JPH05121621A - Lead terminal solder processor of semiconductor element - Google Patents

Abstract

PURPOSE:To cleanse the surface treating of the lead terminal after resin sealing step in the semiconductor element assembly thereby enabling the equipment in the preceding and succeeding steps to be compounded for the rationalization of the production lines. CONSTITUTION:The title lead terminal solder processor of semiconductor element is equipped with a chamber 11 covering the lead terminal 2 of a semiconductor element 1, a lead surface processor having blowing-out nozzles 12 feeding reducing gas to the chamber 11, a solder coating part having a solder feeding nozzle 14 as well as solder melting down part melting down the coated solder by laser beams, etc., to be bonded onto the lead terminal 2, while the pollutant gas production can be minimized by drying up the lead surface processor and minimizing the solder gas production thereby enabling the assembling step in high cleanliness to be arranged as well as all the equipments to be compounded.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface treatment of lead terminals in a semiconductor element assembling process, and more particularly to a structure of a solder treatment apparatus which can be combined with a front and rear process.

[0002]

2. Description of the Related Art As shown in FIG. 4, a conventional solder processing apparatus used for treating the surface of a lead of a semiconductor element aligns a plurality of resin-sealed semiconductor elements 1 and chucks a portion other than a lead terminal 2. 3 and then sequentially conveys to each treatment tank by rotating or horizontal feeding, and by a conveying mechanism that can be immersed in each tank by vertical movement, pretreatment tank 4, flux tank 5,
The semiconductor element 1 was transferred to the solder bath 6, the cleaning bath 7, the draining bath 8 and the drying bath 9 for surface treatment.

In the pretreatment tank 4, the lead terminal 2 is generally immersed in a tank in which an acid-based solution is overflowing for a specified time to remove the oxide film on the surface of the lead terminal 2, and then the carrier is moved and moved up and down. The flux tank 5,
The solder layer is sent to the solder bath 6, and a solder layer is formed on the surface of the lead terminal 2 in the solder bath 6.

After that, in order to remove the acid and the surface-active agent adhering to the pretreatment tank 4 and the flux tank 5, after immersing in the cleaning tank 7 and washing with running water, dry air is blown from the air nozzle 10 in the draining tank 8 and finally. Hot air nozzle 10 'of the drying tank 9
It was dry due to the blowout from.

[0005]

In this conventional solder processing apparatus, since the acid solution is used in the pretreatment tank 4 and the solution containing the surfactant is used in the flux tank 5, When the lead terminal 2 was dipped and moved, there was a problem that the solution was scattered or dropped around each tank or in the moving route to stain the device, or rust due to acid was generated.

Further, since the solder bath 6 keeps the solder in a molten state at all times, there is a problem that the device is contaminated by solder gas and the indoor atmosphere is contaminated, and the device cannot be installed in a clean room during the assembly process. It was a hindrance to the combination of processes.

Since an acid-based solution is used,
Since the wash water has to be treated as wastewater, it has been a factor in increasing costs in terms of investment in wastewater treatment facilities and quality control of wastewater.

An object of the present invention is to provide a lead terminal soldering apparatus for a semiconductor element, which cleans the surface treatment of the lead terminals and rationalizes the production line.

[0009]

In order to achieve the above object, a lead terminal soldering apparatus for a semiconductor element according to the present invention is a lead terminal soldering apparatus after resin sealing in semiconductor element assembly, A chamber for covering the lead section, a REIT surface treatment section having a plurality of gas blowing nozzles for supplying a reducing gas into the chamber, and a solder coating section including a solder storage container, a solder supply nozzle, and a solder supply nozzle drive mechanism. And a solder melting portion for moving the light beam while irradiating the lead terminal with the laser beam to melt the solder.

In addition, infrared rays are used in the solder melting portion.

[0011]

The dry process of the lead terminal surface and the suppression of the generation of solder gas minimize the generation of pollutant gas and clean the assembly process. In addition, the production line will be rationalized by combining equipment.

[0012]

The present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view of a lead surface treatment section and a solder application section of a solder processing apparatus according to an embodiment of the present invention. Figure 2
FIG. 4 is a cross-sectional view of a solder melting portion of the present invention. FIG. 3 is a block diagram showing the configuration of basic functions in the solder processing apparatus of the present invention.

In FIG. 1, reference numeral 1 denotes a semiconductor element, which is held by a chuck 3 attached to a transfer mechanism composed of a motor or a cylinder.

Reference numeral 11 denotes a chamber that covers the lead processing section, and has a plurality of blowing nozzles 12 installed therein for blowing a reducing gas (or an inert gas).

A solder container 13 has a solder supply nozzle 14 at its tip and is attached to a nozzle drive mechanism 15.

In the solder melting portion shown in FIG. 2, 16 is a laser irradiation port, which can be moved in the XY directions by a head moving guide 17. Reference numeral 18 denotes a reflecting mirror having a concave surface installed so as to collect the irradiated laser light on the back surface of the lead terminal 2.

Next, the operation will be described. The semiconductor device 1 is shown in FIG.
As shown in FIG.
Further, under the control of the control unit 24, the supply unit 20 sends the lead processing unit 21, the solder coating unit 22, and the solder melting unit 23 in this order to the storage unit 26.

In the lead processing section 21, the blowing nozzle 12
The oxide film on the surface of the lead terminal 2 is removed by the reducing gas blown out from. Next, cream-like solder (powder may be used) is supplied from the solder supply nozzle 14, and the nozzle drive mechanism 15 moves XY to apply the solder to the entire surface of the lead terminal 2.

After that, the semiconductor element 1 has the solder melting portion 22.
The laser irradiation port 16 to the head movement guide 17
The solder of the lead terminal 2 is melted and fixed by laser irradiation. The solder melting portion 22 is connected to the chamber 11
The gas that is covered by the gas and that is generated by melting does not leak to the outside of the chamber 11 and is exhausted through a duct connected to the chamber 11.

In another embodiment of the invention, the solder fusion zone 22
With respect to the movement of the laser irradiation port 16, the entire surface of the lead terminal 2 is uniformly melted by shaking the laser light by the polygon mirror 19 as shown in FIG. 5 instead of moving the head moving guide 17 in the XY directions. It is also possible.

Also, when infrared rays are used instead of laser as the solder melting means, the same effect can be obtained.

[0022]

As described above, according to the present invention, the lead surface treatment portion is changed from the conventional wet method using acid to the dry method using reducing gas, and only the required amount of solder is supplied to the lead terminals. As a result, the contamination with acid is completely eliminated, and the gas generated from the solder is extremely small, so that the air in the assembly process is not contaminated. Furthermore, it becomes possible to combine the processes with the preceding and following processes, and it is possible to introduce a rationalized line by integrated production, and it is possible to obtain effects such as a reduction in manufacturing lead time and a reduction in running cost because a water treatment facility is unnecessary.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a lead surface treatment portion and a solder application portion according to an embodiment of the present invention.

FIG. 2 is a sectional view of a solder melting portion.

FIG. 3 is a block diagram showing an overall system of a solder processing apparatus according to the present invention.

FIG. 4 is a diagram showing an example of a conventional solder processing apparatus.

FIG. 5 is a sectional view showing another embodiment according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor element 2 Lead terminal 3 Chuck 4 Pretreatment tank 5 Flux tank 6 Solder tank 7 Cleaning tank 8 Draining tank 9 Drying tank 10 Air nozzle 10 'Hot air nozzle 11 Chamber 12 Blow-out nozzle 13 Solder container 14 Solder supply nozzle 15 Nozzle drive mechanism 16 Laser irradiation light 17 Head movement guide 18 Reflecting mirror 19 Polygon mirror

Claims (2)

[Claims] 1. A solder processing device for a lead terminal after resin encapsulation in a semiconductor device assembly, comprising: a chamber covering the lead portion; and a plurality of gas blowing nozzles for supplying a reducing gas into the chamber. A solder surface treatment unit, a solder application unit including a solder container, a solder supply nozzle, and a solder supply nozzle drive mechanism, and a solder melting unit that moves the light beam while irradiating the lead terminal with a laser beam to melt the solder A semiconductor device lead terminal solder processing device characterized by the above. 2. The lead terminal solder processing apparatus for a semiconductor element according to claim 1, wherein infrared rays are used for said solder melting portion.