the cleaning liquid of the liquid tank, and the suction nozzle And a suction mechanism connected to the suction nozzle, the suction nozzle is positioned to face the printed wiring board being conveyed, and the cleaning liquid in the liquid tank is transferred to the printed wiring board based on the suction pressure of the suction mechanism. In the cleaning device capable of sucking through the through hole, the suction nozzles are spaced from each other in the conveying direction of the printed wiring board and in the lateral width direction at right angles thereto. Distributed plurality of slit-like openings which are arranged becomes formed,
A cleaning device, which covers the width of the printed wiring board as a whole. 2. In the above-mentioned cleaning device, the suction nozzle is provided with slit-shaped openings arranged obliquely with respect to a lateral width direction perpendicular to the conveying direction of the printed wiring board, and the lateral width of the printed wiring board. That it covers
Cleaning device characterized by. 3. The slit-shaped opening is provided with an assembly of top members facing each other along the arrangement direction, each top member being attached to a shaft and rotatable along the transport direction. , All of which normally closes the slit-shaped openings, while on the other hand, while the printed wiring board is conveyed through the corresponding slit-shaped openings, it is displaced by the corresponding slit-shaped openings. The cleaning device according to claim 1 or 2, wherein the opening is opened.