JPH05166857A - Chip mounting method - Google Patents

Abstract

(57) [Summary] [Purpose] To improve the quality of the substrate on which chips are mounted by eliminating the variation in the characteristics of the chips mounted on the same substrate from the wafer. [Structure] In a chip mounting method in which a chip P on a wafer 3 is adsorbed by a nozzle 7 to be picked up, and the chip P is mounted on a bond B coated on a substrate 6, the wafer 3 is radiused from a center point O. It is divided into a plurality of areas E according to the distance in the direction R, and the same area E is formed on the same substrate 6.
The chip P inside is mounted.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip mounting method,
More specifically, the characteristics of chips mounted on the same substrate are eliminated to improve the quality of the substrate on which the chips are mounted.

[0002]

2. Description of the Related Art For example, a display panel has a large number of L's on a substrate.
The ED chips are formed side by side in a matrix. As shown in FIG. 5, the chips are mounted on the substrate by mounting the chips P on the wafer 100 onto the nozzles 1 of the head 101.
This is performed by adsorbing and picking up by 02 and sequentially mounting them on the bond previously coated on the substrate 103. In FIG. 5, an arrow N indicates a locus in the order of picking up the chips P by the transfer head 101, and as illustrated, the nozzle 102 picks up the chips P in the direction traversing the wafer 100 in order.

[0003]

By the way, the wafer 1
A resist film is formed on the surface of 00. This resist film is generally formed by applying a coating paste to the central portion of the wafer 100, horizontally rotating the wafer 100 and applying a centrifugal force to the wafer 100 so that the resist film is diffused over the entire surface of the wafer 100. However, the thickness of the resist film formed by such means is not uniform over the entire surface of the wafer, and the thickness tends to be uneven in the radial direction R. That is, if the centrifugal force is too large, the outer edge portion becomes thicker than the central portion, and if the centrifugal force is too small, the central portion becomes thicker than the outer edge portion. As described above, the thickness of the resist film becomes uneven along the radial direction R, so that the characteristics of the chip P gradually change according to the distance from the center point O of the wafer 100.

However, in the above conventional means, the nozzle 10
In No. 2, the chip P is picked up in the direction traversing the wafer 100, so that the chip P having considerably different characteristics is mounted on the same substrate 103. In particular, the direction in which the nozzle 102 traverses the vicinity of the center point O of the wafer 100 (arrow N ′).
Direction), when picking up the chip P, the substrate 10
The characteristic of the chip P of No. 3 is severely varied, and there is a problem that the brightness of the display panel is locally varied.

Therefore, an object of the present invention is to provide a chip mounting method capable of improving the quality of a substrate on which chips are mounted by eliminating variations in characteristics of chips mounted on the same substrate from a wafer. To do.

[0006]

To this end, the present invention is designed to adsorb a chip on a wafer to a nozzle and pick it up.
In a chip mounting method of mounting this chip on a bond coated on a substrate, the wafer is divided into a plurality of areas according to the distance in the radial direction from the center point, and the chips in the same area are mounted on the same substrate. It is designed to be installed.

[0007]

According to the above construction, the nozzle is moved up and down to pick up the chips in the same area as much as possible, and the chips are mounted on the same substrate, thereby eliminating variations in the characteristics of the chips mounted on the same substrate from the wafer. Then, the quality of the substrate on which the chip is mounted can be improved.

[0008]

(Embodiment 1) Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of a chip mounting apparatus, FIG. 2 is a plan view of the apparatus, and 1 is a supply unit of an LED chip P. The supply unit 1 is a table 2 provided on an XY table 50. The wafer 3 to which the LED chips P are attached is placed and configured. As described in the section of the related art, the chip P at the central portion of the wafer 3 and the chip P at the outer edge portion have quite different characteristics because the resist films have different thicknesses. Therefore, in this means, as shown in FIG. 3, the wafer 3 is divided into a plurality of areas E (E1, E2) according to the distance from the center point O in the radial direction R.
a to E2d, E3a to E3d, E4a to E4c). With this division, the chips P in the same area E are located at substantially the same distance from the center point O, so that the thickness of the resist film is substantially uniform and the characteristics are almost uniform. Therefore, by mounting the chips P in the same area E on the same substrate 6, the characteristics of the chips P on the substrate 6 can be made uniform.

In FIG. 1, reference numeral 5 is a bonding arm, and a tip 7 and a substantially central portion of the bonding arm 5 adsorb a chip P mounted on a wafer 3 and transfer and mount the chip P on a substrate 6, and a bond tray 8. A transfer pin 9 for transferring the bond B stored in the substrate 6 is vertically provided. As will be described later, the bonding arm 5 reciprocates in the length direction thereof, and the XY table 11 is driven to drive the substrate 6. Moves in the X and Y directions to transfer and mount the chip P on the substrate 6 by the nozzle 7 and simultaneously apply the bond B to the substrate 6.

The XY table 11 includes an X table 12 and a Y table.
It is composed of a table 13 and moves the substrate 6 in the XY directions for positioning. Reference numeral 14 is a clamp member for sandwiching and fixing the substrate 6 from both sides. In FIG. 2, reference numeral 15 denotes a conveyer for loading and unloading the substrate 6 onto and from the XY table 11, which is arranged in a direction orthogonal to the bonding arm 5 and has the substrate 6 on both sides thereof. A loader 16 for supplying and an unloader 17 for accommodating the substrate 6 on which the chip P has been mounted are arranged.

In FIG. 1, 20 is a drive box for the bonding arm 5, 21 is a drive motor, and 27 is a speed reducer. A swing lever 22 is pivotally attached to the wall surface of the drive box 20, and a protrusion 23 at the tip of the swing lever 22 is provided between a pair of guide brackets 24, 24 suspended near the rear end of the bonding arm 5. It is inserted. In addition, the rear end of the bonding arm 5 and the part slightly rearward of the substantially central part are
The rocking members 25 and 26, whose lower ends are rotatably supported on the wall surface of the drive box 20, are pivotally supported by the upper ends of the rocking members 25 and 26, and the bonding arm 5 is inclined forward toward its tip. When the motor 21 is driven, the swing lever 22 reciprocally rotates about its lower end, and the bonding arm 5 reciprocates in the length direction (oblique direction) N1. Then the nozzle 7
Moves back and forth between the wafer 3 and the substrate 6 positioned on the XY table 11, transfers and mounts the chip P on the wafer 3 onto the substrate 6, and the transfer pins 9 apply the bond B of the bond tray 8 to the substrate 6. To do.

Reference numeral 30 denotes a chip P detection device provided below the transfer path of the nozzle 7 between the supply unit 1 and the XY table 11, and of the support unit 31 arranged in parallel with the bonding arm 5. It is attached to an elongated plate 32 extending from the lower end of the tip. Reference numeral 33 denotes a light receiving element, which is arranged at the tip of the plate 32. This light receiving element 3
3 is located below the transfer path of the nozzle 7, detects light emitted from a light emitting element (not shown) mounted on the nozzle 7, and the detection signal is transmitted to the plate 32 via the fiber 34. It is sent to the control unit 35 provided and it is determined whether or not the chip P is correctly adsorbed to the nozzle 7.

This chip mounting apparatus has the above-mentioned structure, and its operation will be described below. As shown in FIG. 1, the substrate 6 supplied from the loader 16 to the conveyor 15
Are conveyed to the conveyor 15 and positioned on the XY table 11. Further, the swing lever 22 is rotated in the (a) direction by the drive of the motor 21, the bonding arm 5 is advanced to the position indicated by the solid line, and the transfer pin 9 is bonded to the bond B.
Is applied to the substrate 6, and the nozzle 7 adsorbs the chip P on the wafer 3. Next, when the swing lever 22 rotates in the (b) direction, the bonding arm 5 retracts to the position of the chain line, the nozzle 7 adsorbs the chip P and transfers it to the substrate 6, and at the same time, the transfer pin 9 moves the substrate. 6 to bond plate 8
Return to and collect the bond B at its tip.

In the above operation, the pickup of the chip P by the nozzle 7 is performed by the areas E1 to E4 in FIG.
Among them, for example, first, the area E1 is selected, and the XY table 50 is moved in the XY directions, so that the chips P in the area E1 are sequentially picked up along the arrow Q1 and the bond B applied on the substrate 6 is selected. It will be mounted on the top one by one.
Therefore, the chips P having the same characteristics in the same area E1
It is possible to mount only the same on the same substrate 6, so that variations in the characteristics of the chips P on the substrate 6 can be eliminated as much as possible, and the quality of the substrate 6 on which the chips P are mounted can be improved.

Next, when the chips P in the area E1 are out of stock, the area E2 is picked up. in this case,
For example, the chip P in the area E2a is first picked up along the arrow Q2, the chip P in the area E2b is picked up along the arrow Q3, and then the chip P in the area E2c is picked up along the arrow Q4. ...
Pick up sequentially. However, instead of directly moving from the area E2a to the area E2b, for example, the area E2a may be partially complemented by the area E3a and then moved to the area E2b. The point is the same substrate 6
Although it is desirable to mount chips P in the same area E as much as possible, it is not prohibited to mount chips P in other adjacent areas E together. Then
Similarly, the chips P in the areas E3 and E4 are similarly picked up and mounted on the substrate 6.

(Embodiment 2) FIG. 4 is an explanatory view of a chip pick-up sequence according to Embodiment 2 of the present invention, in which a chip P is picked up by a nozzle 7 from an outer edge portion to a central portion of a wafer 3 as indicated by a solid arrow Q5. The chips P are sequentially picked up concentrically toward each other, and the chip P is applied to the bond B on the substrate 6.
Mount on top. Of course, conversely to this pick-up order, the wafer 3 may be picked up concentrically from the central portion to the outer edge portion as indicated by the broken line arrow Q6.

The present invention is not limited to the above embodiment. For example, in the above embodiment 1, the pick-up of the wafer 3 is performed in the order of the area E1 → the area E4, that is, from the center point O of the wafer 3 toward the outer edge portion. In this order, on the contrary, it is possible to pick up in the order of the area E4 → E1 from the outer edge portion toward the center point O, in short, the same substrate 6
In this case, the chip P in the area E which is as close as possible may be mounted.

Further, in the above-described embodiment, the chip mounting apparatus of the type in which the nozzle directly transfers and mounts the chip of the supply section onto the substrate of the XY table has been described, but the first nozzle is the chip of the supply section. After transferring to the intermediate stage and correcting the positional displacement of the chip in this intermediate stage, the second nozzle may be transferred from the intermediate stage to the substrate of the positioning section and mounted, or a bond may be applied to the substrate by a dispenser. The method may be applied to various types of chip mounting devices.

[0019]

As described above, according to the present invention, the wafer is divided into a plurality of areas according to the distance in the radial direction from the center point, and the chips in the same area are mounted on the same substrate. It is possible to improve the quality of the substrate on which the chip is mounted by eliminating variations in the characteristics of the chip mounted on the chip.

[Brief description of drawings]

FIG. 1 is a perspective view of a chip mounting apparatus according to a first embodiment of the present invention.

FIG. 2 is a plan view of the device.

FIG. 3 is a plan view of a wafer

FIG. 4 is an explanatory diagram of a pickup order of chips according to a second embodiment of the present invention.

FIG. 5 is an explanatory diagram of a pick-up order of chips according to a conventional means.

[Explanation of symbols]

 3 wafer 6 substrate 7 nozzle B bond E area O center point P chip R radial direction

Claims (2)

[Claims] 1. A chip mounting method in which a chip on a wafer is adsorbed by a nozzle to be picked up and mounted on a bond coated on a substrate, wherein the wafer is moved in a radial direction from a center point. The chip mounting method is characterized in that the chip in the same area is mounted on the same substrate by dividing the chip into a plurality of areas. 2. A chip mounting method in which a chip on a wafer is adsorbed by a nozzle to be picked up and mounted on a bond coated on a substrate. In the chip mounting method, the chips on the wafer are sequentially and concentrically arranged on the nozzle. A chip mounting method, characterized in that the chip is adsorbed and picked up, and the chip is mounted on a bond coated on the substrate.